Precursor packaging container and vapor deposition system
By designing a precursor package container with purification components and on-off control components, the problem of interrupting the vapor deposition process when replacing the precursor package container is solved, and automatic recharge and efficient production are achieved.
Patent Information
- Application Number
- CN202421467531.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-26
AI Technical Summary
In the prior art, the vapor deposition process is required to be interrupted when replacing the precursor packaging container, resulting in low production efficiency of the film layer.
A precursor package container is designed, including a container body, a supplementary container, a purification assembly and an on-off control assembly. The air in the buffer chamber is purified by the purification component, and the on-off control component controls the on-off between the container main body and the replenishment container, automatic recharge of the precursor is achieved, avoiding interruptions during container replacement.
The precursor recharge is achieved without interrupting the vapor deposition process, which improves the production efficiency of the film layer and saves time in purification operations.
Smart Images
Figure CN222684752U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of vapor deposition technology, and in particular to a precursor packaging container and a vapor deposition system. Background Art
[0002] Precursors are important raw materials for thin film deposition processes and are used in vapor deposition processes to form various thin film layers that meet the requirements of semiconductor manufacturing. These thin film layers can be widely used in the semiconductor industry, optoelectronics and other fields. Precursors are key materials for semiconductor chip manufacturing, and their purity, stability, vapor pressure and other factors will directly affect the quality of film formation.
[0003] In the related art, a packaging container is usually used to fill and package the precursor, and then the packaging container is connected to the vapor deposition equipment to supply the precursor to the vapor deposition equipment. As the reaction proceeds, the precursor in the packaging container is also continuously consumed. Therefore, it is necessary to replace the packaging container in time after the consumption of the precursor reaches a certain level to ensure the normal supply to the vapor deposition equipment. However, when replacing the packaging container, in order to prevent gas leakage or external pollution sources from entering the process system, the vapor deposition process needs to be interrupted, resulting in low production efficiency of the thin film layer. Utility Model Content
[0004] Based on this, it is necessary to provide a precursor packaging container and a vapor deposition system to address the problem of low production efficiency of thin film layers.
[0005] In a first aspect, the present application provides a precursor packaging container, comprising:
[0006] A container body, wherein the container body is filled with a precursor;
[0007] At least one supplementary container, the supplementary container contains a precursor, the supplementary container is detachably connected to the container body, and the open end of the supplementary container and / or the open end of the container body is provided with a buffer cavity;
[0008] a purification component for purifying the air in the buffer chamber before the container body and the supplementary container are connected; and
[0009] An on-off control assembly, used to control the on-off connection between the open end of the container body and the open end of the supplementary container;
[0010] When the container body and the supplementary container are connected, the precursor in the supplementary container enters the container body through the buffer cavity.
[0011] In one embodiment, a buffer enclosure is provided at the open end of the supplementary container and / or the open end of the container body, and the buffer cavity is formed by the inner wall of the buffer enclosure, the outer wall of the open end of the supplementary container and the outer wall of the open end of the container body.
[0012] In one embodiment, a buffer cover is provided at the open end of the replenishing container and / or the open end of the container body, a connecting port is provided on the buffer cover, the inner wall of the buffer cover and the outer wall of the open end of the replenishing container are combined to form a buffer cavity located at the open end of the replenishing container, and / or the inner wall of the buffer cover and the outer wall of the container body are combined to form a buffer cavity located at the open end of the container body.
[0013] In one embodiment, the open end of the supplementary container is connected to the open end of the container body through a connecting tube, and the buffer cavity is formed by the inner wall of the connecting tube, the outer wall of the open end of the supplementary container and the outer wall of the open end of the container body.
[0014] In one embodiment, the on-off control component includes:
[0015] A first control valve is provided on the supplementary container, and the first control valve is used to control the opening and closing of the opening end of the supplementary container;
[0016] A second control valve is provided on the container body, and the second control valve is used to control the opening and closing of the opening end of the container body; and
[0017] The third control valve is used to control the connection and disconnection between the opening end of the supplementary container and the opening end of the container body.
[0018] In one embodiment, the buffer chamber includes a first buffer chamber, a second buffer chamber and a connecting pipe; the third control valve includes a first top control valve and a second top control valve, the first top control valve is arranged between the first buffer chamber and one end of the connecting pipe, and the second top control valve is arranged between the second buffer chamber and the other end of the connecting pipe.
[0019] In one embodiment, a first mounting plate is extended from the outer side wall of the open end of the supplementary container, and a second mounting plate is extended from the outer side wall of the open end of the container body. The second mounting plate is detachably connected to the first mounting plate via a connecting piece.
