Semiconductor cold and hot impact test box

Abstract

The utility model discloses a semiconductor cold and hot impact test box which comprises a box body, a test cavity is formed in the box body, a partition plate is fixedly installed in the test cavity and divides the test cavity into a high-temperature cavity and a low-temperature cavity, a hydraulic rod is fixedly installed on the top wall of the box body, a lifting frame is arranged at the bottom end of the hydraulic rod, and the lifting frame is connected with the box body. The lifting frame comprises two cover plates, the two cover plates are fixedly connected through a plurality of connecting rods, the lifting frame is arranged in the through groove of the partition plate, and a rotating mechanism is arranged on the lifting frame. The driving motor can drive the rotating rod to rotate so as to drive the driving gear to rotate, the driving gear is meshed with the driven gear to drive the top rotating column to rotate so as to drive the two turntables to rotate, and when the turntables rotate, the plurality of trays are driven to rotate through the mounting rods, so that semiconductors placed on the trays rotate at a constant speed. Therefore, the semiconductor placed on the tray is heated or cooled more uniformly, and the reliability of test data is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor test equipment, in particular to a semiconductor thermal shock test box. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is very huge. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential semiconductor material in various applications. The thermal shock tester is used to test the degree to which composite materials and material structures can withstand continuous environments of extremely high and extremely low temperatures in an instant, that is, to test the chemical changes or physical damage caused by thermal expansion and contraction in the shortest time.

[0003] The placement trays for placing semiconductors in conventional semiconductor thermal shock test chambers are fixed and cannot be rotated, resulting in uneven heating or cooling of the semiconductors on the placement trays, thereby failing to ensure the reliability of the test data. Therefore, in view of this, the existing structure and defects are studied and improved to provide a semiconductor thermal shock test chamber. Utility Model Content

[0004] The utility model aims to provide a semiconductor thermal shock test box to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor thermal shock test chamber, comprising:

[0006] A box body, wherein a test chamber is provided on the box body, a box door is installed on the front side of the box body, a partition is fixedly installed in the middle of the test chamber, the partition separates the test chamber into a high-temperature chamber and a low-temperature chamber, a heating component is installed on the rear inner wall of the high-temperature chamber, and a cooling component is installed on the rear inner wall of the low-temperature chamber, a hydraulic rod is fixedly installed on the top wall of the box body, a lifting frame is arranged at the bottom end of the hydraulic rod, the lifting frame comprises two cover plates, the two cover plates are fixedly connected by a plurality of connecting rods, the lifting frame is arranged in the through groove of the partition, and a rotating mechanism is arranged on the lifting frame.

[0007] Preferably, the rotating mechanism includes two rotating columns, two mounting rods and a driving assembly, the two rotating columns are respectively rotatably mounted at the center of the side walls opposite to the two cover plates, a turntable is fixedly mounted on the two rotating columns, the two ends of the two mounting rods are respectively fixedly mounted on the two turntables, and a plurality of trays are fixedly mounted on the two mounting rods.

[0008] Preferably, the driving assembly includes a driven gear and a driving motor, the driven gear is fixedly mounted on the top rotating column, the driving motor is fixedly mounted on the top cover plate, the output end of the driving motor is transmission-connected with a rotating rod, the rotating rod is rotatably mounted on the top cover plate, and a driving gear is fixedly mounted on the bottom end of the rotating rod, and the driving gear is meshingly connected with the driven gear.

[0009] Preferably, a heat insulation cover is arranged outside the driving motor, and the heat insulation cover is fixedly mounted on the top cover plate.

[0010] Preferably, a controller is fixedly mounted on the box, and the controller is electrically connected to the hydraulic rod and the drive motor via a wire.

