Non-contact silicon wafer carrying system

Abstract

The utility model relates to the field of silicon wafer carrying, in particular to a non-contact type silicon wafer carrying system which comprises two rotating cylinders and two silicon wafer limiting mechanisms, the two silicon wafer limiting mechanisms are fixedly installed at the top end of an installation plate through a fixing plate, and the two rotating cylinders are detachably installed in the middles of the two sides of the installation plate respectively. And the plurality of suckers are located between the bottom ends of the two silicon wafer limiting mechanisms. According to the device, the plurality of suckers, the two silicon wafer limiting mechanisms and the two rotating cylinders are arranged, so that the bottom ends of the two silicon wafer limiting mechanisms are matched with the bottom ends of the two rotating cylinders to clamp and limit the silicon wafer when the silicon wafer is carried, and the silicon wafer cannot move upwards when the plurality of suckers are operated; the upper surface of the silicon wafer does not contact with the lower surface of the sucker, so that the upper surface of the silicon wafer can be prevented from being polluted due to contact, and the subsequent processing effect of the silicon wafer is ensured; and the device can clamp and carry two silicon wafers at the same time, so that the carrying efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer transportation, in particular to a contactless silicon wafer transportation system. Background Art

[0002] Thin film preparation technology has a very wide range of applications in VLSI technology. According to its film forming method, it can be divided into two categories: physical vapor deposition (PVD) and chemical vapor deposition (CVD). Plasma enhanced chemical vapor deposition (PECVD) is a type of chemical vapor deposition, and its most prominent advantage is its low deposition temperature. The thin film deposited by PECVD has excellent electrical properties, good substrate adhesion and excellent step coverage. Because of these advantages, it has a wide range of applications in VLSI, optoelectronic devices, MEMS and other fields. Silicon wafer transmission is an important equipment in the manufacturing process of solar panels, and it is also an important technical link in the process of plasma enhanced chemical vapor deposition (PECVD).

[0003] Before silicon wafers are used for transportation, they need to go through multiple processing steps, among which a silicon wafer handling system is needed to transport the silicon wafers to the processing site. The current mainstream silicon wafer handling systems are mostly contact-type vacuum nozzles. When the silicon wafers are transported, the vacuum nozzles will directly contact the upper surface of the silicon wafers, which will cause varying degrees of contamination on the upper surface of the silicon wafers, thus greatly reducing the effect of the subsequent processing steps of the silicon wafers. Moreover, most of the current silicon wafer handling systems can only transport one wafer at a time, and the handling efficiency is not high. Utility Model Content

[0004] The utility model aims to provide a contactless silicon wafer handling system.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A contactless silicon wafer handling system is provided, comprising two rotating cylinders and two silicon wafer limiting mechanisms, wherein the two silicon wafer limiting mechanisms are fixedly mounted on the top of a mounting plate through a fixing plate, the two rotating cylinders are detachably mounted on the middle of both sides of the mounting plate, and a plurality of suction cups are detachably mounted on the bottom end of the mounting plate, wherein the plurality of suction cups are all located between the bottom ends of the two silicon wafer limiting mechanisms.

[0007] Furthermore, the silicon wafer limiting mechanism includes a cylinder, a long side limiting structure and two short side limiting structures. The cylinder is fixedly installed on the top of the fixed plate. The two short side limiting structures are rotatably connected to the two sides of the protruding end of the cylinder through two connecting rods. The long side limiting structure is fixedly connected to the protruding end of the cylinder through a connecting rod. The bottom ends of the long side limiting structure and the two short side limiting structures are slidably connected to the top of the mounting plate.

[0008] Furthermore, the short side limiting structure includes two sliders, two short side limiting connecting plates and multiple limiting parts. The two sliders are slidably connected to the top of the mounting plate and are respectively located on both sides of the cylinder. The two short side limiting connecting plates are respectively fixedly installed on the top of the two sliders. One end of the two short side limiting connecting plates close to the cylinder is rotatably connected to the two sides of the cylinder output end through two connecting rods. Multiple limiting parts are respectively detachably installed on the end of the two short side limiting connecting plates away from the cylinder.

[0009] Furthermore, the long side limiting structure includes a slider 2, a long side limiting connecting plate and two limiting parts 2. The long side limiting connecting plate is fixedly installed on the top of the slider 2. The slider 2 is slidably connected to the top of the mounting plate. One end of the long side limiting connecting plate close to the cylinder is fixedly connected to the output end of the cylinder through a connecting rod. The two limiting parts 2 are respectively and detachably installed on both sides of the other end of the long side limiting connecting plate.