[0020] In one embodiment, the purification component includes:
[0021] An inert gas supply device is used to supply inert gas to the buffer chamber;
[0022] A gas extraction device, used for extracting gas from the buffer chamber;
[0023] An air inlet pipe, the air outlet end of the air inlet pipe is communicated with the buffer cavity of the supplementary container or the buffer cavity of the container body, and the air inlet end of the air inlet pipe is connected to the inert gas supply device;
[0024] An air outlet pipe, an air inlet end of the air outlet pipe is communicated with the buffer cavity of the supplementary container or the buffer cavity of the container body, and an air outlet end of the air outlet pipe is connected to the air extraction device.
[0025] In one of the embodiments, the precursor packaging container further includes a pressure monitoring device, which is connected to the gas outlet pipe and is used to monitor the pressure in the buffer chamber.
[0026] In a second aspect, the present application provides a vapor deposition system, which includes any one of the precursor packaging containers provided in the first aspect, and the vapor deposition system also includes a vapor deposition device. The precursor packaging container also includes a carrier gas inlet pipe and a carrier gas outlet pipe, and the carrier gas inlet pipe is used to introduce carrier gas into the container body so that the carrier gas carries the precursor in the container body to flow out from the carrier gas outlet pipe and enter the vapor deposition device.
[0027] The above-mentioned precursor packaging container includes a container body, at least one supplementary container, a purification component and an on-off control component, wherein the container body is filled with a precursor; the supplementary container contains a precursor, the supplementary container is detachably connected to the container body, and a buffer cavity is provided at the open end of the supplementary container and / or the open end of the container body; the purification component is used to purify the air in the buffer cavity before the container body and the supplementary container are connected; the on-off control component is used to control the on-off connection between the open end of the container body and the open end of the supplementary container, wherein when the container body and the supplementary container are connected, the precursor in the supplementary container enters the container body through the buffer cavity. When the precursor in the container body of the present application is consumed to a certain extent as the vapor deposition process proceeds, the buffer chamber located between the open end of the container body and the open end of the supplementary container is first purified by the purification component to ensure that the gas environment in the buffer chamber meets the requirements of the vapor deposition process, and then the container body and the supplementary container are connected by the on-off control component to realize the precursor replenishment of the container body by the supplementary container, thereby eliminating the need to replace the container body and purify the pipeline connecting the container body to the vapor deposition equipment, which helps to save purification operation time; in addition, when the precursor in the container body needs to be replenished, the air in the buffer chamber can be purified in advance by the purification component, so when the supplementary container needs to be connected to the container body, there is no need to interrupt the vapor deposition process, thereby enabling the present application to improve the production efficiency of the thin film layer compared to the prior art.
[0028] Furthermore, when there are at least two supplementary containers, the supplementary containers can be used alternately, that is, each supplementary container can alternately supply the container body with precursor, and the supplementary container removed from the container body can be installed on the container body again after being refilled with the precursor, so that the vapor deposition process does not need to be interrupted from beginning to end, thereby further improving the production efficiency of the thin film layer. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0030] Figure 1 This is a schematic diagram of the structure of a precursor packaging container in some embodiments of the present application;
[0031] Figure 2 It is a schematic structural diagram of a precursor packaging container in some other embodiments of the present application;
[0032] Figure 3 It is a schematic structural diagram of a precursor packaging container in some other embodiments of the present application;
[0033] Figure 4 Schematic diagram of the structure of the vapor deposition system in some embodiments of the present application.
[0034] Description of Figure Numbers:
[0035] 1. Precursor packaging container; 100. Container body; 110. Buffer chamber; 112. Connecting pipe; 120. Second mounting plate; 130. Carrier gas inlet pipe; 140. Carrier gas outlet pipe; 150. Sealing member; 200. Supplementary container; 210. First mounting plate; 300. Buffer enclosure; 400. Inert gas supply equipment; 410. Inlet pipe; 500. Vacuum equipment; 510. Outlet pipe; 520. Pressure monitoring device; 600. First control valve; 700. Second control valve; 800. Third control valve; 800a. First top control valve; 800b. Second top control valve; 900. Connecting member; 11. On / off control assembly; 12. Purification assembly; 2. Vapor deposition equipment; 3. Carrier gas supply equipment; 4. Precursor monitoring device. DETAILED DESCRIPTION
[0036] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0039] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0040] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.
[0042] In order to solve the problem of low production efficiency of thin film layers in the related art, the present application provides a precursor packaging container and a vapor deposition system, which are described in detail below.
[0043] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a precursor packaging container in some embodiments of the present application. The precursor packaging container of the present application includes a container body 100, at least one supplementary container 200, a purification component and an on-off control component.
