Feeding system
By designing a feeding system including a patch machine, a feeding mechanism and a dipping mechanism, the problem of electronic component patch machines requiring first cumbersome dot coating or printing operations in SMT processing and manufacturing is solved, and the effect of simplifying operations, saving manpower and equipment, and reducing production costs is achieved.
Patent Information
- Application Number
- CN202421321792.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-06-11
AI Technical Summary
In SMT processing and manufacturing, electronic component patch machines need to perform dot coating or printing operations first, which are cumbersome, labor-consuming and high production costs.
Design a feeding system, including a patch machine, a feeding mechanism and a dipping mechanism. The feeding mechanism transports the electronic components to the patch machine. The dipping mechanism is close to the output end of the feeding mechanism and is used to hold and scrape flat dot-coated or printed materials. After picking up the electronic components, the patching machine dips the materials from the dipping mechanism for dot-coated or printed operations.
No additional dispensing or printing equipment is required, which simplifies operation, saves manpower and equipment, effectively reduces production costs, and improves loading speed and efficiency.
Smart Images
Figure CN222674841U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of SMT processing and manufacturing, in particular to a feeding system. Background Art
[0002] At present, in SMT (Surface Mount Technology) processing and manufacturing, most electronic component placement machines use a combination of tape and tray for loading, that is, a tape feeder is connected to the placement machine for loading. Before using the placement machine for placement operations, it is often necessary to use a dispensing or printing device to dispensing solder paste or glue on the electronic components. The operation is cumbersome, labor-intensive, and has a high production cost. Utility Model Content
[0003] The main purpose of the utility model is to provide a feeding system, aiming to simplify operation, save manpower and equipment, and reduce production costs.
[0004] In order to achieve the above-mentioned purpose, the utility model proposes a feeding system, which comprises:
[0005] Chip mounter;
[0006] A feeding mechanism, the output end of which is connected to the placement machine and is used to transport the electronic components to be mounted to the placement machine; and
[0007] A dipping mechanism, which is arranged near the output end of the feeding mechanism and is used to hold the material to be dotted or printed;
[0008] Before the chip placement operation, the chip placement machine picks up the electronic components in place and dips the material from the dipping mechanism to perform a dot coating or printing operation on the electronic components in place.
[0009] In one embodiment, the dipping mechanism scrapes the placed material flat according to the waiting instruction or the picking instruction sent by the placement machine.
[0010] In one embodiment, the dipping mechanism comprises:
[0011] Dipping trays to hold dispensed or printed material; and
[0012] A scraper is movably arranged above the dipping tray and is used for scraping the material in the dipping tray.
[0013] In one embodiment, the scraper can move up and down along the height direction of the dipping pan.
[0014] In one embodiment, the dipping mechanism further includes a sensor, and the sensor is used to detect the amount of material in the dipping tray.
[0015] In one embodiment, the dipping mechanism further includes a visual inspection device, which is disposed close to the dipping tray and is used to detect the amount of material in the dipping tray to confirm whether the dipping action of the placement machine is effective.
[0016] In one embodiment, the feeding mechanism is a vibration plate mechanism, which conveys the electronic components one by one according to the waiting instructions sent by the placement machine, and identifies and sorts the front and back sides of the electronic components during the conveying process.
[0017] In one embodiment, the vibration plate mechanism includes a circular disc vibration tooling and a linear vibration tooling, the circular disc vibration tooling is connected to the input end of the linear vibration tooling, and the output end of the linear vibration tooling is connected to the placement machine.
[0018] In one embodiment, the vibration plate mechanism further includes an auxiliary judgment device, which is disposed close to the linear vibration tooling and is used for automatically identifying and sorting the front and back sides of the electronic components.
[0019] In one embodiment, the feeding system further includes a control system, and the control system is communicatively connected with the placement machine, the feeding mechanism and the dipping mechanism.
[0020] The technical solution of the utility model is to connect the output end of the feeding mechanism with the placement machine, and set a dipping mechanism near the output end of the feeding mechanism. The dipping mechanism is used to hold the material to be dotted or printed. Before the placement operation, the placement machine picks up the electronic components in place and dips the material from the dipping mechanism to perform dot coating or printing operations on the electronic components in place. That is, the placement machine of the utility model can perform a series of operations such as picking up the electronic components in place, dipping the material, dot coating or printing, and placement, so there is no need to set up additional dispensing or printing equipment, which simplifies the operation, saves manpower and equipment, and effectively reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0022] Figure 1 A structural schematic diagram of an embodiment of a feeding system provided by the utility model;
[0023] Description of Figure Numbers:
[0024] 100-feeding system; 1-chip mounter; 2-vibration plate mechanism; 21-disc vibration tooling; 22-linear vibration tooling; 23-auxiliary judgment equipment; 3-dipping mechanism; 31-visual inspection equipment.
