Device with bonding pad structure and display screen

Abstract

The utility model relates to a device with a bonding pad structure and a display screen, which comprise a square substrate with an LED chip arranged on the front surface, four bonding pads arranged on the back surface of the substrate, and the four bonding pads are arranged in the middle of four edges of the back surface of the substrate. The four bonding pads are a data input end bonding pad, a data output end bonding pad, a power supply end bonding pad and a power supply grounding end bonding pad correspondingly; and the data input end bonding pad and the data output end bonding pad are arranged on two opposite sides of the back surface of the substrate. According to the utility model, wiring design and connection between adjacent devices are facilitated when a plurality of devices form a module, and the requirement of miniaturization is met.

Description

Technical Field

[0001] The utility model relates to the field of LED devices, in particular to a device with a pad structure and a display screen. Background Art

[0002] At present, the LED display industry has entered the development stage of fine pitch, but for small pitch LED display device products, its development is limited by the influence of multiple factors such as pad circuit setting, equipment accuracy, circuit board process, etc., especially the pad structure of the display device, which has become the main factor limiting the miniaturization of LED display devices. In traditional LED display devices, the pads are usually set on the four corners of the substrate. In this way, when multiple LED display devices are combined into an LED display module, the wiring structure between two adjacent devices is complicated, which leads to the need to increase the overall area of ​​the LED display device, and it is impossible to achieve simple wiring and miniaturization. Utility Model Content

[0003] In view of the existing deficiencies, the utility model provides a device and a display screen with a pad structure.

[0004] The technical solution adopted by the utility model to solve its technical problems is: a device with a pad structure, including a square substrate with an LED chip arranged on the front, four pads arranged on the back of the substrate, the four pads are arranged in the middle of the four sides of the back of the substrate, the four pads correspond to a data input terminal pad, a data output terminal pad, a power supply terminal pad and a power ground terminal pad; the data input terminal pad and the data output terminal pad are arranged on two opposite sides of the back of the substrate.

[0005] Preferably, a driver IC is built into the front side of the substrate or a driver IC is arranged in the middle of the back side of the substrate, the data input terminal pad is electrically connected to the data input terminal pin of the driver IC, the data output terminal pad is electrically connected to the data output terminal pin of the driver IC, the power terminal pad is electrically connected to the VDD pin of the driver IC, and the power ground terminal pad is electrically connected to the GND pin of the driver IC.

[0006] Preferably, the driver IC is built in the front side of the substrate, and a Zener diode and / or a capacitor connected between a VDD pin of the driver IC and a GND pin of the driver IC are also built in the front side of the substrate.

[0007] Preferably, the LED chip comprises a red LED chip, a green LED chip and a blue LED chip which are arranged in parallel.

[0008] Preferably, the four pads are pads of the same shape and the same area.

[0009] Preferably, the pad is square or triangular, and the base of the triangle is flush with the edge of the substrate and the vertex faces the center of the substrate.

[0010] A display screen adopts any one of the above-mentioned devices with a pad structure.

[0011] The beneficial effect of the utility model is that the utility model sets the pad in the middle of the back side of the substrate, and the data input terminal pad and the data output terminal pad are set on the two opposite sides of the back side of the substrate, so that the power terminal pad and the power ground terminal pad are also located on the other two opposite sides of the back side of the substrate. When connecting multiple devices, it is only necessary to arrange two parallel lines on the opposite sides of the device, and the part between the two lines is connected in the middle of the device. At this time, the pads between adjacent devices are on the same axis, and the distance between the two is the smallest. The adjacent devices can be wired and connected in a head-to-tail manner with the minimum distance, thereby realizing the connection between devices, and there will be no staggering in the wiring on both sides, so the minimum distance between the wiring and the pad can be achieved, further reducing the size of the product, and the wiring structure is also simple and practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic structural diagram of the back side of the substrate of the first embodiment of the utility model;

[0013] Figure 2 This is a schematic structural diagram of the back side of the substrate of the second embodiment of the utility model;

[0014] Figure 3 It is a structural schematic diagram of the front side of the embodiment of the utility model;

[0015] Figure 4 This is a schematic diagram of the structure of a LED display module formed by connecting multiple devices in the first embodiment of the utility model;