[0044] The container body 100 is filled with a precursor, which is a material required for the vapor deposition equipment to produce a thin film layer. For example, if the material of the thin film layer is gallium nitride, the precursor includes trimethyl gallium and ammonia. The supplementary container 200 is filled with the precursor, and the supplementary container 200 is detachably connected to the container body 100. The open end of the supplementary container 200 and / or the open end of the container body 100 is provided with a buffer chamber 110.
[0045] Furthermore, the container body 100 and the supplementary container 200 include but are not limited to containers such as bottles and cans that can hold the precursor. In addition, in order to ensure that the precursor packaging container of the present application is less restricted by the site space, the relative position relationship between the supplementary container 200 and the container body 100 can be adaptively adjusted according to the size of the actual site space; for example, when the site space is smaller in the horizontal direction and larger in the vertical direction, the supplementary container 200 can be set above the container body 100, and the open end of the supplementary container 200 can be detachably connected to the open end of the top of the container body 100; when the site space is larger in the horizontal direction and smaller in the vertical direction, the supplementary container 200 can be set on the side of the container body 100, and the open end of the supplementary container 200 can be detachably connected to the open end of the side of the container body 100.
[0046] In addition, when the supplementary container 200 and the container body 100 are installed, there will inevitably be a certain space at the connection between the supplementary container 200 and the container body 100, and because the precursor has strong activity, it is easy to react more violently with the oxygen in the air after contacting with the air. Therefore, in order to ensure the stability of the vapor deposition process, a purification component is provided to purify the air in the space at the connection between the supplementary container 200 and the container body 100; the setting of the buffer chamber 110 can balance the pressure after the supplementary container 200 is connected to the container body 100, and the buffer chamber 110 can be formed by the open end of the supplementary container 200 and the open end of the container body 100, or it can be separately provided on the supplementary container 200 and the container body 100.
[0047] The purification component is used to purify the air in the buffer chamber 110 before the container body 100 and the supplementary container 200 are connected.
[0048] The on-off control component is used to control the on-off connection between the open end of the container body 100 and the open end of each supplementary container 200, wherein when the container body 100 and the supplementary container 200 are connected, the precursor in the supplementary container 200 enters the container body 100 through the buffer chamber 110.
[0049] In one embodiment, if Figure 1 As shown, the buffer chamber 110 includes a first buffer chamber 110a, a second buffer chamber 110b and a connecting tube 112; the first buffer chamber 110a is arranged at the open end of the container body 100, and the second buffer chamber 110b is arranged at the open end of the supplementary container 200, and the first buffer chamber 110a and the second buffer chamber 110b are connected by the connecting tube 112.
[0050] The on-off control assembly includes a first control valve 600, a second control valve 700 and a third control valve 800; the first control valve 600 is disposed between the supplementary container 200 and the second buffer cavity 110b, and the first control valve 600 is used to control the opening and closing of the opening end of the supplementary container 200. The second control valve 700 is disposed between the container body 100 and the first buffer cavity 110a, and the second control valve 700 is used to control the opening and closing of the opening end of the container body 100. The third control valve 800 is used to control the on-off between the opening end of the supplementary container 200 and the opening end of the container body 100.
[0051] Furthermore, the first control valve 600 , the second control valve 700 and the third control valve 800 are all electrically controlled valves, which can be opened and closed according to electrical signals.
[0052] The third control valve 800 includes a first top control valve 800a and a second top control valve 800b. The first top control valve 800a is arranged between the first buffer cavity 110a and one end of the connecting pipe 112, and the second top control valve 800b is arranged between the second buffer cavity 110b and the other end of the connecting pipe 112.
[0053] Furthermore, the purification component includes an air inlet pipe 410 and an air outlet pipe 510, the air inlet pipe 410 is connected to the first buffer cavity 110a, and the air inlet pipe 410 is used to input inert gas into the buffer cavity 110, and the air outlet pipe 510 is connected to the second buffer cavity 110b, and the air outlet pipe 510 is used to extract the gas in the buffer cavity 110.
[0054] In the initial state, the first top control valve 800a, the second top control valve 800b, the first control valve 600 and the second control valve 700 are all in a closed state. When in use, first open the first top control valve 800a of the container body 100 and the second top control valve 800b of the supplementary container 200; then, through the cooperation of the air inlet pipe 410 and the air outlet pipe 510, repeatedly perform vacuum and inflation operations on the inside of the buffer chamber 110 to exhaust the air inside and achieve a low-water, low-oxygen process atmosphere; then open the first control valve 600, and then open the second control valve 700 to transfer the precursor in the supplementary container 200 to the container body 100; after completion After the transfer, close the second control valve 700 and the first control valve 600, and through the cooperation of the air inlet pipe 410 and the air outlet pipe 510, perform vacuum and inflation operations on the inside of the buffer chamber 110 repeatedly to discharge the precursor vapor in the buffer chamber 110 and realize a high-purity inert gas atmosphere; then, remove the replenishing container 200 from the container body 100; wait until the temperature in the container body 100 is constant, that is, when the transferred precursor meets the vapor deposition process conditions, use the precursor for vapor deposition operation.
