Plasma degumming machine with adjustable angle and height

Abstract

The utility model provides an angle height adjustable plasma degumming machine, including the case, be equipped with placing subassembly, ionizing subassembly and gas supply subassembly in proper order from bottom up in the case, placing subassembly includes the installation cylinder, be equipped with the bottom plate and partition plate in parallel in the installation cylinder, be equipped with the drive mechanism on the bottom plate, be equipped with the drive mechanism on the partition plate, be equipped with the drive mechanism on the partition plate. A driving mechanism is arranged on the base, a placing rotary disc is arranged at the output end of the driving mechanism and concentrically arranged above the partition plate, the driving mechanism is used for driving the placing rotary disc to rotate and ascend and descend, a plurality of adjusting assemblies are arranged on the placing rotary disc, and fixing mechanisms used for fixing silicon wafers are arranged at the output ends of the adjusting assemblies. According to the utility model, the position and the height of the silicon wafer can be adjusted as required, so that the photoresist removing process is more uniform, the residual photoresist phenomenon is reduced, the subsequent adjustment or repeated processing steps can be reduced by uniform photoresist removing, and the photoresist removing efficiency and the photoresist removing quality are improved.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of plasma glue removers, and in particular to a plasma glue remover with adjustable angle and height. Background Art

[0002] The working principle of the plasma degumming machine is to place the silicon wafer in a vacuum reaction system, introduce a small amount of oxygen, add a high voltage of 1500V, and generate a high-frequency signal from a high-frequency signal generator to form a strong electromagnetic field in the quartz tube, ionize the oxygen, and form a plasma glow column of a mixture of oxygen ions, activated oxygen atoms, oxygen molecules and electrons. Activated oxygen (active atomic oxygen) can quickly oxidize the polyimide film into volatile gas, which is pumped away by a mechanical pump, thus removing the polyimide film on the silicon wafer. The advantages of plasma degumming are simple degumming operation, high degumming efficiency, clean and smooth surface, no scratches, low cost, and environmental protection.

[0003] For example, Chinese patent publication No. CN111804673B discloses a plasma degumming machine, which includes a chassis, wherein a radio frequency power supply, a heating plate, a placement component and an ionization component are sequentially arranged inside the chassis from bottom to top; a vacuuming component for evacuating the interior of the chassis is provided on the left side wall of the chassis, a filtering circulation component for circulating the hot air flow generated in the chassis is provided on the right side wall of the chassis, and an air supply component for supplying air to the interior of the ionization component is provided on the top of the chassis.

[0004] The above application solves the problem that uneven heating will lead to poor degumming effect on the one hand, and on the other hand, a large number of high-energy active particles generated during the ionization process will cause damage to the surface of the wafer, thereby improving the practicality of the plasma degumming machine. However, in the use of the plasma degumming machine in the prior art, it is mostly inconvenient to adjust the angle and height of the placement table of the plasma degumming machine. If the height of the placement table and the position of the silicon wafer cannot be adjusted, the distance between the silicon wafer surface and the plasma will be uneven, resulting in uneven degumming. The thickness of the glue layer at different positions on the silicon wafer may be different, and it is necessary to adjust the position of the silicon wafer to ensure the uniformity of degumming. If the silicon wafer is placed at an incorrect angle, the surface of the silicon wafer may be damaged during the degumming process. For example, the gas pressure generated during plasma treatment may damage the silicon wafer due to uneven force. In addition, for some situations where a specific angle and height are required to achieve the best degumming effect, the inability to adjust the table angle and height may limit the flexibility of the degumming process, and cannot meet all requirements, resulting in poor use of the plasma degumming machine, thereby reducing the practicality of the plasma degumming machine. Utility Model Content

[0005] 1. Technical problems to be solved by the utility model:

[0006] The utility model provides a plasma glue remover with adjustable angle and height, which is used to solve the technical problems existing in the above-mentioned background technology.

