Self-adaptive imaging device

Abstract

According to the self-adaptive imaging device provided by the utility model, the projection assembly used for chip imaging is preset to be a detachable imaging module through the carrier assembly in the projection module, so that the adjustment process of a prism is omitted, and the efficiency of chip appearance detection is improved; meanwhile, the reflector assembly is matched with the horizontally arranged zoom imaging assembly, so that the longitudinal space of the appearance detection module is saved, and the stability of the whole appearance detection module is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to an adaptive imaging device. Background Art

[0002] In existing chip sorting equipment, the appearance of the chip will be inspected. The inspection method is mainly to capture images of the six sides of the chip through a visual capture module, and then convert the captured images into corresponding information and transmit them back to the main control system to complete the appearance analysis and evaluation of the six sides of the chip.

[0003] For example, in the patent for a system and method for detecting the end face appearance of a semiconductor laser chip with announcement number CN109100366, the patent arranges multiple side observation prisms in an optical device on the four sides of the chip, and uses the illumination beam provided by the light source to reflect the side appearance image of the four sides of the chip to an upward-looking camera. The upward-looking camera can be moved up and down to adjust the focal length, and captures clear images of the lower surface and four sides of the chip at one time to a coaxial microscope objective for appearance analysis; however, such a design still has many defects.

[0004] First, although the upward-looking camera can move up and down, it will occupy a large amount of longitudinal space of the entire sorting equipment, increase the center of gravity of the appearance inspection module of the sorting equipment, and easily affect the stability of the entire appearance inspection module; secondly, when the specifications of the chip change, it is necessary to adjust the arrangement position of each prism in the optical device again so that the four sides of the chip can be in the image reflection area of ​​the prism again. The entire adjustment process is time-consuming and labor-intensive, which reduces the efficiency of chip appearance inspection. Summary of the invention

[0005] In order to solve the above-mentioned technical problems, the purpose of the utility model is to provide an adaptive imaging device, which presets the projection component used for chip imaging as a detachable imaging module through the carrier component in the projection module, thereby eliminating the adjustment process of the prism and improving the efficiency of chip appearance detection; at the same time, the cooperation of the reflector component and the horizontally arranged zoom imaging component saves the longitudinal space of the appearance detection module and improves the stability of the entire appearance detection module.

[0006] The technical solution of the utility model is achieved in this way:

[0007] An adaptive imaging device, comprising:

[0008] A support frame; configured as a support member in the imaging device;

[0009] The projection module comprises a carrier assembly connected to the support frame in a detachable manner, a longitudinal through hole is provided in the middle of the carrier assembly, a projection assembly for downwardly projecting four side images of the chip is provided on the carrier assembly, and the projection assembly comprises four prisms arranged in an array around the through hole; the four prisms form a receiving area for receiving the chip in the through hole;

[0010] Light source assembly; arranged directly below the projection module, and capable of providing an illumination beam for the lower surface and four side surfaces of the chip in the accommodation area;

[0011] A reflector assembly is arranged directly below the light source assembly; the reflector assembly includes a total reflection prism, and the total reflection prism includes a reflection inclined surface for reflecting the projection light beam;

[0012] A zoom imaging component is arranged horizontally on the side facing the reflective inclined surface to capture images of the lower surface and four side surfaces of the chip;

[0013] The projection component can project the lower surface and four side images of the chip downward to the reflector component through an illumination light beam. The reflector component can horizontally reflect the projection light beam forming the lower surface and four side images of the chip to the zoom imaging component. The zoom imaging component can capture clear images of the lower surface and four side surfaces of the chip by changing the focal length.

[0014] Preferably, the light source assembly is a coaxial light source connected to the support frame; the illumination beam provided by the coaxial light source is uniform and soft, which can make the image quality of the bottom surface and surrounding sides of the chip clearer.

[0015] Preferably, the carrier assembly includes an upper shell and a lower shell, both of which are longitudinally penetrated by through holes in the middle. The upper shell and the lower shell are aligned with the projection assembly and connected with screws; so that the projection assembly is wrapped by the two shells into a module that is easy to replace and move.

