A semiconductor equipment fastening and clamping device

Abstract

The utility model belongs to the field of semiconductor technology, specifically a semiconductor equipment fastening and clamping device, including a cleaning tool, two sides of the cleaning tool are symmetrically fixedly connected with slide rails, a clamping assembly is installed above the slide rails, the clamping assembly includes a plurality of sliding frames and fixed plates, the sliding frame is slidably connected to the slide rails, and two sides of the sliding frame are symmetrically fixedly connected with L-shaped mounting frames; the utility model uses a slidable sliding frame, and a larger operating space is left between the sliding frames. Compared with the prior art, it is convenient to take or place parts and reduce the occurrence of bumps, and the sliding frame is clamped and fixed by the cooperation of the fixed plate and the cleaning tool, so as to avoid shaking of parts during cleaning and improve the stability of the equipment during cleaning.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor equipment fastening and clamping device. Background Art

[0002] In the preventive maintenance of semiconductor reaction chambers, components used in quartz and silicon etching processes need to be ultrasonically cleaned. Currently, the wafer size used in semiconductor factories is mostly 300mm in diameter, so most of the process component parts are circular ring structures, such as insert rings, alignment rings, edge rings, etc., with an inner diameter of (300+x)mm and an outer diameter of (300+x+y)mm, where the values ​​of x and y vary slightly depending on the design of different manufacturers' models.

[0003] In order to prevent component parts from being damaged, they cannot be stacked. During the cleaning process, these parts can only be placed flat in the ultrasonic cleaning tank, but the cleaning tank has a limited volume and can only clean 2 to 4 parts at a time; even if only two parts are placed on one layer, they may scratch each other and cause the parts to be scrapped.

[0004] The existing Chinese patent with announcement number CN207735293U discloses a clamping device for a semiconductor cleaning device, including a quadrilateral frame surrounded by four plates with through grooves, and slide rails with an "H"-shaped cross-section are arranged on the tops of two opposite width sides of the frame, and two connecting rods are spanned between the two slide rails, and both ends of the two connecting rods are slidably arranged on the slide rails through slide grooves.

[0005] In view of the above-mentioned and existing related technologies, the inventors believe that the following defects often exist: the distance between adjacent clamping parts of the device is small, which makes it inconvenient to place or take parts, resulting in the risk of collision when placing parts, and needs to be improved; therefore, a semiconductor equipment fastening and clamping device is proposed to address the above problems. Utility Model Content

[0006] In order to make up for the deficiencies of the prior art and solve the above-mentioned technical problems, the utility model provides a semiconductor equipment fastening and clamping device.

[0007] The technical solution adopted by the utility model to solve its technical problems is: a semiconductor equipment fastening and clamping device described in the utility model comprises a cleaning tool, and slide rails are symmetrically fixedly connected on both sides of the cleaning tool, and a clamping assembly is installed above the slide rails, and the clamping assembly comprises a plurality of sliding frames and fixed plates, and the sliding frame is slidably connected to the slide rails, and L-shaped mounting frames are symmetrically fixedly connected on both sides of the sliding frame, and rollers are installed on the side walls of the mounting frame, and an annular groove is opened on the surface of the roller, and the fixed plate is slidably connected to the slide rails, and the semiconductor parts are supported by placing them in the grooves of the rollers. When installing the parts, the sliding frames can be pushed in turn by the slidable sliding frames, so that a larger operating space is left between the sliding frames and the adjacent sliding frames. Compared with the prior art, it is convenient to take or place the parts and reduce the occurrence of bumps. After the parts are placed, the cleaning tool is placed in the cleaning tank for ultrasonic cleaning.

[0008] Preferably, a slide groove is provided on the surface of the fixed plate, and a clamping plate is slidably connected inside the slide groove. After the parts are placed, the fixed plate is pushed against the sliding frame so that the sliding frames fit each other without leaving any gaps. The clamping block is inserted into the fixed groove through the elastic force of the spring to fix the position of the fixed plate, and then the sliding frame is clamped and fixed by the cooperation of the fixed plate and the cleaning tooling to prevent the parts from shaking during cleaning.

[0009] Preferably, a clamping block is fixedly connected to the lower side wall of the clamping plate.

[0010] Preferably, a spring is fixedly connected to the lower side wall of the card plate, and the other end of the spring is fixedly connected to the fixed plate. When the fixed plate needs to be moved, the card plate is pushed to make the card block exit the fixed groove, and the fixed plate can be pushed to slide on the slide rail.

[0011] Preferably, the clamping assembly further comprises a plurality of fixing grooves, and the fixing grooves are provided on the side walls of the slide rail.

[0012] Preferably, the roller includes a rotating shaft, and one end of the rotating shaft is rotatably connected to the mounting frame, one end of the rotating shaft is fixedly connected to a fixed ring, and the other end of the rotating shaft is sleeved with a rotating ring. A slot is formed by the space between the fixed ring and the rotating ring. The rotatable roller reduces scratches on parts, improves the production quality of parts, and can vertically carry annular parts of various sizes.

