Rotary support and rotary corrosion table

Abstract

The utility model discloses a rotary support which comprises a support body and a limiting assembly, the support body comprises a first limiting edge and a second limiting edge, the limiting assembly comprises first limiting pieces and second limiting pieces, and the two ends of the first limiting edge and the two ends of the second limiting edge are each provided with one first limiting piece, one first limiting edge or one second limiting edge. Or the first limiting edge and the second limiting edge are provided with at least one second limiting piece, the second limiting pieces are located between the first limiting pieces, and the first limiting pieces and the second limiting pieces are located on the same circumference; the utility model further discloses a rotary corrosion table. Through the structural design of the frame body, the first limiting piece and the second limiting piece can be installed on the frame body at the same time, the first limiting piece serves as basic positioning, the second limiting piece increases limitation on wafer movement, and therefore the stability of wafer positioning is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer etching equipment, in particular to a rotating bracket and a rotating etching table. Background Art

[0002] The wafer rotary etching table is the main equipment for wafer etching. The wafer is supported by a rotating bracket, which drives the wafer to rotate. The bracket drives the wafer to rotate from low speed to high speed through the central rotating axis according to the set program. The purpose is to allow the colloidal liquid above the wafer to drip onto the wafer and form a uniform film on the surface, or to spray the cleaning liquid onto the wafer and then dry it under the centrifugal action of high-speed rotation.

[0003] The wafer used for chip manufacturing is not a complete circle. For wafers with a diameter of 150mm or less, one or two positioning edges in different positions are given on the edge to distinguish the crystal orientation and the conductive type. Depending on the crystal orientation and conductive type, some wafers have only one main positioning edge, and some have another secondary positioning edge in different directions in addition to the main positioning edge. The length of the main positioning edge is almost one-third of the wafer diameter.

[0004] When a rotating bracket with an existing structure is used to position the wafer of the above structure, the position of the positioning edge of the wafer when it is sent into the bracket is random. If its positioning edge is just "close to" a limit pin, the wafer has more "freedom" in the bracket, so there is some distance between the center of the wafer and the rotation center of the bracket. If the wafer is too eccentric, there is a certain risk when the bracket rotates at high speed. In severe cases, there is a problem that the wafer is easily thrown out of the bracket. Utility Model Content

[0005] The embodiment of the present application provides a rotating bracket to improve the stability of the rotating bracket in positioning the wafer. The embodiment of the present application also provides a rotating etching table.

[0006] The first aspect of the present application provides a rotating bracket, comprising:

[0007] The frame includes a first limiting edge and a second limiting edge;

[0008] A limiting component includes a first limiting member and a second limiting member, wherein the first limiting edge and the second limiting edge are respectively provided with a first limiting member at both ends, the first limiting edge or the second limiting edge, or the first limiting edge and the second limiting edge are provided with at least one second limiting member, the second limiting member is located between the first limiting members, and the first limiting member and the second limiting member are located on the same circumference.

[0009] The beneficial effect of the above embodiment is that: through the structural design of the frame, the frame can be installed with the first limiter and the second limiter at the same time, with the first limiter serving as the basic positioning and the second limiter increasing the restriction on the movement of the wafer, thereby improving the stability of wafer positioning.

[0010] Based on the above embodiments, the embodiments of the present application may also be improved as follows:

[0011] In one embodiment of the present application: the frame also includes a first supporting edge and a second supporting edge, one end of the first limiting edge and the second limiting edge are connected through the first supporting edge, the other end of the first limiting edge and the second limiting edge are connected through the second supporting edge, and the surfaces of the first supporting edge and the second supporting edge have bosses, and the bosses are used to support the wafer. The beneficial effect of this step: the first limiting edge and the second limiting edge are connected into a complete structure through the first supporting edge and the second supporting edge, and the wafer is lifted off the surfaces of the first supporting edge and the second supporting edge by the bosses.

[0012] In one embodiment of the present application: the connecting edge is connected between the first supporting edge and the second supporting edge, the lower surface of the connecting edge has a sleeve, the sleeve is provided with a hole body connected to the rotating shaft of the etching table, and the outer periphery of the sleeve is also provided with a locking screw hole connected to the hole body, and the locking screw hole is used to connect the positioning bolt. The beneficial effect of this step: by designing the sleeve, the frame can be stably connected to the etching table.

[0013] In one embodiment of the present application: a first weight-reducing hole is formed between the first limiting edge and the first supporting edge, the second supporting edge and the connecting edge; a second weight-reducing hole is formed between the second limiting edge and the first supporting edge, the second supporting edge and the connecting edge. Beneficial effect of this step: the weight of the frame is reduced by designing the first weight-reducing hole and the second weight-reducing hole.

[0014] In one embodiment of the present application: the first limiting edge and the second limiting edge are both configured with two second limiting members. Beneficial effect of this step: further improving the limiting of the wafer.

[0015] In one embodiment of the present application: the first limiting member of the first limiting edge and the first limiting member of the second limiting edge are symmetrically structured with the axis of the hole body as the center; the second limiting member of the first limiting edge and the second limiting member of the second limiting edge are symmetrically structured with the axis of the hole body as the center. Beneficial effect of this step: improving the stability of the second limiting member in limiting the wafer.

