Silicon wafer transmission device

Abstract

The utility model relates to a silicon wafer conveying device which comprises a material washing pool. The first-stage conveying belt is arranged in the material washing pool; the second-stage conveying belt comprises a bearing section close to the tail end of the first-stage conveying belt and a feeding section extending out of the material washing pool upwards, the conveying direction of the bearing section is perpendicular to the conveying direction of the first-stage conveying belt, and a negative pressure hole is formed in the second-stage conveying belt; and the slicing nozzle is perpendicular to the conveying direction of the first-stage conveying belt, is connected with a water pump and points to the tail end of the first-stage conveying belt. No human intervention is needed in the process from cleaning to feeding, automatic transfer is carried out, the automation degree is improved, and the damage rate of silicon wafers is reduced. In addition, the wafer separating mechanism separates the attached silicon wafers by spraying liquid impact, the silicon wafers soaked in the material washing pool are separated by liquid impact, the silicon wafers can be effectively protected while the silicon wafers are separated, and the damage rate of the silicon wafers is further reduced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, in particular to a silicon wafer transmission device. Background Art

[0002] Silicon wafers are thin flat sheets made of high-purity polycrystalline silicon. They are important raw materials in semiconductor manufacturing and are widely used in many fields. As technology advances, the thickness of silicon wafers has gradually become thinner to adapt to technological advances and emerging devices.

[0003] Thin silicon wafers have low strength and are easily damaged, and the production process is more demanding. Before processing thin silicon wafers, they need to be cleaned with a specific cleaning agent, and only after cleaning can they be loaded and processed. During the cleaning and loading process, the silicon wafers need to be transported many times, and the silicon wafers are easily damaged during the transportation process. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a silicon wafer transmission device to reduce the damage rate of silicon wafers during the cleaning and loading process.

[0005] To achieve the above purpose, the technical solution of the utility model is as follows:

[0006] A silicon wafer transmission device, comprising: a material washing tank; a primary conveyor belt arranged in the material washing tank; a secondary conveyor belt, comprising a receiving section near the end of the primary conveyor belt and a feeding section extending upward from the material washing tank, wherein the conveying direction of the receiving section is perpendicular to the conveying direction of the primary conveyor belt, and a negative pressure hole is arranged on the secondary conveyor belt. A slicing nozzle is perpendicular to the conveying direction of the primary conveyor belt, the slicing nozzle is connected to a water pump, and the slicing nozzle points to the end of the primary conveyor belt.

[0007] Compared with the prior art, the beneficial technical effects of the utility model are as follows:

[0008] (1) The silicon wafer transmission device of the utility model is provided with a primary conveyor belt in the material washing tank, and the silicon wafers are moved and washed in the material washing tank along the primary conveyor belt. A secondary conveyor belt is also provided, and a slicing mechanism is provided between the primary conveyor belt and the secondary conveyor belt. The slicing mechanism separates the silicon wafers that are bonded together, and the separated single silicon wafers are then moved to the next processing step along the receiving section and the feeding section of the secondary conveyor belt. No human intervention is required from the cleaning to the feeding process, and the transfer is automatically performed, thereby improving the degree of automation and reducing the damage rate of silicon wafers. The slicing mechanism separates the bonded silicon wafers by spraying liquid impact, and the silicon wafers immersed in the material washing tank are separated by the impact of the liquid. While separating the silicon wafers, the silicon wafers can be effectively protected, further reducing the damage rate of the silicon wafers.

[0009] (2) Furthermore, a synchronous belt is provided on the side of the primary conveyor belt, which resists and supports the silicon wafer on the primary conveyor belt to prevent the silicon wafer from shifting and ensure that the silicon wafer is accurately transferred to the secondary conveyor belt.

[0010] (3) Furthermore, a duckbill nozzle is provided to point toward the secondary conveyor belt. When the duckbill nozzle sprays and rinses the silicon wafers on the secondary conveyor belt, the impact force firmly fixes the silicon wafers on the surface of the secondary conveyor belt to prevent the silicon wafers from falling off the secondary conveyor belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A three-dimensional structural schematic diagram of a silicon wafer transmission device provided by an embodiment of the utility model is shown.

[0012] Markings in the accompanying drawings:

[0013] 1. Material washing tank; 2. Primary conveyor belt; 21. Support roller; 22. Conveyor belt bracket; 23. Adjustment slot; 3. Synchronous belt; 31. Synchronous belt bracket; 4. Slicing nozzle; 5. Duckbill nozzle; 6. Secondary conveyor belt; 61. Feeding section; 62. Receiving section; 7. Synchronous roller; 8. Leveling roller; 9. Silicon wafer. DETAILED DESCRIPTION

[0014] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the attached drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the attached drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no technical substantive significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model.