[0013] Preferably, the surface of the fixed ring is rotatably connected to connecting plate 1, and the surface of the rotating ring is rotatably connected to connecting plate 2. The connecting plate 1 and connecting plate 2 are located above the mounting frame. The surface of the connecting plate 1 is rotatably connected to a lead screw, and the lead screw is threadedly connected to connecting plate 2. The connecting plate 2 can be driven to slide by rotating the lead screw, thereby adjusting the distance between the fixed ring and the rotating ring, and the width of the slot can be adjusted, so that the slot is suitable for carrying parts of various thicknesses.

[0014] Preferably, one end of the lead screw is rotatably connected to a limit seat, and the limit seat is fixedly connected to the mounting frame, and the position of the lead screw is limited by the limit seat, so that the connecting plate 1 and the connecting plate 2 are located above the mounting frame.

[0015] Preferably, an annular inclined surface is provided on opposite sides of the fixed ring and the rotating ring, and the cross section of the inclined surface is triangular.

[0016] The utility model is beneficial in that:

[0017] 1. The utility model has a slidable sliding frame with a larger operating space between the sliding frames. Compared with the prior art, it is convenient to take or place parts and reduce the occurrence of bumps. The sliding frame is clamped and fixed by the cooperation of the fixed plate and the cleaning tool to prevent the parts from shaking during cleaning.

[0018] 2. The utility model reduces the scratches on the parts through the rotatable roller, thereby improving the production quality of the parts. At the same time, it can carry annular parts of various sizes vertically, and the distance between the fixed ring and the rotating ring is adjusted by rotating the lead screw, thereby adjusting the width of the slot, so that the slot is suitable for carrying parts of various thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 For this utility model Figure 1 Side view of

[0022] Figure 3 This is a schematic diagram of the structure of the clamping assembly of the utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the fixed plate of the utility model;

[0024] Figure 5 For this utility model Figure 2 Schematic diagram of the A structure.

[0025] In the figure: 1. Cleaning tool; 2. Slide rail; 3. Clamping assembly; 31. Sliding frame; 32. Mounting frame; 33. Fixed plate; 34. Slide groove; 35. Card plate; 36. Card block; 37. Spring; 38. Fixed groove; 4. Roller; 41. Rotating shaft; 42. Fixed ring; 43. Rotating ring; 44. Connecting plate 1; 45. Connecting plate 2; 46. Screw; 47. Limit seat. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Embodiment 1

[0028] See also Figure 1-4 As shown, a semiconductor equipment fastening and clamping device includes a cleaning tool 1, and slide rails 2 are symmetrically fixedly connected on both sides of the cleaning tool 1. A clamping assembly 3 is installed above the slide rail 2. The clamping assembly 3 includes a plurality of sliding frames 31 and a fixed plate 33. The sliding frame 31 is slidably connected to the slide rail 2, and L-shaped mounting frames 32 are symmetrically fixedly connected on both sides of the sliding frame 31. Rollers 4 are installed on the side walls of the mounting frame 32. The surface of the roller 4 is provided with an annular groove. The fixed plate 33 is slidably connected to the slide rail 2. The semiconductor parts are supported by placing them in the groove of the roller 4. When installing the parts, the sliding frame 31 can be pushed in sequence by the slidable sliding frame 31, so that a large operating space is left between the sliding frame 31 and the adjacent sliding frame 31, which is convenient for taking or placing parts and reducing the occurrence of bumps. After the parts are placed, the cleaning tool 1 is placed in the cleaning tank for ultrasonic cleaning.

[0029] A slide groove 34 is provided on the surface of the fixed plate 33, and a clamping plate 35 is slidably connected inside the slide groove 34. After the parts are placed, the fixed plate 33 is pushed against the sliding frame 31 so that the sliding frames 31 fit each other without leaving any gaps. The clamping block 36 is inserted into the fixed groove 38 through the elastic force of the spring 37 to fix the position of the fixed plate 33, and then the sliding frame 31 is clamped and fixed by the cooperation of the fixed plate 33 and the cleaning tool 1 to prevent the parts from shaking during cleaning.

[0030] A clamping block 36 is fixedly connected to the lower side wall of the clamping plate 35 .

[0031] The lower side wall of the card plate 35 is fixedly connected with a spring 37, and the other end of the spring 37 is fixedly connected to the fixed plate 33. When the fixed plate 33 needs to be moved, the card plate 35 is pushed to make the block 36 withdraw from the fixed groove 38, so that the fixed plate 33 can be pushed to slide on the slide rail 2.

[0032] The clamping assembly 3 further includes a plurality of fixing grooves 38 , which are formed on the side walls of the slide rail 2 .

[0033] Embodiment 2

[0034] For comparison with Example 1, please refer to Figure 5 As shown, the utility model provides another embodiment, the roller 4 includes a rotating shaft 41, and one end of the rotating shaft 41 is rotatably connected to the mounting frame 32, one end of the rotating shaft 41 is fixedly connected to a fixing ring 42, and the other end of the rotating shaft 41 is sleeved with a rotating ring 43, and a slot is formed by the space between the fixing ring 42 and the rotating ring 43. The rotatable roller 4 reduces the scratches on the parts, improves the production quality of the parts, and can carry annular parts of various sizes vertically.