[0055] Since the buffer chamber 110 and the connecting pipe 112 are provided, during the precursor transfer process, only the first control valve 600, the second control valve 700, the first top control valve 800a and the second top control valve 800b need to be operated, and only the buffer chamber 110 needs to be inflated and evacuated, and there is no need to flush and evacuate the entire pipeline connecting the precursor and the vapor deposition equipment, which greatly reduces the operation time of inflation and exhaust, and during the precursor transfer process, there is no need to interrupt the vapor deposition process, and it only needs to be completed during the vapor deposition process preparation stage (such as heating, changing process conditions, etc.), which greatly improves the utilization rate and production capacity of the vapor deposition equipment and reduces the production cost.
[0056] In the present embodiment, when the precursor in the container body 100 is consumed to a certain extent as the vapor deposition process proceeds, the buffer chamber 110 located between the open end of the container body 100 and the open end of the supplementary container 200 is first purified by a purification component to ensure that the gas environment in the buffer chamber 110 meets the requirements of the vapor deposition process; then the open end of the container body 100 and the open end of the supplementary container 200 are connected by an on-off control component to achieve the precursor replenishment of the container body 100 by the supplementary container 200, thereby eliminating the need to replace the container body 100 and purifying the pipeline connecting the container body 100 and the vapor deposition equipment, which helps to save time for the purification operation; in addition, when the precursor in the container body 100 needs to be replenished, the air in the buffer chamber 110 can be purified in advance by the purification component, so when the supplementary container 200 needs to be connected to the container body 100, there is no need to interrupt the vapor deposition process, thereby enabling the present application to improve the production efficiency of the thin film layer compared to the prior art.
[0057] It is worth noting that the precursor material is generally highly active and can react violently with water and oxygen in the air. The present application can ensure that the internal environment of the buffer chamber 110 is free of water and oxygen by performing inflation and exhaust operations, and exhaust the air inside the buffer chamber 110. On the one hand, it can reduce the violent reaction between the precursor and water and oxygen to avoid dangerous accidents. On the other hand, it can prevent the precursor from being contaminated by water and oxygen, and prevent the contaminated precursor from entering the vapor deposition equipment to cause process fluctuations that affect product performance.
[0058] In some embodiments, Figure 2 As shown, a buffer enclosure 300 is provided at the open end of the supplementary container 200 and / or the open end of the container body 100, and the buffer cavity 110 is formed by the inner wall of the buffer enclosure 300, the outer wall of the open end of the supplementary container 200 and the outer wall of the open end of the container body 100.
[0059] Specifically, when the buffer cavity 110 is located at the open end of the supplementary container 200, the buffer enclosure 300 is integrally formed with the supplementary container 200; when the buffer cavity 110 is located at the open end of the container body 100, the buffer enclosure 300 is integrally formed with the container body 100. Integrally forming the buffer enclosure 300 with the supplementary container 200 or the container body 100 helps to ensure the airtightness of the formed buffer cavity 110.
[0060] In some embodiments, Figure 2 As shown, the purification component includes an inert gas supply device 400, an exhaust device 500, an air inlet pipe 410 and an air outlet pipe 510. The inert gas supply device 400 is used to introduce inert gas into the buffer chamber 110, and the exhaust device 500 is used to extract the gas in the buffer chamber 110.
[0061] The outlet end of the inlet pipe 410 is connected to the buffer chamber 110 of the supplementary container 200, and the inlet end of the inlet pipe 410 is connected to the inert gas supply device 400; the inlet end of the outlet pipe 510 is connected to the buffer chamber 110 of the supplementary container 200, and the outlet end of the outlet pipe 510 is connected to the exhaust device 500. Alternatively, the outlet end of the inlet pipe 410 is connected to the buffer chamber 110 of the container body 100, and the inlet end of the inlet pipe 410 is connected to the inert gas supply device 400; the inlet end of the outlet pipe 510 is connected to the buffer chamber 110 of the container body 100, and the outlet end of the outlet pipe 510 is connected to the exhaust device 500.
