Anti-electromagnetic interference mechanism of PCBA mainboard

Abstract

The utility model discloses a PCBA mainboard anti-electromagnetic interference mechanism, which comprises a frame body, a heat dissipation mechanism and an anti-electromagnetic mechanism, the top of the frame body is provided with a first mounting groove, a second mounting groove and a third mounting groove in sequence from inside to outside, one end of the heat dissipation mechanism is slidably connected to the inner wall of the first mounting groove, and the other end of the heat dissipation mechanism is slidably connected to the inner wall of the third mounting groove. And the other end of the heat dissipation mechanism is slidably connected to the inner wall of the second mounting groove, the PCBA mainboard is arranged in the first mounting groove, and the anti-electromagnetic mechanism comprises a side electromagnetic plate base, a top electromagnetic plate base, a bottom electromagnetic plate base and a wavy magnet vane. Therefore, the anti-electromagnetic mechanism arranged on the device can carry out all-around electromagnetic protection on the PCBA main board, it is ensured that the PCBA main board is prevented from being invaded by electromagnetic interference in the using process, meanwhile, the device fully considers the heat dissipation requirement, and the heat dissipation mechanism arranged on the device can ensure that the PCBA main board can keep good heat dissipation performance in the working process, so that the heat dissipation performance of the PCBA main board is improved, and the service life of the PCBA main board is prolonged. The service life of the PCBA mainboard is effectively prolonged, the practicability is high, and the using effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of electromagnetic interference prevention, in particular to an electromagnetic interference prevention mechanism of a PCBA mainboard. Background Art

[0002] With the rapid development of electronic technology, PCBA (Printed Circuit Board Assembly) motherboards, as core components in electronic devices, bear the interconnection and communication tasks of many electronic components. However, in modern electronic environments, PCBA motherboards are often threatened by electromagnetic interference (EMI), which may come from external electromagnetic fields or radiation from other electronic devices. These interferences may not only cause data transmission errors and signal distortion, but may also cause abnormal operation of the motherboard and even damage sensitive components on the motherboard.

[0003] Existing anti-electromagnetic interference mechanisms are often only set up on the top of the PCBA motherboard. However, this local protection method cannot provide all-round electromagnetic protection for the PCBA motherboard. The electromagnetic interference problem on the side and bottom of the motherboard is still prominent, which greatly limits the protection effect.

[0004] In addition, existing anti-electromagnetic interference mechanisms often ignore the heat dissipation problem when designing. The PCBA motherboard will generate a lot of heat during operation. If it cannot be dissipated in time, the motherboard temperature will rise, which will affect the performance and life of the electronic components. Although traditional protection methods can effectively suppress electromagnetic interference, they also hinder the dissipation of heat, exacerbating the heat dissipation problem of the motherboard. When the motherboard temperature exceeds its tolerance range, the components may be thermally damaged, performance degraded or life shortened. Utility Model Content

[0005] The utility model aims to solve one of the technical problems in the related art at least to a certain extent.

[0006] To this end, the purpose of the utility model is to propose an anti-electromagnetic interference mechanism for a PCBA motherboard. The anti-electromagnetic mechanism provided in the device can perform all-round electromagnetic protection for the PCBA motherboard to ensure that it is protected from electromagnetic interference during use. At the same time, the device also fully considers the heat dissipation requirements. The heat dissipation mechanism provided in the device can ensure that the PCBA motherboard can maintain good heat dissipation performance when working, effectively extending the service life of the PCBA motherboard, and has strong practicality and good use effect.