[0007] 2. Technical solution:

[0008] To achieve the above-mentioned purpose, the technical solution provided by the utility model is: a plasma degumming machine with adjustable angle and height, comprising a chassis, in which a placement component, an ionization component and an air supply component are arranged in sequence from bottom to top, the placement component comprises a mounting cylinder, in which a parallel bottom plate and a partition are arranged, a driving mechanism is arranged on the bottom plate, a placement turntable is arranged on the output end of the driving mechanism, the placement turntable is concentrically arranged above the partition, the driving mechanism is used to drive the placement turntable to rotate and lift, a plurality of adjustment components are arranged on the placement turntable, a fixing mechanism for fixing the silicon wafer is arranged on the output end of the adjustment component, and the adjustment component is used to adjust the position of the fixing mechanism.

[0009] Preferably, the driving mechanism includes a rotating block rotatably mounted on the base plate, a spline shaft movably mounted in the rotating block through a keyway, the lower end of the spline shaft movably mounted on a connecting block, the upper end of which is movably connected to the placement turntable, the connecting block is connected to the first electric push rod, a second motor is fixedly mounted on the base plate, and the second motor is movably connected to the spline shaft through a second synchronous belt assembly.

[0010] Preferably, the adjustment component includes a mounting frame fixed on the turntable, a screw is rotatably mounted on the mounting frame, a threaded sleeve is threadedly mounted on the screw, a moving block is provided on the threaded sleeve, the fixing mechanism is mounted on the moving block, and both ends of the moving block are connected to the mounting frame via an accordion cover.

[0011] Preferably, a first synchronous belt assembly is provided on the mounting frame, an input end of the first synchronous belt assembly is connected to the motor shaft of the first motor, and an output end of the first synchronous belt assembly is connected to the screw rod.

[0012] Preferably, guide rails are symmetrically arranged on both sides of the mounting frame, and a slider is arranged on the moving block, and the slider is slidably mounted on the guide rails.

[0013] Preferably, two fixing mechanisms are symmetrically arranged, and the fixing mechanism comprises a support frame fixed to the adjustment component, a second electric push rod is fixedly mounted on the support frame, and a clamping block is fixedly mounted on the output end of the second electric push rod.

[0014] Preferably, two guide sleeves are installed on the support frame, and the two guide sleeves are symmetrically arranged on both sides of the second electric push rod. Two guide shafts are fixedly installed on the clamping block, and the guide shafts are slidably installed in the guide sleeves.

[0015] 3. Beneficial effects:

[0016] Compared with the prior art, the technical solution provided by the utility model has the following beneficial effects:

[0017] The utility model drives the placement turntable to rotate and rise and fall through a driving mechanism, and the adjustment component is used to adjust the position of the fixing mechanism, so that the position and height of the silicon wafer can be adjusted as needed. Different silicon wafer surfaces may have uneven glue layer thicknesses. By accurately adjusting the position and height of the silicon wafer, the plasma can contact the silicon wafer surface from different directions, which can make the degumming process more uniform and reduce residual glue. At the same time, the risk of silicon wafer damage caused by plasma impact or gas pressure during the degumming process can be reduced, which helps to protect the surface integrity of the silicon wafer and avoid defects in subsequent processes. Uniform degumming can reduce subsequent adjustments or repeated processing steps, thereby improving the efficiency and quality of degumming.

[0018] The utility model can push or pull the connecting block through the first electric push rod, thereby driving the spline shaft to move up and down in the output end of the second synchronous belt assembly and the rotating block, thereby realizing the lifting and lowering of the placement turntable; the second motor is linked with the spline shaft through the second synchronous belt assembly, thereby driving the placement turntable to rotate. When using this structure, the angle and height of the placement turntable can be adjusted by controlling the movement of the first electric push rod and the second motor. The driving mechanism of the utility model has a compact structure, stable movement, high precision and good reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the placement component structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the internal structure of the installation tube of the utility model;

[0022] Figure 4 It is an enlarged schematic diagram of area A of the utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the rotating disk of the utility model;

[0024] Figure 6 This is a schematic diagram of the structure of the adjustment component of the utility model;

[0025] Figure 7 It is a schematic diagram of the fixing mechanism structure of the utility model.

