Power device and plastic package mold

Abstract

The utility model provides a power device and a plastic package mold. The power device comprises a substrate, wherein a graphical metal layer is arranged on the surface of one side of the substrate; the bottom of the metal boss is connected to the metal layer; the chip assembly is arranged on the substrate and is adjacent to the metal boss, and the chip assembly is electrically connected with the metal layer; the power terminal is electrically connected with the metal layer; and the plastic package body wraps the substrate, the chip assembly, part of the power terminals and part of the metal bosses, the plastic package body is provided with through holes corresponding to the metal bosses, and the through holes are exposed out of the tops of the metal bosses. According to the power device provided by the embodiment of the utility model, stray inductance can be effectively reduced, so that the current stability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a power device and a plastic packaging mold. Background Art

[0002] Power semiconductor devices are the core components of power electronic converters. Module packaging is commonly used in high-power applications. Packaging technology is the process of connecting and securing the chip to a carrier substrate, extending the terminals, and then plastic-sealing it into a complete power device or module. This technology primarily provides electrical connection, structural support and protection, and heat dissipation.

[0003] A common power module package structure includes a ceramic substrate and chip. The ceramic substrate is electrically connected to several power terminals and signal terminals, both of which extend from the edge of the package. These terminals require a certain amount of space between them to meet clearance and creepage requirements, severely limiting the placement of these power and signal terminals within the limited package area. Furthermore, this packaging format places the chip away from the signal terminals, generating noise that affects the effective inductance. It also reduces the effective area of ​​the substrate structure and can even compromise the design of more rational chip layouts. Utility Model Content

[0004] The Summary of the Utility Model introduces a series of simplified concepts that will be further described in the Detailed Description of the Utility Model. The Summary of the Utility Model of the Utility Model does not intend to limit the key features and essential technical features of the claimed technical solution, nor does it intend to determine the scope of protection of the claimed technical solution.

[0005] The present invention is proposed to solve the above-mentioned problems. According to a first aspect of the present invention, a power device is provided, comprising: a substrate having a patterned metal layer on one side surface of the substrate; a metal boss, the bottom of the metal boss being connected to the metal layer; a chip assembly disposed on the substrate, adjacent to the metal boss, the chip assembly being electrically connected to the metal layer; a power terminal electrically connected to the metal layer; and a plastic package covering the substrate, the chip assembly, a portion of the power terminal, and a portion of the metal boss, the plastic package having through holes corresponding to the metal bosses, the through holes exposing the tops of the metal bosses.

[0006] In one embodiment of the present application, the power device further includes a signal terminal, which is disposed in the through hole and electrically connected to the metal boss.

[0007] In one embodiment of the present application, the signal terminal is a rigid pin or a spring pin.

[0008] In one embodiment of the present application, the signal terminal and the metal boss are fixedly connected by ultrasonic welding or reflow welding.

[0009] In one embodiment of the present application, the chip assembly includes a chip body, a connecting metal strip and a bonding wire; the connecting metal strip is connected to the chip body and the metal layer, and the chip body and the power terminal are electrically connected through the metal strip and the metal layer; the bonding wire is connected to the chip body and the metal layer, and the chip body and the metal boss are electrically connected through the bonding wire and the metal layer.

[0010] In one embodiment of the present application, the power device further includes a heat sink, and the plastic package body is connected to the heat sink.

[0011] In one embodiment of the present application, the substrate is a DBC ceramic substrate or an AMB ceramic substrate.

[0012] According to a second aspect of the present invention, a plastic encapsulation mold is provided for manufacturing the aforementioned power device, the plastic encapsulation mold comprising: a lower mold for carrying the substrate, the metal boss, the chip assembly and the power terminal; an upper mold, the upper mold comprising an upper mold body and a PIN column, the PIN column being connected to the upper mold body and corresponding to the position of the metal boss; wherein, when the upper mold and the lower mold are in a closed mold state, the end of the PIN column away from the upper mold body abuts against the top of the metal boss.