[0016] Preferably, a beam channel toward the light source assembly is provided on the lower shell, and the beam channel array is arranged around the through hole and forms a cross channel with the through hole; the passing area of ​​the light beam is increased to ensure good imaging effects on the bottom surface and surrounding sides of the chip.

[0017] Preferably, the reflecting bevel is forty-five degrees; the forty-five-degree reflecting bevel of the total reflection prism has a better reflection effect, and the vertical projection light beam is completely reflected horizontally to the zoom imaging component.

[0018] Preferably, the reflector assembly further comprises a shield, which fits the outer contour of the total reflection prism and blocks all exposed surfaces except the forty-five-degree reflection surface, thereby preventing other interfering light from interfering with the imaging effect of the chip.

[0019] Preferably, the zoom imaging component is a camera that is arranged to slide horizontally on the side facing the reflective inclined surface. The camera can form an adaptive focal length for the image of the lower surface and four side surfaces of the chip by sliding horizontally, so as to form a good image capture effect for chips of different sizes.

[0020] Preferably, the zoom imaging component is a zoom camera that is fixed horizontally on the side facing the reflective inclined surface and has a built-in zoom function, so that a good image capturing effect can be formed for chips of different sizes.

[0021] The principle of the utility model using the above technical solution is:

[0022] The utility model aims to provide an adaptive imaging device, which presets a projection component for chip imaging into a detachable imaging module through a carrier component in the projection module, and uses a reflector component to reflect the projection beam to a horizontally arranged zoom imaging component.

[0023] The beneficial effects of the utility model using the above technical solution are:

[0024] The detachable design of the carrier component allows multiple projection components of different specifications to be pre-installed on the corresponding carrier component during chip appearance inspection, so that the prism adjustment process during chip appearance inspection is simplified to the disassembly and assembly process of a projection module, which simplifies the prism adjustment steps and improves the efficiency of appearance inspection of chips of different specifications.

[0025] The zoom imaging assembly is horizontally arranged and forms a horizontal imaging effect with the reflector assembly for the images on the bottom and surrounding sides of the chip. Compared with placing the zoom imaging assembly directly under the projection assembly, this design does not need to raise the support frame, so that the center of gravity of the entire imaging device is maintained within a reasonable range, thereby ensuring the stability of the entire imaging device and saving the longitudinal space of the entire imaging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of a chip sorting device;

[0027] Figure 2 It is a schematic diagram of the structure of the pickup assembly;

[0028] Figure 3 It is a cross-sectional view of the suction nozzle;

[0029] Figure 4 is an enlarged view of the second visual module;

[0030] Figure 5 This is an enlarged view of the electrical performance test module;

[0031] Figure 6is an enlarged view of the first visual module;

[0032] Figure 7 is a schematic diagram of the structure of an adaptive imaging device;

[0033] Figure 8 is a schematic diagram of the front structure of the projection module;

[0034] Fig. 9 is a schematic diagram of the back structure of the projection module;

[0035] Fig.10 The schematic diagram of the arrangement of the four prisms after the upper shell is hidden;

[0036] Fig.11 A schematic diagram of the optical path when the adaptive imaging device detects the bottom surface and surrounding sides of the chip;

[0037] Fig.12 The schematic diagram of the structure for installing the horizontal plate;

[0038] Fig.13 It is a schematic diagram of the structure on the back of the upper shell;

[0039] Fig.14 is a schematic diagram of the structure of the lower shell;

