Diamond composite heat sink device

By designing clamping components and silicone thermal pads in the diamond composite heat sink device, filling the tiny gaps, and using wind heat dissipation mechanisms to improve heat exchange efficiency, the problem of low heat conduction efficiency in the prior art is solved, and efficient heat dissipation effect is achieved.

CN222673027UActive Publication Date: 2025-03-25JIAXING TOPSTONE NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202421393103.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-18
Publication Date
2025-03-25
Estimated Expiration
2034-06-18

AI Technical Summary

Technical Problem

The existing diamond composite heat sink device has a tiny gap during processing, which affects the heat conduction efficiency and cannot meet the efficient heat dissipation needs of high-power electronic devices.

Method used

A diamond composite heat sink device is designed to reduce and fill the tiny gaps during installation of the heat sink through the clamping assembly of the fixing mechanism and the silicone thermal pad, and to improve the heat exchange efficiency through the wind heat sink mechanism.

Benefits of technology

It effectively improves the heat conduction efficiency and heat dissipation effect, and meets the demand for efficient heat dissipation of high-power electronic devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a diamond composite heat sink device which comprises a diamond-based composite material radiating fin, a fixing mechanism and a wind power radiating mechanism, the fixing mechanism used for fixing the diamond-based composite material radiating fin is arranged below the diamond-based composite material radiating fin, and the wind power radiating mechanism is arranged below the diamond-based composite material radiating fin. A wind power heat dissipation mechanism used for improving the heat exchange efficiency of the diamond-based composite material cooling fins and air is arranged above the diamond-based composite material cooling fins, and the fixing mechanism comprises a mounting groove, a first frame and a second frame. According to the diamond composite heat sink device provided by the utility model, through the structural design of the fixing mechanism, the diamond-based composite heat sink can be clamped and fixed by rotating the knob after the diamond-based composite heat sink is inserted into the inner side of the mounting groove; tiny gaps generated when the diamond-based composite material cooling fins are installed can be reduced and filled through clamping and silica gel heat conduction pads, and the heat conduction efficiency of the device is effectively improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of heat sinks, in particular to a diamond composite heat sink device. Background Art

[0002] Due to the rapid development of integrated circuits and electronic devices, new packaging forms are constantly emerging. At present, the packaging shells of high-power electronic devices usually use heat sink materials, mainly tungsten-copper alloys, molybdenum-copper alloys, CPC, CMC, Kovar alloys and other high thermal conductivity heat sink materials. However, in high-power electronic devices, the thermal conductivity of the heat sink material in the thickness direction, referred to as the Z-direction thermal conductivity, is required to be higher. Single-filament traditional heat sink materials can no longer meet the requirements of efficient heat dissipation. Metal-based diamond composites have become the most promising new generation of heat sink materials with their high thermal conductivity and low thermal expansion coefficient. However, the weldability and electroplating performance of metal-based diamond composites are relatively poor, and cannot meet the use of later packaging.

[0003] For example, a Chinese utility model patent (CN212786456U) discloses a diamond composite heat sink device, which records: "Through a combined structure, the heat sink frame and the heat sink are combined into a whole. The structure can make the heat sink of the composite diamond composite material directly contact with the electronic device, thereby improving the heat dissipation efficiency." It also records: "The sandwich packaging form commonly used in the prior art isolates the diamond-based composite material from direct contact with the electronic device, and the sheet or block packaging form seriously affects its Z-direction heat dissipation efficiency and cannot meet the use requirements of high-power electronic devices." Technical problems.

[0004] Based on the above, it can be seen that the following technical problems exist in the prior art: in the above patent, the heat dissipation efficiency is improved by plugging and fixing the frame and the heat sink into a whole. However, during the processing of the frame and the heat sink, although they look very smooth, there are still some irregularities and bumps at the microscopic level, which makes a small gap between the radiator and the frame, thereby affecting the heat conduction efficiency of the device. For this reason, the present application proposes a diamond composite heat sink device to provide a new technical solution to solve the technical problems mentioned in the above patent. Utility Model Content

[0005] Based on this, it is necessary to provide a diamond composite heat sink device to address the above technical problems. Through the structural design of the fixing mechanism, the diamond-based composite heat sink can be clamped and fixed by turning the knob after the diamond-based composite heat sink is inserted into the inner side of the installation groove. The tiny gap generated during the installation of the diamond-based composite heat sink can be reduced and filled by clamping and using a silicone thermal pad, thereby effectively improving the thermal conduction efficiency of the device.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A diamond composite heat sink device is used for heat conduction and heat dissipation.