[0016] Names and serial numbers of components in the figure: 1-substrate 10-LED chip 100-red LED chip 101-green LED chip 102-blue LED chip 11-driving IC 12-Zener diode 13-capacitor 2-data input terminal pad 3-data output terminal pad 4-power supply terminal pad 5-power ground terminal pad. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with the embodiments, and a clear and complete description will be given. It should be understood that these embodiments are used to illustrate the present invention and are not limited to the scope of the present invention. The implementation conditions adopted in the embodiments can be further adjusted according to the conditions of the specific manufacturer, and the unspecified implementation conditions are usually the conditions in the conventional experiments. In addition, the directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", etc., are only referenced to the directions of the attached diagrams. The directional terms used are for better and clearer explanation and understanding of the present invention, rather than indicating or implying the orientation that the present invention must have, and therefore cannot be understood as limitations on the present invention.

[0018] The utility model is implemented as follows Figures 1 to 4As shown in the figure, a device with a pad structure includes a square substrate 1 with an LED chip 10 arranged on the front, and four pads are arranged on the back of the substrate 1. The LED chip 10 and the pads are arranged on two opposite sides of the substrate 1, and the pads will not affect the light emission of the LED chip 10, thereby avoiding the blocking and absorption of light, thereby improving the luminous brightness and reducing energy consumption, so that the light energy emitted by the LED chip 10 can be maximized, so that the picture displayed by the LED display screen formed by using this device is clearer and the display effect is improved. The LED chip 10 includes red LED chips 100 and 101 arranged in parallel. The green LED chip 101 and the blue LED chip 102 have four pads arranged in the middle of the four sides of the back side of the substrate 1. The four pads correspond to the data input pad 2, the data output pad 3, the power supply pad 4 and the power ground pad 5; the data input pad 2 and the data output pad 3 are arranged on two opposite sides of the back side of the substrate 1. For example, if the data input pad 2 is arranged in the middle of the upper side of the back side of the substrate 1, then the data output pad 3 is arranged in the middle of the lower side of the back side of the substrate 1. The corresponding power supply pad 4 is in the middle of the left side of the back side of the substrate 1, and the power ground pad 5 is in the middle of the right side of the back side of the substrate 1. In this way, during production, multiple devices can be arranged in a row from top to bottom and then wired and connected. At this time, a power supply terminal connection line connected to the power supply terminal pad 4 of each device is arranged on the left side, and the power supply terminal connection line can be set on the left side of each device with a minimum distance. Similarly, a power supply ground terminal connection line connected to the power supply ground terminal pad 5 of each device is arranged on the right side, and the power supply ground terminal connection line can be set on the right side of each device with a minimum distance. There will be no problem of interlacing the power supply terminal connection line and the power supply ground terminal connection line, thereby reducing the length of the left and right to miniaturize the product; in the up and down direction, the upper The data output terminal pad 3 of the device is connected to the data input terminal pad 2 of the adjacent device below it. The two pads are on the same vertical axis and are connected vertically with a straight line of the shortest distance, thereby reducing the size of the product. By analogy, multiple devices are combined into an LED display module for display, realizing the design requirements of miniaturized LED display modules. There will be no crossed wires in the wiring, and the ring structure of the connecting wires between two adjacent devices is avoided. The power wire and the signal wire are wired in parallel in the longitudinal or transverse direction, ensuring that the wiring of the power wire and the signal wire does not conflict.