[0035] The surface of the fixed ring 42 is rotatably connected to a connecting plate 1 44, and the surface of the rotating ring 43 is rotatably connected to a connecting plate 2 45. The connecting plate 1 44 and the connecting plate 2 45 are located above the mounting frame 32. The surface of the connecting plate 1 44 is rotatably connected to a lead screw 46, and the lead screw 46 is threadedly connected to the connecting plate 2 45. By rotating the lead screw 46, the connecting plate 2 45 can be driven to slide, thereby adjusting the distance between the fixed ring 42 and the rotating ring 43, and the width of the slot can be adjusted, so that the slot is suitable for carrying parts of various thicknesses.

[0036] One end of the lead screw 46 is rotatably connected to a limit seat 47 , and the limit seat 47 is fixedly connected to the mounting frame 32 . The position of the lead screw 46 is limited by the limit seat 47 , so that the connecting plate 1 44 and the connecting plate 2 45 are located above the mounting frame 32 .

[0037] An annular inclined surface is provided on opposite sides of the fixed ring 42 and the rotating ring 43 , and the cross section of the inclined surface is triangular.

[0038] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art.

[0039] The working principle is to support the semiconductor parts by placing them inside the card slot of the roller 4. When installing the parts, the sliding rack 31 can be pushed in sequence through the slidable sliding rack 31, so that a large operating space is left between the sliding rack 31 and the adjacent sliding rack 31, which is convenient for taking or placing parts and reduces the occurrence of bumps. After the parts are placed, the cleaning tool 1 is placed in the cleaning tank for ultrasonic cleaning.

[0040] After the parts are placed, the fixed plate 33 is pushed against the sliding frame 31 so that the sliding frames 31 fit each other without leaving any gaps. The clamping block 36 is inserted into the interior of the fixed groove 38 through the elastic force of the spring 37 to fix the position of the fixed plate 33. Then, the sliding frame 31 is clamped and fixed through the cooperation of the fixed plate 33 and the cleaning tool 1 to prevent the parts from shaking during cleaning.

[0041] The rotatable roller 4 can reduce the scratches on the parts and improve the production quality of the parts. At the same time, annular parts of various sizes can be carried vertically. By rotating the screw 46, the connecting plate 45 can be driven to slide, and then the distance between the fixed ring 42 and the rotating ring 43 can be adjusted. The width of the slot can be adjusted to make the slot suitable for carrying parts of various thicknesses.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0043] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A semiconductor device fastening and clamping device, comprising a cleaning tool (1), characterized in that: The cleaning tool (1) is symmetrically and fixedly connected to the slide rails (2) on both sides, and a clamping assembly (3) is installed above the slide rails (2). The clamping assembly (3) includes a plurality of sliding frames (31) and a fixed plate (33). The sliding frames (31) are slidably connected to the slide rails (2). The sliding frames (31) are symmetrically and fixedly connected to the L-shaped mounting frames (32) on both sides. The side walls of the mounting frames (32) are installed with rollers (4). The surfaces of the rollers (4) are provided with an annular groove. The fixed plate (33) is slidably connected to the slide rails (2).

2. The semiconductor device fastening and clamping device according to claim 1, characterized in that: A sliding groove (34) is provided on the surface of the fixing plate (33), and a clamping plate (35) is slidably connected inside the sliding groove (34).

3. The semiconductor device fastening and clamping device according to claim 2, characterized in that: A clamping block (36) is fixedly connected to the lower side wall of the clamping plate (35).

4. The semiconductor device fastening and clamping device according to claim 2, characterized in that: A spring (37) is fixedly connected to the lower side wall of the clamping plate (35), and the other end of the spring (37) is fixedly connected to the fixing plate (33).

5. The semiconductor device fastening and clamping device according to claim 1, characterized in that: The clamping assembly (3) further comprises a plurality of fixing grooves (38), wherein the fixing grooves (38) are formed on the side walls of the slide rail (2).

6. The semiconductor device fastening and clamping device according to claim 1, characterized in that: The roller (4) comprises a rotating shaft (41), and one end of the rotating shaft (41) is rotatably connected to the mounting frame (32), one end of the rotating shaft (41) is fixedly connected to a fixing ring (42), and the other end of the rotating shaft (41) is sleeved with a rotating ring (43).

7. The semiconductor device fastening and clamping device according to claim 6, characterized in that: The surface of the fixed ring (42) is rotatably connected to a connecting plate 1 (44), and the surface of the rotating ring (43) is rotatably connected to a connecting plate 2 (45). The connecting plate 1 (44) and the connecting plate 2 (45) are located above the mounting frame (32). The surface of the connecting plate 1 (44) is rotatably connected to a lead screw (46), and the lead screw (46) is threadedly connected to the connecting plate 2 (45).

8. The semiconductor device fastening and clamping device according to claim 7, characterized in that: One end of the lead screw (46) is rotatably connected to a limiting seat (47), and the limiting seat (47) is fixedly connected to the mounting frame (32).

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