[0040] The figures are marked as follows: 1-vibration feeding assembly, 2-first visual module, 3-second visual module, 4-appearance inspection module, 5-electrical performance inspection module, 6-distribution barrel, 7-taping packaging machine, 8-pickup assembly, 9-ion blower, 10-driving mechanism, 11-operating table, 21-first camera, 22-first light hole, 31-second camera, 32-second light source assembly, 41-optical imaging module, 41a-carrier assembly, 42-coaxial light source, 43-reflector assembly, 44-zoom imaging assembly, 45-L-shaped plate, 46-horizontal through hole, 47-mounting cross plate, 48-support frame, 51- Horizontal support platform, 52-pressure sensor, 81-driving element, 82-mounting plate, 83-rotating shaft, 84-suction nozzle, 85-bearing box, 86-elastic member, 87-connecting sleeve, 88-zero position sensor, 89-sensing sheet, 411-upper shell, 411a-sinking groove, 412-prism, 412a-beam reflecting surface, 413-lower shell, 413a-beam channel, 414-mounting slot, 415-positioning hole, 431-total reflection prism, 432-reflecting bevel, 433-shield, 471-accommodating groove, 472-through area, 473-positioning pin, b-accommodating area, s-through hole. DETAILED DESCRIPTION

[0041] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0042] In the description of the present invention, the term "at least one" refers to one or more than one, unless otherwise clearly defined. The terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0043] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0044] The utility model has multiple implementation modes, and the specific implementation modes are as follows:

[0045] Example 1: Figure 1-14 As shown, this embodiment provides an adaptive imaging device, which is installed on a chip sorting device. The chip sorting device includes a vibration loading component 1. The vibration loading component 1 can flip a plurality of partial chips placed on the upper end of the vibration loading component 1 into chips to be selected with the front side facing up under the vibration of the vibration loading component 1.

[0046] Furthermore, the upper end of the vibration loading component 1 has a tray for placing chips. In order to avoid electrostatic interference between the tray and the chips during chip sorting, an ion fan 9 for eliminating static electricity is also provided at the upper end of the side of the vibration loading component; the vibration mechanism connected below the tray can drive the tray to vibrate, so that among the multiple chips on the upper end of the tray, some chips are flipped to the front side under the action of vibration, that is, the chips to be selected with the upper end facing up. For the specific structure and working principle of the vibration loading component 1, please refer to the relevant content of the announcement number CN217172052, which will not be repeated here.

[0047] like Figure 6 As shown, a first visual module 2 is provided at the upper end of the tray. The first visual module 2 can capture the position distribution image of multiple chips at the upper end of the vibration component, and then feed back the captured initial position distribution image information to the control system. The control system then divides the initial position distribution information of the multiple chips into multiple sorting areas containing chips to be selected.

[0048] Furthermore, the first visual module 2 includes a first camera 21 fixed above the vibration loading component 1, and a light-through plate is provided between the first camera 21 and the vibration loading component 1, and a first light-through hole 22 is provided on the light-through plate and passes downward therethrough. The first camera 22 is directly opposite to the first light-through hole 22, and can capture the initial distribution diagram of the chips on the vibration loading component 1, and transmit the distribution image information back to the control system. Since the vibration loading component 1 cannot guarantee that all chips will be flipped upward through vibration, the control system will divide the chip area to be selected according to the distribution of the chips facing upward, and then the control system will randomly select a target sorting area from multiple sorting areas, and then control the driving mechanism 10 to drive the second visual module 3 to move above the target sorting area, and the second visual module 3 will capture the front images of multiple chips to be selected in the target sorting area.

[0049] Furthermore, the driving mechanism 10 is a three-axis module electrically connected to the control system; the three-axis module has high precision and practical effect, multiple modules can be installed on the three-axis module, and the corresponding modules can be accurately driven to move to the predetermined position in the plane and vertical space.

[0050] Further, if Figure 4 As shown, the second vision module 3 is connected to the driving mechanism 10, including a second camera 31. A second light source component 32 for illumination is provided at the lower end of the second camera 31. The driving mechanism 10 can drive the second vision module 3 to move to the selected target sorting area, and clearly and accurately capture a clear image of the selected target sorting area under the illumination of the second light source component 32. After that, the second vision module 3 randomly selects a single chip to be selected according to the captured front image, and generates and feeds back the precise position information of the corresponding single chip to be selected to the control system.