[0007] In order to achieve the above-mentioned purpose, the utility model proposes an anti-electromagnetic interference mechanism of a PCBA motherboard, comprising a frame, a heat dissipation mechanism and an anti-electromagnetic mechanism, wherein the top of the frame is sequentially provided with a first mounting groove, a second mounting groove and a third mounting groove from the inside to the outside, wherein the first mounting groove is connected to the inside of the second mounting groove, one end of the heat dissipation mechanism is slidably connected to the inner wall of the first mounting groove, the other end of the heat dissipation mechanism is slidably connected to the inner wall of the second mounting groove, and is clamped and fixed with the inner wall of the second mounting groove, the PCBA motherboard is arranged inside the first mounting groove, and a guide is bonded and fixed to the top of the heat dissipation mechanism Thermal silicone; the anti-electromagnetic mechanism includes a side electromagnetic plate seat, a top electromagnetic plate seat, a bottom electromagnetic plate seat and a wavy magnetic isolation plate, wherein the side electromagnetic plate seat is slidably connected to the inner wall of the third mounting groove and is clamped and fixed to the surface of the frame, the top electromagnetic plate seat and the bottom electromagnetic plate seat are respectively arranged on the top side of the first mounting groove and the bottom side of the first mounting groove, one end of the bottom of the top electromagnetic plate seat and one end of the top of the bottom electromagnetic plate seat are respectively clamped and fixed to the inner wall of the first mounting groove, and the wavy magnetic isolation plate is respectively fixedly connected to the inner wall of the side electromagnetic plate seat, the inner wall of the top electromagnetic plate seat and the inner wall of the bottom electromagnetic plate seat.

[0008] The utility model discloses an anti-electromagnetic interference mechanism for a PCBA mainboard. The anti-electromagnetic mechanism provided in the device can perform all-round electromagnetic protection for the PCBA mainboard, ensuring that the PCBA mainboard is protected from electromagnetic interference during use. At the same time, the device also fully considers the heat dissipation demand. The heat dissipation mechanism provided in the device can ensure that the PCBA mainboard can maintain good heat dissipation performance when working, effectively prolonging the service life of the PCBA mainboard, and has strong practicality and good use effect.

[0009] In addition, the anti-electromagnetic interference mechanism of a PCBA motherboard proposed in the application may also have the following additional technical features:

[0010] Specifically, the heat dissipation mechanism includes two groups of air vent plates, a U-shaped seat and a connecting column, wherein the two groups of air vent plates are respectively slidably connected to the inner wall of the first mounting groove and are arranged up and down, the size of the air vent plates of the lower group is larger than the size of the air vent plates of the upper group, the PCBA main board is consistent with the size of the air vent plates of the upper group, the PCBA main board is located on one side of the top of the air vent plates of the upper group, and thermal conductive silicone is bonded and fixed to the top of the air vent plates of the upper group; the U-shaped seat is slidably connected to the inner wall of the second mounting groove, and is clamped and fixed to the inner wall of the second mounting groove by a first elastic clip, a strip groove is provided on the inner wall of the first mounting groove, and the first mounting groove is connected to the inside of the second mounting groove through the strip groove, and the connecting column is slidably connected to the inner wall of the strip groove, and is respectively fixed to one end surface of the air vent plate and one end surface of the U-shaped seat.

[0011] Specifically, the heat dissipation mechanism also includes a fan, a connecting card hole, side holes and an air guide column, wherein the fan is fixedly connected to the bottom of the lower group of air vent plates, the connecting card holes are respectively opened at the top of the frame and the bottom of the frame, and the positions are corresponding, the side holes are respectively opened on the inner walls of the first mounting grooves, and are connected with the interior of the connecting card holes; the air guide columns are respectively threadedly connected to the top electromagnetic plate seat surface and the bottom electromagnetic plate seat surface, and correspond to the positions of the connecting card holes, one end of the air guide column is located inside the connecting card hole and is connected with the interior of the connecting card hole, and the inner wall of the other end of the air guide column is threadedly connected with a dustproof mesh seat.

[0012] Specifically, a socket and a slot are respectively provided at positions corresponding to the surface of the side electromagnetic plate seat and the surface of the frame, and the socket is slidably connected to the inner wall of the slot; a second elastic clamp and a first clamping hole are respectively provided at positions corresponding to the surface of the socket and the inner wall of the slot, and the second elastic clamp is clamped and fixed to the first clamping hole.

[0013] Specifically, a boss is provided at one end of the bottom of the top electromagnetic plate seat and one end of the top of the bottom electromagnetic plate seat respectively, the boss is slidably connected to the inner wall of the strip groove, a third elastic clip and a second clip hole are provided at the positions corresponding to the positions of the boss surface and the inner wall of the strip groove respectively, and the third elastic clip is fixedly connected and fastened to the second clip hole.