[0010] Furthermore, the limiting member 1 includes a mounting member and a limiting column 1, the limiting column 1 is fixedly installed at the bottom end of the mounting member, and limiting grooves for detachable connection with the mounting member are provided on both sides of the short side limiting connecting plate, and the structure of the limiting member 2 is the same as that of the limiting member 1.

[0011] Furthermore, two limit seats are fixedly provided at the top of the mounting plate, mounting seats are fixedly provided at the middle of both sides of the top of the mounting plate, and a plurality of slide rails are also fixedly provided at the top of the mounting plate.

[0012] Furthermore, a second limiting column is fixedly provided at the bottom ends of the two rotating cylinders.

[0013] The beneficial effects of the utility model are as follows: the device is provided with multiple suction cups, two silicon wafer limiting mechanisms and two rotating cylinders, so that when the silicon wafer is transported, the bottom ends of the two silicon wafer limiting mechanisms cooperate with the bottom ends of the two rotating cylinders to clamp and limit the silicon wafer, ensuring that when multiple suction cups are operated, the silicon wafer will not move upward, and the upper surface of the silicon wafer will not contact the lower surface of the suction cup, which can avoid the upper surface of the silicon wafer from being contaminated due to contact, thereby ensuring the subsequent processing effect of the silicon wafer; and the device can clamp and transport two silicon wafers at the same time, thereby improving the transportation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solution of the embodiment of the utility model, the following is a brief introduction to the drawings required for use in the embodiment of the utility model.

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 for Figure 1 A local enlarged schematic diagram of the middle A;

[0017] Figure 3 It is a three-dimensional structural schematic diagram of the utility model;

[0018] Figure 4 It is a three-dimensional structural schematic diagram of the utility model;

[0019] In the figure: 1. Mounting plate; 1a. Limit seat; 1b. Mounting seat; 1c. Slide rail; 2. Fixed plate; 3. Silicon wafer limiting mechanism; 3a. Cylinder; 3b. Short side limiting structure; 3b1. Slider 1; 3b2. Short side limiting connecting plate; 3b21. Limiting groove; 3b3. Limiting piece 1; 3b31. Mounting piece; 3b32. Limiting column 1; 3c. Long side limiting structure; 3c1. Slider 2; 3c2. Long side limiting connecting plate; 3c3. Limiting piece 2; 3d. Connecting rod; 3e. Connecting rod; 4. Rotating cylinder; 4a. Limiting column 2; 5. Suction cup; 6. Silicon wafer. DETAILED DESCRIPTION

[0020] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0021] Among them, the drawings are only used for illustrative purposes and represent only schematic diagrams rather than actual pictures, and should not be understood as limitations on this patent; in order to better illustrate the embodiments of the utility model, some parts of the drawings will be omitted, enlarged or reduced, and do not represent the size of the actual product.

[0022] Reference Figures 1 to 4 A contactless silicon wafer handling system shown in the figure includes two rotating cylinders 4 and two silicon wafer limiting mechanisms 3. The two silicon wafer limiting mechanisms 3 are fixedly installed on the top of the mounting plate 1 through the fixing plate 2. The two rotating cylinders 4 are detachably installed in the middle of both sides of the mounting plate 1. A plurality of suction cups 5 are detachably installed at the bottom end of the mounting plate 1. The plurality of suction cups 5 are all located between the bottom ends of the two silicon wafer limiting mechanisms 3. When the two silicon wafer limiting mechanisms 3 are in operation, the bottom ends of the two silicon wafer limiting mechanisms 3 can cooperate with the bottom ends of the two rotating cylinders 4 to clamp and limit the two silicon wafers under the plurality of suction cups 5. Then, by starting the plurality of suction cups 5, the plurality of suction cups 5 apply an upward suction force to the two silicon wafers 6. The two silicon wafers 6 will not move upward under the clamping cooperation of the two silicon wafer limiting mechanisms 3 and the bottom ends of the two rotating cylinders 4. In this way, it can be ensured that the two silicon wafers 6 will not fall during the handling process, and the upper surfaces of the two silicon wafers 6 will not contact the lower surfaces of the plurality of suction cups 5, so that the upper surfaces of the two silicon wafers 6 can be prevented from being contaminated.

