Battery management system

By adopting a double stacked PCB board structure in BMS, the problem of excessive volume of existing BMS non-energy components is solved, better integration functions in limited space is achieved, and low cost and simple assembly process is maintained.

CN222654019UActive Publication Date: 2025-03-21HEFEI GUOXUAN HIGH TECH POWER ENERGY
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Patent Information

Application Number
CN202421270014.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-04
Publication Date
2025-03-21
Estimated Expiration
2034-06-04

AI Technical Summary

Technical Problem

The existing BMS non-energy components are too large to achieve integration of more functions in a limited space.

Method used

A double-layer stacked PCB board structure is adopted, and a double-layer stacked PCB board is added to the existing PCB motherboard and connected and separated by copper columns.

Benefits of technology

The overall size of the BMS is effectively reduced, allowing it to better adapt to smaller spaces, while maintaining a simple structure and assembly process, avoiding additional costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a battery management system, which belongs to the field of new energy automobiles and comprises a lower base, an upper cover plate and a PCB (printed circuit board) mother board, the lower base and the upper cover plate are butted and covered up and down to form a shell, the PCB mother board is arranged on the inner wall of the lower base, a PCB daughter board is clamped between the lower base and the upper cover plate, and the PCB daughter board is arranged in the shell. And the PCB daughter board and the PCB mother board are connected and separated through a plurality of copper columns to form a double-layer stacked PCB. According to the battery management system disclosed by the utility model, the structure and the assembly process of double-layer stacked PCBs (Printed Circuit Board) are simple, and the number of related parts is not obviously increased compared with that of a BMS (Battery Management System) of a single-layer board, so that the additional cost is not increased, and the popularization is facilitated.
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Description

Technical Field

[0001] The utility model relates to the field of new energy vehicles, and in particular to a battery management system. Background Art

[0002] The battery management system (BMS) is one of the core technologies of new energy vehicles and the core component of the battery pack. It usually includes upper and lower shells and a PCB board. The shell mainly plays a protective role to prevent the main component PCB board from being damaged by external force.

[0003] Common BMSs include split type and master-slave integrated type. Compared with split type, master-slave integrated type has certain advantages in volume. However, with the increasing demand for power battery energy density, there are greater challenges to volume grouping efficiency. The current BMS non-energy components are relatively large, which is not conducive to the integration of more functions in a limited space. Therefore, it is necessary to reduce the volume of non-energy components as much as possible to achieve the integration of more functions in a limited space. Utility Model Content

[0004] In view of the above problems, the purpose of the present utility model is to provide a battery management system for solving the problem that the current BMS non-energy components are relatively large in size, which is not conducive to the integration of more functions in a limited space.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The utility model discloses a battery management system, comprising a lower base, an upper cover plate and a PCB motherboard, wherein the lower base and the upper cover plate are butted and covered up and down to form a shell, the PCB motherboard is arranged on the inner wall of the lower base, a PCB sub-board is sandwiched between the lower base and the upper cover plate, and the PCB sub-board is connected and separated from the PCB motherboard by a plurality of copper columns to form a double-layer stacked PCB board.

[0007] Preferably, the PCB daughter board and the PCB mother board are parallel to each other.

[0008] Preferably, the PCB sub-board is fixedly connected to the hidden part of the PCB motherboard via four copper pillars;

[0009] The exposed ends of the PCB sub-board and the PCB motherboard are respectively configured with a bottom insulating fixing frame and an upper insulating fixing frame; the bottom insulating fixing frame and the upper insulating fixing frame are fixed together to fix the PCB sub-board and the exposed end of the PCB motherboard.

[0010] Preferably, the bottom insulating fixed frame and the upper insulating fixed frame include an upper top plate, a lower bottom plate, a left end plate, a right end plate and a plurality of partitions, the upper top plate, the lower bottom plate, the left end plate and the right end plate are all insulating plates, which are connected end to end in sequence to form a rectangle, and the upper top plate and the lower bottom plate are separated by a plurality of partitions; the lower bottom plate of the upper insulating fixed frame is fixed to the upper top plate of the bottom insulating fixed frame; wherein, the middle parts of the left end plate, the right end plate and the plurality of partitions are respectively provided with notches for clamping the exposed ends of the PCB sub-board or the PCB motherboard to respectively limit the outward displacement of the PCB sub-board or the PCB motherboard; the inner sides of the upper top plate and the lower bottom plate are respectively provided with protrusions for limiting the outward displacement of the PCB sub-board or the PCB motherboard.