[0014] Specifically, a rectangular groove is opened on the surface of the frame at a position corresponding to the position of the wavy magnetic isolation plate, and the rectangular groove is connected to the inside of the third mounting groove. A heat dissipation groove is opened on the surface of the frame at a position corresponding to the position of the U-shaped seat, and the heat dissipation groove is connected to the inside of the second mounting groove.

[0015] Specifically, a boss is integrally formed at the bottom of the bottom electromagnetic plate seat.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0018] Figure 1 This is a schematic diagram of the structure of an anti-electromagnetic interference mechanism of a PCBA mainboard of the utility model;

[0019] Figure 2 This is a schematic diagram of the structural decomposition of an anti-electromagnetic interference mechanism of a PCBA mainboard of the utility model;

[0020] Figure 3 This is a schematic diagram of the frame structure in the anti-electromagnetic interference mechanism of a PCBA mainboard of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of a heat dissipation mechanism in an anti-electromagnetic interference mechanism of a PCBA mainboard of the utility model;

[0022] Figure 5 This is a schematic diagram of the structure of a side electromagnetic plate seat in an anti-electromagnetic interference mechanism of a PCBA mainboard of the utility model;

[0023] Figure 6 This is a schematic diagram of the top electromagnetic plate seat structure in the anti-electromagnetic interference mechanism of a PCBA mainboard of the utility model;

[0024] Figure 7 The utility model is a schematic diagram of the bottom electromagnetic plate seat structure in the anti-electromagnetic interference mechanism of a PCBA mainboard.

[0025] As shown in the figure:

[0026] 1. Frame; 2. Heat dissipation mechanism; 3. Anti-electromagnetic mechanism; 11. First mounting slot; 12. Second mounting slot; 13. Third mounting slot; 14. Strip slot; 10. PCBA mainboard; 31. Side electromagnetic plate seat; 32. Top electromagnetic plate seat; 33. Bottom electromagnetic plate seat; 35. Wave-shaped magnetic isolation plate;

[0027] 21. vent plate; 22. U-shaped seat; 23. first elastic clamp; 24. connecting column;

[0028] 25. Fan; 26. Connection card hole; 27. Side discharge hole; 28. Air guide column; 29. ​​Dustproof mesh seat;

[0029] 312, card seat; 15, card slot; 311, second elastic card member;

[0030] 321, convex seat; 322, third elastic clamp; 141, second clamp hole;

[0031] 18. Rectangular slot; 17. Heat dissipation slot;

[0032] 34. Boss. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention. On the contrary, the embodiments of the present invention include all changes, modifications, and equivalents that fall within the spirit and connotation of the appended claims.

[0034] The following describes an anti-electromagnetic interference mechanism of a PCBA mainboard according to an embodiment of the utility model in conjunction with the accompanying drawings.

[0035] like Figure 1-Figure 7 As shown, an anti-electromagnetic interference mechanism of a PCBA motherboard according to an embodiment of the utility model comprises a frame 1, a heat dissipation mechanism 2 and an anti-electromagnetic mechanism 3, wherein a first mounting groove 11, a second mounting groove 12 and a third mounting groove 13 are sequentially provided on the top of the frame 1 from the inside to the outside, wherein the first mounting groove 11 is connected to the inside of the second mounting groove 12, one end of the heat dissipation mechanism 2 is slidably connected to the inner wall of the first mounting groove 11, and the other end of the heat dissipation mechanism 2 is slidably connected to the inner wall of the second mounting groove 12 and is clamped and fixed with the inner wall of the second mounting groove 12, and a PCBA motherboard 10 is arranged inside the first mounting groove 11, and a thermal conductive silicon is bonded and fixed to the top of the heat dissipation mechanism 2. Glue; The anti-electromagnetic mechanism 3 includes a side electromagnetic plate seat 31, a top electromagnetic plate seat 32, a bottom electromagnetic plate seat 33 and a wavy magnetic isolation plate 35, wherein the side electromagnetic plate seat 31 is slidably connected to the inner wall of the third mounting groove 13, and is clamped and fixed to the surface of the frame 1, the top electromagnetic plate seat 32 and the bottom electromagnetic plate seat 33 are respectively arranged on the top side of the first mounting groove 11 and the bottom side of the first mounting groove 11, the bottom end of the top electromagnetic plate seat 32 and the top end of the bottom electromagnetic plate seat 33 are respectively clamped and fixed to the inner wall of the first mounting groove 11, and the wavy magnetic isolation plate 35 is respectively fixedly connected to the inner wall of the side electromagnetic plate seat 31, the inner wall of the top electromagnetic plate seat 32 and the inner wall of the bottom electromagnetic plate seat 33.

