Silicon wafer receiving and sending wafer box device

Abstract

The utility model discloses a silicon wafer receiving and sending wafer box device, which belongs to the field of photovoltaic manufacturing equipment, and comprises a mounting plate, a wafer receiving mechanism, a driving mechanism and a wafer arranging mechanism, the wafer receiving mechanism comprises a first wafer receiving assembly and a second wafer receiving assembly which are arranged in parallel, and the first wafer receiving assembly and the second wafer receiving assembly are used for receiving silicon wafers; the sheet arranging mechanism comprises a first sheet arranging assembly and a second sheet arranging assembly, the first sheet arranging assembly comprises a first sheet arranging plate and a second sheet arranging plate, and the second sheet arranging assembly comprises a third sheet arranging plate and a fourth sheet arranging plate; the driving mechanism is used for driving the first wafer arranging assembly and the second wafer arranging assembly to move oppositely so that the first wafer arranging plate and the third wafer arranging plate can be close to each other to push the silicon wafers, and the second wafer arranging plate and the fourth wafer arranging plate can be close to each other to push the silicon wafers so that the silicon wafers on the first wafer receiving assembly and the second wafer receiving assembly can be aligned. According to the silicon wafer receiving and sending wafer box device, two groups of silicon wafers can be shaped at the same time, the loss of the silicon wafers in the loading and unloading process is reduced, and the productivity of equipment can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic manufacturing equipment, in particular to a silicon wafer box transfer device. Background Art

[0002] As time goes by, the scarcity of fossil energy becomes more and more obvious. Against the background of increasingly tight fossil energy supply, solar energy, as an inexhaustible renewable energy source for mankind, has an important influence in the long-term energy strategy due to its unique full cleanliness, absolute safety, and relative extensiveness. As a typical representative of photovoltaic manufacturing automation equipment, the fully automatic graphite boat loading and unloading machine is used before and after the PECVD process in the production process of solar cells to automatically load silicon wafers into the graphite boat or automatically load silicon wafers in the graphite boat into the wafer basket. It has the characteristics of high automation and production efficiency, reducing contact pollution between manual labor and silicon wafers, and greatly increasing the stability of wafer placement. It is recognized by the industry as a key equipment in the photovoltaic manufacturing industry. The loading and unloading of silicon wafers in the graphite boat requires the storage and shaping of the silicon wafers to correspond to the size of the graphite boat, so as to facilitate loading and unloading and improve efficiency. The silicon wafers in the graphite boat are mostly square wafers. As the technology develops, the size of the silicon wafers increases and the thickness decreases. Since the width of the wafer box is larger than the width of the silicon wafer, the silicon wafer is prone to skew in the wafer box, and the silicon wafer is easily damaged when being taken and placed, which limits the speed of taking and placing and affects efficiency. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a silicon wafer transfer box device, which solves the problem that silicon wafers are easily skewed in the box, silicon wafers are easily damaged when being taken and placed, and the speed of taking and placing is limited, affecting the efficiency.

[0004] A silicon wafer transfer box device according to an embodiment of the utility model includes:

[0005] Mounting plate;

[0006] The chip connection mechanism comprises a first chip connection assembly and a second chip connection assembly arranged in parallel, wherein the first chip connection assembly and the second chip connection assembly are mounted on the mounting plate, the first chip connection assembly is used to connect the first silicon chip, and the second chip connection assembly is used to connect the second silicon chip;

[0007] A driving mechanism, mounted on the mounting plate;

[0008] The whole-piece mechanism includes a first whole-piece component and a second whole-piece component, the first whole-piece component and the second whole-piece component are slidably connected to the mounting plate, the driving mechanism connects the first whole-piece component and the second whole-piece component, the first whole-piece component includes a first whole-piece plate and a second whole-piece plate, the second whole-piece component includes a third whole-piece plate and a fourth whole-piece plate, the second whole-piece plate is located on a side close to the second whole-piece component, and the third whole-piece plate is located on a side close to the first whole-piece component, the driving mechanism is used to drive the first whole-piece component and the second whole-piece component to move toward each other so that the first whole-piece plate and the third whole-piece plate are close to each other to push the first silicon wafer and the second whole-piece plate and the fourth whole-piece plate are close to each other to push the second silicon wafer so as to align the first silicon wafer on the first wafer assembly and the second silicon wafer on the second wafer assembly.