[0023] The silicon wafer limiting mechanism 3 includes a cylinder 3a, a long side limiting structure 3c and two short side limiting structures 3b. The cylinder 3a is fixedly installed on the top of the fixed plate 2. The two short side limiting structures 3b are rotatably connected to the two sides of the extended end of the cylinder 3a through two connecting rods 3d. The long side limiting structure 3c is fixedly connected to the extended end of the cylinder 3a through a connecting rod 3e. The bottom ends of the long side limiting structure 3c and the two short side limiting structures 3b are slidably connected to the top of the mounting plate 1. When the cylinder 3a is running, the extended end of the cylinder 3a can be extended or retracted, and can synchronously drive the long side limiting structure 3c and the two short side limiting structures 3b to slide along the length direction of the contact surface with the top of the mounting plate 1, and cooperate with the bottom ends of the two rotating cylinders 4 to clamp and limit the silicon wafer 6 located under the multiple suction cups 5, so that when the multiple suction cups 5 apply force to the silicon wafer 6, the silicon wafer 6 can remain motionless to avoid contact with the lower surfaces of the multiple suction cups 5, thereby preventing the silicon wafer 6 from being contaminated.

[0024] The short side limiting structure 3b includes two sliders 3b1, two short side limiting connecting plates 3b2 and a plurality of limiting members 3b3. The two sliders 3b1 are slidably connected to the top of the mounting plate 1 and are respectively located on both sides of the cylinder 3a. The two short side limiting connecting plates 3b2 are respectively fixedly installed on the tops of the two sliders 3b1. One end of the two short side limiting connecting plates 3b2 close to the cylinder 3a is rotatably connected to the two sides of the output end of the cylinder 3a through two connecting rods 3d. The limiting members 3b3 are detachably mounted on the ends of the two short side limiting connecting plates 3b2 away from the cylinder 3a. When the cylinder 3a is running and the protruding end of the cylinder 3a moves, the protruding end of the cylinder 3a can drive the two connecting rods 3d to move, and then drive the two sliders 3b1 to slide on the top of the mounting plate 1, so that the bottom ends of the multiple limiting members 3b3 can contact the sides of the silicon wafer 6 and cooperate with the bottom ends of the two rotating cylinders 4 to clamp and limit the silicon wafer 6.

[0025] The long side limiting structure 3c includes a slider 3c1, a long side limiting connecting plate 3c2 and two limiting members 3c3. The long side limiting connecting plate 3c2 is fixedly installed on the top of the slider 3c1. The slider 3c1 is slidably connected to the top of the mounting plate 1. One end of the long side limiting connecting plate 3c2 close to the cylinder 3a is fixedly connected to the output end of the cylinder 3a through a connecting rod 3e. The two limiting members 3c3 are detachably installed on both sides of the other end of the long side limiting connecting plate 3c2. When the protruding end of the cylinder 3a moves, the slider 3c1 can slide on the top of the mounting plate 1, and can drive the long side limiting connecting plate 3c2 and the two limiting members 3c3 to move synchronously, so that the bottom ends of the two limiting members 3c3 cooperate with the two short side limiting structures 3b and the bottom ends of the two rotating cylinders 4 to clamp and limit the side of the silicon wafer 6.

[0026] The limiting member 1 3b3 includes a mounting member 3b31 and a limiting column 1 3b32, wherein the limiting column 1 3b32 is fixedly mounted at the bottom end of the mounting member 3b31, and both sides of the short side limiting connecting plate 3b2 are provided with limiting grooves 3b21 for detachably connecting with the mounting member 3b31, and the mounting member 3b31 can be mounted at different positions of the limiting grooves 3b21, so that the limiting column 1 3b32 can better clamp and limit the silicon wafer 6. The structure of the limiting member 2 3c3 is the same as that of the limiting member 1 3b3.

[0027] Two limit seats 1a are fixedly provided at the top of the mounting plate 1, which are respectively used for two connecting rods 3e to pass through, so that the two connecting rods 3e can slide more smoothly. Mounting seats 1b are fixedly provided at the middle of both sides of the top of the mounting plate 1, which are used for mounting two rotating cylinders 4. A plurality of slide rails 1c are also fixedly provided at the top of the mounting plate 1, which are respectively used for slidably connecting with a plurality of sliders 1 3b1 and two sliders 2 3c1.

[0028] The bottom ends of the two rotating cylinders 4 are fixedly provided with limiting columns 4a, which are used to limit the sides of the silicon wafers 6. When the rotating cylinders 4 are running, the limiting columns 4a can rotate to adjust the positions of the two silicon wafers 6, making the transportation of the two silicon wafers 6 more stable.

[0029] Working principle: When transporting two silicon wafers 6, operate the two cylinders 3a to make the protruding ends of the two cylinders 3a move, respectively driving the connecting rods 3d connected thereto to move, and then driving the two short-side limiting structures 3b and the two long-side limiting structures 3c to move, so that their bottom ends cooperate with the bottom ends of the two rotating cylinders 4 to clamp and limit the sides of the two silicon wafers 6; then start the multiple suction cups 5 to apply upward suction to the two silicon wafers 6 to ensure that the two silicon wafers 6 do not fall during the transportation process, and under the clamping cooperation of the silicon wafer limiting mechanism 3 and the rotating cylinder 4, the upper surfaces of the two silicon wafers 6 do not contact the lower surfaces of the multiple suction cups 5, which can prevent the upper surfaces of the silicon wafers 6 from being contaminated; then, by operating the two rotating cylinders 4, the two limiting columns 4a adjust the positions of the two silicon wafers 6 to make the transportation work more stable.