[0051] Furthermore, in order to sort the chips to be selected in the target sorting area one by one, the second visual module 3 will select a chip to be selected in the generated image to start the sorting operation, and in order to facilitate the picking of the chip to be selected, the second visual module 3 will send the position information of the chip to be selected back to the control system, and the control system will generate the precise position point of the corresponding chip to be selected. After receiving the precise position information of a single chip to be selected, the control system will issue an instruction to the drive mechanism 10, so that the drive mechanism 10 drives the picking component 8 to move first to the top of the corresponding chip to be selected, and the picking component 8 picks up a single chip to be selected and then moves it to the detection module for quality inspection; then the detection module feeds back the detection information of the chip to the control system.

[0052] Furthermore, the detection module can be any module that detects the corresponding performance of the chip. Therefore, in this embodiment, the detection module is regarded as the appearance detection module 4 for explanation. Figure 7-14As shown, the appearance inspection module 4 can simultaneously inspect the appearance of the bottom surface and the surrounding sides of the chip to be selected, and then generate and feed back corresponding appearance inspection information to the control system; thereby completing the appearance inspection of the bottom surface and surrounding areas of the chip to be selected at one time, eliminating the need for multiple image captures of the chip to be selected, and improving the inspection and sorting efficiency of the chip to be selected.

[0053] Further, the appearance detection module 4 is an adaptive imaging device to be explained in this embodiment, which includes a support frame 48, and the support frame 48 is connected to the optical imaging module 41 and the coaxial light source 42 in sequence from top to bottom, wherein the support frame includes an L-shaped plate 45 and a mounting cross plate 47, the L-shaped plate 45 includes a horizontal plate and a vertical plate perpendicular to the horizontal plate, the upper edge of the vertical plate is connected to the mounting cross plate 47, and the mounting cross plate 47 is provided with a receiving groove 471 for installing the optical imaging module 41, and the receiving groove 471 has a through area 472 for light transmission, and the through area 472 penetrates the mounting cross plate 47 downward.

[0054] Furthermore, the optical imaging module 41 includes a carrier component 41a connected to the mounting horizontal plate 47 in a detachable manner, a longitudinal through hole s is provided in the middle of the carrier component 41a, and a projection component for projecting the four side images of the chip downward is provided on the carrier component 41a, and the projection component includes four prisms 412 arranged in an array around the through hole; the four prisms 412 form a accommodating area b for accommodating the chip in the through hole; each prism 412 has a light beam reflecting surface 412a facing the chip, and when the picking component 8 picks up the chip to be selected and is in the accommodating area b, the chip to be selected is still acted upon by the picking component 8 and is not in direct contact with the appearance detection module 4, and at this time, the light beam reflecting surface 412a of the projection component can project the lower surface and four side images of the chip downward through the illumination beam of the coaxial light source 42.

[0055] Further, there is a reflector assembly 43 directly below the projection assembly, and the reflector assembly 43 includes a total reflection prism 431, and the total reflection prism 431 includes a 45-degree reflection bevel 432 for reflecting the projection light beam, and the 45-degree reflection bevel 432 is a reflection surface after being deflected 45 degrees in the horizontal direction. A horizontal through hole 46 is provided on the vertical plate of the L-shaped plate 45, and a zoom imaging assembly 44 has a reflection bevel 432 facing horizontally at 45 degrees along the axis direction of the horizontal through hole 46. When the projection light beam forming the lower surface and four side surface images of the chip is projected vertically downward, the 45-degree reflection bevel 432 can reflect it horizontally so that it passes through the horizontal through hole 46. And reaches the zoom imaging component 44, which can capture clear images of the lower surface and four sides of the chip by changing the focal length; if the reflector component 43 is not set, and the zoom imaging component 44 is directly set under the projection component, the vertical space of the support frame 48 will be bloated, affecting the stability of the entire appearance detection module 4. Therefore, this design sets the zoom imaging component 44 in the horizontal direction, saving the vertical space of the appearance detection module 4 and ensuring its stability; in addition, the zoom feature of the zoom imaging component 44 also enables the appearance detection module 4 to capture the bottom and surrounding images of chips of various sizes, thereby forming an adaptive imaging effect on the bottom and surrounding images of the chip.