[0011] Preferably, cutouts adapted to the bottom insulating fixing frame and the upper insulating fixing frame are respectively provided on one side of the lower base where the exposed end of the PCB motherboard is located and the upper cover where the exposed end of the PCB sub-board is located, and the bottom insulating fixing frame and the upper insulating fixing frame are respectively correspondingly arranged on the adapted cutouts of the lower base and the upper cover.

[0012] Preferably, the lower base and the upper cover are connected as one body by screws.

[0013] Preferably, the lower base is provided with a plurality of main columns, and screw holes are respectively provided on the upper cover plate corresponding to the main columns. When the lower base and the upper cover plate are butt-jointed and covered up and down, the main columns of the lower base and the screw holes of the upper cover plate are locked by screws, and the PCB motherboard is clamped at the same time.

[0014] Preferably, a plurality of reinforcing ribs are crisscrossedly arranged on the lower base.

[0015] Preferably, a BMS installation point is respectively arranged on the outer side of the four corners of the lower base, for a total of four BMS installation points.

[0016] The utility model adopts the above technical solution, which has the following advantages:

[0017] The utility model discloses a battery management system. On the basis of an existing PCB motherboard, a PCB daughter board is added. The PCB daughter board is connected and separated from the PCB motherboard by a plurality of copper columns to form a double-layer stacked PCB board, wherein the PCB motherboard and the PCB daughter board are equivalent to dividing a large PCB board into two and then stacking them. Although the size in the height direction will be increased a little, the size in the length and width directions will be greatly reduced, and the overall size of the BMS will be effectively reduced, so as to be conducive to adapting to a smaller reserved space in a package, so that the overall size of the BMS can be better adapted to a smaller space; at the same time, the utility model discloses a battery management system. The structure and assembly process of the double-layer stacked PCB board are simple, and the number of components involved is not significantly increased compared with that of a BMS with a single-layer board, so it will not bring about an increase in additional costs, which is conducive to promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional view of the overall structure of the battery management system provided by Embodiment 1 of the present utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of the battery management system after the upper cover plate is removed provided in Example 1 of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the left end plate or the right end plate of the bottom insulating fixed frame or the upper insulating fixed frame provided in Example 1 of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the lower base provided in Example 1 of the utility model;

[0022] Figure 5 It is a partial enlarged view of the connection between the upper cover plate and the lower base provided in Example 1 of the utility model.

[0023] Description of reference numerals: 10 - PCB motherboard, 20 - PCB daughterboard;

[0024] 30-bottom insulation fixing frame, 31-upper insulation fixing frame, 32-notch, 33-protrusion;

[0025] 40-lower base, 41-main column, 42-reinforcement rib, 43-BMS installation point, 44-cut;

[0026] 50-upper cover, 60-screws, 70-copper pillars. DETAILED DESCRIPTION

[0027] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0028] In order to solve the problem that the current BMS non-energy components are relatively large in size, which is not conducive to integrating more functions in a limited space, the utility model discloses a battery management system. On the basis of an existing PCB motherboard, a PCB sub-board is added. The PCB sub-board is connected and separated from the PCB motherboard by a number of copper columns to form a double-layer stacked PCB board, wherein the PCB motherboard and the PCB sub-board are equivalent to dividing a large PCB board into two and then stacking them. Although the size in the height direction will be increased a little, the size in the length and width directions will be greatly reduced, effectively reducing the overall size of the BMS, which is conducive to adapting to a smaller reserved space in the package, so that the overall size of the BMS can better adapt to a smaller space; at the same time, the utility model discloses a battery management system, the structure and assembly process of the double-layer stacked PCB board are simple, and the number of components involved is not significantly increased compared with the BMS of a single-layer board, so it will not bring about an increase in additional costs, which is conducive to promotion.