[0030] The device is provided with multiple suction cups, two silicon wafer limiting mechanisms and two rotating cylinders, so that when the silicon wafer is transported, the bottom ends of the two silicon wafer limiting mechanisms cooperate with the bottom ends of the two rotating cylinders to clamp and limit the silicon wafer, ensuring that when multiple suction cups are operated, the silicon wafer will not move upward, and the upper surface of the silicon wafer will not contact the lower surface of the suction cup, which can avoid the upper surface of the silicon wafer from being contaminated due to contact, thereby ensuring the subsequent processing effect of the silicon wafer; and the device can clamp and transport two silicon wafers at the same time, thereby improving the transportation efficiency.

[0031] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A contactless silicon wafer handling system, characterized in that: The invention comprises two rotating cylinders (4) and two silicon wafer limiting mechanisms (3), wherein the two silicon wafer limiting mechanisms (3) are fixedly mounted on the top of a mounting plate (1) via a fixing plate (2), the two rotating cylinders (4) are detachably mounted on the middle of both sides of the mounting plate (1), and a plurality of suction cups (5) are detachably mounted on the bottom end of the mounting plate (1), wherein the plurality of suction cups (5) are all located between the bottom ends of the two silicon wafer limiting mechanisms (3).

2. The contactless silicon wafer handling system according to claim 1, characterized in that: The silicon wafer limiting mechanism (3) comprises a cylinder (3a), a long side limiting structure (3c) and two short side limiting structures (3b); the cylinder (3a) is fixedly mounted on the top of a fixed plate (2); the two short side limiting structures (3b) are rotatably connected to the two sides of the extended end of the cylinder (3a) via two connecting rods (3d); the long side limiting structure (3c) is fixedly connected to the extended end of the cylinder (3a) via a connecting rod (3e); and the bottom ends of the long side limiting structure (3c) and the two short side limiting structures (3b) are slidably connected to the top of the mounting plate (1).

3. The contactless silicon wafer handling system according to claim 2, characterized in that: The short side limiting structure (3b) comprises two sliders (3b1), two short side limiting connecting plates (3b2) and a plurality of limiting members (3b3); the two sliders (3b1) are slidably connected to the top of the mounting plate (1) and are respectively located on both sides of the cylinder (3a); the two short side limiting connecting plates (3b2) are respectively fixedly installed on the tops of the two sliders (3b1); one end of the two short side limiting connecting plates (3b2) close to the cylinder (3a) is rotatably connected to both sides of the output end of the cylinder (3a) via two connecting rods (3d); and the plurality of limiting members (3b3) are respectively detachably installed on one end of the two short side limiting connecting plates (3b2) away from the cylinder (3a).

4. The contactless silicon wafer handling system according to claim 3, characterized in that: The long side limiting structure (3c) comprises a second slider (3c1), a long side limiting connecting plate (3c2) and two second limiting members (3c3); the long side limiting connecting plate (3c2) is fixedly mounted on the top of the second slider (3c1); the second slider (3c1) is slidably connected to the top of the mounting plate (1); one end of the long side limiting connecting plate (3c2) close to the cylinder (3a) is fixedly connected to the output end of the cylinder (3a) via a connecting rod (3e); and the two second limiting members (3c3) are detachably mounted on both sides of the other end of the long side limiting connecting plate (3c2).

5. The contactless silicon wafer handling system according to claim 4, characterized in that: The limiting member 1 (3b3) comprises a mounting member (3b31) and a limiting column 1 (3b32), wherein the limiting column 1 (3b32) is fixedly mounted on the bottom end of the mounting member (3b31), and limiting grooves (3b21) for detachably connecting with the mounting member (3b31) are provided on both sides of the short side limiting connecting plate (3b2), and the structure of the limiting member 2 (3c3) is the same as that of the limiting member 1 (3b3).

6. The contactless silicon wafer handling system according to claim 5, characterized in that: Two limit seats (1a) are fixedly arranged at the top of the mounting plate (1), mounting seats (1b) are fixedly arranged at the middle of both sides of the top of the mounting plate (1), and a plurality of slide rails (1c) are also fixedly arranged at the top of the mounting plate (1).

7. The contactless silicon wafer handling system according to claim 6, characterized in that: The bottom ends of the two rotating cylinders (4) are both fixedly provided with limiting pillars 2 (4a).

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