[0009] A silicon wafer transfer box device according to an embodiment of the utility model has at least the following beneficial effects:

[0010] The first wafer assembly receives the first silicon wafer, and the second wafer assembly receives the second silicon wafer, and the two groups of silicon wafers are stored at the same time; the driving mechanism drives the first whole wafer assembly and the second whole wafer assembly to move toward each other, so that the first whole wafer board and the third whole wafer board are close to each other to push the first silicon wafer, and the second whole wafer board and the fourth whole wafer board are close to each other to push the second silicon wafer, so that the first silicon wafer on the first wafer assembly is aligned and the second silicon wafer on the second wafer assembly is aligned, and the two groups of silicon wafers are shaped at the same time, which can ensure the equipment production capacity. The shaped silicon wafers are not easily damaged during placement and removal, which can reduce the loss during the silicon wafer loading and unloading process and improve the equipment production capacity.

[0011] According to some embodiments of the present invention, the first whole-piece assembly includes a first upper connecting plate, a first lower connecting plate, a first mounting bar and a second mounting bar, the first upper connecting plate is connected above the first mounting bar and the second mounting bar, the first lower connecting plate is connected below the first mounting bar and the second mounting bar, the first upper connecting plate is slidably connected to the mounting plate, the first whole-piece plate is mounted on the first mounting bar, and the second whole-piece plate is mounted on the second mounting bar.

[0012] According to some embodiments of the utility model, a first long slot hole is provided on the first whole plate, a first threaded hole is provided on the first mounting bar corresponding to the position of the first long slot hole, a second long slot hole is provided on the second whole plate, and a second threaded hole is provided on the second mounting bar corresponding to the position of the second long slot hole.

[0013] According to some embodiments of the utility model, the silicon wafer transfer box device also includes a sliding mechanism, the sliding mechanism includes a first sliding assembly, the first sliding assembly includes a first guide rail and a first slider, the first guide rail is installed on the mounting plate, the first slider is slidably connected to the first guide rail, and the first upper connecting plate is connected to the first slider.

[0014] According to some embodiments of the utility model, the splicing mechanism includes a first tooth plate, a second tooth plate and an intermediate tooth plate, the mounting plate is connected above the first tooth plate, the second tooth plate and the intermediate tooth plate, the first tooth plate and the second tooth plate are located on both sides of the intermediate tooth plate, the first tooth plate is provided with a plurality of first supporting teeth on a side close to the intermediate tooth plate, the intermediate tooth plate is provided with a plurality of second supporting teeth on a side close to the first tooth plate, the first supporting teeth and the second supporting teeth are used to support a first silicon wafer, the intermediate tooth plate is provided with a plurality of third supporting teeth on a side close to the second tooth plate, the second tooth plate is provided with a plurality of fourth supporting teeth on a side close to the intermediate tooth plate, the third supporting teeth and the fourth supporting teeth are used to support a second silicon wafer, the first tooth plate, the first supporting teeth, the intermediate tooth plate and the second supporting teeth form the first splicing assembly, the second tooth plate, the third supporting teeth, the intermediate tooth plate and the fourth supporting teeth form the second splicing assembly.

[0015] According to some embodiments of the present utility model, the connecting plate mechanism also includes a tooth plate connecting plate, which is connected below the first tooth plate, the second tooth plate and the middle tooth plate. The sliding mechanism also includes a second sliding assembly, which includes a second guide rail and a second slider. The second guide rail is installed on the tooth plate connecting plate, the second slider is slidably connected to the second guide rail, and the first lower connecting plate is connected to the second slider.

[0016] According to some embodiments of the utility model, the silicon wafer transfer box device also includes a limit assembly, the limit assembly includes a first limit block and a second limit block, the first limit block is installed on the mounting plate, the second limit block is installed on the first whole wafer assembly, and the first limit block is used to limit the movement range of the second limit block.

