Semiconductor laser

Abstract

The utility model discloses a semiconductor laser which comprises a chip and a bottom plate. The liquid inlet channel, the liquid separation channel and the liquid outlet channel which are communicated in sequence are arranged, the sub-channels communicated between the liquid separation channel and the liquid outlet channel are arranged, and the sub-channels are located under the chip, so that the purpose of improving the cooling effect of the chip can be achieved. And meanwhile, the sub-channels are obliquely arranged downwards in the direction from the liquid separation channel to the liquid outlet channel, so that the flow speed of the cooling liquid in the cooling channel is increased, and the technical effect of increasing the chip cooling speed is further achieved. Moreover, a first flow guide surface is arranged on the inner side wall of the liquid separation channel, a second flow guide surface is arranged on the inner side wall of the liquid outlet channel, and the flow guide surfaces are arc-shaped surfaces or inclined surfaces, so that the flow resistance of the cooling liquid at the position can be further reduced, and the technical effect of improving the chip cooling speed is further achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of lasers, and in particular relates to a semiconductor laser. Background Art

[0002] As high-power semiconductor lasers are used more and more widely, it is necessary to improve the heat dissipation capacity of the chip in the semiconductor laser. If the temperature of the chip is too high, the performance of the semiconductor laser will be reduced, and even the semiconductor laser will be damaged.

[0003] The existing chip cooling methods are as follows: Figure 1 As shown, the bottom surface of the chip 1, the heat sink 3 and the top of the bottom plate 2 are fixed in sequence, and the heat of the chip 1 is transferred to the position of the bottom plate 2 through the heat sink 3. A U-shaped water channel 4 is provided on the side of the bottom plate 2. The coolant flows through the U-shaped water channel 4 to cool down the bottom plate 2 to dissipate heat, so as to achieve heat dissipation of the chip. However, this heat dissipation method has the following disadvantages:

[0004] 1) The U-shaped water channel has limited heat dissipation capacity and has certain restrictions on the number of chips.

[0005] 2) The U-shaped water channel has a right angle bend, which gives the coolant flow resistance, resulting in a decrease in the coolant flow and affecting the cooling speed of the base plate. Utility Model Content

[0006] In view of the above problems, the utility model discloses a semiconductor laser to overcome the above problems or at least partially solve the above problems.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A semiconductor laser comprises a chip and a base plate;

[0009] The chip is located above the bottom plate; a cooling channel is provided in the bottom plate, and at least part of the cooling channel is located directly below the chip, and a liquid inlet and a liquid outlet of the cooling channel are located on one side or both sides of the bottom plate;

[0010] The cooling channel comprises a liquid inlet channel, a liquid separation channel, a sub-channel and a liquid outlet channel which are sequentially connected between the liquid inlet and the liquid outlet;

[0011] The sub-channels are provided with a plurality of them, the first ends of the plurality of sub-channels are connected with the liquid separation channel, the second ends of the sub-channels are connected with the liquid outlet channel, and the sub-channels are arranged to be inclined downward along the direction from the liquid separation channel to the liquid outlet channel;

[0012] A first guide surface is provided on the inner side wall of the liquid separation channel, and the first guide surface is located on the extension line of the first end of the sub-channel; a second guide surface is provided on the inner side wall of the liquid outlet channel, and the second guide surface is located on the extension line of the second end of the sub-channel; the first guide surface and / or the second guide surface are arc-shaped surfaces or inclined surfaces.

[0013] Furthermore, the cross-sectional shape of the longitudinal section of the sub-channel is a curved bending shape, and / or the cross-sectional shape of the sub-channel is a curved bending shape.

[0014] Furthermore, when the cross-sectional shape of the longitudinal section of the sub-channel is a curved bending shape, the crest of the curved bending shape is located directly below the chip.

[0015] Furthermore, the horizontal height of the sub-channel and the horizontal height of the liquid outlet channel are not higher than the horizontal height of the liquid inlet channel.

[0016] Furthermore, it also includes a heat sink; the heat sink is fixed to the bottom surface of the chip, and the chip is fixedly connected to the bottom plate through the heat sink;

[0017] A notch is provided on the top of the sub-channel, and a contact connection is formed between the notch and the heat sink.

[0018] Furthermore, the bottom end of the heat sink extends downward to form a protrusion, and the protrusion extends from the notch into the sub-channel.