[0008] The diamond composite heat sink device specifically comprises: a diamond-based composite heat sink, a fixing mechanism and a wind heat dissipation mechanism, wherein a fixing mechanism for fixing the diamond-based composite heat sink is provided below the diamond-based composite heat sink, and a wind heat dissipation mechanism for improving the heat exchange efficiency between the diamond-based composite heat sink and the air is provided above the diamond-based composite heat sink;

[0009] The fixing mechanism includes a mounting groove, a first frame, a second frame, a clamping assembly and a heat-conducting assembly. The number of the first frames is two and they are symmetrically arranged. A plurality of second frames are equidistantly arranged between the two first frames. The surfaces of the first frame and the second frame are both provided with mounting grooves, and the diamond-based composite material heat sink extends to the inner side of the mounting groove.

[0010] As a preferred embodiment of the diamond composite heat sink device provided by the utility model, the clamping assembly includes a threaded rod, a fixed baffle and a knob, the number of the threaded rods is two and they are symmetrically arranged at the two end positions of the first frame and the second frame, the two threaded rods both penetrate the ends of the first frame and the second frame and extend outward, the first frame and the second frame are both movably connected to the threaded rod, one end of the threaded rod is fixedly connected to the fixed baffle, the end of the threaded rod away from the fixed baffle is threadedly connected to the knob, and the fixed baffle and the knob are respectively tightly fitted with the two first frames.

[0011] As a preferred embodiment of the diamond composite heat sink device provided by the utility model, the heat conductive component includes a silicone thermal pad, which is fixedly connected to the inner side of the mounting groove, and the surface of the silicone thermal pad is tightly fitted with the diamond-based composite heat sink.

[0012] As a preferred embodiment of the diamond composite heat sink device provided by the utility model, heat dissipation grooves are evenly formed on the surface of the diamond-based composite material heat sink.

[0013] As a preferred embodiment of the diamond composite heat sink device provided by the utility model, the wind heat dissipation mechanism includes a mounting plate, a fan and a connecting component, a mounting plate is arranged above the diamond-based composite material heat sink, the mounting plate is tightly fitted with the top surface of the diamond-based composite material heat sink, and a fan is embedded and fixedly connected in the middle of the mounting plate.

[0014] As a preferred embodiment of the diamond composite heat sink device provided by the utility model, the connecting assembly includes a rotating seat, a connecting plate, a positioning groove, a clamping plate, a hand-tightening bolt and a spring. A connecting plate is rotatably connected to the top of the first frame through a rotating seat. A positioning groove is provided on the outside of the mounting plate and at a position corresponding to the connecting plate. A clamping plate is slidably connected to the inside of the connecting plate. Both ends of the clamping plate extend to the outside of the connecting plate and fit tightly with the surface of the mounting plate. A hand-tightening bolt is provided above the clamping plate, and the hand-tightening bolt is threadedly connected to the connecting plate. A spring is provided inside the connecting plate and at a position below the clamping plate, and both ends of the spring are fixedly connected to the connecting plate and the clamping plate, respectively.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] The diamond composite heat sink device provided by the utility model can clamp and fix the diamond-based composite heat sink by turning the knob after the diamond-based composite heat sink is inserted into the inner side of the installation groove through the structural design of the fixing mechanism. The tiny gap generated when the diamond-based composite heat sink is installed can be reduced and filled through clamping and the silicone thermal pad, thereby effectively improving the heat conduction efficiency of the device.