[0017] According to some embodiments of the present invention, a stop screw is threadedly connected to the first limit block, the axial direction of the stop screw is consistent with the moving direction of the second limit block, and the stop screw is located on the moving track of the second limit block.

[0018] According to some embodiments of the present invention, the driving mechanism includes a first driving component and a second driving component, the first driving component is connected to the first whole-piece component, and the second driving component is connected to the second whole-piece component.

[0019] According to some embodiments of the present invention, the first drive assembly includes a first drive cylinder, and the second drive assembly includes a second drive cylinder.

[0020] Additional aspects and advantages of the present invention will be partially presented in the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 The structure of the silicon wafer box device of the utility model is shown as follows Figure 1 ;

[0023] Figure 2 The structure of the silicon wafer box device of the utility model is shown as follows Figure 2 ;

[0024] Figure 3 This is a schematic structural diagram of a first whole wafer assembly of a silicon wafer transfer box device according to an embodiment of the utility model;

[0025] Figure 4 It is a structural schematic diagram of the second whole wafer assembly of the silicon wafer transfer box device according to an embodiment of the utility model;

[0026] Figure 5 This is a schematic structural diagram of the silicon wafer transfer box device of the utility model embodiment after removing the whole wafer mechanism;

[0027] Figure 6 The structure of the silicon wafer box device of the utility model is shown as follows Figure 3 .

[0028] Figure Number:

[0029] 100. Mounting plate;

[0030] 200, splice mechanism; 210, first splice assembly; 220, second splice assembly; 230, first tooth plate; 231, first supporting tooth; 240, second tooth plate; 241, fourth supporting tooth; 250, middle tooth plate; 251, second supporting tooth; 252, third supporting tooth; 260, tooth plate connecting plate;

[0031] 300, driving mechanism; 310, first driving assembly; 311, first driving cylinder; 320, second driving assembly; 321, second driving cylinder;

[0032] 400, whole piece mechanism; 410, first whole piece assembly; 411, first whole piece board; 4111, first long slot hole; 412, second whole piece board; 4121, second long slot hole; 413, first upper connecting plate; 414, first lower connecting plate; 415, first mounting bar; 416, second mounting bar; 420, second whole piece assembly; 421, third whole piece board; 4211, third long slot hole; 422, fourth whole piece board; 4221, fourth long slot hole; 423, second upper connecting plate; 424, second lower connecting plate; 425, third mounting bar; 426, fourth mounting bar;

[0033] 500, sliding mechanism; 510, first sliding assembly; 511, first guide rail; 512, first slider; 513, third slider; 520, second sliding assembly; 521, second guide rail; 522, second slider; 523, fourth slider;

[0034] 600, limit assembly; 610, first limit block; 611, stop screw; 620, second limit block; 630, third limit block;

[0035] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0036] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0037] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] See also Figure 1 , Figure 2 and Figure 3 The present invention provides a wafer transfer box device, comprising a mounting plate 100, a wafer splicing mechanism 200, a driving mechanism 300 and a wafer whole mechanism 400. The wafer splicing mechanism 200 comprises a first wafer splicing assembly 210 and a second wafer splicing assembly 220, the first wafer splicing assembly 210 and the second wafer splicing assembly 220 are arranged side by side along a first direction, the first wafer splicing assembly 210 and the second wafer splicing assembly 220 are mounted on the mounting plate 100, the first wafer splicing assembly 210 is used to receive the first silicon wafer, and the second wafer splicing assembly 220 is used to receive the second silicon wafer. The driving mechanism 300 is mounted on the mounting plate 100, the wafer whole mechanism 400 comprises a first wafer whole assembly 410 and a second wafer whole assembly 420, the first wafer whole assembly 410 and the second wafer whole assembly 420 are slidably connected to the mounting plate 100, and the driving mechanism 300 connects the first wafer whole assembly 410 and the second wafer whole assembly 420. The first whole-piece assembly 410 includes a first whole-piece board 411 and a second whole-piece board 412, and the second whole-piece assembly 420 includes a third whole-piece board 421 and a fourth whole-piece board 422. The second whole-piece board 412 is located near the second whole-piece assembly 420, and the third whole-piece board 421 is located near the first whole-piece assembly 410. The driving mechanism 300 is used to drive the first whole-piece assembly 410 and the second whole-piece assembly 420 to move toward each other along the first direction, so that the first whole-piece board 411 and the third whole-piece board 421 are close to each other to push the first silicon wafer, and the second whole-piece board 412 and the fourth whole-piece board 422 are close to each other to push the second silicon wafer, so that the first silicon wafer on the first wafer assembly 210 is aligned and the second silicon wafer on the second wafer assembly 220 is aligned.