[0019] Further improvements such as Figure 3As shown in , the front side of the substrate 1 is equipped with a driver IC 11 or the middle side of the back side of the substrate 1 is equipped with a driver IC 11, that is, the driver IC 11 driving the LED chip 10 is arranged on the front side of the substrate 1 or the middle side of the back side of the substrate according to different use requirements. In order to avoid the influence on each pad when the driver IC 11 is arranged on the back side, it is preferred to arrange the driver IC 11 on the front side of the substrate 1. The driver IC 11 is arranged on the front side of the substrate 1, which also facilitates the installation of them when forming an LED display screen, and there is no need to arrange a protective back shell to protect the display screen. Accordingly, the data input terminal pad 2 and the data input terminal pin of the driver IC 11 are electrically connected to form the D1 terminal of the device, the data output terminal pad 3 and the data output terminal pin of the driver IC 11 are electrically connected to form the D0 terminal of the device, the power supply terminal pad 4 and the VDD pin of the driver IC 11 are electrically connected to form the VDD terminal of the device, and the power ground terminal pad 5 and the GND pin of the driver IC 11 are electrically connected to form the GND terminal of the device. The front of the substrate 1 is also built with a Zener diode 12 and / or a capacitor 13 connected between the VDD pin of the driver IC 11 and the GND pin of the driver IC 11. In this way, the Zener diode 12 can be used to stabilize the voltage and increase the antistatic ability of the device. The capacitor 13 can be used to achieve functions such as oscillation, filtering, phase shift, bypass, coupling, and stable display. The capacitor 13 is a chip capacitor; during production, the Zener diode 12, the capacitor 13, the driver IC 11, and the LED chip 10 are set on the front of the substrate 1 after solid crystal, baking, and wire bonding, and then packaged into an integrated structure with the substrate 1 through film pressing, which is convenient for installation and use, and can also provide safety protection and stable output during use. When the capacitor 13 and the Zener diode 12 are set at the same time, the capacitor 13 and the Zener diode 12 are connected in parallel between the VDD pin and the GND pin of the driver IC 11.

[0020] Further improvements such as Figure 1 , Figure 2 and Figure 4 As shown in the figure, the four pads are of the same shape and area, which can avoid the situation that the temperature rise of pads with different areas is not synchronized, the solder paste wetting is not synchronized, and the overall device tilting or cold soldering occurs during the welding process, and also avoids the abnormal display phenomenon of the LED display screen formed by using such a device; the pad is square or triangular, and the bottom side of the triangle is flush with the edge of the substrate and the vertex is toward the center of the substrate. The triangular structure can maintain sufficient welding area of ​​the pad while making the substrate further miniaturized.

[0021] A display screen uses a device with a pad structure as described above. The aforementioned multiple devices are first assembled into an LED display module, and then the multiple LED display modules are assembled in parallel into an LED display screen of a certain size. The number of devices is selected according to the size of the display screen.

[0022] Although the utility model has been described in detail above with general descriptions and specific implementation schemes, it is obvious to those skilled in the art that some modifications or improvements can be made to the utility model. Therefore, these modifications or improvements made without departing from the spirit of the utility model are within the scope of protection claimed by the utility model.

Claims

1. A device having a pad structure, characterized in that: It comprises a square substrate with an LED chip arranged on the front side, and four solder pads arranged on the back side of the substrate, the four solder pads are arranged in the middle of the four sides of the back side of the substrate, and the four solder pads correspond to a data input terminal solder pad, a data output terminal solder pad, a power terminal solder pad and a power ground terminal solder pad; the data input terminal solder pad and the data output terminal solder pad are arranged on two opposite sides of the back side of the substrate.

2. The device having a pad structure according to claim 1, characterized in that : A driver IC is built into the front side of the substrate or a driver IC is arranged in the middle of the back side of the substrate, the data input terminal pad is electrically connected to the data input terminal pin of the driver IC, the data output terminal pad is electrically connected to the data output terminal pin of the driver IC, the power terminal pad is electrically connected to the VDD pin of the driver IC, and the power ground terminal pad is electrically connected to the GND pin of the driver IC.

3. The device having a pad structure according to claim 2, characterized in that : The driver IC is built into the front side of the substrate, and the front side of the substrate also has a Zener diode and / or capacitor connected between the VDD pin of the driver IC and the GND pin of the driver IC.

4. The device having a pad structure according to claim 1, characterized in that :The LED chip includes a red LED chip, a green LED chip and a blue LED chip arranged in parallel.

5. The device having a pad structure according to claim 1, characterized in that : The four pads are pads of the same shape and the same area.

6. The device having a pad structure according to claim 1, characterized in that The pad is square or triangular in shape, with the base of the triangle flush with the edge of the substrate and the vertex facing the center of the substrate.

7. A display screen, characterized in that: A device with a pad structure as claimed in any one of claims 1 to 6 is used.

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