[0029] Embodiment 1: A battery management system

[0030] Embodiment 1 of the present invention provides a battery management system, and its structure is described in detail below with reference to the accompanying drawings.

[0031] refer to Figure 1 and Figure 2 The battery management system includes a lower base 40, an upper cover 50, a PCB motherboard 10 and a PCB daughterboard 20.

[0032] The lower base 40 and the upper cover 50 are butted and covered up and down to form a shell;

[0033] The PCB motherboard 10 is arranged on the inner wall of the lower base 40;

[0034] A PCB sub-board 20 is sandwiched between the lower base 40 and the upper cover 50, and the PCB sub-board 20 is connected and separated from the PCB motherboard 10 by a plurality of copper pillars 70, forming a double-layer stacked PCB board.

[0035] Preferably, the PCB daughter board 20 and the PCB mother board 10 are parallel to each other.

[0036] Specifically, the PCB daughter board 20 is fixedly connected to the hidden part of the PCB mother board 10 through four copper pillars 70;

[0037] The exposed ends of the PCB sub-board 20 and the PCB motherboard 10 are respectively provided with a bottom insulating fixing frame 30 and an upper insulating fixing frame 31;

[0038] The bottom insulating fixing frame 30 and the upper insulating fixing frame 31 are fixed together to fix the exposed end of the PCB sub-board 20 to the PCB motherboard 10 .

[0039] More specifically, the bottom insulating fixed frame 30 and the upper insulating fixed frame 31 include an upper top plate, a lower bottom plate, a left end plate, a right end plate and a plurality of partitions.

[0040] The upper top plate, the lower bottom plate, the left end plate and the right end plate are all insulating plates, which are connected end to end in sequence to form a rectangle, and the upper top plate and the lower bottom plate are separated by a plurality of partitions;

[0041] The lower bottom plate of the upper insulating fixed frame 31 is fixed on the upper top plate of the bottom insulating fixed frame 30;

[0042] Among them, reference Figure 3 The left end plate, the right end plate and the middle parts of the plurality of partitions are respectively provided with notches 32 for clamping the exposed ends of the PCB sub-board 20 or the PCB motherboard 10 to limit the outward displacement of the PCB sub-board 20 or the PCB motherboard 10;

[0043] The inner side surfaces of the upper top plate and the lower bottom plate are respectively provided with protrusions 33 for limiting the outward displacement of the PCB sub-board 20 or the PCB motherboard 10 .

[0044] Specifically, cutouts 44 adapted to the bottom insulating fixing frame 30 and the upper insulating fixing frame 31 are respectively provided on one side of the lower base 40 where the exposed end of the PCB motherboard 10 is located and the upper cover plate 50 where the exposed end of the PCB sub-board 20 is located, and the bottom insulating fixing frame 30 and the upper insulating fixing frame 31 are respectively correspondingly arranged on the cutouts 44 adapted to the lower base 40 and the upper cover plate 50.

[0045] In order to enhance the stability between the lower base 40 and the upper cover 50 , the lower base 40 and the upper cover 50 are connected as one body by screws 60 .

[0046] Specifically, Figure 4As shown, the lower base 40 is provided with a plurality of main columns 41, and the upper cover plate 50 corresponding to the main columns 41 is respectively provided with screw holes. When the lower base 40 and the upper cover plate 50 are butted and covered up and down, the main columns 41 of the lower base 40 and the screw holes of the upper cover plate 50 are locked by screws 60, and the PCB motherboard 10 is clamped at the same time, as shown in FIG. Figure 5 shown.

[0047] In order to further increase the structural strength of the lower base 40 , a plurality of reinforcing ribs 42 are crisscrossedly disposed on the lower base 40 .

[0048] In order to facilitate the fixation on the battery pack, a BMS mounting point 43 is respectively provided on the outer side of the four corners of the lower base 40, and there are a total of four BMS mounting points 43 for fixing on the battery pack.

