Semiconductor thermal test device capable of rapidly cooling

Abstract

The utility model discloses a semiconductor thermal testing device capable of rapidly cooling, which comprises an electric heating module, an inner shell and an outer shell are sequentially arranged outside the electric heating module, and clamping cavities are arranged between the electric heating module and the inner shell and between the inner shell and the outer shell. The tops of the electric heating module, the inner shell and the outer shell are fixedly connected with a fixing plate, and a flip cover is hinged to the upper portion of the fixing plate; a test cavity is formed in the electric heating module, and a second through hole is formed in the bottom of the test cavity; a placement hole of a circular structure is formed in the middle of the fixing plate, an air outlet and an air inlet are sequentially formed in the periphery of the placement hole, the air outlet is communicated with a clamping cavity between the electric heating module and the inner shell, and the air inlet is communicated with a clamping cavity between the inner shell and the outer shell. The semiconductor thermal test device provided by the utility model can solve the problems of low heat energy utilization rate and high energy consumption in the thermal test process, and also can solve the problems of slow cooling speed and non-uniformity of the semiconductor product and the heating module.

Description

Technical Field

[0001] The utility model relates to a semiconductor thermal testing device capable of rapidly cooling down, belonging to the technical field of semiconductor testing. Background Art

[0002] With the development of semiconductor technology and the research of semiconductor materials, microelectronics technology is developing towards high density and high reliability, and various new semiconductor materials have emerged. Nowadays, various products with semiconductor materials as chips have been widely used in people's lives and production. Semiconductor devices are generally used in the fields of electronics and electrical appliances. When such equipment and devices are in use, they will exceed normal temperature. Therefore, semiconductor devices need to have certain high temperature resistance.

[0003] Semiconductor devices need to be tested by thermal testing devices to test their high temperature resistance. However, existing semiconductor thermal testing devices have the following technical problems during use:

[0004] 1. During the test, the heating module generates a lot of heat energy, much of which will be dissipated into the surrounding environment, resulting in low thermal energy utilization and high energy consumption.

[0005] 2. After the test, the semiconductor products and heating modules need a long time to cool to room temperature, and the cooling process is uneven.

[0006] In summary, the prior art obviously has inconveniences and defects in practical use, so it is necessary to improve it. Utility Model Content

[0007] In view of the deficiencies in the background technology, the utility model provides a semiconductor thermal testing device that can quickly cool down, which can solve the problems of low thermal energy utilization and high energy consumption during thermal testing, and can also solve the problems of slow and uneven cooling of semiconductor products and heating modules.

[0008] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0009] A semiconductor thermal testing device capable of rapid temperature reduction comprises an electric heating module, an inner shell and an outer shell are sequentially arranged outside the electric heating module, a clamping cavity is arranged between the electric heating module and the inner shell, and between the inner shell and the outer shell, the top of the electric heating module, the inner shell and the outer shell are fixedly connected to a fixing plate, and a flip cover is hinged above the fixing plate;

[0010] A test cavity is provided inside the electric heating module, and a second through hole is provided at the bottom of the test cavity;

[0011] A circular placement hole is provided in the middle of the fixing plate, and an air outlet and an air inlet are sequentially provided on the periphery of the placement hole. The air outlet is connected to the clamping cavity between the electric heating module and the inner shell, and the air inlet is connected to the clamping cavity between the inner shell and the outer shell.

[0012] Furthermore, the second through hole connects the test cavity in the electric heating module with the clamping cavity between the electric heating module and the inner shell.

[0013] Furthermore, the air outlet and the air inlet are both arc-shaped hole structures.

[0014] Furthermore, the number of the air outlets and the air inlet are both multiple and distributed in a circle.

[0015] Furthermore, a fan is installed below the inner shell, and an annular portion for installing the fan is provided at the bottom end of the inner shell.

[0016] Furthermore, a first through hole is provided at the bottom of the inner cavity of the inner shell, and the first through hole is connected to the outlet end of the fan, and the inlet end of the fan is located in the cavity between the inner shell and the outer shell.