[0036] It should be noted that buckle grooves are respectively formed on the surfaces of the side electromagnetic plate seat 31 , the top electromagnetic plate seat 32 and the bottom electromagnetic plate seat 33 .

[0037] Specifically, the device is provided with an anti-electromagnetic mechanism 3, which includes a side electromagnetic plate seat 31, a top electromagnetic plate seat 32, a bottom electromagnetic plate seat 33 and a wavy magnetic isolation plate 35. The side electromagnetic plate seat 31, the top electromagnetic plate seat 32, the bottom electromagnetic plate seat 33 and the wavy magnetic isolation plate 35 cooperate with each other to protect all six surfaces of the frame 1, and the use effect is good. Among them, the snap-on design is convenient for disassembly and assembly, effectively improves the disassembly and assembly efficiency, and reduces labor intensity. The wavy design of the wavy magnetic isolation plate 35 has a larger specific surface area than a flat plate, and its radiation protection area is further increased, and the use effect is good.

[0038] The device is also provided with a heat dissipation mechanism 2, which includes a heat conduction heat dissipation method mainly based on a vent plate 21, a U-shaped seat 22 and a connecting column 24, and an air cooling heat dissipation method mainly based on a fan 25. The two heat dissipation methods cooperate with each other to effectively improve the heat dissipation performance. Among them, the use of the heat dissipation mechanism 2 does not affect the use of the anti-electromagnetic mechanism 3 and the PCBA mainboard 10 itself, and the use effect is better.

[0039] The anti-electromagnetic mechanism 3 provided in the device can provide all-round electromagnetic protection for the PCBA mainboard 10, ensuring that it is protected from electromagnetic interference during use. At the same time, the device also fully considers the heat dissipation requirements. The heat dissipation mechanism 2 provided in the device can ensure that the PCBA mainboard 10 can maintain good heat dissipation performance during operation, effectively extending the service life of the PCBA mainboard 10, and has strong practicality and good use effect.

[0040] In one embodiment of the present invention, Figure 3 As shown, the heat dissipation mechanism 2 includes two groups of air vent plates 21, a U-shaped seat 22 and a connecting column 24, wherein the two groups of air vent plates 21 are respectively slidably connected to the inner wall of the first mounting groove 11 and are arranged up and down, the size of the lower group of air vent plates 21 is larger than the size of the upper group of air vent plates 21, the PCBA mainboard 10 is consistent with the size of the upper group of air vent plates 21, the PCBA mainboard 10 is located on one side of the top of the upper group of air vent plates 21, and is bonded and fixed with thermal conductive silicone between the top of the upper group of air vent plates 21; the U-shaped seat 22 is slidably connected to the inner wall of the second mounting groove 12, and is clamped and fixed to the inner wall of the second mounting groove 12 by a first elastic clip 23, a strip groove 14 is opened on the inner wall of the first mounting groove 11, and the first mounting groove 11 is connected to the inside of the second mounting groove 12 through the strip groove 14, and the connecting column 24 is slidably connected to the inner wall of the strip groove 14, and is respectively fixedly connected to one end surface of the air vent plate 21 and one end surface of the U-shaped seat 22.

[0041] It should be noted that the air perforated plate 21, the U-shaped seat 22 and the connecting column 24 described in this embodiment are integrally formed.

[0042] It should also be noted that the air vent plate 21, U-shaped seat 22 and connecting column 24 are all made of heat-conducting metal material, which can be copper or aluminum. In order to reduce the weight of the heat dissipation mechanism 2, the U-shaped seat 22 and the connecting column 24 are hollow structures.