[0013] In one embodiment of the present application, the upper mold further includes an elastic member, and the PIN column is connected to the upper mold body via the elastic member.

[0014] In one embodiment of the present application, the elastic member includes a spring.

[0015] According to the power device of the embodiment of the present invention, a metal boss is provided on one side surface of the substrate, so that the chip component is adjacent to the metal boss, and the plastic package is provided with a through hole to expose the top of the metal boss, so that the signal terminal can be led out through the through hole, thereby improving the performance of the power device product, effectively reducing the stray inductance, thereby improving the stability of the circuit current, and at the same time making full use of the area of ​​the substrate structure, which is beneficial to the arrangement of the chip and making the chip heat dissipation capacity more reasonable. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following drawings of this application are incorporated herein by reference and are provided for understanding the present application. The drawings illustrate embodiments of the present application and their descriptions, and are used to explain the apparatus and principles of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 Schematic diagram of the structure of a traditional power device;

[0018] Figure 2 This is a schematic structural diagram of a power device according to an embodiment of the present invention, wherein the signal terminal and the heat sink are not shown;

[0019] Figure 3 This is an exploded schematic diagram of the structure of a power device before plastic packaging according to an embodiment of the present invention, wherein the chip body is not shown;

[0020] Figure 4 This is an assembly diagram of a power device before plastic packaging according to an embodiment of the present invention;

[0021] Figure 5 This is a schematic structural diagram of a power device according to an embodiment of the present invention, wherein a signal terminal and a heat sink are shown;

[0022] Figure 6 This is a structural diagram of a plastic encapsulation mold according to an embodiment of the present invention;

[0023] Figure 7 This is a structural diagram of the plastic encapsulation mold in one embodiment of the utility model in the mold closing state:

[0024] Figure 8 This is a structural schematic diagram of the plastic sealing mold of one embodiment of the present invention after plastic sealing is completed and the upper and lower molds are separated.

[0025] Description of reference numerals:

[0026] 101- plastic package, 102- power terminal, 103- signal terminal;

[0027] 11-plastic package, 11a-through hole, 12-power terminal, 13-substrate, 13a-metal layer, 14-metal boss, 15-chip assembly, 15a-chip body, 15b-connecting metal strip, 15c-bonding wire, 16-signal terminal, 17-heat sink;

[0028] 21-lower mold, 22-upper mold, 22a-upper mold body, 22b-PIN column, 22c-elastic part. DETAILED DESCRIPTION

[0029] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, some technical features well known in the art are not described in order to avoid confusion with the present application.

[0030] It should be understood that the present application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make the disclosure thorough and complete and to fully convey the scope of the present application to those skilled in the art. In the drawings, the dimensions and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals throughout represent like elements.

[0031] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0032] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the drawings is flipped, then the elements or features described as "under" or "beneath" or "beneath" the other elements will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both the upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0033] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and "said / the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0034] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application relates. It will also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0035] In order to make the purpose, technical solutions and advantages of the present application more apparent, the following is a detailed description of example embodiments of the present application with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present application described in this application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of this application.

[0036] Figure 1 This is a schematic diagram of the structure of a traditional power device. Power terminals 102 extend from the edge of the plastic package 101. Signal terminals 103 are L-shaped and, like power terminals 102, extend from the edge of the plastic package 101. This packaging method places the chip inside the plastic package away from the signal terminals 103, which generates noise that affects the effective inductance. It also causes the substrate structure inside the plastic package to lose a significant amount of effective area, and may even sacrifice some of the chips for a more reasonable layout.

[0037] Therefore, in view of the existence of the above-mentioned technical problems, the present invention proposes a power device.