[0062] There is no strict restriction on the specific connection arrangement of the air inlet pipe 410 and the air outlet pipe 510 , and it is only necessary to purify the air in the buffer chamber 110 before the corresponding supplementary container 200 is connected to the container body 100 .
[0063] Specifically, when purifying the air in the buffer chamber 110, the air in the buffer chamber 110 is extracted through the cooperation of the exhaust device 500 and the air outlet pipe 510, and at the same time, the inert gas is filled into the buffer chamber 110 through the cooperation of the inert gas supply device 400 and the air inlet pipe 410 until the filling time reaches the preset time or meets other preset filling end conditions, indicating that the air in the buffer chamber 110 has been purified.
[0064] In some embodiments, reference Figure 2 The precursor packaging container also includes a pressure monitoring device 520 , which is connected to the gas outlet pipe 510 . The pressure monitoring device 520 is used to monitor the pressure in the buffer chamber 110 .
[0065] According to the above content, in order to ensure that the atmosphere in the buffer chamber 110 meets the process requirements, it is necessary to fill the buffer chamber 110 with inert gas. In order to ensure the stability of the process, it is also necessary to ensure the balance of the pressure in the buffer chamber 110. Therefore, a pressure monitoring device 520 is provided to monitor the pressure in the buffer chamber 110.
[0066] Specifically, in the initial state, the pressure in the supplementary container 200 is consistent with the pressure in the container body 100. When the inert gas is filled into the buffer chamber 110, the pressure in the buffer chamber 110 is monitored by the pressure monitoring device 520. When the pressure in the buffer chamber 110 is consistent with the pressure in the container body 100, it indicates that the preset filling end condition has been met. At this time, the filling of the inert gas into the buffer chamber 110 can be stopped.
[0067] In this embodiment, the pressure monitoring device 520 is used to monitor whether the pressure in the buffer chamber 110 is consistent with the pressure in the container body 100, and when the pressure in the buffer chamber 110 is consistent with the pressure in the container body 100, the filling of the inert gas is stopped. This helps to save production resources while ensuring the stability of the vapor deposition process.
[0068] In some embodiments, reference Figure 2 A first mounting plate 210 is extended from the outer wall of the supplementary container 200 near its own opening end, and a second mounting plate 120 is extended from the outer wall of the container body 100 near its own opening end. The second mounting plate 120 is detachably connected to the first mounting plate 210 via a connector 900.
[0069] The first mounting plate 210 is horizontally extended and arranged on the outer side wall of the supplementary container 200 near its own opening end, and the second mounting plate 120 is horizontally extended and arranged on the outer side wall of the container body 100 near its own opening end, and the first mounting plate 210 is integrally formed with the supplementary container 200, and the second mounting plate 120 is integrally formed with the container body 100. The connecting member 900 includes a bolt and a nut.
[0070] Specifically, the first mounting plate 210 is arranged on the outer side wall of the buffer enclosure 300 of the supplementary container 200, and the second mounting plate 120 is arranged on the outer side wall of the buffer enclosure 300 of the container body 100. After the worker aligns the open end of the supplementary container 200 with the open end of the container body 100, the first mounting plate 210 and the second mounting plate 120 are fixed by bolts and nuts to close the buffer chamber 110. After the precursor in the supplementary container 200 is transferred, the worker removes the supplementary container 200 from the container body 100. In addition, the detachable connection setting of the supplementary container 200 and the container body 100 in the present application is not limited to the above-mentioned related settings, and can also be other detachable connection methods such as the open end of the supplementary container 200 and the open end of the container body 100 are detachably connected through a clamp.
[0071] In some embodiments, reference Figure 2 The opening end of the supplementary container 200 and / or the opening end of the container body 100 are both provided with a seal 150 , and the seal 150 may be a rubber seal or a metal gasket, etc., which can further ensure the sealing of the buffer cavity 110 .
[0072] Specifically, a rubber sealing gasket may be bonded to the side wall of the first mounting plate 210 away from the supplementary container 200, or a rubber sealing gasket may be bonded to the side wall of the second mounting plate 120 away from the container body 100, so that after the supplementary container 200 is installed on the container body 100, the rubber sealing gasket is tightly pressed between the first mounting plate 210 and the second mounting plate 120, thereby achieving sealing of the buffer cavity 110 located between the supplementary container 200 and the container body 100.
[0073] In other embodiments, a buffer cover is provided at the open end of the replenishing container 200 and / or the open end of the container body 100, a connecting port is provided on the buffer cover, the inner wall of the buffer cover and the outer wall of the open end of the replenishing container 200 are combined to form a buffer cavity 110 located at the open end of the replenishing container 200, and / or the inner wall of the buffer cover and the outer wall of the container body 100 are combined to form a buffer cavity 110 located at the open end of the container body 100.