[0016] In one embodiment of the present application: the diameter of the inscribed circle of the inner edge of the first stopper and the second stopper is c larger than the corresponding wafer diameter, 1.5mm≤c≤2.5mm. Beneficial effect of this step: the wafer has a certain degree of freedom of movement.

[0017] In one embodiment of the present application: c=2 mm. The beneficial effect of this step is to enable the wafer to have a suitable degree of freedom of movement.

[0018] A second aspect of the present application provides a rotary etching table, comprising the rotary bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0020] Figure 1 is a schematic diagram of the structure of the rotating bracket;

[0021] Figure 2 This is a schematic diagram of a structure in which four first limiting members are used alone to limit the position of a wafer;

[0022] Figure 3 A schematic diagram of a structure in which four first limiting members and four second limiting members are used to limit the position of a wafer at the same time;

[0023] Figure 4 for Figure 2 and Figure 3 Schematic diagram of the structure after superposition.

[0024] Among them, 1 frame body, 101 first limiting edge, 102 second limiting edge, 103 first supporting edge, 104 second supporting edge, 105 boss, 106 connecting edge, 107 sleeve, 108 hole body, 109 locking screw hole, 110 first weight reduction hole, 111 second weight reduction hole;

[0025] 2 limit assembly, 201 first limit member, 202 second limit member. DETAILED DESCRIPTION

[0026] In this application, unless otherwise clearly specified and limited, the terms in this application should be understood in a broad sense, such as connection can be fixed connection, detachable connection or integration, direct connection or indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of different terms in this utility model can be understood according to specific circumstances, and the scope of the specific meaning should be limited to realizing the functions of this application.

[0027] Embodiment 1

[0028] A rotating bracket includes: a frame body 1 and a limiting assembly 2, wherein the frame body 1 includes a first limiting edge 101 and a second limiting edge 102, and the limiting assembly 2 includes a first limiting piece 201 and a second limiting piece 202. A first limiting piece 201 is respectively arranged at both ends of the first limiting edge 101 and the second limiting edge 102, and the first limiting edge 101 or the second limiting edge 102, or the first limiting edge 101 and the second limiting edge 102 are configured with at least one second limiting piece 202, and the second limiting piece 202 is located between the first limiting pieces 201, and the first limiting piece 201 and the second limiting piece 202 are located on the same circumference.

[0029] Specifically, the first limiting member 201 and the second limiting member 202 both use the same screws or bolts, and threaded holes are provided on the surfaces of the first limiting edge 101 and the second limiting edge 102. The first limiting member 201 and the second limiting member 202 are threadedly connected in the corresponding threaded holes. The use of bolts and screws is low-cost, easy to obtain and assemble.

[0030] Specifically, the frame 1 also includes a first supporting edge 103 and a second supporting edge 104, one end of the first limiting edge 101 and the second limiting edge 102 are connected through the first supporting edge 103, and the other end of the first limiting edge 101 and the second limiting edge 102 are connected through the second supporting edge 104, and the surfaces of the first supporting edge 103 and the second supporting edge 104 have a boss 105, and the boss 105 is used to support the wafer, and the first limiting edge 101 and the second limiting edge 102 are connected into a complete structure through the first supporting edge 103 and the second supporting edge 104, and the wafer is lifted off the surface of the first supporting edge 103 and the second supporting edge 104 by the boss 105.

[0031] Specifically, the frame 1 also includes a connecting edge 106, which is connected between the first supporting edge 103 and the second supporting edge 104. The lower surface of the connecting edge 106 has a sleeve 107, and the sleeve 107 is provided with a hole body 108 connected to the rotating axis of the corrosion table. The outer periphery of the sleeve 107 is also provided with a locking screw hole 109 connected to the hole body 108, and the locking screw hole 109 is used to connect the positioning bolt, wherein the hole body 108 is a square hole, and the locking screw hole 109 is a threaded hole or a smooth hole. When a threaded hole is used, the positioning bolt is threadedly connected to the threaded hole and presses the side of the rotating axis, thereby connecting the frame 1 to the rotating axis. When a smooth hole is used, the threaded end of the positioning bolt passes through the smooth hole and is threadedly connected to the threaded hole opened on the surface of the rotating axis, thereby connecting the frame 1 to the rotating axis. By designing the sleeve 107, the frame 1 can be stably connected to the corrosion table.

[0032] Specifically, a first weight-reducing hole 110 is formed between the first limiting edge 101 and the first supporting edge 103, the second supporting edge 104 and the connecting edge 106; a second weight-reducing hole 111 is formed between the second limiting edge 102 and the first supporting edge 103, the second supporting edge 104 and the connecting edge 106. The weight of the frame 1 is reduced by the design of the first weight-reducing hole 110 and the second weight-reducing hole 111.