[0043] Specifically, the PCBA mainboard 10 is set on the ventilation hole plate 21, and the heat on the PCBA mainboard 10 is conducted to the ventilation hole plate 21 through the thermal conductive silica gel, and then conducted to the connecting column 24 by the ventilation hole plate 21, and finally conducted to the U-shaped seat 22 by the connecting column 24. The surface of the U-shaped seat 22 is exposed to the air, which accelerates the heat dissipation and has a good use effect.

[0044] In one embodiment of the present invention, Figure 3-Figure 4 and Figure 6-Figure 7 As shown, the heat dissipation mechanism 2 also includes a fan 25, a connecting card hole 26, a side row hole 27 and an air guide column 28, wherein the fan 25 is fixedly connected to the bottom of a group of air vent plates 21 below, the connecting card holes 26 are respectively opened at the top and the bottom of the frame 1, and the positions correspond, the side row holes 27 are respectively opened on the inner wall of the first mounting groove 11, and are connected with the inside of the connecting card hole 26; the air guide column 28 is respectively threadedly connected to the surface of the top electromagnetic plate seat 32 and the surface of the bottom electromagnetic plate seat 33, and corresponds to the position of the connecting card hole 26, one end of the air guide column 28 is located inside the connecting card hole 26 and is connected with the inside of the connecting card hole 26, and the inner wall of the other end of the air guide column 28 is threadedly connected with a dustproof mesh seat 29.

[0045] It should be noted that the air guide column 28 described in this embodiment protrudes from the surface of the top electromagnetic plate seat 32 by a set height.

[0046] It should also be noted that the connection card hole 26 opened at the top of the frame 1 is not connected to the inside of the connection card hole 26 opened at the bottom of the frame 1 .

[0047] Specifically, the fan 25 is powered on and runs, and the operation of the fan 25 accelerates the air flow rate in the first installation slot 11. The gas enters the connection card hole 26 from the air guide column 28 on the surface of the bottom electromagnetic plate seat 33, and then enters the side discharge hole 27 from the connection card hole 26, and then enters the first installation slot 11 from the side discharge hole 27. Then, the gas entering the first installation slot 11 flows from the bottom of the air vent plate 21 to the top of the air vent plate 21, and takes away the heat from the surface of the PCBA mainboard 10 during the flow process. Then, the hot air enters the connection card hole 26 through the side discharge hole 27 above the PCBA mainboard 10, and then The air enters the air guide column 28 on the surface of the top electromagnetic plate seat 32 from the inside of the connecting card hole 26, and is finally discharged by the air guide column 28. The air guide column 28 protrudes from the surface of the top electromagnetic plate seat 32 to a set height. By setting the air guide column 28 at a suitable height, the gas inside the first installation groove 11 can be discharged more quickly to a certain extent. A dustproof mesh seat 29 is threadedly connected to the inner wall at one end of the air guide column 28. The dustproof mesh seat 29 effectively prevents dust from entering the first installation groove 11, reducing the impact on the PCBA mainboard 10, and has a good use effect. The connecting card hole 26, the side discharge hole 27 and the air guide column 28 are also convenient for threading.

[0048] In one embodiment of the present invention, Figure 3 and Figure 5As shown, a socket 312 and a slot 15 are respectively provided at positions corresponding to the surface of the side electromagnetic plate seat 31 and the surface of the frame 1, and the socket 312 is slidably connected to the inner wall of the slot 15; a second elastic clamp 311 and a first clamp hole are respectively provided at positions corresponding to the surface of the socket 312 and the inner wall of the slot 15, and the second elastic clamp 311 is clamped and fixed to the first clamp hole.

[0049] Specifically, the clamping seat 312 and the clamping slot 15 are convenient for limiting the side electromagnetic plate seat 31 , and the second elastic clamping piece 311 and the first clamping hole are designed to facilitate fixing the side electromagnetic plate seat 31 .

[0050] In one embodiment of the present invention, Figure 3 and Figure 6-Figure 7 As shown, a boss 321 is respectively provided at the bottom end of the top electromagnetic plate seat 32 and the top end of the bottom electromagnetic plate seat 33. The boss 321 is slidably connected to the inner wall of the strip groove 14. A third elastic clamp 322 and a second clamp hole 141 are respectively provided at the positions corresponding to the positions of the inner wall of the strip groove 14 on the surface of the boss 321. The third elastic clamp 322 is clamped and fixed with the second clamp hole 141.