[0056] Furthermore, the reflector assembly also includes a shield 433, which fits the outer contour of the total reflection prism 431, that is, it is put on the total reflection prism 433, and the shield 433 blocks all exposed surfaces except the forty-five-degree reflecting inclined surface 432; the blocking of the shield 433 can ensure that no other interfering light will pass through the total reflection prism 431, so as to ensure that the image formed by the zoom imaging assembly 44 has sufficient clarity.

[0057] Furthermore, in order to accommodate appearance inspection of chips of various specifications, the carrier component 41a is connected in the accommodating groove 471 in a detachable manner. Two upwardly extending positioning pins 473 are provided on the bottom wall of the accommodating groove 471 around the through-area 472. The carrier component 41a is sleeved on the positioning pins 473 and remains fixed during operation. The positioning pins 473 can be slid out during disassembly, thereby facilitating the replacement of the optical imaging module 41. This design presets the optical imaging module 41 as a detachable module. When the specification of the chip to be inspected changes, it is only necessary to replace the corresponding preset module. There is no need to rearrange the four array-arranged prisms 412, which saves time and improves the inspection speed.

[0058] Furthermore, the carrier assembly 41a includes an upper shell 411 and a lower shell 413 which are mounted on the projection assembly, and the through hole s penetrates the middle of the upper shell 411 and the middle of the lower shell 413 at the same time. After the through hole s penetrates the upper shell 411, it can avoid the chip to be selected picked up by the picking assembly 8; and the through hole s penetrates the lower shell 413 in order to receive the illumination light beam of the coaxial light source 42 so that the illumination light beam can be smoothly irradiated to the chip to be selected.

[0059] Further, if Fig.13 As shown, the lower end surface of the upper shell 411 is provided with a groove 411a that matches the contour of the four prisms 412, so that when the four prisms 412 are placed in the groove 411a, they will remain horizontally fixed; in order to prevent the four prisms 412 from falling out of the groove 411a, the upper shell 411 and the lower shell 413 are aligned up and down behind the four prisms 412 and connected together with screws.

[0060] Further, if Fig.12 , 14 As shown, the lower shell 413 is provided with two holes corresponding to the positioning pin 473, and the two holes are respectively a mounting slot 414 whose inner diameter is slightly larger than the outer diameter of the positioning pin 473 and a positioning hole 415 whose size matches the positioning pin 473. This design makes it more convenient to install the lower shell 413 on the positioning pin 473; this is because if the two holes are both positioning holes 415, when the positioning hole 415 and the positioning pin 473 are slightly misaligned or have size deviations due to manufacturing errors in the lower shell 413, it will make it difficult for the entire lower shell to be fitted on the positioning pin 473. Therefore, the design of the mounting slot 414 can provide sufficient tolerance space after one of the positioning pins 473 is positioned with the positioning hole 415, so that the lower shell 413 can be quickly installed in the accommodating groove 471.

[0061] Further, if Fig.14 As shown, in order to increase the incident area of ​​the illumination light beam generated by the coaxial light source 42, a beam channel 413a facing the coaxial light source 42 is provided on the lower shell 413, and the beam channels 413a are arranged in an array around the through hole s and form a cross-shaped light-transmitting channel with the through hole s on the lower shell 413.

[0062] Furthermore, the zoom imaging component 44 is a camera that is arranged to slide in the horizontal direction on the side facing the reflective slope 432. The camera can form an adaptive focal length for the image of the lower surface and four side surfaces of the chip by horizontal sliding; in order to adapt to the size range of different chips, the sliding range of the camera in the horizontal direction is usually 0.01mm-13mm.