[0025] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0029] In view of the technical problem that before using a placement machine to perform placement operations, it is often necessary to use a dispensing or printing device to dispensing and printing solder paste or glue on electronic components, which is cumbersome, labor-intensive, and has high production costs, the utility model proposes a feeding system 100, which aims to simplify operations, save manpower and equipment, and reduce production costs.
[0030] See also Figure 1 In one embodiment of the utility model, the feeding system 100 includes a placement machine 1, a feeding mechanism and a dipping mechanism 3, wherein the output end of the feeding mechanism is connected to the placement machine 1, and is used to transport the electronic components to be mounted to the placement machine 1; the dipping mechanism 3 is arranged close to the output end of the feeding mechanism, and the dipping mechanism 3 is used to hold the material to be dotted or printed; before the placement operation, the placement machine 1 picks up the electronic components in place, and dips the material from the dipping mechanism 3 to perform dot coating or printing operations on the electronic components in place.
[0031] Specifically, the placement machine 1 is an SMT placement machine 1, and the electronic components can be selected as capacitors, resistors, diodes or chips, etc. The feeding mechanism can be selected as a vibration feeding mechanism, and the specific structural setting is not limited, as long as the electronic components to be mounted can be delivered to the placement machine 1 one by one. The input end of the feeding mechanism is provided with a feeding tray for placing the electronic components to be mounted, and the output end is connected to the placement machine 1, so that the electronic components to be mounted can be delivered to the placement machine 1 one by one through the feeding mechanism. The dipping mechanism 3 has a placement space for holding materials to be applied or printed, including but not limited to glue, solder paste and flux. The placement space can be an open space or a closed space, which is not limited here and is within the protection scope of the present utility model. After the electronic components to be mounted are in place, the placement machine 1 first picks up the electronic components in place, and then dips the material from the dipping mechanism 3 to perform a dot coating or printing operation on the electronic components in place, and finally mounts the electronic components on the products to be mounted. The chip mounter 1 of the utility model can perform a series of operations including picking up electronic components in place, dipping materials, dispensing or printing, and patching, without the need for additional dispensing or printing equipment, thus simplifying the operation, saving manpower and equipment, and effectively reducing production costs.
[0032] The technical solution of the utility model is to connect the output end of the feeding mechanism with the SMT machine 1, and set a dipping mechanism 3 near the output end of the feeding mechanism. The dipping mechanism 3 is used to hold the material to be dotted or printed. Before the SMT operation, the SMT machine 1 picks up the electronic components in place and dips the material from the dipping mechanism 3 to dot or print the electronic components in place. That is, the SMT machine 1 of the utility model can perform a series of operations including picking up the electronic components in place, dipping the material, dot coating or printing, and SMT, so there is no need to set up additional dispensing or printing equipment, which simplifies the operation, saves manpower and equipment, and effectively reduces production costs.
[0033] In an embodiment of the present invention, the dipping mechanism 3 scrapes the placed material flat according to the material waiting instruction or the picking instruction sent by the placement machine 1 .
[0034] Specifically, when the loading system 100 is used to load the electronic components to be mounted, the dot-coated or printed materials are added to the dipping mechanism 3, the placement machine 1 is started and sends a waiting instruction to the loading mechanism and the dipping mechanism 3. After the dipping mechanism 3 receives the waiting instruction, the dipping mechanism 3 scrapes the material therein for the placement machine 1 to dip the material; or, the placement machine 1 is started and sends a waiting instruction to the loading mechanism. After receiving the waiting instruction, the loading mechanism transports the electronic components to the placement machine 1 and sends an in-place instruction to the placement machine 1. After receiving the in-place instruction, the placement machine 1 picks up the in-place electronic components and sends a picking instruction to the dipping mechanism 3. After receiving the picking instruction, the dipping mechanism 3 scrapes the material therein for the placement machine 1 to dip the material.
[0035] In this embodiment, before the SMT machine 1 dips the material, the material is first scraped flat, which can facilitate the dipping operation of the SMT machine 1 on the one hand, and on the other hand, it can facilitate the acquisition of the amount of material used to confirm whether the dipping action of the SMT machine 1 is effective.