[0074] While forming the buffer cavity 110, the buffer cover also helps to improve the alignment efficiency between the opening end of the supplementary container 200 and the opening end of the container body 100; a connecting port is provided on the buffer cover to ensure smooth communication between the opening end of the supplementary container 200 and the opening end of the container body 100.
[0075] Specifically, one or both of the supplementary container 200 and the container body 100 may be integrally formed with a buffer cover, as long as a buffer cavity 110 can be provided between the open end of the supplementary container 200 and the open end of the container body 100. In addition, the first mounting plate 210 may be integrally formed on the outer side wall of the buffer cover of the supplementary container 200, and the second mounting plate 120 may be integrally formed on the outer side wall of the buffer cover of the container body 100, and under the joint cooperation of the connecting member 900, the buffer cavity 110 between the supplementary container 200 and the container body 100 is sealed, and in order to further improve the sealing effect of the buffer cavity 110, the above-mentioned sealing member 150 may be provided between the first mounting plate 210 and the second mounting plate 120.
[0076] In other embodiments, reference Figure 2 The open end of the supplementary container 200 is connected to the open end of the container body 100 through a connecting tube 112, and the buffer cavity 110 is formed by the inner wall of the connecting tube 112, the outer wall of the open end of the supplementary container 200 and the outer wall of the open end of the container body 100.
[0077] One end of the connecting tube 112 can be fixedly connected to the open end of the container body 100, and the other end of the connecting tube 112 can be detachably connected to the open end of the supplementary container 200, and the detachable connection method includes a clamp or the like. At this time, the first mounting plate 210 can be integrally formed and set on the outer side wall of the open end of the supplementary container 200, and the second mounting plate 120 can be integrally formed and set on the outer side wall of the open end of the container body 100, and the longitudinal sections of the second mounting plate 120 and the first mounting plate 210 are both L-shaped, and the space enclosed by the second mounting plate 120 and the first mounting plate 210 can accommodate the connecting tube 112, and with the cooperation of the connecting piece 900, the container body 100 can be assisted to stably support the supplementary container 200, and the stability of the direction of the connecting tube 112 can also be ensured. In addition, in order to ensure the sealing of the buffer chamber 110, the above-mentioned seal 150 can be set at the connection between the connecting pipe 112 and the container body 100 and the supplementary container 200. At the same time, the above-mentioned seal 150 can also be set between the first mounting plate 210 and the second mounting plate 120.
[0078] It is worth noting that in the present application, when there is only one supplementary container 200, through the cooperation of the on-off control component, the purification component and the single supplementary container 200, there is no need to replace the container body 100, and there is no need to purify the pipeline connecting the container body 100 and the vapor deposition equipment. It is only necessary to purify the buffer chamber between the container body 100 and the supplementary container 200, so that the purification time can be saved, and when the container body 100 needs to replenish the precursor, there is no need to interrupt the vapor deposition process, so that the production efficiency of the thin film layer is improved. When the number of the supplementary containers 200 is at least two, since each supplementary container 200 can alternately replenish the precursor for the container body 100, and the supplementary container 200 removed from the container body 100 can be installed on the container body 100 again after being refilled with the precursor, the vapor deposition process can be made without interruption from beginning to end, thereby further improving the production efficiency of the thin film layer; the following describes that the supplementary precursor packaging container includes at least two filling containers 200.
[0079] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of the precursor packaging container in some other embodiments of the present application. Figure 3 Precursor packaging container and Figure 2 The difference between the precursor packaging container in is that Figure 3The number of the supplementary containers 200 is at least two, and the supplementary containers 200 can be used alternately, that is, the supplementary containers 100 can alternately supply the container body 100 with precursors, and the supplementary containers 200 removed from the container body 100 can be installed on the container body 100 again after being refilled with precursors, so that the vapor deposition process does not need to be interrupted from beginning to end, thereby further improving the production efficiency of the thin film layer; in addition, the provision of the supplementary container 200 also makes the precursor packaging container of the present application less affected by site space limitations.
[0080] Specifically, Figure 3 A setting method for a specific connection relationship and positional relationship between at least two supplementary containers 200 and a container body 100 is provided. When there are two supplementary containers 200 to supply precursors to the container body 100, the two supplementary containers 200 are both located above the container body 100, and the open ends of the supplementary containers 200 are detachably connected to the open ends of the top of the container body 100. The open ends of the two supplementary containers 200 and the open end of the container body 100 are both provided with a buffer cavity 110, and the buffer cavity 110 is formed by enclosing a buffer enclosure 300. The first control valve 600 is arranged in the open end of the supplementary container 200, the second control valve 700 is arranged in the open end of the container body 100, and the third control valve 800 can be arranged on the buffer enclosure 300 of the supplementary container 200, or on the buffer enclosure 300 of the container body 100.