[0017] Furthermore, a visual scanning module is installed at the bottom of the flip cover.

[0018] Furthermore, a handle is integrally formed with the side of the flip cover.

[0019] Compared with the prior art, the utility model has the following advantages after adopting the above technical solution:

[0020] The electric heating module is powered on to heat the semiconductor device for thermal testing. The heat is kept warm by the cavity between the electric heating module and the inner shell, and between the inner shell and the outer shell, so as to reduce heat loss and solve the problem of low thermal energy utilization and high energy consumption during thermal testing.

[0021] The airflow enters the cavity between the inner shell and the outer shell from the air inlet, and then enters the cavity between the electric heating module and the inner shell from the first through hole and is divided into two, blowing toward the inside and outside of the electric heating module. During the flow, the airflow quickly and comprehensively cools down the electric heating module and the semiconductor devices.

[0022] The utility model is described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the utility model;

[0024] Figure 2 It is a top view of the structure of the fixed plate;

[0025] Figure 3It is a schematic diagram of air flow during the cooling process of the utility model.

[0026] In the figure, 1-outer shell; 2-fixing plate, 21-placing hole, 22-air inlet, 23-air outlet; 3-inner shell, 31-annular portion, 32-first through hole; 4-electric heating module, 41-second through hole; 5-flip cover, 51-handle; 6-visual scanning module; 7-fan; 8-semiconductor device. DETAILED DESCRIPTION

[0027] In order to have a clearer understanding of the technical features, purposes and effects of the utility model, the specific implementation methods of the utility model are now described with reference to the accompanying drawings.

[0028] like Figure 1-Figure 3 As shown together, the utility model provides a semiconductor thermal testing device that can quickly cool down, including an electric heating module 4, the outside of which is sequentially provided with an inner shell 3 and an outer shell 1, and a heat-insulating cavity is provided between the electric heating module 4 and the inner shell 3, and between the inner shell 3 and the outer shell 1, and the electric heating module 4, the inner shell 3 and the top of the outer shell 1 are fixedly connected to a fixing plate 2.

[0029] The electric heating module 4 is provided with a test cavity inside, in which the semiconductor device 8 to be tested can be placed, and the bottom of the test cavity is provided with a second through hole 41. The second through hole 41 connects the test cavity in the electric heating module 4 with the clamping cavity between the electric heating module 4 and the inner shell 3, so as to facilitate airflow.

[0030] A circular placement hole 21 is provided in the middle of the fixing plate 2 , through which the semiconductor device 8 enters the test cavity inside the electric heating module 4 .

[0031] The periphery of the placement hole 21 is sequentially provided with an air outlet 23 and an air inlet 22 , and both the air outlet 23 and the air inlet 22 are arc-shaped hole structures.

[0032] The number of the air outlets 23 and the air inlet 22 are both multiple and distributed in a circle.

[0033] The air outlet 23 is communicated with the cavity between the electric heating module 4 and the inner shell 3 , and the air inlet 22 is communicated with the cavity between the inner shell 3 and the outer shell 1 .

[0034] A fan 7 is installed below the inner shell 3. The bottom end of the inner shell 3 is provided with an annular portion 31 for installing the fan 7. The bottom of the inner cavity of the inner shell 3 is provided with a first through hole 32. The first through hole 32 is connected to the outlet end of the fan 7. The inlet end of the fan 7 is located in the clamping cavity between the inner shell 3 and the outer shell 1.

[0035] The fan 7 drives the cooling air to flow, thereby achieving rapid cooling of the electric heating module 4 and the semiconductor device 8 .

[0036] A flap 5 is hinged on the top of the fixed plate 2, and the flap 5 can play a role in heat preservation.

[0037] A visual scanning module 6 is installed at the bottom of the flip cover 5, and the visual scanning module 6 is used to scan the state of the semiconductor device 8 during the thermal test process in real time. The visual scanning module 6 swings with the flip cover 5. When the flip cover 5 is in a closed state, the visual scanning module 6 is in the placement hole 21 of the fixed plate 2 and is located above the test cavity.