[0036] Of course, in other embodiments, the dipping mechanism 3 scrapes the material therein in the mounting machine 1.
[0037] In one embodiment of the utility model, the dipping mechanism 3 includes: a dipping tray and a scraper, the dipping tray is used to hold the material to be coated or printed; the scraper is movably arranged above the dipping tray, and is used to scrape the material in the dipping tray flat.
[0038] Specifically, the dipping tray is roughly in the shape of a disk, which can be a circular disk, a square disk, or other reasonable disk shapes. The scraper can be set above the dipping tray through a mounting frame, and the scraper can be moved horizontally from one side of the dipping tray to the other opposite side to scrape the material in the dipping tray flat; of course, the scraper can be rotatably connected to the mounting frame at one end, and the other end can scrape the material in the dipping tray flat during rotation. The specific structure of the scraper and the mounting frame is not limited, as long as the scraper can scrape the material in the dipping tray flat, it is within the protection scope of the present utility model. In this embodiment, the dipping tray is set in a disk shape, which is convenient for the scraping operation of the scraper and the amount of material in the dipping tray, which is convenient for observing the amount of material in the dipping tray, and thus helps to confirm whether the dipping action of the placement machine 1 is effective.
[0039] In one embodiment of the utility model, the scraper can move up and down along the height direction of the dipping plate. Specifically, the mounting frame can drive the scraper to move up and down. In actual use, the specific setting height of the scraper can be adjusted according to the requirements of the placement machine 1 for dipping different materials.
[0040] In one embodiment of the present invention, the dipping mechanism 3 further includes a sensor, which is used to detect the amount of material in the dipping tray. The sensor can be an acoustic sensor or a radar sensor, which can be used to detect the height of the material in the dipping tray and then obtain the amount of material. Of course, the sensor can also be other types of sensors, as long as it can detect the amount of material in the dipping tray.
[0041] like Figure 1 As shown, in one embodiment of the present invention, the dipping mechanism 3 further includes a visual detection device 31, which is disposed close to the dipping tray and is used to detect the amount of material in the dipping tray to confirm the dipping action of the placement machine 1.
[0042] Specifically, the visual inspection device 31 is a video device, such as a camera, which can detect the amount of material in the dipping tray after the placement machine 1 dips the material, and then confirm whether the dipping action of the placement machine 1 is effective. If effective, the placement machine 1 performs a dot coating or printing operation; if invalid, a failure command is sent to the placement machine 1. After receiving the failure command, the placement machine 1 repeats the dipping action until it is detected that its dipping action is effective, and then the dot coating or printing operation can be performed.
[0043] In one embodiment of the utility model, the feeding mechanism is a vibration plate mechanism 2, which conveys the electronic components one by one according to the waiting instructions sent by the placement machine 1, and identifies and sorts the front and back sides of the electronic components during the conveying process.
[0044] Specifically, the loading mechanism can be selected as a vibrating plate mechanism 2. After receiving the waiting instruction sent by the placement machine 1, the vibrating plate mechanism 2 conveys the electronic components to be mounted one by one. During the conveying process, the vibrating plate mechanism 2 can identify and sort the front and back sides of the electronic components, and convey the electronic components with the correct direction to the placement machine 1, and intercept the electronic components with the wrong direction outside the placement machine 1 or return them to the loading plate of the loading mechanism, so as to ensure that the direction of the electronic components conveyed to the placement machine 1 is correct.
[0045] Furthermore, the vibration plate mechanism 2 cyclically transports the electronic components according to the material waiting instructions sent by the placement machine 1, so as to transport multiple electronic components to be mounted to the placement machine 1 one by one.
[0046] In this embodiment, the feeding mechanism adopts a vibrating plate mechanism 2 to transport the electronic components to be mounted, which can realize the possibility of direct feeding of bulk materials, with low cost and high speed. Compared with the existing tape loader, there is no need to package the tape and tray, which effectively reduces the waste of packaging materials.
[0047] like Figure 1As shown, the disc vibration mechanism 2 includes a disc vibration tool 21 and a linear vibration tool 22 . The disc vibration tool 21 is connected to the input end of the linear vibration tool 22 , and the output end of the linear vibration tool 22 is connected to the placement machine 1 .