[0038] Refer to the attached Figure 2-5 The power device of an embodiment of the present invention is exemplified. The power device includes a substrate 13, a metal boss 14, a chip assembly 15, a power terminal 12, and a plastic package 11. One side surface of the substrate 13 has a patterned metal layer 13a, and the bottom of the metal boss 14 is connected to the metal layer 13a; the chip assembly 15 is arranged on the substrate 13, adjacent to the metal boss 14, and the chip assembly 15 is electrically connected to the metal layer 13a; the power terminal 12 is electrically connected to the metal layer 13a; the plastic package 11 covers the substrate 13, the chip assembly 15, part of the power terminal 12 and part of the metal boss 14, and has a through hole 11a corresponding to the metal boss 14 on the plastic package 11, and the through hole 11a exposes the top of the metal boss 14.

[0039] According to the power device of this embodiment, on the one hand, a signal terminal can be led out from the through hole 11a on the surface of one side of the plastic package 11, and the signal terminal can be electrically connected to the chip component through the metal boss 14 and the metal layer 13a. As a result, the signal terminal can be closer to the chip component 15, which can effectively improve the product performance of the power device. Specifically, it can effectively reduce the stray inductance, thereby improving the stability of the circuit current. At the same time, it can make full use of the area of ​​the substrate structure, which is beneficial to the arrangement of the product chips, and further improve the design flexibility of the application end.

[0040] On the other hand, the power device of this embodiment can connect the signal terminals after plastic sealing, effectively avoiding the problem of position deviation of the signal terminals caused by thermal deformation of the power device, which can effectively improve product precision.

[0041] For example, substrate 13 can be a DBC (Direct Bonded Copper) ceramic substrate or an AMB (Active Metal Brazing) ceramic substrate. DBC ceramic substrates are composite substrates made by hot-melt bonding copper foil directly to the surface of Al2O3 and AlN ceramics at high temperatures. AMB ceramic substrates are developed based on DBC technology. At a high temperature of approximately 800°C, AgCu solder containing active elements Ti and Zr wets and reacts at the interface between the ceramic and metal, thereby achieving heterogeneous bonding between the ceramic and metal.

[0042] In this embodiment, the substrate 13 is an AMB ceramic substrate. Since the AMB ceramic substrate is bonded by a chemical reaction between ceramic and active metal solder paste at high temperature, it has higher bonding strength and better reliability, and is extremely suitable for scenarios with high current carrying capacity and high heat dissipation requirements.

[0043] One side surface of the substrate 13 has a patterned metal layer 13a, and the chip component 15 can be electrically connected to the metal boss 14 and the power terminal 12 through the metal layer 13a. It should be noted that the metal boss 14 and the power terminal 12 are not electrically connected through the metal layer.

[0044] In this embodiment, there are multiple metal bosses 14 . The metal bosses 14 are cylindrical and made of copper or copper alloy. The bottoms of the metal bosses 14 can be connected to the metal layer 13 a by welding.

[0045] In this embodiment, the chip assembly 15 includes a chip body 15a, a connecting metal strip 15b and a bonding wire 15c. There can be multiple chip bodies 15a, and the chip body 15a can be fixedly connected to the substrate 13 by means such as welding. There can be multiple connecting metal strips 15b, and each connecting metal strip 15b is connected to the chip body 15a and the metal layer 13a, for example, by welding, so that the chip body 15a and the power terminal 12 can be electrically connected through the connecting metal strip 15b and the metal layer 13a. There can be multiple bonding wires 15c, and each bonding wire 15c is connected to the chip body 15a and the metal layer 13a at both ends, for example, by welding, so that the chip body 15a and the metal boss 14 can be electrically connected through the bonding wire 15c and the metal layer 13a. It should be noted that the connecting metal strip 15b and the bonding wire 15c are not electrically connected through the metal layer.