[0026] Reference numerals:

[0027] 1. Chassis; 2. Placement component; 3. Ionization component; 4. Air supply component; 5. Mounting cylinder; 51. Bottom plate; 52. Partition; 6. Placement turntable; 7. Adjustment component; 71. Mounting frame; 72. Screw; 73. Threaded sleeve; 74. Moving block; 75. First motor; 76. First synchronous belt assembly; 77. Slider; 78. Guide rail; 79. Organ cover; 8. Driving mechanism; 81. Rotating block; 82. Spline shaft; 83. Connecting block; 84. First electric push rod; 85. Second synchronous belt assembly; 86. Second motor; 9. Fixing mechanism; 91. Support frame; 92. Second electric push rod; 93. Clamping block; 94. Guide sleeve; 95. Guide shaft. DETAILED DESCRIPTION

[0028] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "page", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "provided with", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] It should be noted that the structures not introduced in the present invention are not related to the design points and improvement directions of the present invention, and are the same as the prior art or can be implemented by using the prior art, and will not be described in detail here. Example

[0033] Refer to the attached Figures 1 to 7 A plasma degumming machine with adjustable angle and height comprises a chassis 1, in which a placement component 2, an ionization component 3 and an air supply component 4 are arranged in sequence from bottom to top, the placement component 2 comprises a mounting tube 5, in which a parallel bottom plate 51 and a partition plate 52 are arranged, a driving mechanism 8 is arranged on the bottom plate 51, a placement turntable 6 is arranged on the output end of the driving mechanism 8, the placement turntable 6 is concentrically arranged above the partition plate 52, the driving mechanism 8 is used to drive the placement turntable 6 to rotate and rise and fall, a plurality of adjustment components 7 are arranged on the placement turntable 6, a fixing mechanism 9 for fixing a silicon wafer is arranged on the output end of the adjusting component 7, and the adjusting component 7 is used to adjust the position of the fixing mechanism 9.

[0034] The driving mechanism 8 includes a rotating block 81 rotatably mounted on the base plate 51, a spline shaft 82 movably mounted in the rotating block 81 through a keyway, the lower end of the spline shaft 82 is movably mounted on a connecting block 83, the upper end of which is movably connected to the turntable 6, the connecting block 83 is connected to the first electric push rod 84, and a second motor 86 is fixedly mounted on the base plate 51, and the second motor 86 is movably connected to the spline shaft 82 through a second synchronous belt assembly 85.

[0035] The adjustment assembly 7 includes a mounting frame 71 fixed on the rotating disk 6, a screw rod 72 is rotatably mounted on the mounting frame 71, a threaded sleeve 73 is threadedly mounted on the screw rod 72, a moving block 74 is arranged on the threaded sleeve 73, a fixing mechanism 9 is mounted on the moving block 74, and both ends of the moving block 74 are connected to the mounting frame 71 through an accordion cover 79. A first synchronous belt assembly 76 is arranged on the mounting frame 71, an input end of the first synchronous belt assembly 76 is connected to the motor shaft of the first motor 75, and an output end of the first synchronous belt assembly 76 is connected to the screw rod 72. Guide rails 78 are symmetrically arranged on both sides of the mounting frame 71, and a slider 77 is arranged on the moving block 74, and the slider 77 is slidably mounted on the guide rails 78. The design of the guide rails 78 and the slider 77 ensures that the moving block 74 moves smoothly and reduces friction and wear.