[0017] The diamond composite heat sink device provided by the utility model can enhance the air flow near the diamond-based composite heat sink by starting the connecting plate through the structural design of the wind heat dissipation mechanism, so that the diamond-based composite heat sink and the outside air can exchange heat more quickly, effectively improving the heat dissipation effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of the overall structure of the diamond composite heat sink device provided by the utility model;

[0020] Figure 2 A schematic diagram of the structure of the fixing mechanism of the diamond composite heat sink device provided by the utility model;

[0021] Figure 3 A schematic diagram of the structure of the threaded rod, fixed baffle and knob of the diamond composite heat sink device provided by the utility model;

[0022] Figure 4A schematic diagram of the structure of the diamond composite heat sink device installation groove and the silicone thermal pad provided by the utility model;

[0023] Figure 5 A schematic diagram of the structure of the wind-driven heat dissipation mechanism of the diamond composite heat sink device provided by the utility model;

[0024] Figure 6 A schematic diagram of the structure of the mounting plate, fan and positioning groove of the diamond composite heat sink device provided by the utility model;

[0025] Figure 7 This is a cross-sectional view of the internal structure of the connecting plate of the diamond composite heat sink device provided by the utility model.

[0026] The markings in the figure are as follows:

[0027] 1. Diamond-based composite heat sink; 2. Fixing mechanism; 3. Wind heat dissipation mechanism; 4. Mounting slot; 5. First frame; 6. Second frame; 7. Heat dissipation slot; 8. Threaded rod; 9. Fixed baffle; 10. Knob; 11. Silicone thermal pad; 12. Rotating seat; 13. Connecting plate; 14. Mounting plate; 15. Fan; 16. Positioning slot; 17. Clamping plate; 18. Hand-tightened bolt; 19. Spring. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0029] As described in the background technology, the above patent improves the heat dissipation efficiency by plugging and fixing the frame and the heat sink into a whole. However, during the processing of the frame and the heat sink, although they look very smooth, there are still some irregularities and bumps at the microscopic level, which makes a small gap between the radiator and the frame, thereby affecting the heat conduction efficiency of the device.

[0030] In order to solve this technical problem, the utility model provides a diamond composite heat sink device, which is used for heat conduction and heat dissipation.

[0031] Specifically, please refer to Figure 1-Figure 7 , the diamond composite heat sink device specifically includes:

[0032] A diamond-based composite heat sink 1, a fixing mechanism 2 and a wind heat dissipation mechanism 3. A fixing mechanism 2 for fixing the diamond-based composite heat sink 1 is provided below the diamond-based composite heat sink 1, and a wind heat dissipation mechanism 3 for improving the heat exchange efficiency between the diamond-based composite heat sink 1 and the air is provided above the diamond-based composite heat sink 1;

[0033] The fixing mechanism 2 includes a mounting groove 4, a first frame 5, a second frame 6, a clamping assembly and a heat conducting assembly. There are two first frames 5 and they are symmetrically arranged. A plurality of second frames 6 are equidistantly arranged between the two first frames 5. The surfaces of the first frame 5 and the second frame 6 are both provided with mounting grooves 4, and the diamond-based composite material heat sink 1 extends to the inner side of the mounting groove 4.

[0034] The diamond composite heat sink device provided by the utility model can, through the structural design of the fixing mechanism 2, clamp and fix the diamond-based composite heat sink 1 by turning the knob 10 after the diamond-based composite heat sink 1 is inserted into the inner side of the installation groove 4. The tiny gap generated when the diamond-based composite heat sink 1 is installed can be reduced and filled by clamping and the silicone thermal pad 11, thereby effectively improving the heat conduction efficiency of the device.

[0035] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0036] Embodiment 1:

[0037] Please refer to Figure 1-Figure 4 A diamond composite heat sink device comprises: a diamond-based composite heat sink 1, a fixing mechanism 2 and a wind heat dissipation mechanism 3, wherein the fixing mechanism 2 for fixing the diamond-based composite heat sink 1 is arranged below the diamond-based composite heat sink 1, and the wind heat dissipation mechanism 3 for improving the heat exchange efficiency between the diamond-based composite heat sink 1 and the air is arranged above the diamond-based composite heat sink 1;

[0038] Specifically, the fixing mechanism 2 includes a mounting groove 4, a first frame 5, a second frame 6, a clamping assembly and a heat conducting assembly. The number of first frames 5 is two and they are symmetrically arranged. A plurality of second frames 6 are equidistantly arranged between the two first frames 5. The surfaces of the first frame 5 and the second frame 6 are both provided with mounting grooves 4, and the diamond-based composite material heat sink 1 extends to the inner side of the mounting groove 4.