[0019] Furthermore, the heat sink is made of a material having a thermal conductivity of not less than 190 W / m·K; and / or,

[0020] The optical output power of the chip is not less than 28W.

[0021] Furthermore, a plurality of guide ribs are arranged alternately and spaced apart in the sub-channel along its own length direction, forming a continuous S-shaped channel or a maze-shaped channel.

[0022] Furthermore, one end of the guide rib along its own length direction is fixed to the inner wall of the sub-channel, and the other end of the guide rib is inclined toward the second end of the sub-channel.

[0023] Furthermore, the cross-sectional shape of the sub-channel along its own width direction is a rounded rectangle.

[0024] The advantages and beneficial effects of the utility model are:

[0025] In the semiconductor laser of the utility model, by setting a liquid inlet channel, a liquid separation channel and a liquid outlet channel connected in sequence, and setting a plurality of sub-channels connected between the liquid separation channel and the liquid outlet channel, the sub-channel is located directly below the chip, which can achieve the purpose of improving the cooling effect of the chip. At the same time, the sub-channel is arranged to be tilted downward from the liquid separation channel to the liquid outlet channel, which can increase the flow rate of the coolant in the cooling channel, thereby further achieving the technical effect of increasing the cooling speed of the chip. Furthermore, a first guide surface is provided on the inner side wall of the liquid separation channel, and a second guide surface is provided on the inner side wall of the liquid outlet channel, and the guide surface is an arc surface or an inclined surface. Based on this, the flow resistance of the coolant at this position can be further reduced, thereby further achieving the technical effect of improving the cooling speed of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not considered to be limiting of the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0027] Figure 1 A perspective view of the connection between a chip, a heat sink, a base plate and a U-shaped water channel in an existing semiconductor laser;

[0028] Figure 2 is a three-dimensional structural diagram of the semiconductor laser of this embodiment;

[0029] Figure 3 for Figure 2 perspective drawing;

[0030] Figure 4 It is a schematic diagram of the structure in which the notch of the sub-channel of the semiconductor laser of this embodiment is connected to the protrusion of the heat sink.

[0031] In the figure: 1. chip; 2. bottom plate; 3. heat sink; 4. U-shaped water channel; 211. liquid inlet; 212. liquid outlet; 213. liquid inlet channel; 214. liquid separation channel; 215. sub-channel; 216. liquid outlet channel; 2131. first guide surface; 2132. second guide surface; 2151. first end of sub-channel; 2152. second end of sub-channel; 2153. notch; 2154. guide rib; 31. protrusion. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and effect of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] The technical solutions provided by various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0034] Combination Figures 2 to 4 As shown, this embodiment discloses a semiconductor laser, including a chip 1 and a base plate 2. The chip 1 is located Figure 2 As shown, a cooling channel is provided on the bottom plate 2. The cooling channel is at least partially located directly below the chip 1. The coolant enters from the liquid inlet 211 of the cooling channel and flows out from the liquid outlet 212 of the cooling channel. The liquid inlet 211 and the liquid outlet 212 of the cooling channel are located on one side of the bottom plate 2, so that the coolant can be circulated and cooled without adding new coolant, thereby achieving the technical effect of saving coolant.

[0035] The cooling channel includes a liquid inlet channel 213, a liquid separation channel 214, a sub-channel 215 and a liquid outlet channel 216. The liquid inlet 211, the liquid inlet channel 213, the liquid separation channel 214, the liquid outlet channel 216 and the liquid outlet 212 of the cooling channel are connected in sequence to form a U-shaped structure. Specifically, there are multiple sub-channels 215, and the number of sub-channels 215 is not less than the number of columns or rows of chips 1, that is, according to the arrangement of chips 1, the number and position of sub-channels 215 are set corresponding to the columns or rows of chips 1, so as to avoid blockage in a sub-channel affecting the flow of coolant and improve the reliability of coolant cooling, and at least one sub-channel 215 is set correspondingly to the position of a column / row of chips 1, which can reduce the distance between the coolant and the chip 1, thereby achieving the technical effect of improving the cooling efficiency of the chip 1.

[0036] Among them, along the length direction of the subchannel 215 (i.e., along Figure 3 The first end 2151 of each sub-channel 215 is connected to the liquid separation channel 214, and the second end 2152 of the sub-channel 215 is connected to the liquid outlet channel 216. The sub-channel 215 is arranged to be inclined downward from the liquid separation channel 214 to the liquid outlet channel 216 (i.e., along the Figure 3 The Y-axis is tilted in the positive direction as shown), which can increase the flow rate of the coolant in the sub-channel, speed up the cooling efficiency of the chip, and further achieve the purpose of improving the chip cooling effect.