[0046] Among them, the metal boss 14 can be adjacent to the chip body 15a. The metal boss 14 is used to connect the signal terminal, so the signal terminal can be closer to the chip body 15a, which can effectively reduce the noise and thus improve the stability of the circuit current. At the same time, it can make full use of the area of ​​the substrate structure, which is beneficial to the arrangement of the product chip, making the chip's heat dissipation capacity more reasonable, and further improving the design flexibility of the application end.

[0047] The plastic encapsulation body 11 is formed by encapsulating an injection molding material (abbreviated as plastic encapsulation). The plastic encapsulation material can be an epoxy molding compound, also known as EMC (Epoxy Molding Compound). This is a powdered molding compound composed of an epoxy resin as a base resin, a high-performance phenolic resin as a curing agent, silica powder and other fillers, and various additives. The plastic encapsulation process involves extruding the EMC into a mold cavity using a transfer molding method, embedding the semiconductor chip therein, and simultaneously cross-linking and curing it to form a semiconductor device with a specific structural appearance. Its main function is to protect the chip from the influence of the external environment, resist external moisture, solvents, and impact, ensure electrical insulation between the chip and the external environment, and provide good installation performance, resist thermal shock and mechanical vibration during installation, and heat diffusion.

[0048] The plastic encapsulation body 11 covers the substrate 13, the chip assembly 15, part of the power terminal 12, and part of the metal boss 14. The plastic encapsulation body 11 covers the portion where the power terminal 12 is connected to the metal layer 13. The plastic encapsulation body 11 covers the side of the metal boss and has a through hole 11a corresponding to the metal boss 14. The through hole 11a exposes the top of the metal boss 14. During the process of injecting the plastic encapsulation material, the through hole 11a is left above the metal boss 14, and the metal boss 14 is not sealed, so that the top of the metal boss 14 is exposed. Therefore, the signal terminal can be led out through the through hole 11a, and the signal terminal can be connected to the metal boss 14, and then electrically connected to the chip assembly 15 through the metal boss 14 and the metal layer 13a.

[0049] See attached Figure 5 The power device also includes a signal terminal 16, which is disposed within the through-hole 11a and electrically connected to the metal boss 14. The signal terminal 16 extends perpendicular to the surface of the substrate 13 and exits the through-hole 11a. This arrangement increases the heat dissipation area of ​​the power terminal 12 and allows for more flexible placement of the signal terminal 16, avoiding the risk of interference between the power terminal 12 and the signal terminal 16 during layout, thereby improving the performance of the chip package structure.

[0050] Exemplarily, signal terminals 16 are rigid pins or elastic pins. The elastic pins have an internal elastic portion, which can be a spring. The elastic pins can buffer pressure, preventing significant stress from acting within the chip package structure and reducing the risk of deformation or even breakage of signal terminals 16.

[0051] Exemplarily, the signal terminal 16 is fixedly connected to the metal boss 14 by ultrasonic welding or reflow soldering. Ultrasonic welding uses high-frequency vibration waves to transmit to the surfaces of two objects to be welded. Under pressure, the two surfaces of the objects rub against each other to form a fusion between the molecular layers. This is an indirect thermal welding process that uses ultrasonic waves to weld thermoplastics and thin metal parts together. Reflow soldering refers to the use of solder paste (a mixture of solder and flux) to connect one or more electronic components to the contact pad, and then melt the solder through controlled heating to achieve a permanent joint. Soldering can be performed using different heating methods such as a reflow oven, infrared heating lamp or hot air gun.

[0052] The power device of this embodiment can be welded to the signal terminals 16 after plastic sealing, which increases the selection of welding methods and avoids welding the signal terminals before injection molding. The influence of the overall warping deformation of the product on the signal terminals during the injection molding process is reduced, and the difficulty of implementing the welding process is also improved.

[0053] See attached Figure 5For example, the power device further includes a heat sink 17, and the plastic package 11 is connected to the heat sink 17. The side of the plastic package 11 away from the through hole 11a can be connected to the heat sink 17 by welding or gluing.