[0011] Preferably, the partition and the two cover plates are made of heat-insulating materials.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] When the utility model is in use, the hydraulic rod can drive the lifting frame to rise and fall so that the semiconductor enters the high-temperature chamber or the low-temperature chamber for a hot and cold shock test. During the test, the driving motor can drive the rotating rod to rotate, thereby driving the driving gear to rotate. The driving gear drives the top rotating column to rotate through the engagement with the driven gear, and then drives the two turntables to rotate. When the turntable rotates, the mounting rod drives multiple trays to rotate, so that the semiconductor placed on the tray rotates at a uniform speed, so that the semiconductor placed on the tray is heated or cooled more evenly, thereby ensuring the reliability of the test data. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of a semiconductor thermal shock test chamber proposed by the utility model;

[0015] Figure 2 This is a front view structural diagram of a semiconductor thermal shock test box proposed by the utility model;

[0016] Figure 3 The utility model provides a semiconductor thermal shock test box. Figure 2 Enlarged structural diagram at point A in the middle.

[0017] In the figure: 1. Box body; 2. Test chamber; 3. Box door; 4. Partition; 5. High temperature chamber; 6. Low temperature chamber; 7. Heating component; 8. Cooling component; 9. Hydraulic rod; 10. Cover plate; 11. Connecting rod; 12. Rotating column; 13. Turntable; 14. Mounting rod; 15. Tray; 16. Driven gear; 17. Driving motor; 18. Rotating rod; 19. Driving gear; 20. Heat insulation cover; 21. Controller. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-3 The utility model provides a technical solution: a semiconductor thermal shock test chamber, comprising:

[0020] A box body 1 is provided with a test chamber 2, a box door 3 is installed on the front side of the box body 1, a partition 4 is fixedly installed in the middle of the test chamber 2, the partition 4 divides the test chamber 2 into a high-temperature chamber 5 and a low-temperature chamber 6, a heating component 7 is installed on the rear inner wall of the high-temperature chamber 5, and a cooling component 8 is installed on the rear inner wall of the low-temperature chamber 6, a hydraulic rod 9 is fixedly installed on the top wall of the box body 1, a lifting frame 22 is arranged at the bottom end of the hydraulic rod 9, the lifting frame 22 includes two cover plates 10, the two cover plates 10 are fixedly connected by a plurality of connecting rods 11, the lifting frame 22 is arranged in the through groove of the partition 4, and a rotating mechanism is arranged on the lifting frame 22.

[0021] The rotating mechanism includes two rotating columns 12, two mounting rods 14 and a driving assembly. The two rotating columns 12 are rotatably mounted at the center of one side wall opposite to the two cover plates 10 respectively. A turntable 13 is fixedly mounted on the two rotating columns 12. Both ends of the two mounting rods 14 are fixedly mounted on the two turntables 13 respectively. A plurality of trays 15 are fixedly mounted on the two mounting rods 14. The two turntables 13 can rotate on the lifting frame 22 through the rotation cooperation of the two rotating columns 12 and the two cover plates 10, so that the semiconductors placed on the trays 15 are rotated by driving the plurality of trays 15 to rotate through the mounting rods 14, so that the semiconductors placed on the trays 15 are heated or cooled more evenly.

[0022] The driving assembly includes a driven gear 16 and a driving motor 17, wherein the driven gear 16 is fixedly mounted on the top rotating column 12, and the driving motor 17 is fixedly mounted on the top cover plate 10. The output end of the driving motor 17 is transmission-connected with a rotating rod 18, and the rotating rod 18 is rotatably mounted on the top cover plate 10. A driving gear 19 is fixedly mounted on the bottom end of the rotating rod 18, and the driving gear 19 is meshingly connected with the driven gear 16. After the driving motor 17 is started, the rotating rod 18 can be driven to rotate, thereby driving the driving gear 19 to rotate. The driving gear 19 drives the top rotating column 12 to rotate by meshing with the driven gear 16, thereby driving the multiple trays 15 to rotate.

[0023] A heat insulation cover 20 is disposed outside the driving motor 17 . The heat insulation cover 20 is fixedly mounted on the top cover plate 10 . The heat insulation cover 20 serves to protect the driving motor 17 .