[0037] Furthermore, combined with Figure 3 As shown, a first guide surface 2131 is provided on the inner side wall of the liquid separation channel 214, and the first guide surface 2131 is located on the extension line of the first end 2151 of the sub-channel 215, specifically on the end of the liquid separation channel 214 away from the liquid inlet channel 213, and is also located on the inner side wall of the liquid separation channel facing the first end 2151 of the sub-channel 215. A second guide surface 2132 is provided on the inner side wall of the liquid outlet channel 216, and the second guide surface 2132 is located on the extension line of the second end 2152 of the sub-channel 215, specifically on the end of the liquid outlet channel 216 away from the liquid outlet 212, and is also located on the inner side wall of the liquid outlet channel facing the second end 2152 of the sub-channel 215; the first guide surface 2131 and the second guide surface 2132 are arc-shaped surfaces. Based on this, the use of the first guide surface and the second guide surface can reduce the resistance of the coolant flowing through the connection between the liquid separation channel and the sub-channel, and the connection between the sub-channel and the liquid outlet channel, thereby increasing the flow rate of the coolant at this position, and further achieving the purpose of improving the cooling effect on the chip.

[0038] In this embodiment, the first guide surface is located at the corner of the liquid separation channel corresponding to the extension line of the first end of the sub-channel, and the second guide surface is located at the corner of the liquid outlet channel corresponding to the extension line of the second end of the sub-channel.

[0039] Of course, in other embodiments, the first guide surface can also be located on the inner side wall of the liquid separation channel corresponding to the extension line of the first end of all sub-channels (including the corresponding corner position of the liquid separation channel), and at the same time, the second guide surface can also be located on the inner side wall of the liquid outlet channel corresponding to the extension line of the second end of the sub-channel (including the corresponding corner position of the liquid outlet channel).

[0040] In the semiconductor laser of this embodiment, by providing a liquid inlet channel, a liquid separation channel and a liquid outlet channel connected in sequence, and providing a plurality of sub-channels connected between the liquid separation channel and the liquid outlet channel, the sub-channel is located directly below the chip, which can achieve the purpose of improving the cooling effect of the chip. At the same time, the sub-channel is arranged to be tilted downward from the liquid separation channel to the liquid outlet channel, which can increase the flow rate of the coolant in the cooling channel, thereby further achieving the technical effect of increasing the cooling speed of the chip. Furthermore, a first guide surface is provided on the inner side wall of the liquid separation channel, and a second guide surface is provided on the inner side wall of the liquid outlet channel, and the first guide surface and / or the second guide surface are arc-shaped surfaces, which can further reduce the flow resistance of the coolant at this position, thereby further achieving the technical effect of improving the cooling speed of the chip.

[0041] Of course, in other embodiments, the liquid inlet and the liquid outlet of the cooling channel may also be located on both sides of the base plate, for example, they may be two opposite sides of the base plate, or two adjacent sides of the base plate, which can also achieve the purpose of improving the chip cooling effect.

[0042] In other embodiments, the cooling channel may also be a straight line or other curved structures.

[0043] In addition, in other embodiments, the first guide surface and the second guide surface may also be inclined surfaces, which can also achieve the technical effect of reducing water resistance.

[0044] In addition, in this embodiment, the sub-channel 215 is Figure 3 The cross-sectional shape (in the X-axis direction) is circular.

[0045] Of course, in other embodiments, the cross-sectional shape of the sub-channel along its own width direction can also be a rounded rectangle, which can increase the contact area between the coolant and the chip, thereby achieving the technical effect of increasing the cooling speed of the chip.

[0046] Combination Figure 3 As shown, in this embodiment, the longitudinal section (i.e., along the Figure 3 The cross-section shape of the cross-section parallel to the YZ plane is a curved bending shape. For example, the curved bending shape can be a wave-like shape with undulating peaks and valleys. Based on this, the connection area between the sub-channel and the bottom plate can be increased, thereby achieving the technical effect of improving the cooling speed of the chip.

[0047] Of course, in other embodiments, the cross section of the sub-channel (i.e., along the Figure 3 The cross-section shape of the cross-section parallel to the XY plane is set to a curved bending shape, which can also achieve the technical effect of improving the chip cooling speed.