[0054] Power devices have thermal resistance, which affects their lifespan and efficiency. To enhance heat dissipation, it is necessary to consider that all semiconductor products will generate heat when working, and when the heat reaches a certain limit, it will affect the normal operation of the chip. If the operating temperature is too high, it will not only cause a decline in device performance, but also cause reliability problems due to the mismatch of the coefficient of thermal expansion (CTE) of different packaging materials and the thermal stress at the interface. The provision of the heat sink 17 can effectively dissipate heat for the chip assembly 15 and the plastic package 11, thereby improving the performance of the power device.

[0055] This concludes the introduction to the structure of the power device of the present invention. A complete power device may also include other components, which will not be detailed here.

[0056] See attached Figure 6-8 The present invention also provides a plastic encapsulation mold for manufacturing the above-mentioned power device. Specifically, the plastic encapsulation mold is used to encapsulate the substrate 13, the metal boss 14, the chip assembly 15 and the power terminal 12.

[0057] See attached Figure 6 The plastic encapsulation mold includes an upper mold 22 and a lower mold 21. The lower mold 21 is used to support the substrate 13, metal bosses 14, chip assembly 15, and power terminals 12. After being connected to the substrate 13, the metal bosses 14, chip assembly 15, and power terminals 12 can be placed together with the substrate 13 in the lower mold 21 for plastic encapsulation. The lower mold 21 can be provided with a limiting structure to limit the position of the substrate 13 to a specific position within the lower mold.

[0058] The upper mold 22 includes an upper mold body 22a and PIN posts 22b. The upper mold body 22a forms the injection molding chamber together with the lower mold 21. The PIN posts 22b can be metal posts connected to the upper mold body 22a and corresponding in position to the metal bosses 14. The PIN posts 22b are located on the side of the upper mold facing the lower mold. The number and position of the PIN posts 22b correspond to the metal bosses 14 on the substrate 13. Figure 6-8 Only one PIN post is shown.

[0059] See attached Figure 7When the upper mold 22 and lower mold 21 are in the closed state, the upper mold body 22a forms an injection molding chamber with the lower mold 21. The substrate 13, metal boss 14, chip assembly 15, and power terminal 12 are located within this molding chamber. The end of the PIN post 22b, away from the upper mold body 22a, abuts against the top of the metal boss 14. The PIN post 22b can press the metal boss 14 slightly to prevent the molding compound from overflowing onto the surface of the metal boss 14.

[0060] Therefore, see Appendix Figure 8 After the injection molding is completed and the upper and lower molds are separated, the resulting plastic package body 11 may have a through hole 11a, which exposes the top of the metal boss 14 to facilitate the connection of the signal terminal 16. During the injection molding process, the PIN column 22b is located at the position of the through hole 11a, which can effectively prevent the plastic package compound from overflowing onto the upper surface of the metal boss 14.

[0061] In this embodiment, the upper mold 22 also includes an elastic member 22c, through which the PIN post 22b is connected to the upper mold body 22a. The PIN post 22b is movable relative to the upper mold body 22. During the injection molding process, the PIN post 22b uses the mold clamping force to support the metal boss 14, even forcing the metal boss 14 slightly deeper to prevent epoxy resin from overflowing onto the surface of the metal boss 14. The elastic member 22c compresses inward under the mold clamping force to provide a buffer, preventing excessive stress from acting on the metal boss 14 and substrate 13, and reducing the risk of deformation or even fracture of the metal boss 14 and substrate 13. This allows for controllable vertical elastic force of the PIN post 22b. Furthermore, the elastic member 22c forces the product to a flat surface, further alleviating the impact of warping of the substrate 13 on the plastic encapsulation and reducing the risk of glue overflow, facilitating subsequent soldering of the signal terminals 16. For example, the elastic member 22c may be a spring. The elastic member 22c may also be other structures that can elastically connect the PIN column 22b to the upper mold body.