[0051] It should be noted that the boss 321 described in this embodiment is adapted to the outer dimensions of the strip groove 14 .

[0052] Specifically, when installing the top electromagnetic plate seat 32 and the bottom electromagnetic plate seat 33, align the protrusion 321 with the strip groove 14 and press down. After the protrusion 321 enters the strip groove 14, the third elastic clip 322 simultaneously enters the strip groove 14 until it is clipped and fixed with the second clip hole 141. When the third elastic clip 322 is clipped and fixed with the second clip hole 141, the top electromagnetic plate seat 32 and the bottom electromagnetic plate seat 33 are installed and fixed simultaneously.

[0053] In one embodiment of the present invention, Figure 3 As shown, a rectangular groove 18 is opened on the surface of the frame 1 at a position corresponding to the position of the wavy magnetic isolation plate 35, and the rectangular groove 18 is connected to the inside of the third mounting groove 13. A heat dissipation groove 17 is opened on the surface of the frame 1 at a position corresponding to the position of the U-shaped seat 22, and the heat dissipation groove 17 is connected to the inside of the second mounting groove 12.

[0054] Specifically, the rectangular groove 18 is designed to expose the wavy magnetic isolation plate 35, and the heat dissipation groove 17 is designed to increase the heat dissipation area of ​​the U-shaped seat 22, thereby improving the heat dissipation effect.

[0055] In one embodiment of the present invention, Figure 7 As shown, a boss 34 is integrally formed at the bottom of the bottom electromagnetic plate seat 33 .

[0056] Specifically, the design of the boss 34 facilitates the air intake of the air guide column 28 on the surface of the bottom electromagnetic plate seat 33, and the use effect is good.

[0057] In summary, the anti-electromagnetic interference mechanism of a PCBA mainboard in an embodiment of the utility model, the anti-electromagnetic mechanism 3 provided in the device can perform all-round electromagnetic protection for the PCBA mainboard 10, ensuring that it is protected from electromagnetic interference during use. At the same time, the device also fully considers the heat dissipation requirements. The heat dissipation mechanism 2 provided in the device can ensure that the PCBA mainboard 10 can maintain good heat dissipation performance during operation, effectively extending the service life of the PCBA mainboard 10, and has strong practicality and good use effect.

[0058] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0060] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. An anti-electromagnetic interference mechanism for a PCBA motherboard, characterized in that: It comprises a frame (1), a heat dissipation mechanism (2) and an anti-electromagnetic mechanism (3), wherein: The top of the frame (1) is provided with a first installation groove (11), a second installation groove (12) and a third installation groove (13) in order from the inside to the outside, wherein: The first installation groove (11) is connected to the inside of the second installation groove (12); one end of the heat dissipation mechanism (2) is slidably connected to the inner wall of the first installation groove (11); the other end of the heat dissipation mechanism (2) is slidably connected to the inner wall of the second installation groove (12) and is fixedly engaged with the inner wall of the second installation groove (12); the PCBA mainboard (10) is arranged inside the first installation groove (11) and is bonded and fixed to the top of the heat dissipation mechanism (2) with thermal conductive silicone; The anti-electromagnetic mechanism (3) comprises a side electromagnetic plate seat (31), a top electromagnetic plate seat (32), a bottom electromagnetic plate seat (33) and a wavy magnetic isolation plate (35), wherein: The side electromagnetic plate seat (31) is slidably connected to the inner wall of the third mounting groove (13) and is fixedly engaged with the surface of the frame (1); the top electromagnetic plate seat (32) and the bottom electromagnetic plate seat (33) are respectively arranged on the top side of the first mounting groove (11) and the bottom side of the first mounting groove (11); the bottom end of the top electromagnetic plate seat (32) and the top end of the bottom electromagnetic plate seat (33) are respectively fixedly engaged with the inner wall of the first mounting groove (11); the wavy magnetic isolation plate (35) is respectively fixedly connected to the inner wall of the side electromagnetic plate seat (31), the inner wall of the top electromagnetic plate seat (32) and the inner wall of the bottom electromagnetic plate seat (33).