[0048] At the same time, in other embodiments, the sub-channel has both an area whose longitudinal section shape is a curved bend and an area whose cross-sectional shape is a curved bend, which can also achieve the technical effect of increasing the chip cooling speed.

[0049] Further, preferably, the peak of the curved bend in the sub-channel 215 is located directly below the chip 1, for example, can be located directly below more than one chip 1, and at the same time, the trough of the curved bend in at least one sub-channel can be located between adjacent chips.

[0050] Specifically, the peak of the curved bend in the sub-channel 215 is located directly below each chip 1 (not shown in the figure), that is, the trough of the curved bend in the sub-channel is located between adjacent chips. This can reduce the distance between the coolant in the sub-channel and the chip, thereby improving the cooling effect on the chip.

[0051] Furthermore, the horizontal height of the sub-channel 215 and the horizontal height of the liquid outlet channel 216 are not higher than the horizontal height of the liquid inlet channel 213 .

[0052] Preferably, in comparison between the positions of the sub-channel 215, the outlet channel 216 and the inlet channel 213, the inner bottom surface of the sub-channel 215 and the inner bottom surface of the inlet channel 213 are at the same horizontal height, the inner bottom surface of the outlet channel 216 is lower than the inner bottom surface of the sub-channel 215, the inner top surface of the inlet channel 213 and the inner top surface of the liquid separation channel 214 are at the same horizontal height, the liquid inlet channel 213 is higher than the sub-channel 215, and the coolant entering the liquid separation channel 214 through the inlet channel 213 directly passes through the sub-channel 215 and the outlet channel 216 in sequence.

[0053] 216 flows out, thereby achieving cooling of the bottom plate and further cooling of the chip. At the same time, it can also prevent the level of the liquid inlet channel from being too low. When the water level in the liquid separation channel is higher than the water level in the liquid inlet channel, the coolant in the liquid separation channel will affect the flow direction of the coolant in the liquid inlet channel. The level of the sub-channel and the liquid outlet channel is not higher than the level of the liquid inlet channel, which can ensure that the coolant in the liquid inlet channel flows normally into the liquid separation channel.

[0054] In addition, combined Figure 4 As shown, in this embodiment, the semiconductor laser further includes a heat sink 3. The top of the heat sink 3 is fixed to the bottom surface of the chip 1, and the bottom surface of the heat sink 3 is fixed to the bottom plate 2. A notch 2153 is provided at the top of the sub-channel 215, and a contact connection is formed between the notch 2153 and the heat sink 3, so that the distance between the coolant and the sub-channel can be shortened, so that the coolant directly cools the heat sink, eliminating the process of cooling the heat sink by the coolant, thereby achieving the purpose of improving the chip cooling effect.

[0055] Furthermore, the bottom end of the heat sink 3 extends downward to form a protrusion 31, and the protrusion 31 extends into the sub-channel 215 through the notch 2153, which can further ensure that the protrusion 31 forms a contact connection with the coolant in the sub-channel 215, thereby achieving the purpose of improving the technical effect of cooling the chip.

[0056] The material of the raised portion is the same as that of the heat sink, ensuring that the heat of the chip can be transferred out through the raised portion in a timely manner.

[0057] In this embodiment, the heat sink is made of a material with a thermal conductivity of not less than 190W / m·K, and the light output power of the chip is not less than 28W. Based on this, through the coordination between the heat sink and the chip, the heat sink can not only conduct heat to the chip, but also achieve the technical effect of cost saving. Specifically, the heat sink can be any of the following materials: aluminum nitride, silicon carbide, graphene and diamond; of course, the heat sink in this embodiment is not limited to the above materials, and materials that can achieve the above functions are within the scope of protection.

[0058] Meanwhile, in other embodiments, the heat sink is made of a material with a thermal conductivity of not less than 190 W / m·K, or a chip with an optical output power of not less than 28 W is selected.

[0059] Preferably, the base plate in this embodiment can be composed of two or more materials. Specifically, the thermal conductivity of the base plate material close to the chip is greater than the thermal conductivity of the base plate material far from the chip, which can not only achieve the technical effect of cost saving, but also achieve the lightweight performance of the semiconductor laser. For example, the base plate material close to the chip is made of metal copper, of course, including other metals with similar heat dissipation capabilities as copper; the base plate material far from the chip is made of metal aluminum, of course, it can also be other metals similar to aluminum.