[0048] Specifically, the disc vibration fixture 21 is the loading tray, and is connected to the placement machine 1 through the linear vibration fixture 22. The electronic components to be mounted are directly placed in the disc vibration fixture 21, and are transported to the placement machine 1 one by one through the linear vibration fixture 22. Among them, the working principle of the disc vibration fixture 21 is as follows: there is a pulse electromagnet under the vibration disc hopper, which can make the vibration disc hopper vibrate in the vertical direction, and the inclined spring sheet drives the hopper to perform torsional vibration around its vertical axis. The electronic components in the vibration disc hopper rise along the spiral track due to this vibration. During the rising process, after a series of track screening or posture changes, the electronic components can automatically enter the assembly or processing position in a unified state according to the requirements of assembly or processing (i.e., the correct direction). That is, the disc vibration fixture 21 includes a vibration disc hopper, a pulse electromagnet, a spring sheet, and a support frame structure, etc., and its specific structural setting is not limited, as long as the above-mentioned operation can be achieved.
[0049] In this embodiment, disordered electronic components are automatically and accurately transported to the linear vibration tooling 22 in an orderly and directional manner in the correct direction through the vibration plate tooling. The linear vibration tooling 22 transports the electronic components to the placement machine 1 by vibration and blowing. The specific structural setting is not limited. As long as the electronic components can be transported to the placement machine 1, they are within the protection scope of the present utility model.
[0050] Furthermore, if Figure 1 As shown, in one embodiment of the present invention, the vibration plate mechanism 2 further includes an auxiliary judgment device 23, which is arranged near the output end of the linear vibration tooling 22 and is used for automatically identifying and sorting the front and back sides of the electronic components.
[0051] Specifically, the auxiliary judgment device 23 is a video device, such as a camera, which is arranged near the output end of the linear vibration tooling 22, and can perform auxiliary judgment processing on electronic components with complex structures or difficult to identify directions. For example, when the auxiliary judgment device 23 identifies that the direction of the electronic components being transported is correct, no processing is performed to perform subsequent dipping, dispensing or printing, and patch operations; when the auxiliary judgment device 23 identifies that the direction of the electronic components being transported is wrong, the electronic components can be blocked and intercepted by an interception device, or the electronic components with the wrong direction identified can be re-transmitted to the disc vibration hopper of the disc vibration tooling 21, or flipped by a flipping device. In this embodiment, the auxiliary judgment device 23 can enhance the visual judgment of electronic components and further improve the accuracy of the state of the electronic components transported to the patch machine 1.
[0052] Of course, in some other embodiments, the auxiliary judgment device 23 can be arranged between the vibration plate tooling and the linear vibration tooling 22 to facilitate timely identification of the direction of the electronic components and timely processing of the electronic components identified to have the wrong direction.
[0053] In one embodiment of the present invention, the feeding system 100 further includes a control system, which is communicatively connected with the placement machine 1 , the feeding mechanism and the dipping mechanism 3 .
[0054] Specifically, the placement machine 1, the vibration plate tooling, the linear vibration tooling 22, and the scraper are all communicatively connected through the control system, so that the loading mechanism can supply materials in a timely and rapid manner according to the waiting instructions sent by the placement machine 1. At the same time, the dipping mechanism 3 can scrape the material in a timely and rapid manner according to the waiting instructions sent by the placement machine 1, so as to facilitate the subsequent rapid dipping of materials by the placement machine 1.
[0055] It should be noted that the placement machine 1 places the required electronic components on the designated positions of the substrate according to the surface mounting technology through pre-set programs, parameters, and the performance and size of the product model to be mounted.
[0056] In one embodiment of the utility model, the process of loading electronic components to be mounted using the loading system 100 provided by the utility model includes the following steps:
[0057] Step 1, preparation: directly put the electronic components to be mounted into the vibration plate hopper of the vibration plate tooling of the vibration plate mechanism 2, and put the materials used for dispensing or printing into the dipping plate of the dipping mechanism 3;
[0058] Step 2: After receiving the material waiting instruction sent by the placement machine 1, the vibration plate mechanism 2 performs the material loading action under the action of the control system. The vibration plate mechanism 2 acts once and delivers an electronic component to be mounted in the correct direction to the placement machine 1;
[0059] Step 3, after the vibration plate mechanism 2 transports the electronic components to the placement machine 1, a placement instruction is sent to the placement machine 1;
[0060] Step 4: the placement machine 1 receives the in-position instruction sent by the vibration plate mechanism 2, and picks up the in-position electronic components according to the in-position instruction, and then the placement machine 1 sends a picking instruction to the dipping mechanism 3;
[0061] Step 5: After the dipping mechanism 3 receives the picking instruction sent by the placement machine 1, the scraper of the dipping mechanism 3 scrapes the material in the dipping tray and sends a scraping instruction to the placement machine 1;
[0062] Step 6, the placement machine 1 receives the scraping instruction sent by the dipping mechanism 3, dips the scraped material in the dipping tray, and performs dot coating or printing operations on the electronic components in place;
[0063] Step seven, the placement machine 1 performs placement operation on the product to be placed, and sends the corresponding material waiting instruction to the vibration plate mechanism 2 to carry out the next cycle.