[0049] Embodiment 2: A method for assembling a battery management system

[0050] Embodiment 2 of the present utility model provides an assembly method of a battery management system, which is used to assemble the battery management system of embodiment 1. The assembly method comprises the following steps:

[0051] Before welding, the bottom insulating fixing frame 30 and the upper insulating fixing frame 31 need to be placed in the middle of the exposed ends of the PCB daughter board 20 and the PCB mother board 10 respectively and fixed;

[0052] The bottom insulating fixing frame 30 and the upper insulating fixing frame 31 clamp the exposed end of the PCB sub-board 20 or the PCB motherboard 10 through the notch 32, and the protrusions 33 on both sides limit the outward displacement of the PCB sub-board 20 or the PCB motherboard 10;

[0053] After the motherboard 10 and the daughterboard 20 are welded together, they are installed into the lower base 40 along the main columns 41 of the lower base 40 , and the main columns 41 play a guiding and limiting role.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A battery management system, comprising a lower base (40), an upper cover (50) and a PCB motherboard (10), wherein the lower base (40) and the upper cover (50) are butted and covered up and down to form a housing, and the PCB motherboard (10) is arranged on the inner wall of the lower base (40), characterized in that: A PCB sub-board (20) is sandwiched between the lower base (40) and the upper cover (50), and the PCB sub-board (20) is connected and separated from the PCB motherboard (10) by a plurality of copper pillars (70), thereby forming a double-layer stacked PCB board.

2. The battery management system according to claim 1, characterized in that: The PCB sub-board (20) and the PCB motherboard (10) are parallel to each other.

3. The battery management system according to claim 2, characterized in that: The PCB sub-board (20) is fixedly connected to the hidden part of the PCB motherboard (10) via four copper pillars (70); The exposed ends of the PCB sub-board (20) and the PCB motherboard (10) are respectively provided with a bottom insulating fixing frame (30) and an upper insulating fixing frame (31); The bottom insulating fixing frame (30) and the upper insulating fixing frame (31) are fixed together to fix the exposed end of the PCB sub-board (20) to the PCB motherboard (10).

4. The battery management system according to claim 3, characterized in that: The bottom insulating fixed frame (30) and the upper insulating fixed frame (31) comprise an upper top plate, a lower bottom plate, a left end plate, a right end plate and a plurality of partition plates. The upper top plate, the lower bottom plate, the left end plate and the right end plate are all insulating plates, which are connected end to end in sequence to form a rectangle, and the upper top plate and the lower bottom plate are separated by a plurality of partitions; The lower bottom plate of the upper insulating fixed frame (31) is fixed on the upper top plate of the lower insulating fixed frame (30); Wherein, the left end plate, the right end plate and the middle parts of the plurality of partitions are respectively provided with notches (32) for clamping the exposed ends of the PCB sub-board (20) or the PCB motherboard (10) to limit the outward displacement of the PCB sub-board (20) or the PCB motherboard (10); The inner side surfaces of the upper top plate and the lower bottom plate are respectively provided with protrusions (33) for limiting the outward displacement of the PCB sub-board (20) or the PCB motherboard (10).

5. The battery management system according to claim 4, characterized in that: Cutouts (44) adapted to the bottom insulating fixing frame (30) and the top insulating fixing frame (31) are respectively arranged on one side of the lower base (40) where the exposed end of the PCB motherboard (10) is located and the top cover (50) where the exposed end of the PCB sub-board (20) is located, and the bottom insulating fixing frame (30) and the top insulating fixing frame (31) are respectively arranged on the cutouts (44) adapted to the lower base (40) and the top cover (50).

6. The battery management system according to claim 5, characterized in that: The lower base (40) and the upper cover plate (50) are connected as one body via screws (60).

7. The battery management system according to claim 6, characterized in that: The lower base (40) is provided with a plurality of main columns (41), and screw holes are respectively provided on the upper cover plate (50) corresponding to the main columns (41). When the lower base (40) and the upper cover plate (50) are butted and covered up and down, the main columns (41) of the lower base (40) and the screw holes of the upper cover plate (50) are locked by screws (60), and the PCB motherboard (10) is clamped at the same time.

8. The battery management system according to claim 7, characterized in that: The lower base (40) is provided with a plurality of reinforcing ribs (42) arranged in a crisscross pattern.

9. The battery management system according to claim 8, characterized in that: A BMS installation point (43) is respectively arranged on the outer sides of the four corners of the lower base (40), with a total of four BMS installation points (43).