[0040] The first contact assembly 210 receives the first silicon wafer, and the second contact assembly 220 receives the second silicon wafer, and the two groups of silicon wafers are stored at the same time. The driving mechanism 300 drives the first whole wafer assembly 410 and the second whole wafer assembly 420 to move toward each other, so that the first whole wafer board 411 and the third whole wafer board 421 are close to each other to push the first silicon wafer, and the second whole wafer board 412 and the fourth whole wafer board 422 are close to each other to push the second silicon wafer, so that the first silicon wafer on the first contact assembly 210 is aligned and the second silicon wafer on the second contact assembly 220 is aligned. At the same time, the two groups of silicon wafers are shaped, which can ensure the equipment production capacity. The shaped silicon wafers are not easily damaged during placement and removal, which can reduce the loss during the loading and unloading of silicon wafers and improve the equipment production capacity.

[0041] In some embodiments, see Figure 1 , Figure 2 , Figure 3 and Figure 4 The first whole piece assembly 410 includes a first upper connecting plate 413, a first lower connecting plate 414, a first mounting bar 415, and a second mounting bar 416. The first upper connecting plate 413 is connected above the first mounting bar 415 and the second mounting bar 416, the first lower connecting plate 414 is connected below the first mounting bar 415 and the second mounting bar 416, the first upper connecting plate 413 is slidably connected to the mounting plate 100, the first whole piece 411 is mounted on the first mounting bar 415, and the second whole piece 412 is mounted on the second mounting bar 416. The first whole piece assembly 410 is in a frame structure as a whole, and the frame structure is more stable.

[0042] The second whole piece assembly 420 includes a second upper connecting plate 423, a second lower connecting plate 424, a third mounting bar 425, and a fourth mounting bar 426. The second upper connecting plate 423 is connected above the third mounting bar 425 and the fourth mounting bar 426, the second lower connecting plate 424 is connected below the third mounting bar 425 and the fourth mounting bar 426, the second upper connecting plate 423 is slidably connected to the mounting plate 100, the third whole piece 421 is mounted on the third mounting bar 425, and the fourth whole piece 422 is mounted on the fourth mounting bar 426. The second whole piece assembly 420 is in a frame structure as a whole, and the frame structure is more stable.

[0043] In some embodiments, see Figure 1 , Figure 2 , Figure 3 and Figure 4, there are two first whole plates 411, and two second whole plates 412. The two first whole plates 411 are connected to both sides of the splicing mechanism 200 along the second direction, and the two second whole plates 412 are connected to both sides of the splicing mechanism 200 along the second direction. There are two third whole plates 421, and two fourth whole plates 422 are connected to both sides of the splicing mechanism 200 along the second direction. The two first whole plates 411 and the two third whole plates 421 can push the first silicon wafer at the same time, ensuring that the silicon wafer is pushed more smoothly. The two second whole plates 412 and the two fourth whole plates 422 can push the second silicon wafer at the same time, ensuring that the silicon wafer is pushed more smoothly.

[0044] The third direction is the up-down direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0045] In some embodiments, see Figure 1 , Figure 2 , Figure 3 and Figure 4 , a first long slot hole 4111 is provided on the first whole plate 411, the length direction of the first long slot hole 4111 is the first direction, and a first threaded hole is provided on the first mounting bar 415 at a position corresponding to the first long slot hole 4111. A second long slot hole 4121 is provided on the second whole plate 412, the length direction of the second long slot hole 4121 is the first direction, and a second threaded hole is provided on the second mounting bar 416 at a position corresponding to the second long slot hole 4121. The first whole plate 411 is connected to the first mounting bar 415 by screws, and the first long slot hole 4111 is provided, so as to facilitate the adjustment of the position of the first whole plate 411 on the first mounting bar 415. The second whole plate 412 is connected to the second mounting bar 416 by screws, and the second long slot hole 4121 is provided, so as to facilitate the adjustment of the position of the second whole plate 412 on the second mounting bar 416.