[0060] In addition, the base plate located near the chip is formed by drawing, forging or 3D printing. For example, copper is formed into multiple sub-channel parts by 3D printing, and the multiple sub-channel parts are arranged on the base plate made of aluminum metal.

[0061] In addition, combined Figure 3 As shown, a plurality of guide ribs 2154 are arranged alternately and spaced apart in the sub-channel 215 along its own length direction to form a continuous S-shaped channel or a maze-shaped channel. The guide ribs can prevent the inclination angle of the sub-channel from being too large, resulting in too fast flow speed of the coolant and affecting the cooling effect of the chip.

[0062] Furthermore, one end of the guide rib 2154 along its own length direction is fixed on the inner wall of the sub-channel 215, and the other end of the guide rib 2154 is inclined toward the second end 2152 of the sub-channel. Through the inclined direction of the guide rib, all the coolant flowing through the guide rib can flow out through the liquid outlet of the cooling channel, thereby avoiding the accumulation of coolant in the guide rib and affecting the technical effect of chip heat dissipation.

[0063] In addition, the coolant in the cooling channel can be pure water or a phase change medium, and the phase change medium includes liquid ammonia or liquid nitrogen, etc., which can improve the heat dissipation or heat absorption capacity through phase change.

[0064] The above description is only a specific implementation of the present invention. Under the above teaching of the present invention, those skilled in the art can make other improvements or modifications based on the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the purpose of the present invention, and the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A semiconductor laser, characterized in that: Including chip and baseboard; The chip is located above the bottom plate; a cooling channel is provided in the bottom plate, and at least part of the cooling channel is located directly below the chip, and a liquid inlet and a liquid outlet of the cooling channel are located on one side or both sides of the bottom plate; The cooling channel comprises a liquid inlet channel, a liquid separation channel, a sub-channel and a liquid outlet channel which are sequentially connected between the liquid inlet and the liquid outlet; The sub-channels are provided with a plurality of them, the first ends of the plurality of sub-channels are connected with the liquid separation channel, the second ends of the sub-channels are connected with the liquid outlet channel, and the sub-channels are arranged to be inclined downward along the direction from the liquid separation channel to the liquid outlet channel; A first guide surface is provided on the inner side wall of the liquid separation channel, and the first guide surface is located on the extension line of the first end of the sub-channel; a second guide surface is provided on the inner side wall of the liquid outlet channel, and the second guide surface is located on the extension line of the second end of the sub-channel; the first guide surface and / or the second guide surface are arc-shaped surfaces or inclined surfaces.

2. The semiconductor laser according to claim 1, characterized in that The cross-sectional shape of the longitudinal section of the sub-channel is a curved bending shape, and / or the cross-sectional shape of the sub-channel is a curved bending shape.

3. The semiconductor laser according to claim 2, characterized in that When the cross-sectional shape of the longitudinal section of the sub-channel is a curved bending shape, the crest of the curved bending shape is located directly below the chip.

4. The semiconductor laser according to claim 1, characterized in that The horizontal height of the sub-channel and the horizontal height of the liquid outlet channel are not higher than the horizontal height of the liquid inlet channel.

5. The semiconductor laser according to claim 1, characterized in that It also includes a heat sink; the heat sink is fixed to the bottom surface of the chip, and the chip is fixedly connected to the bottom plate through the heat sink; A notch is provided on the top of the sub-channel, and a contact connection is formed between the notch and the heat sink.

6. The semiconductor laser according to claim 5, characterized in that The bottom end of the heat sink extends downward to form a protrusion, and the protrusion extends from the notch into the sub-channel.

7. The semiconductor laser according to claim 5, characterized in that The heat sink is made of a material with a thermal conductivity of not less than 190 W / m·K; and / or, The optical output power of the chip is not less than 28W.

8. The semiconductor laser according to claim 1, characterized in that A plurality of guide ribs are arranged alternately and spaced apart in the sub-channel along its own length direction, forming a continuous S-shaped channel or a maze-shaped channel.

9. The semiconductor laser according to claim 8, characterized in that One end of the guide rib along its own length direction is fixed on the inner wall of the sub-channel, and the other end of the guide rib is inclined toward the second end of the sub-channel.

10. The semiconductor laser according to any one of claims 1 to 9, characterized in that: The cross-sectional shape of the sub-channel along its own width direction is a rounded rectangle.

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