[0081] When the precursor consumption in the container body 100 reaches a preset consumption threshold, for example, when the precursor consumption reaches 98% of the total, first open the third control valve 800, and use the purification component to inflate and evacuate the buffer chamber 110 at the open end of the supplementary container 200 and the buffer chamber 110 at the open end of the container body 100 with inert gas to achieve a low-water and low-oxygen buffer chamber 110 atmosphere; then open the first control valve 600 and the second control valve 700 to transfer the precursor from the cavity of the supplementary container 200 to the cavity of the container body 100; after the transfer is completed, close the second control valve 700, then close the first control valve 600, and then use the purification component to clean the opening of the supplementary container 200. The buffer chamber 110 at the open end and the buffer chamber 110 at the open end of the container body 100 are inflated and evacuated with inert gas to achieve a low-water and low-oxygen atmosphere in the buffer chamber 110, and then the third control valve 800 is closed; then the supplementary container 200 is removed from the container body 100; subsequently, when the consumption of the precursor in the container body 100 reaches the preset consumption threshold again, the precursor in another supplementary container 200 is transferred to the container body 100 according to the above steps, and during this period, the previously removed supplementary container 200 can be filled with the precursor and then reinstalled on the container body 100, thereby ensuring the continuity of the vapor deposition process and thereby improving the production efficiency of the thin film layer.
[0082] In the present application, when the precursor in the container body 100 is consumed to a certain extent as the vapor deposition process proceeds, the buffer chamber 110 located between the open end of the container body 100 and the open end of the supplementary container 200 is first purified by a purification component to ensure that the gas environment in the buffer chamber 110 meets the requirements of the vapor deposition process; then, the open end of the container body 100 and the open end of the supplementary container 200 are connected by an on-off control component to achieve the precursor replenishment of the container body 100 by the supplementary container 200, thereby eliminating the need to replace the container body 100 and purify the pipeline connecting the container body 100 and the vapor deposition equipment, which helps to save time for the purification operation; in addition, the precursor in the container body 100 is When the body needs to be replenished, the air in the buffer chamber 110 can be purified in advance by the purification component, so when the replenishing container 200 needs to be connected to the container body 100, there is no need to interrupt the vapor deposition process, so that the present application can improve the production efficiency of the thin film layer compared with the prior art; furthermore, when there are at least two replenishing containers 200 in the present application, the replenishing containers 200 can be used alternately, that is, each replenishing container 100 can alternately replenish the precursor for the container body 100, and the replenishing container 200 removed from the container body 100 can be installed on the container body 100 again after being refilled with the precursor, so that the vapor deposition process does not need to be interrupted from beginning to end, thereby further improving the production efficiency of the thin film layer.
[0083] Please refer to Figures 1 to 4 , Figure 4 This is a structural schematic diagram of a vapor deposition system in some embodiments of the present application. The vapor deposition system includes the above-mentioned precursor packaging container 1 and vapor deposition equipment 2. The precursor packaging container 1 also includes a carrier gas inlet pipe 130 and a carrier gas outlet pipe 140. The carrier gas inlet pipe 130 is used to introduce carrier gas into the container body 100 so that the carrier gas carries the precursor in the container body 100 and flows out from the carrier gas outlet pipe 140 and enters the vapor deposition equipment 2.
[0084] Furthermore, the vapor deposition system also includes a carrier gas supply device 3, one end of the carrier gas inlet pipe 130 is connected to the carrier gas supply device 3, and the other end of the carrier gas inlet pipe 130 extends toward the inner bottom wall of the container body 100 to ensure sufficient contact between the carrier gas and the precursor in the container body 100.
[0085] In some embodiments, the vapor deposition system also includes a precursor monitoring device 4, which is electrically connected to the on-off control component 11 and the purification component 12. The precursor monitoring device 4 is used to monitor the precursor consumption of the container body 100, and when the precursor consumption reaches a preset consumption threshold, the purification component 12 is controlled to purify the air in the buffer chamber 110, and after the purification is completed, the on-off control component 11 is controlled to connect the container body 100 with the replenishment container 200.
[0086] Specifically, when the precursor monitoring device 4 detects that the precursor consumption in the container body 100 reaches 98% of the total, it first sends a first start signal to the on-off control component 11 to control the third control valve 800 to open; then sends a second start signal to the purification component 12 to use the purification component 12 to purify the air in the buffer chamber 110; after the purification is completed, the precursor monitoring device 4 sends a third start signal to the on-off control component 11, so that the on-off control component 11 controls the first control valve 600 and the second control valve 700 to open, thereby realizing the transfer of the precursor from the cavity of the replenishment container 200 to the cavity of the container body 100.