[0046] The third whole plate 421 is provided with a third long slot hole 4211, the length direction of the third long slot hole 4211 is the first direction, and the third mounting bar 425 is provided with a third threaded hole at a position corresponding to the third long slot hole 4211. The fourth whole plate 422 is provided with a fourth long slot hole 4221, the length direction of the fourth long slot hole 4221 is the first direction, and the fourth mounting bar 426 is provided with a fourth threaded hole at a position corresponding to the fourth long slot hole 4221. The third whole plate 421 is connected to the third mounting bar 425 by screws, and the third long slot hole 4211 is provided, so as to facilitate the adjustment of the position of the third whole plate 421 on the third mounting bar 425. The fourth whole plate 422 is connected to the fourth mounting bar 426 by screws, and the fourth long slot hole 4221 is provided, so as to facilitate the adjustment of the position of the fourth whole plate 422 on the fourth mounting bar 426.

[0047] In some embodiments, see Figure 2 , Figure 3 , Figure 4 and Figure 5 The silicon wafer transfer box device further includes a sliding mechanism 500, which includes a first sliding assembly 510, and the first sliding assembly 510 includes a first guide rail 511 and a first slider 512. The first guide rail 511 is mounted on the mounting plate 100, the first slider 512 is slidably connected to the first guide rail 511, and the first upper connecting plate 413 is connected to the first slider 512. The first sliding assembly 510 also includes a third slider 513, the third slider 513 is slidably connected to the first guide rail 511, and the second upper connecting plate 423 is connected to the third slider 513. The first sliding assembly 510 is provided so that the first whole wafer assembly 410 and the second whole wafer assembly 420 move toward each other more smoothly.

[0048] In some embodiments, see Figure 2 , Figure 3 , Figure 4 and Figure 5 The splicing mechanism 200 includes a first tooth plate 230, a second tooth plate 240 and an intermediate tooth plate 250. The mounting plate 100 is connected above the first tooth plate 230, the second tooth plate 240 and the intermediate tooth plate 250, and the first tooth plate 230 and the second tooth plate 240 are located on both sides of the intermediate tooth plate 250. A plurality of first supporting teeth 231 are provided on the side of the first tooth plate 230 close to the intermediate tooth plate 250, and a plurality of second supporting teeth 251 are provided on the side of the intermediate tooth plate 250 close to the first tooth plate 230. The first supporting teeth 231 and the second supporting teeth 251 are used to support the first silicon wafer. One end of the first silicon wafer is inserted between two adjacent first supporting teeth 231, and the other end of the first silicon wafer is inserted between two adjacent second supporting teeth 251. This allows multiple first silicon wafers to be stably placed between the first tooth plate 230 and the intermediate tooth plate 250.

[0049] A plurality of third supporting teeth 252 are provided on one side of the middle tooth plate 250 close to the second tooth plate 240, and a plurality of fourth supporting teeth 241 are provided on one side of the second tooth plate 240 close to the middle tooth plate 250. The third supporting teeth 252 and the fourth supporting teeth 241 are used to support the second silicon wafer. One end of the second silicon wafer is inserted between two adjacent third supporting teeth 252, and the other end of the second silicon wafer is inserted between two adjacent fourth supporting teeth 241. Therefore, the plurality of second silicon wafers can be stably placed between the second tooth plate 240 and the middle tooth plate 250.

[0050] The first tooth plate 230 , the first supporting teeth 231 , the middle tooth plate 250 and the second supporting teeth 251 form a first splice assembly 210 , and the second tooth plate 240 , the third supporting teeth 252 , the middle tooth plate 250 and the fourth supporting teeth 241 form a second splice assembly 220 .