[0062] Since the PIN column 22b is connected to the upper mold body 22a through the elastic member 22c rather than being fixedly connected, compatibility with metal bosses 14 of different sizes or signal terminals 16 of different sizes can be achieved by replacing PIN columns 22b of different sizes.

[0063] In some embodiments, the elastic member 22 c may not be provided in the upper mold 22 , and the PIN column 22 b is directly connected to the upper mold body 22 a , for example, by welding.

[0064] After the plastic package body 11 is formed, the signal terminal 16 can be welded to the metal boss 14 through the through hole 11 a to achieve electrical connection between the signal terminal 11 a and the chip assembly 15 .

[0065] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely illustrative and are not intended to limit the scope of the present application. Various changes and modifications may be made therein by those skilled in the art without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0066] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0067] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units described is merely a logical function division. In actual implementation, other division methods may be used, such as combining or integrating multiple units or components into another device, or ignoring or not performing some features.

[0068] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0069] Similarly, it should be understood that in order to streamline the present application and aid in understanding one or more of the various application aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, this approach of the present application should not be interpreted as reflecting the intention that the claimed application requires more features than those explicitly recited in each claim. More precisely, as reflected in the corresponding claims, the point of the application is that the corresponding technical problem can be solved with fewer features than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present application.

[0070] It will be understood by those skilled in the art that, except where mutually exclusive, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus disclosed herein may be combined in any combination. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature providing the same, equivalent, or similar purpose.

[0071] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

[0072] It should be noted that the above embodiments are illustrative rather than limiting of the present application, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

[0073] The above description is merely a specific embodiment or illustration of a specific embodiment of the present application, and the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. The scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A power device, characterized in that: include: A substrate, wherein one side surface of the substrate has a patterned metal layer; A metal boss, the bottom of which is connected to the metal layer; A chip component is disposed on the substrate and adjacent to the metal boss, the chip component being electrically connected to the metal layer; A power terminal electrically connected to the metal layer; The plastic package body covers the substrate, the chip assembly, part of the power terminals and part of the metal bosses. The plastic package body has through holes corresponding to the metal bosses, and the through holes expose the tops of the metal bosses.

2. The power device according to claim 1, characterized in that: The power device further comprises a signal terminal, wherein the signal terminal is inserted into the through hole and electrically connected to the metal boss.

3. The power device according to claim 2, characterized in that: The signal terminal is a rigid pin or an elastic pin.

4. The power device according to claim 2, characterized in that: The signal terminal is fixedly connected to the metal boss by ultrasonic welding or reflow welding.

5. The power device according to claim 1, characterized in that: The chip assembly includes a chip body, connecting metal strips and bonding wires; The connecting metal strip is connected to the chip body and the metal layer, and the chip body and the power terminal are electrically connected through the metal strip and the metal layer; The bonding wire is connected to the chip body and the metal layer, and the chip body and the metal boss are electrically connected through the bonding wire and the metal layer.

6. The power device according to claim 1, characterized in that: The power device further comprises a heat sink, and the plastic package body is connected to the heat sink.

7. The power device according to claim 1, characterized in that: The substrate is a DBC ceramic substrate or an AMB ceramic substrate.

8. A plastic packaging mold, characterized in that: For manufacturing the power device according to claim 1, the plastic encapsulation mold comprises: A lower mold, used for carrying the substrate, the metal boss, the chip assembly and the power terminal; An upper mold, the upper mold comprising an upper mold body and a PIN column, the PIN column is connected to the upper mold body and corresponds to the position of the metal boss; Wherein, when the upper mold and the lower mold are in a mold-clamping state, one end of the PIN column away from the upper mold body abuts against the top of the metal boss.

9. The plastic encapsulation mold according to claim 8, characterized in that: The upper mold further includes an elastic member, and the PIN column is connected to the upper mold body via the elastic member.

10. The plastic encapsulation mold according to claim 9, characterized in that: The elastic member includes a spring.

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