[0063] Furthermore, when the appearance information of the bottom and sides of the chip is sent back to the control system, the control system performs chip quality analysis based on the received detection information. If the quality of the chip to be selected meets the requirements, the next detection step is performed. If the quality of the chip to be selected does not meet the requirements, the control system controls the drive mechanism 10 to drive the picking component 8 to place the chip to be selected that does not meet the quality requirements in the corresponding discharge area, and then circulates it to the target sorting for the next chip to be selected. Specifically, the next detection step can be performed only when the chip to be selected is qualified, and the unqualified ones will be transferred to the discharge area, thereby avoiding the unqualified chips from continuing to be sorted, which not only ensures the quality stability of the sorted chips to be selected, but also forms a closed-loop quality control effect for the chip sorting.

[0064] Furthermore, after the appearance inspection is completed, the control system controls the driving mechanism 10 and drives the picking component 8 to place the selected chips that meet the quality requirements in the corresponding discharge area; specifically, the discharge area is provided with multiple discharge barrels 5 and a braiding packaging machine 6. When the selected chips are sorted, the chips can be arranged according to different requirements. The picking component 8 can place the chips in the corresponding discharge barrel 5, or the braiding packaging machine 6 can perform braiding packaging on the sorted chips.

[0065] Furthermore, in order to cyclically sort the chips to be selected in the target sorting area, when the chip to be selected passes the quality inspection, the picking component 8 will return to the initial target sorting area again to perform the sorting operation of the next chip to be selected, until all the chips in the entire target sorting area are sorted, and no chips will be missed during sorting.

[0066] Furthermore, in order to sort all the chips to be selected in the sorting area, after sorting the chips to be selected in one of the target sorting areas, the picking component 8 will move to the next target sorting area for chip sorting to ensure that the chips to be selected in all the sorting areas can be sorted.

[0067] Furthermore, when all the chips to be selected in the sorting areas have been sorted, there are still unsorted chips facing down on the upper end of the vibration loading component 1. Therefore, it is necessary to start the vibration loading component 1 again to vibrate the remaining chips to flip them into chips to be selected facing up, and then perform specific sorting operations, and so on, until all the chips on the upper end of the vibration loading component 1 can be sorted.

[0068] Furthermore, the second visual module 3 can also cooperate with the control system to complete the front appearance inspection of the chip with the front appearance of the chip as the quality standard. That is, while the second visual module 3 feeds back the precise position information of the single chip to be selected, it generates and feeds back the front appearance inspection information of the single chip to be selected to the control system based on the captured front image.

[0069] Furthermore, the front image captured by the second visual module 3 includes the front appearance images of multiple chips to be selected. Therefore, after the second visual module 3 determines the single chip to be selected for sorting, it can also synchronously send the image back to the control system. After receiving the image, the control system will perform a front appearance analysis on the selected chip to detect whether its front appearance quality meets the requirements.

[0070] Furthermore, after the selected chips are vibrated and loaded by the vibrating loading assembly 1, their distribution directions are not uniform. Therefore, in order to ensure that the selected chips are in a uniform direction before being placed in the detection module, Figure 2 As shown, the picking component 8 includes a correction component and a nozzle component for picking up chips, which are sequentially arranged longitudinally on a mounting plate 82. The correction component includes a driving element 81 and a rotating shaft 83. The driving element 81 is a motor, and the motor is connected to the rotating shaft by a belt drive. The middle part of the rotating shaft 83 is installed in a bearing box 85 to ensure that the rotating shaft 83 can stably rotate along its own axis in the longitudinal direction; the lower end of the rotating shaft 83 is connected to the nozzle assembly, and the driving element 81 is electrically connected to the control system; in step S4a, the control system can obtain and store the deflection information of the chip to be selected according to the front appearance detection information of the chip to be selected; in step S5, after the nozzle assembly picks up the chip to be selected, the control system can control the rotation of the rotating shaft 83 through the driving element 81 according to the stored deflection information to ensure that the chip is corrected to a predetermined orientation; this design ensures that the chip is in a uniform orientation when it is moved to the detection module, and avoids interference or collision with components on the detection module when the chip is placed in the detection module.