[0087] The vapor deposition system in this embodiment, when equipped with any of the above-mentioned precursor packaging containers, does not need to frequently replace the precursor packaging containers, thus overcoming the problem of vapor deposition process interruption due to replacement of precursor packaging containers and thus increasing non-process time, greatly improving the utilization rate of vapor deposition equipment, increasing production capacity, and reducing production costs.
[0088] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.
[0089] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0090] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A precursor packaging container, characterized in that: The precursor packaging container comprises: A container body, wherein the container body is filled with a precursor; At least one supplementary container, wherein the supplementary container contains a precursor, the supplementary container is detachably connected to the container body, and a buffer cavity is provided at an open end of the supplementary container and / or an open end of the container body; a purification component, used for purifying the air in the buffer chamber before the container body and the supplementary container are connected; and An on-off control component, used to control the on-off connection between the open end of the container body and the open end of the supplementary container; Wherein, when the container body and the supplementary container are in communication, the precursor in the supplementary container enters the container body through the buffer cavity.
2. The precursor packaging container according to claim 1, characterized in that: The open end of the supplementary container and / or the open end of the container body is provided with a buffer enclosure, and the buffer cavity is formed by the inner wall of the buffer enclosure, the outer wall of the open end of the supplementary container and the outer wall of the open end of the container body.
3. The precursor packaging container according to claim 1, characterized in that: A buffer cover is provided at the open end of the replenishing container and / or the open end of the container body, a connecting port is provided on the buffer cover, an inner wall of the buffer cover and an outer wall of the open end of the replenishing container are combined to form a buffer cavity located at the open end of the replenishing container, and / or an inner wall of the buffer cover and an outer wall of the container body are combined to form a buffer cavity located at the open end of the container body.
4. The precursor packaging container according to claim 1, characterized in that: The open end of the supplementary container is connected to the open end of the container body through a connecting pipe, and the buffer cavity is formed by the inner wall of the connecting pipe, the outer wall of the open end of the supplementary container and the outer wall of the open end of the container body.
5. The precursor packaging container according to claim 4, characterized in that: The on-off control component comprises: a first control valve, disposed on the replenishing container, the first control valve being used to control the opening and closing of the opening end of the replenishing container; A second control valve, disposed on the container body, the second control valve being used to control the opening and closing of the opening end of the container body; and The third control valve is used to control the connection and disconnection between the opening end of the supplementary container and the opening end of the container body.
6. The precursor packaging container according to claim 5, characterized in that: The buffer chamber includes a first buffer chamber, a second buffer chamber and the connecting pipe; the third control valve includes a first top control valve and a second top control valve, the first top control valve is arranged between the first buffer chamber and one end of the connecting pipe, and the second top control valve is arranged between the second buffer chamber and the other end of the connecting pipe.
7. The precursor packaging container according to claim 1, characterized in that: A first mounting plate is extended on the outer side wall of the opening end of the supplementary container, and a second mounting plate is extended on the outer side wall of the opening end of the container body. The second mounting plate is detachably connected to the first mounting plate via a connecting piece.
8. The precursor packaging container according to any one of claims 1 to 7, characterized in that: The purification component comprises: An inert gas supply device, used for introducing an inert gas into the buffer chamber; A gas extraction device, used to extract the gas in the buffer chamber; An air inlet pipe, the air outlet end of the air inlet pipe is communicated with the buffer chamber of the supplementary container or the buffer chamber of the container body, and the air inlet end of the air inlet pipe is connected to the inert gas supply device; An air outlet pipe, the air inlet end of the air outlet pipe is communicated with the buffer chamber of the supplementary container or the buffer chamber of the container body, and the air outlet end of the air outlet pipe is connected to the air extraction device.
9. The precursor packaging container according to claim 8, characterized in that: The precursor packaging container further includes a pressure monitoring device, which is communicated with the gas outlet pipe and is used to monitor the pressure in the buffer chamber.
10. A vapor deposition system, comprising the precursor packaging container according to any one of claims 1 to 9, characterized in that: The vapor deposition system also includes a vapor deposition device, and the precursor packaging container also includes a carrier gas inlet pipe and a carrier gas outlet pipe, wherein the carrier gas inlet pipe is used to introduce carrier gas into the container body so that the carrier gas carries the precursor in the container body and flows out from the carrier gas outlet pipe and enters the vapor deposition device.