[0036] Two fixing mechanisms 9 are symmetrically arranged, and the fixing mechanisms 9 include a support frame 91 fixed on the adjustment assembly 7, a second electric push rod 92 is fixedly mounted on the support frame 91, and a clamping block 93 is fixedly mounted on the output end of the second electric push rod 92. Two guide sleeves 94 are installed on the support frame 91, and the two guide sleeves 94 are symmetrically arranged on both sides of the second electric push rod 92. Two guide shafts 95 are fixedly mounted on the clamping block 93, and the guide shafts 95 are slidably mounted in the guide sleeves 94.

[0037] Working principle:

[0038] The first electric push rod 84 can push or pull the connecting block 83, thereby driving the spline shaft 82 to move up and down in the output end of the second synchronous belt assembly 85 and the rotating block 81, thereby realizing the lifting and lowering of the placement turntable 6; the second motor 86 is linked with the spline shaft 82 through the second synchronous belt assembly 85, thereby driving the placement turntable 6 to rotate. When using this structure, the angle and height of the placement turntable 6 can be adjusted by controlling the movement of the first electric push rod 84 and the second motor 86.

[0039] The first motor 75 is started to drive the screw 72 to rotate through the first synchronous belt assembly 76. The rotation of the screw 72 causes the moving block 74 to move along the guide rail 78 through the threaded sleeve 73, thereby accurately adjusting the position of the component. The fixing mechanism 9 can fix the silicon wafer on the moving block 74.

[0040] Place the silicon wafer to be clamped between the two clamping blocks 93. Start the second electric push rod 92 to extend the piston rod, push the clamping block 93 to move toward the silicon wafer, and thus clamp the silicon wafer. When the silicon wafer needs to be released, the piston rod of the second electric push rod 92 is retracted to drive the clamping block 93 away from the silicon wafer and release the silicon wafer. The cooperation of the guide shaft 95 and the guide sleeve 94 can ensure the smooth and accurate movement of the clamping block 93.

[0041] The placement turntable 6 is driven to rotate and rise and fall by the driving mechanism 8, and the position of the fixing mechanism 9 is adjusted by the adjusting component 7, so that the position and height of the silicon wafer can be adjusted as needed. Different silicon wafer surfaces may have uneven glue layer thickness. By accurately adjusting the position and height of the silicon wafer, the plasma can contact the silicon wafer surface from different directions, which can make the degumming process more uniform and reduce residual glue. At the same time, the risk of silicon wafer damage caused by plasma impact or gas pressure during the degumming process can be reduced, which helps to protect the surface integrity of the silicon wafer and avoid defects in subsequent processes. Uniform degumming can reduce subsequent adjustments or repeated processing steps, thereby improving the efficiency and quality of degumming.

[0042] By adjusting the height of the turntable 6, it is possible to ensure that the distance between the silicon wafer surface and the plasma source of the ionization assembly 3 is evenly distributed. In this way, a more uniform debonding effect can be obtained, avoiding the situation of excessive debonding or insufficient debonding in a local area.

[0043] Adjusting the position of the silicon wafer on the rotating disk 6 can make the plasma fully contact with the surface of the silicon wafer, thereby improving the efficiency of the degumming process, which helps to shorten the degumming time and improve production efficiency.

[0044] Silicon wafers of different sizes and shapes may need to be adjusted differently on the placement turntable 6 to adapt to the working conditions of the plasma stripper. This flexibility can meet diverse production needs and improve the versatility of the equipment.

[0045] Accurately adjusting the height of the turntable 6 and the position of the silicon wafer can evenly distribute the plasma energy on the surface of the silicon wafer, thereby obtaining a better degumming effect. The surface quality of the silicon wafer after degumming is more uniform and clean, which is conducive to the subsequent process.

[0046] Properly adjusting the height of the turntable 6 and the position of the silicon wafer can reduce the risk of excessive etching or damage to the silicon wafer by plasma, which helps to protect the physical structure and electrical properties of the silicon wafer.