[0051] In some embodiments, see Figure 2 , Figure 3 , Figure 4 and Figure 5 , the splice mechanism 200 further includes a tooth plate connecting plate 260, which is connected to the lower part of the first tooth plate 230, the second tooth plate 240 and the middle tooth plate 250, so that the overall structure of the splice mechanism 200 is relatively stable. The sliding mechanism 500 further includes a second sliding assembly 520, which includes a second guide rail 521, a second slider 522 and a fourth slider 523. The second guide rail 521 is installed on the tooth plate connecting plate 260, the second slider 522 is slidably connected to the second guide rail 521, and the first lower connecting plate 414 is connected to the second slider 522. The fourth slider 523 is slidably connected to the second guide rail 521, and the second lower connecting plate 424 is connected to the second slider 522. The upper end of the whole piece mechanism 400 is connected to the first sliding assembly 510, and the lower end is connected to the second sliding assembly 520, so that the first whole piece assembly 410 and the second whole piece assembly 420 move toward each other more smoothly.

[0052] In some embodiments, see Figure 1 , Figure 2 , Figure 5 and Figure 6 The silicon wafer transfer box device further includes a limit assembly 600, which includes a first limit block 610, a second limit block 620, and a third limit block 630. The first limit block 610 is mounted on the mounting plate 100, the second limit block 620 is mounted on the first whole wafer assembly 410, and the third limit block 630 is mounted on the second whole wafer assembly 420. The first limit block 610 is used to limit the movement range of the second limit block 620 and the third limit block 630. The first limit block 610, the second limit block 620, and the third limit block 630 are provided to limit the movement range of the first whole wafer assembly 410 and the second whole wafer assembly 420, so as to prevent the first whole wafer assembly 410 and the second whole wafer assembly 420 from causing damage to the silicon wafer.

[0053] In some embodiments, see Figure 1 , Figure 2 , Figure 5 and Figure 6 The first limit block 610 is threadedly connected with a stop screw 611, the axial direction of the stop screw 611 is consistent with the moving direction of the second limit block 620, and the stop screw 611 is located on the moving track of the second limit block 620. The axial direction of the stop screw 611 is consistent with the moving direction of the third limit block 630, and the stop screw 611 is located on the moving track of the third limit block 630. By adjusting the length of the stop screw 611 extending from the first limit block 610, the moving range of the second limit block 620 and the third limit block 630 can be adjusted.

[0054] In some embodiments, see Figure 1 , Figure 2 , Figure 5 and Figure 6 A buffer pad is provided on the stop screw 611 to prevent the stop screw 611 from directly colliding with the second limit block 620 or the third limit block 630.

[0055] In some embodiments, see Figure 1 , Figure 2 , Figure 5 and Figure 6 The driving mechanism 300 includes a first driving assembly 310 and a second driving assembly 320. The first driving assembly 310 is connected to the first whole piece assembly 410, and the second driving assembly 320 is connected to the second whole piece assembly 420. The first driving assembly 310 can drive the first whole piece assembly 410 to move, and the second driving assembly 320 can drive the second whole piece assembly 420 to move.

[0056] In some embodiments, see Figure 1 , Figure 2 , Figure 5 and Figure 6 The first driving assembly 310 includes a first driving cylinder 311, and the second driving assembly 320 includes a second driving cylinder 321. The first driving assembly 310 can also be a motor screw module, and the second driving assembly 320 can also be a motor screw module.

[0057] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A silicon wafer transfer box device, characterized in that: include: Mounting plate; The chip connection mechanism comprises a first chip connection assembly and a second chip connection assembly arranged in parallel, wherein the first chip connection assembly and the second chip connection assembly are mounted on the mounting plate, the first chip connection assembly is used to connect the first silicon chip, and the second chip connection assembly is used to connect the second silicon chip; A driving mechanism, mounted on the mounting plate; The whole-piece mechanism includes a first whole-piece component and a second whole-piece component, the first whole-piece component and the second whole-piece component are slidably connected to the mounting plate, the driving mechanism connects the first whole-piece component and the second whole-piece component, the first whole-piece component includes a first whole-piece plate and a second whole-piece plate, the second whole-piece component includes a third whole-piece plate and a fourth whole-piece plate, the second whole-piece plate is located on a side close to the second whole-piece component, and the third whole-piece plate is located on a side close to the first whole-piece component, the driving mechanism is used to drive the first whole-piece component and the second whole-piece component to move toward each other so that the first whole-piece plate and the third whole-piece plate are close to each other to push the first silicon wafer and the second whole-piece plate and the fourth whole-piece plate are close to each other to push the second silicon wafer so as to align the first silicon wafer on the first wafer assembly and the second silicon wafer on the second wafer assembly.