[0064] Of course, in some other embodiments, step five can be performed before step four. Specifically, step three also includes: the placement machine 1 also sends a waiting instruction to the dipping mechanism 3. After the dipping mechanism 3 receives the waiting instruction sent by the placement machine 1, the scraper scrapes the material in the dipping tray and sends a scraping instruction to the placement machine 1; accordingly, step four is: the placement machine 1 receives the arrival instruction sent by the vibration plate mechanism 2 and the scraping instruction sent by the dipping mechanism 3, first picks up the electronic components in place according to the arrival instruction, then dips the scraped material in the dipping tray, and performs dot coating or printing operations on the electronic components in place; then perform step seven.
[0065] It should be noted that the vibrating plate mechanism 2, the dipping mechanism 3, and the placement machine 1 can communicate directly (receive or send instructions to each other, etc.), or they can communicate through the control system, that is, the vibrating plate mechanism 2, the dipping mechanism 3, and the placement machine 1 all send instructions to the control system, which transmits the instructions and controls the actions of the vibrating plate mechanism 2, the dipping mechanism 3, or the placement machine 1.
[0066] Based on the above embodiments, the chip mounter 1 of the utility model can perform a series of operations such as picking up electronic components, dipping materials, dispensing or printing, and patching, so there is no need to set up additional dispensing or printing equipment, which simplifies the operation, saves manpower and equipment, and effectively reduces production costs. In addition, the vibration plate mechanism 2 is used to replace the existing material tray and material belt, eliminating the process of packaging paper material belts for electronic components, and can directly identify and sort the bulk materials for loading, reducing material waste, saving production costs, and at the same time, the loading speed is fast and the efficiency is high.
[0067] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A feeding system, characterized in that: The feeding system comprises: Chip mounter; A feeding mechanism, the output end of which is connected to the placement machine and is used to transport the electronic components to be mounted to the placement machine; and A dipping mechanism, which is arranged near the output end of the feeding mechanism and is used to hold the material to be dotted or printed; Before the chip placement operation, the chip placement machine picks up the electronic components in place and dips the material from the dipping mechanism to perform a dot coating or printing operation on the electronic components in place.
2. The feeding system according to claim 1, characterized in that: The dipping mechanism scrapes and levels the placed material according to the waiting instruction or the picking instruction sent by the placement machine.
3. The feeding system according to claim 2, characterized in that: The dipping mechanism comprises: Dipping trays to hold dispensed or printed material; and A scraper is movably arranged above the dipping tray and is used for scraping the material in the dipping tray.
4. The feeding system according to claim 3, characterized in that: The scraper can move up and down along the height direction of the dipping tray.
5. The feeding system according to claim 3, characterized in that: The dipping mechanism also includes a sensor, which is used to detect the amount of material in the dipping tray.
6. The feeding system according to claim 3, characterized in that: The dipping mechanism also includes a visual inspection device, which is arranged close to the dipping tray and is used to detect the amount of material in the dipping tray to confirm whether the dipping action of the placement machine is effective.
7. The feeding system according to any one of claims 1 to 6, characterized in that: The feeding mechanism is a vibration plate mechanism, which conveys the electronic components one by one according to the waiting instructions sent by the placement machine, and identifies and sorts the front and back sides of the electronic components during the conveying process.
8. The feeding system according to claim 7, characterized in that: The vibration plate mechanism comprises a circular disc vibration tool and a linear vibration tool. The circular disc vibration tool is connected to the input end of the linear vibration tool, and the output end of the linear vibration tool is connected to the placement machine.
9. The feeding system according to claim 8, characterized in that: The vibration plate mechanism also includes an auxiliary judgment device, which is arranged close to the linear vibration tooling and is used for automatically identifying and sorting the front and back sides of the electronic components.
10. The feeding system according to any one of claims 1 to 6, characterized in that: The feeding system also includes a control system, which is communicatively connected with the placement machine, the feeding mechanism and the dipping mechanism.