[0038] A handle 51 is formed integrally with the flip cover 5 on its side, and the flip cover 5 can be easily lifted up by the handle 51 .

[0039] The specific working principle of this utility model:

[0040] The semiconductor device 8 is placed in the test cavity of the electric heating module 4. The electric heating module 4 is powered on for heating to perform a thermal test on the semiconductor device 8. The heat is insulated by the cavity between the electric heating module 4 and the inner shell 3 and between the inner shell 3 and the outer shell 1 to reduce heat loss.

[0041] During the test, the state of the semiconductor device 8 during the thermal test process is scanned in real time by the visual scanning module 6. After the test is completed, the flip cover 5 is lifted, the fan 7 is started, and the airflow enters the sandwich cavity between the inner shell 3 and the outer shell 1 from the air inlet 22, and then the airflow enters the sandwich cavity between the electric heating module 4 and the inner shell 3 from the first through hole 32, and is divided into two, blowing to the inner and outer sides of the electric heating module 4, and finally the airflow is discharged from the air outlet 23. During the flow of the airflow, the electric heating module 4 and the semiconductor device 8 are quickly and comprehensively cooled.

[0042] The above is an example of the best implementation of the utility model, and the parts not described in detail are common knowledge of ordinary technicians in this field. The protection scope of the utility model is based on the content of the claims, and any equivalent transformation based on the technical inspiration of the utility model is also within the protection scope of the utility model.

Claims

1. A semiconductor thermal testing device capable of rapid cooling, characterized in that: It comprises an electric heating module (4), the outside of which is provided with an inner shell (3) and an outer shell (1) in sequence, a clamping cavity is provided between the electric heating module (4) and the inner shell (3), and between the inner shell (3) and the outer shell (1), the top of the electric heating module (4), the inner shell (3) and the outer shell (1) are all fixedly connected to a fixing plate (2), and a flip cover (5) is hingedly connected above the fixing plate (2); A test cavity is provided inside the electric heating module (4), and a second through hole (41) is provided at the bottom of the test cavity; A placement hole (21) of a circular structure is provided in the middle of the fixing plate (2), and an air outlet (23) and an air inlet (22) are sequentially provided on the periphery of the placement hole (21); the air outlet (23) is connected to the cavity between the electric heating module (4) and the inner shell (3), and the air inlet (22) is connected to the cavity between the inner shell (3) and the outer shell (1).

2. A semiconductor thermal testing device capable of rapid cooling as claimed in claim 1, characterized in that: The second through hole (41) connects the test cavity in the electric heating module (4) with the clamp cavity between the electric heating module (4) and the inner shell (3).

3. A semiconductor thermal testing device capable of rapid cooling as claimed in claim 1, characterized in that: The air outlet (23) and the air inlet (22) are both arc-shaped hole structures.

4. A semiconductor thermal testing device capable of rapid cooling as claimed in claim 3, characterized in that: The air outlets (23) and the air inlets (22) are both multiple in number and are distributed in a circular pattern.

5. A semiconductor thermal testing device capable of rapid cooling as claimed in claim 1, characterized in that: A fan (7) is installed below the inner shell (3), and an annular portion (31) for installing the fan (7) is provided at the bottom end of the inner shell (3).

6. A semiconductor thermal testing device capable of rapid cooling as claimed in claim 5, characterized in that: A first through hole (32) is provided at the bottom of the inner cavity of the inner shell (3); the first through hole (32) is connected to the outlet end of the fan (7); and the inlet end of the fan (7) is located in the cavity between the inner shell (3) and the outer shell (1).

7. A semiconductor thermal testing device capable of rapid cooling as claimed in claim 1, characterized in that: A visual scanning module (6) is installed at the bottom of the flip cover (5).

8. A semiconductor thermal testing device capable of rapid cooling as claimed in claim 1, characterized in that: A handle (51) is formed integrally with the flip cover (5) on the side thereof.

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