2. The anti-electromagnetic interference mechanism of the PCBA mainboard according to claim 1, characterized in that: The heat dissipation mechanism (2) comprises two groups of air perforated plates (21), a U-shaped seat (22) and a connecting column (24), wherein: The two groups of the air vent plates (21) are respectively slidably connected to the inner wall of the first mounting groove (11) and are arranged up and down, the size of the lower group of the air vent plates (21) is larger than the size of the upper group of the air vent plates (21), the PCBA main board (10) is consistent with the size of the upper group of the air vent plates (21), the PCBA main board (10) is located on one side of the top of the upper group of the air vent plates (21), and a thermal conductive silica gel is bonded and fixed between the upper group of the air vent plates (21); The U-shaped seat (22) is slidably connected to the inner wall of the second mounting groove (12) and is fixedly connected to the inner wall of the second mounting groove (12) by means of a first elastic clamp (23); a strip groove (14) is provided on the inner wall of the first mounting groove (11); the first mounting groove (11) is connected to the inside of the second mounting groove (12) through the strip groove (14); the connecting column (24) is slidably connected to the inner wall of the strip groove (14) and is fixedly connected to one end surface of the air vent plate (21) and one end surface of the U-shaped seat (22) respectively.

3. The anti-electromagnetic interference mechanism of the PCBA mainboard according to claim 2, characterized in that: The heat dissipation mechanism (2) further comprises a fan (25), a connection card hole (26), a side discharge hole (27) and an air guide column (28), wherein: The fan (25) is fixedly connected to the bottom of the lower group of the vent plates (21); the connection holes (26) are respectively opened at the top of the frame (1) and the bottom of the frame (1), and the positions are corresponding; the side holes (27) are respectively opened on the inner wall of the first mounting groove (11), and are connected to the inside of the connection holes (26); The air guide column (28) is respectively threadedly connected to the surface of the top electromagnetic plate seat (32) and the surface of the bottom electromagnetic plate seat (33), and corresponds to the position of the connecting card hole (26). One end of the air guide column (28) is located inside the connecting card hole (26) and is connected to the inside of the connecting card hole (26). The inner wall of the other end of the air guide column (28) is threadedly connected to a dustproof net seat (29).

4. The anti-electromagnetic interference mechanism of the PCBA mainboard according to claim 1, characterized in that: A clamping seat (312) and a clamping slot (15) are respectively provided at positions corresponding to the surface of the side electromagnetic plate seat (31) and the surface of the frame body (1), and the clamping seat (312) is slidably connected to the inner wall of the clamping slot (15); A second elastic clamping piece (311) and a first clamping hole are respectively provided at positions on the surface of the clamping seat (312) corresponding to the inner wall of the clamping slot (15), and the second elastic clamping piece (311) is clamped and fixed to the first clamping hole.

5. The anti-electromagnetic interference mechanism of the PCBA mainboard according to claim 1, characterized in that: A convex seat (321) is respectively arranged at the bottom end of the top electromagnetic plate seat (32) and the top end of the bottom electromagnetic plate seat (33); the convex seat (321) is slidably connected to the inner wall of the strip groove (14); a third elastic clamp (322) and a second clamping hole (141) are respectively arranged at positions corresponding to the inner wall of the strip groove (14) on the surface of the convex seat (321); the third elastic clamp (322) is clamped and fixed to the second clamping hole (141).

6. The anti-electromagnetic interference mechanism of the PCBA mainboard according to claim 2, characterized in that: A rectangular groove (18) is provided on the surface of the frame (1) at a position corresponding to the position of the wavy magnetic isolation plate (35), and the rectangular groove (18) is connected to the inside of the third mounting groove (13). A heat dissipation groove (17) is provided on the surface of the frame (1) at a position corresponding to the position of the U-shaped seat (22), and the heat dissipation groove (17) is connected to the inside of the second mounting groove (12).

7. The anti-electromagnetic interference mechanism of the PCBA mainboard according to claim 1, characterized in that: The bottom of the bottom electromagnetic plate seat (33) is integrally formed with a boss (34).

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