2. A silicon wafer transfer box device according to claim 1, characterized in that: The first whole-piece assembly includes a first upper connecting plate, a first lower connecting plate, a first mounting bar and a second mounting bar, the first upper connecting plate is connected above the first mounting bar and the second mounting bar, the first lower connecting plate is connected below the first mounting bar and the second mounting bar, the first upper connecting plate is slidably connected to the mounting plate, the first whole-piece plate is mounted on the first mounting bar, and the second whole-piece plate is mounted on the second mounting bar.

3. A silicon wafer transfer box device according to claim 2, characterized in that: A first long slot hole is provided on the first whole plate, a first threaded hole is provided on the first mounting bar at a position corresponding to the first long slot hole, a second long slot hole is provided on the second whole plate, and a second threaded hole is provided on the second mounting bar at a position corresponding to the second long slot hole.

4. The silicon wafer transfer box device according to claim 2, characterized in that: It also includes a sliding mechanism, which includes a first sliding component, and the first sliding component includes a first guide rail and a first slider. The first guide rail is installed on the mounting plate, the first slider is slidably connected to the first guide rail, and the first upper connecting plate is connected to the first slider.

5. The silicon wafer transfer box device according to claim 4, characterized in that: The splicing mechanism includes a first tooth plate, a second tooth plate and an intermediate tooth plate, the mounting plate is connected above the first tooth plate, the second tooth plate and the intermediate tooth plate, the first tooth plate and the second tooth plate are located on both sides of the intermediate tooth plate, the first tooth plate is provided with a plurality of first supporting teeth on a side close to the intermediate tooth plate, the intermediate tooth plate is provided with a plurality of second supporting teeth on a side close to the first tooth plate, the first supporting teeth and the second supporting teeth are used to support a first silicon wafer, the intermediate tooth plate is provided with a plurality of third supporting teeth on a side close to the second tooth plate, the second tooth plate is provided with a plurality of fourth supporting teeth on a side close to the intermediate tooth plate, the third supporting teeth and the fourth supporting teeth are used to support a second silicon wafer, the first tooth plate, the first supporting teeth, the intermediate tooth plate and the second supporting teeth form the first splicing assembly, the second tooth plate, the third supporting teeth, the intermediate tooth plate and the fourth supporting teeth form the second splicing assembly.

6. The silicon wafer transfer box device according to claim 5, characterized in that: The connecting plate mechanism also includes a tooth plate connecting plate, which is connected below the first tooth plate, the second tooth plate and the middle tooth plate. The sliding mechanism also includes a second sliding assembly, which includes a second guide rail and a second slider. The second guide rail is installed on the tooth plate connecting plate, and the second slider is slidably connected to the second guide rail. The first lower connecting plate is connected to the second slider.

7. The silicon wafer transfer box device according to claim 1, characterized in that: It also includes a limit assembly, which includes a first limit block and a second limit block. The first limit block is installed on the mounting plate, and the second limit block is installed on the first whole piece assembly. The first limit block is used to limit the movement range of the second limit block.

8. The silicon wafer transfer box device according to claim 7, characterized in that: A stop screw is threadedly connected to the first limit block, the axial direction of the stop screw is consistent with the moving direction of the second limit block, and the stop screw is located on the moving track of the second limit block.

9. The silicon wafer transfer box device according to claim 1, characterized in that: The driving mechanism includes a first driving assembly and a second driving assembly, wherein the first driving assembly is connected to the first whole-piece assembly, and the second driving assembly is connected to the second whole-piece assembly.

10. The silicon wafer transfer box device according to claim 9, characterized in that: The first drive assembly includes a first drive cylinder, and the second drive assembly includes a second drive cylinder.

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