[0047] Process optimization and control can be performed by precisely adjusting the parameters of the placement turntable 6. The best placement conditions can be found according to the specific degumming requirements and silicon wafer characteristics to achieve a more accurate and repeatable degumming process.

[0048] The adjustable placement turntable 6 enables the operator to place the silicon wafer in a suitable position more conveniently and to monitor and adjust in real time during the debonding process, which helps to improve the convenience of operation and the controllability of production.

[0049] The above-described embodiments only express a certain implementation method of the utility model, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the patent of the utility model shall be based on the attached claims.

Claims

1. A plasma degumming machine with adjustable angle and height, comprising a chassis (1), characterized in that: The chassis (1) is provided with a placement component (2), an ionization component (3) and an air supply component (4) in order from bottom to top. The placement component (2) comprises a mounting tube (5). A parallel bottom plate (51) and a partition plate (52) are provided in the mounting tube (5). A driving mechanism (8) is provided on the bottom plate (51). A placement turntable (6) is provided on the output end of the driving mechanism (8). The placement turntable (6) is concentrically arranged above the partition plate (52). The driving mechanism (8) is used to drive the placement turntable (6) to rotate and rise and fall. A plurality of adjustment components (7) are provided on the placement turntable (6). A fixing mechanism (9) for fixing a silicon wafer is provided on the output end of the adjustment component (7). The adjustment component (7) is used to adjust the position of the fixing mechanism (9).

2. The plasma degumming machine with adjustable angle and height according to claim 1, characterized in that: The driving mechanism (8) comprises a rotating block (81) rotatably mounted on the base plate (51), a spline shaft (82) being movably mounted in the rotating block (81) via a keyway, the lower end of the spline shaft (82) being movably mounted on a connecting block (83), the upper end of which is movably connected to the placing turntable (6), the connecting block (83) being connected to a first electric push rod (84), a second motor (86) being fixedly mounted on the base plate (51), and the second motor (86) being movably connected to the spline shaft (82) via a second synchronous belt assembly (85).

3. The plasma degumming machine with adjustable angle and height according to claim 1, characterized in that: The adjustment assembly (7) comprises a mounting frame (71) fixed on the placing turntable (6); a screw rod (72) is rotatably mounted on the mounting frame (71); a threaded sleeve (73) is threadedly mounted on the screw rod (72); a moving block (74) is arranged on the threaded sleeve (73); the fixing mechanism (9) is mounted on the moving block (74); and both ends of the moving block (74) are connected to the mounting frame (71) via an accordion cover (79).

4. The plasma degumming machine with adjustable angle and height according to claim 3, characterized in that: A first synchronous belt assembly (76) is arranged on the mounting frame (71), an input end of the first synchronous belt assembly (76) is connected to the motor shaft of the first motor (75), and an output end of the first synchronous belt assembly (76) is connected to the screw rod (72).

5. The plasma degumming machine with adjustable angle and height according to claim 3, characterized in that: Guide rails (78) are symmetrically arranged on both sides of the mounting frame (71), and a sliding block (77) is arranged on the moving block (74), and the sliding block (77) is slidably mounted on the guide rails (78).

6. The plasma degumming machine with adjustable angle and height according to claim 1, characterized in that: Two fixing mechanisms (9) are symmetrically arranged, and the fixing mechanisms (9) comprise a support frame (91) fixed to the adjustment component (7), a second electric push rod (92) being fixedly mounted on the support frame (91), and a clamping block (93) being fixedly mounted on the output end of the second electric push rod (92).

7. The plasma degumming machine with adjustable angle and height according to claim 6, characterized in that: Two guide sleeves (94) are mounted on the support frame (91), and the two guide sleeves (94) are symmetrically arranged on both sides of the second electric push rod (92). Two guide shafts (95) are fixedly mounted on the clamping block (93), and the guide shafts (95) are slidably mounted in the guide sleeves (94).

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