[0039] Furthermore, the clamping assembly includes a threaded rod 8, a fixed baffle 9 and a knob 10. There are two threaded rods 8 and they are symmetrically arranged at the two end positions of the first frame 5 and the second frame 6. The two threaded rods 8 both penetrate the ends of the first frame 5 and the second frame 6 and extend outward. The first frame 5 and the second frame 6 are both movably connected to the threaded rod 8. One end of the threaded rod 8 is fixedly connected to the fixed baffle 9, and the end of the threaded rod 8 away from the fixed baffle 9 is threadedly connected to the knob 10. The fixed baffle 9 and the knob 10 are tightly fitted with the two first frames 5 respectively.

[0040] Furthermore, the heat-conducting component includes a silicone thermal pad 11 , which is fixedly connected to the inner side of the mounting groove 4 , and the surface of the silicone thermal pad 11 is tightly fitted to the diamond-based composite material heat sink 1 .

[0041] It can be seen that after the diamond-based composite heat sink 1 is placed inside the mounting groove 4, the knob 10 can be rotated. While the knob 10 is rotating, the distance between the fixed baffle 9 and the knob 10 will gradually decrease, so that the fixed baffle 9 and the knob 10 respectively push the two first frames 5 to gradually move towards each other. While the two first frames 5 move, they will push the diamond-based composite heat sink 1 and the second frame 6 to move, thereby clamping and fixing the diamond-based composite heat sink 1 inside the mounting groove 4. While clamping the diamond-based composite heat sink 1, the silicone thermal pad 11 inside the mounting groove 4 will further fill the gaps between the first frame 5 and the diamond-based composite heat sink 1 and between the second frame 6 and the first frame 5, thereby improving the thermal conduction efficiency of the device.

[0042] Furthermore, the surface of the diamond-based composite material heat sink 1 is evenly provided with heat dissipation grooves 7 , which can facilitate air flow and reduce the material cost of the diamond-based composite material heat sink 1 .

[0043] Embodiment 2:

[0044] The diamond composite heat sink device provided in Example 1 is further optimized. Specifically, Figure 5-Figure 7 As shown, further, the wind heat dissipation mechanism 3 includes a mounting plate 14, a fan 15 and a connecting component. The mounting plate 14 is arranged above the diamond-based composite heat sink 1. The mounting plate 14 is tightly fitted to the top surface of the diamond-based composite heat sink 1, and the fan 15 is embedded and fixedly connected in the middle of the mounting plate 14.

[0045] Furthermore, the connecting assembly includes a rotating seat 12, a connecting plate 13, a positioning groove 16, a clamping plate 17, a hand-tightening bolt 18 and a spring 19. The connecting plate 13 is rotatably connected to the top of the first frame 5 through the rotating seat 12. A positioning groove 16 is provided on the outer side of the mounting plate 14 and at a position corresponding to the connecting plate 13. The inside of the connecting plate 13 is slidably connected to the clamping plate 17. Both ends of the clamping plate 17 extend to the outer side of the connecting plate 13 and fit tightly with the surface of the mounting plate 14. A hand-tightening bolt 18 is provided above the clamping plate 17. The hand-tightening bolt 18 is threadedly connected to the connecting plate 13. A spring 19 is provided inside the connecting plate 13 and at a position below the clamping plate 17. Both ends of the spring 19 are fixedly connected to the connecting plate 13 and the clamping plate 17, respectively.