[0071] Further, after completing the orientation correction of the chip to be selected, the rotating shaft 83 needs to return to the initial position to facilitate the re-correction of the chip to be selected when picking up the chip to be selected next time. Therefore, it is necessary to provide an initial reference for the rotating shaft 83, that is, the shaft body of the rotating shaft 83 is connected with a sensing sheet 89, and the sensing sheet 89 has a zero position sensor 88, and the zero position sensor 88 is installed on the mounting plate 82. In step S5, when the driving element 81 drives the rotating shaft 83 to rotate and adjust the chip orientation, the sensing sheet 89 can trigger the zero position sensor 88 after the rotating shaft 83 deflects along the initial position, so that the zero position sensor 88 generates and sends the deflection angle information to the control system; after the picking component 8 places the chip to be selected into the corresponding discharge area, the control system can drive the rotating shaft 83 to rotate through the driving element 81 according to the deflection angle information, so that the sensing sheet 89 is reset to the initial position; the zero position sensor 88 and the sensing sheet 89 provide an angle deflection reference for the rotating shaft 83, so that the driving element 81 can perform the next chip deflection correction process according to the angle deflection reference.

[0072] Furthermore, when the user needs to test multiple properties of the chip to be selected, a corresponding quality inspection module can be set next to the appearance inspection module 4 to complete the inspection and sorting of multiple properties of the chip. For example, when the electrical performance inspection module 5 in this embodiment is inspected, the control system sends an instruction to the drive mechanism 10, so that the drive mechanism 10 drives the pickup assembly 8 to move the chip to the electrical performance inspection module 5, so that the chip and the electrical performance inspection module 5 are in contact with each other, and the electrical performance inspection of the single chip to be selected is completed; then the electrical performance inspection module 5 feeds back the electrical performance inspection information of the chip to the control system; specifically, Figure 5 As shown, the electrical performance detection module 5 includes a horizontal support platform 51, and a circuit detection device (not shown) corresponding to the chip detection specification is installed on the upper end of the horizontal support platform 51. During the electrical performance detection, the chip to be selected needs to be in contact with the circuit detection device before the electrical performance detection of the chip to be selected can be completed. After that, the circuit detection device sends the corresponding information back to the control system for sorting according to the detection results.

[0073] Furthermore, a pressure sensor 52 electrically connected to the control system is provided under the horizontal supporting platform 51 of the electrical performance detection module 5; when the selected chip is in contact with the circuit detection board on the electrical performance detection module 5, the pressure sensor 52 can sense the pressure in real time and feedback the pressure information to the control system; the pressure sensor 52 enables the control system to monitor the contact force between the chip and the electrical performance detection module 5 in real time, so as to avoid inadequate detection due to insufficient force or chip damage due to excessive force.

[0074] Further, if Figure 3 As shown, the suction nozzle assembly includes a suction nozzle 84 connected to the lower end of the rotating shaft 83 for sucking chips and an elastic member 86 connected to the upper end of the suction nozzle 84, wherein the lower end of the rotating shaft 83 passes through the bearing box 85, and is connected to a connecting sleeve 87 for easy disassembly and assembly by a threaded manner, and the elastic member 86 is a spring arranged in the connecting sleeve 87, and the lower end of the spring abuts against the suction nozzle 84. In step S6a, when the chip picked up by the suction nozzle 84 is in contact with the electrical performance detection module 5, the elastic member 86 can produce elastic deformation to avoid rigid extrusion between the suction nozzle 84 and the chip to be selected, so as to form a buffer protection for the suction nozzle 84; this design avoids damage to the suction nozzle 84 due to excessive force when the chip contacts the electrical performance detection module 5, thereby improving the service life of the suction nozzle 84.

[0075] Furthermore, various quality inspection conditions of the chip can also be viewed in real time through the operating console 11 on the chip sorting device. The operating console 11 is a master control computer, and the predetermined quality parameters and standard data of the corresponding chip can also be imported or modified through the master control computer.