[0033] Specifically, the first limiting edge 101 and the second limiting edge 102 are both configured with two second limiting members 202 . The limiting of the wafer is further improved by the plurality of second limiting members 202 , thereby improving the stability of the wafer movement.

[0034] Specifically, the first limiting member 201 of the first limiting edge 101 and the first limiting member 201 of the second limiting edge 102 are symmetrical structures with the axis of the hole body 108 as the center; the second limiting member 202 of the first limiting edge 101 and the second limiting member 202 of the second limiting edge 102 are symmetrical structures with the axis of the hole body 108 as the center, and the stability of the second limiting member 202 in limiting the wafer is improved through the symmetrical structure.

[0035] Specifically, the diameter of the inscribed circle at the inner edge of the first limit member 201 and the second limit member 202 is larger than the corresponding wafer diameter by c, 1.5mm≤c≤2.5mm. In this embodiment, c=2mm. Taking 5 inches (actually 4.9 inches, referred to as 5 inches in the industry) and 6 inches (actually 5.9 inches, referred to as 6 inches in the industry) as examples, the diameter of the 5-inch wafer is 125mm, then the diameter of the inscribed circle is 127mm, the diameter of the 6-inch wafer is 150mm, then the diameter of the inscribed circle is 152mm. By making the inscribed circle diameter larger than the wafer diameter, the wafer has a certain degree of freedom of movement.

[0036] Specifically, the frame 1, the first connecting member, and the second connecting member are all made of corrosion-resistant materials, specifically corrosion-resistant plastics, so as to avoid corrosion of the frame 1, the first connecting member, and the second connecting member during the process of corroding the wafer.

[0037] Now, the use of the first limiting member 201 alone and the use of the first limiting member 201 and the second limiting member 202 together are described as an example. Figure 2 As shown, four first limiting members 201 are used to limit the wafer. Figure 3 As shown, four first limiting members 201 and four second limiting members 202 are used to limit the wafer at the same time. Figure 4As shown, the above two limiting states are superimposed and displayed on the same figure for illustration. It can be seen that the first limiting member 201 and the second limiting member 202 are used simultaneously to limit the wafer, so that the center of the wafer is closer to the rotation center of the frame 1. Therefore, on the basis of the wafer having a certain degree of freedom of movement, it also has a better positioning function, thereby reducing the probability of the wafer being thrown out.

[0038] Embodiment 2

[0039] A rotary etching table comprises the rotary bracket disclosed in the first embodiment.

[0040] The above are only embodiments of the utility model. The common sense such as the known specific structures and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field are aware of all the common technical knowledge in the technical field to which the utility model belongs before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement the scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for the ordinary technicians in the relevant field to implement this application. It should be pointed out that for the technicians in this field, without departing from the structure of the utility model, several deformations and improvements can be made, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent.

Claims

1. A rotating bracket, characterized in that: include: The frame includes a first limiting edge and a second limiting edge; A limiting component includes a first limiting member and a second limiting member, wherein the first limiting member is respectively provided at both ends of the first limiting edge and the second limiting edge, and the first limiting edge or the second limiting edge, or the first limiting edge and the second limiting edge are provided with at least one second limiting member, the second limiting member is located between the first limiting members, and the first limiting member and the second limiting member are located on the same circumference.

2. The rotating bracket according to claim 1, characterized in that: The frame also includes a first supporting edge and a second supporting edge, one end of the first limiting edge and the second limiting edge are connected through the first supporting edge, the other end of the first limiting edge and the second limiting edge are connected through the second supporting edge, and the surfaces of the first supporting edge and the second supporting edge have a boss, and the boss is used to support the wafer.

3. The rotating bracket according to claim 2, characterized in that: The frame also includes a connecting edge, which is connected between the first supporting edge and the second supporting edge. The lower surface of the connecting edge has a sleeve, and the sleeve is provided with a hole body connected to the rotating axis of the corrosion table. The outer periphery of the sleeve is also provided with a locking screw hole connected to the hole body, and the locking screw hole is used to connect the positioning bolt.

4. The rotating bracket according to claim 3, characterized in that: A first weight-reducing hole is formed between the first limiting edge and the first supporting edge, the second supporting edge and the connecting edge; a second weight-reducing hole is formed between the second limiting edge and the first supporting edge, the second supporting edge and the connecting edge.

5. The rotating bracket according to claim 3, characterized in that: The first limiting edge and the second limiting edge are each configured with two second limiting members.

6. The rotating bracket according to claim 4, characterized in that: The first limiting member of the first limiting edge and the first limiting member of the second limiting edge are symmetrical structures with the axis of the hole body as the center; the second limiting member of the first limiting edge and the second limiting member of the second limiting edge are symmetrical structures with the axis of the hole body as the center.

7. The rotating bracket according to claim 1, characterized in that: The diameter of the inscribed circle of the inner edge of the first limiting member and the second limiting member is c larger than the corresponding wafer diameter, 1.5mm≤c≤2.5mm.

8. The rotating bracket according to claim 7, characterized in that: Said c=2 mm.

9. A rotary etching station, characterized in that: It comprises the rotating bracket described in any one of claims 1-8.

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