[0046] It can be seen that when in use, the air flow around the diamond-based composite heat sink 1 can be enhanced by starting the fan 15, so that the heat absorbed by the diamond-based composite heat sink 1 can be transferred to the air faster. When the mounting plate 14 and the fan 15 need to be disassembled or the surface of the diamond-based composite heat sink 1 needs to be cleaned, the hand-tightening bolt 18 can be rotated to disengage the hand-tightening bolt 18 from the clamping plate 17. The clamping plate 17 will move upward and separate from the mounting plate 14 under the push of the spring 19, and then the connecting plate 13 can be flipped outward to release the movement limit of the mounting plate 14.

Claims

1. A diamond composite heat sink device, characterized in that: include: A diamond-based composite material heat sink (1), a fixing mechanism (2) and a wind-powered heat sink (3), wherein the fixing mechanism (2) for fixing the diamond-based composite material heat sink (1) is arranged below the diamond-based composite material heat sink (1), and the wind-powered heat sink (3) for improving the heat exchange efficiency between the diamond-based composite material heat sink (1) and air is arranged above the diamond-based composite material heat sink (1); The fixing mechanism (2) comprises a mounting groove (4), a first frame (5), a second frame (6), a clamping assembly and a heat conducting assembly, the number of the first frames (5) being two and being symmetrically arranged, a plurality of second frames (6) being equidistantly arranged between the two first frames (5), the surfaces of the first frame (5) and the second frame (6) being both provided with a mounting groove (4), and the diamond-based composite material heat sink (1) extending to the inner side of the mounting groove (4).

2. The diamond composite heat sink device according to claim 1, characterized in that: The clamping assembly comprises a threaded rod (8), a fixed baffle (9) and a knob (10); the number of the threaded rods (8) is two and they are symmetrically arranged at the two end positions of the first frame (5) and the second frame (6); the two threaded rods (8) both penetrate the ends of the first frame (5) and the second frame (6) and extend outward; the first frame (5) and the second frame (6) are both movably connected to the threaded rod (8); one end of the threaded rod (8) is fixedly connected to the fixed baffle (9); the end of the threaded rod (8) away from the fixed baffle (9) is threadedly connected to the knob (10); the fixed baffle (9) and the knob (10) are respectively tightly fitted with the two first frames (5).

3. The diamond composite heat sink device according to claim 1, characterized in that: The heat-conducting component comprises a silicone heat-conducting pad (11), the silicone heat-conducting pad (11) is fixedly connected to the inner side of the mounting groove (4), and the surface of the silicone heat-conducting pad (11) is tightly fitted to the diamond-based composite material heat sink (1).

4. The diamond composite heat sink device according to claim 1, characterized in that: The surface of the diamond-based composite material heat sink (1) is evenly provided with heat dissipation grooves (7).

5. The diamond composite heat sink device according to claim 1, characterized in that: The wind heat dissipation mechanism (3) comprises a mounting plate (14), a fan (15) and a connection assembly; the mounting plate (14) is arranged above the diamond-based composite material heat sink (1); the mounting plate (14) is tightly fitted to the top surface of the diamond-based composite material heat sink (1); and the fan (15) is embedded and fixedly connected in the middle of the mounting plate (14).

6. The diamond composite heat sink device according to claim 5, characterized in that: The connecting assembly comprises a rotating seat (12), a connecting plate (13), a positioning groove (16), a clamping plate (17), a hand-tightening bolt (18) and a spring (19); the connecting plate (13) is rotatably connected to the top of the first frame (5) through the rotating seat (12); a positioning groove (16) is provided on the outer side of the mounting plate (14) and at a position corresponding to the connecting plate (13); the interior of the connecting plate (13) is slidably connected to the clamping plate (17); both ends of the clamping plate (17) extend to the outer side of the connecting plate (13) and are tightly fitted with the surface of the mounting plate (14); a hand-tightening bolt (18) is provided above the clamping plate (17); the hand-tightening bolt (18) is threadedly connected to the connecting plate (13); a spring (19) is provided inside the connecting plate (13) and at a position below the clamping plate (17); both ends of the spring (19) are fixedly connected to the connecting plate (13) and the clamping plate (17), respectively.

Citation Information

Patent Citations

  • Diamond composite heat sink device

    CN212786456U