[0076] In addition, the user can either select one of the two modules for performance testing and sorting, or perform performance testing and corresponding sorting on both modules. It should be noted that there is no order restriction for the testing steps of the selected chip on the electrical performance testing module 5 and the appearance testing module 4. The appearance quality of the selected chip can be first tested on the appearance testing module 4, or the electrical performance of the selected chip can be first tested on the electrical performance testing module 5.

[0077] Embodiment 2: The difference between this embodiment and embodiment 1 is that the zoom imaging component 44 can also be a zoom camera fixed in the horizontal direction on the side facing the reflective slope 432 and with a built-in zoom function. This camera can change the distance between each lens in the lens through an internal mechanical mechanism to change the focal length of the camera, and capture the requirements of the appearance image of the bottom and surroundings of the chip in an adaptive manner. After capturing the appearance image of the bottom and surroundings of the chip, it can also send it to the control system for appearance detection of the bottom and surrounding images of the chip.

[0078] The above schematically describes the present invention and its implementation methods, which are not restrictive. The drawings show only one implementation method of the present invention, and the actual structure is not limited thereto. Therefore, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the present invention, they should all fall within the protection scope of the present invention.

Claims

1. An adaptive imaging device, characterized in that: include: A support frame (48) configured as a support member in the imaging device; Projection module; It comprises a carrier component (41a) connected to a support frame (48) in a detachable manner, a longitudinal through hole (s) being provided at the middle of the carrier component (41a), a projection component for projecting four side images of a chip downwardly being provided on the carrier component (41a), the projection component comprising four prisms (412) arranged in an array around the through hole (s); the four prisms (412) form a receiving area (b) for receiving the chip in the through hole (s); A light source assembly is arranged directly below the projection module and can provide an illumination beam for the lower surface and four side surfaces of the chip in the accommodation area (b); A reflector assembly (43); arranged directly below the light source assembly; the reflector assembly (43) comprises a total reflection prism (431), and the total reflection prism (431) comprises a reflection inclined surface (432) for reflecting a projection light beam; A zoom imaging component (44) is arranged in the horizontal direction on a side facing the reflective inclined surface (432) to capture images of the lower surface and four side surfaces of the chip; The projection component can project the lower surface and four side images of the chip downward to the reflector component (43) through an illumination light beam. The reflector component (43) can horizontally reflect the projection light beam forming the lower surface and four side images of the chip to the zoom imaging component (44). The zoom imaging component (44) can capture clear images of the lower surface and four side images of the chip by changing the focal length.

2. The adaptive imaging device according to claim 1, characterized in that: The light source assembly is a coaxial light source (42) connected to a support frame (48).

3. The adaptive imaging device according to claim 1, characterized in that: The carrier assembly (41a) comprises an upper shell (411) and a lower shell (413) both of which are longitudinally penetrated by a through hole (s) in the middle thereof. The upper shell (411) and the lower shell (413) are matched up and down on the projection assembly and connected by screws.

4. The adaptive imaging device according to claim 3, characterized in that: The lower shell (413) is provided with a light beam channel (413a) facing the light source assembly, and the light beam channels (413a) are arranged in an array around the through hole (s) and form a cross-shaped channel with the through hole (s).

5. The adaptive imaging device according to claim 1, characterized in that: The reflection slope (432) is forty-five degrees.

6. The adaptive imaging device according to claim 5, characterized in that: The reflector assembly also includes a protective cover (433), which fits the outer contour of the total reflection prism (431) and blocks all exposed surfaces except the forty-five-degree reflective inclined surface (432).

7. The adaptive imaging device according to claim 1, characterized in that: The zoom imaging component (44) is a camera that is arranged to slide in the horizontal direction on a side facing the reflective inclined surface (432), and the camera can form an adaptive focal length for the image of the lower surface and four side surfaces of the chip through horizontal sliding.

8. The adaptive imaging device according to claim 1, characterized in that: The zoom imaging component (44) is a zoom camera that is fixed in the horizontal direction on a side facing the reflective inclined surface (432) and has a built-in zoom function.

Images