[0024] A controller 21 is fixedly mounted on the box body 1 . The controller 21 is electrically connected to the hydraulic rod 9 and the drive motor 17 through wires. The controller 21 is convenient for controlling the operation of the hydraulic rod 9 and the drive motor 17 .

[0025] The partition plate 4 and the two cover plates 10 are both made of heat-insulating materials to ensure that the temperatures of the high-temperature chamber 5 and the low-temperature chamber 6 do not affect each other.

[0026] Working principle: When the utility model is in use, the hydraulic rod 9 can drive the lifting frame 22 to move up and down to allow the semiconductor to enter the high-temperature chamber 5 or the low-temperature chamber 6 for a hot and cold shock test. During the test, the drive motor 17 can drive the rotating rod 18 to rotate, thereby driving the driving gear 19 to rotate. The driving gear 19 drives the top rotating column 12 to rotate through the engagement with the driven gear 16, and then drives the two turntables 13 to rotate. When the turntable 13 rotates, it drives multiple trays 15 to rotate through the mounting rod 14, so that the semiconductor placed on the tray 15 rotates at a uniform speed, so that the semiconductor placed on the tray 15 is heated or cooled more evenly, thereby ensuring the reliability of the test data.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor thermal shock test chamber, characterized in that: include: A box body (1) is provided with a test chamber (2), a box door (3) is installed on the front side of the box body (1), a partition (4) is fixedly installed in the middle of the test chamber (2), the partition (4) divides the test chamber (2) into a high-temperature chamber (5) and a low-temperature chamber (6), a heating component (7) is installed on the rear inner wall of the high-temperature chamber (5), and a cooling component (8) is installed on the rear inner wall of the low-temperature chamber (6), a hydraulic rod (9) is fixedly installed on the top wall of the box body (1), a lifting frame (22) is arranged at the bottom end of the hydraulic rod (9), the lifting frame (22) comprises two cover plates (10), the two cover plates (10) are fixedly connected by a plurality of connecting rods (11), the lifting frame (22) is arranged in a through groove of the partition (4), and a rotating mechanism is arranged on the lifting frame (22).

2. A semiconductor thermal shock test chamber according to claim 1, characterized in that: The rotating mechanism comprises two rotating columns (12), two mounting rods (14) and a driving assembly. The two rotating columns (12) are respectively rotatably mounted at the center of one side wall opposite to the two cover plates (10). A turntable (13) is fixedly mounted on the two rotating columns (12). Both ends of the two mounting rods (14) are respectively fixedly mounted on the two turntables (13). A plurality of trays (15) are fixedly mounted on the two mounting rods (14).

3. A semiconductor thermal shock test chamber according to claim 2, characterized in that: The driving assembly comprises a driven gear (16) and a driving motor (17), wherein the driven gear (16) is fixedly mounted on the top rotating column (12), and the driving motor (17) is fixedly mounted on the top cover plate (10). The output end of the driving motor (17) is transmission-connected with a rotating rod (18), and the rotating rod (18) is rotatably mounted on the top cover plate (10). A driving gear (19) is fixedly mounted on the bottom end of the rotating rod (18), and the driving gear (19) is meshingly connected with the driven gear (16).

4. A semiconductor thermal shock test chamber according to claim 3, characterized in that: A heat insulation cover (20) is arranged outside the driving motor (17), and the heat insulation cover (20) is fixedly mounted on the top cover plate (10).

5. A semiconductor thermal shock test chamber according to claim 4, characterized in that: A controller (21) is fixedly mounted on the box body (1), and the controller (21) is electrically connected to the hydraulic rod (9) and the drive motor (17) via a wire.

6. A semiconductor thermal shock test chamber according to claim 1, characterized in that: The partition plate (4) and the two cover plates (10) are both made of heat-insulating materials.

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