[0015] In the description of the present invention, the orientations or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0016] Figure 1 The three-dimensional structure diagram of the silicon wafer transmission device provided by the embodiment of the utility model is shown. Figure 1A silicon wafer transmission device includes a washing tank 1, which contains a specific chemical solution for chemically corroding and cleaning silicon wafers 9. A primary conveyor belt 2 is arranged in the washing tank 1, and the bonded silicon wafers 9 are arranged perpendicular to the primary conveyor belt 2. The silicon wafers 9 move along the primary conveyor belt 2 in the washing tank 1 and are cleaned. A secondary conveyor belt 6 includes a receiving section 62 near the end of the primary conveyor belt 2 and a feeding section 61 extending upward from the washing tank 1. The conveying direction of the receiving section 62 is perpendicular to the conveying direction of the primary conveyor belt 2. A negative pressure hole (not shown in the figure) is provided on the secondary conveyor belt 6, and the negative pressure hole is connected to a negative pressure machine (not shown in the figure). A slicing nozzle 4 is perpendicular to the conveying direction of the primary conveyor belt 2. The slicing nozzle 4 is connected to a water pump (not shown in the figure), and the slicing nozzle 4 points to the end of the primary conveyor belt 2. No human intervention is required in the process from washing to feeding, and the transfer is automatically performed, thereby improving the degree of automation and reducing the damage rate of silicon wafers 9. The separating mechanism separates the bonded silicon wafers 9 by spraying liquid impact, and the silicon wafers 9 immersed in the washing tank 1 are separated by the impact of the liquid. While separating the silicon wafers 9, the silicon wafers 9 can be effectively protected, and the damage rate of the silicon wafers 9 is further reduced.

[0017] The specific structures of the conveyor belt support 22, the duckbill nozzle 5, the synchronous roller 7 and the leveling roller 8 are described below:

[0018] Please refer to Figure 1 The primary conveyor belt 2 and the secondary conveyor belt 6 are installed on a conveyor belt support 22. The conveyor belt support 22 is provided with a long strip adjustment groove 23. The conveyor belt support 22 is connected to the roller 21 through the adjustment groove 23. The position of the roller 21 can be easily adjusted along the adjustment groove 23, thereby adjusting the conveyor belt. A duckbill nozzle 5 is also included. The duckbill nozzle 5 is vertical and points to the conveying surface of the secondary conveyor belt 6. While the duckbill nozzle 5 sprays and further rinses the silicon wafer 9 on the secondary conveyor belt 6, the impact force firmly fixes the silicon wafer 9 on the surface of the secondary conveyor belt 6, preventing the silicon wafer 9 from detaching from the secondary conveyor belt 6, and enhancing the stability of the transportation of the silicon wafer 9. A synchronous roller 7 is also included. The synchronous roller 7 is close to the conveying surface of the receiving section 62 and abuts against the silicon wafer 9 on the surface of the receiving section 62. Ensure that the silicon wafer 9 is close to the conveyor belt of the receiving section 62 to prevent the silicon wafer 9 from falling from the receiving section 62. A leveling roller 8 is also included. The leveling roller 8 is arranged above the primary conveyor belt 2 and abuts against the silicon wafer 9 on the primary conveyor belt 2. Ensure that the silicon wafers 9 on the primary conveyor belt 2 are highly aligned to facilitate subsequent transfer of the silicon wafers 9 to the secondary conveyor belt 6 .

[0019] The specific structure of the synchronous belt 3 is described below:

[0020] Please refer to Figure 1A synchronous belt 3 is also provided on the side of the primary conveyor belt 2. The synchronous belt 3 supports the silicon wafer 9 on the primary conveyor belt 2 to prevent the silicon wafer 9 from shifting and ensure that the silicon wafer 9 is accurately transferred to the secondary conveyor belt 6. Two synchronous belts 3 are provided, and the two synchronous belts 3 are provided on both sides of the primary conveyor belt 2 to support both sides of the silicon wafer 9 at the same time. A long strip-shaped adjustment groove 23 is provided on the synchronous belt bracket 31 on which the synchronous belt 3 is installed, and the synchronous belt bracket 31 is connected to the roller 21 through the adjustment groove 23. It is convenient to adjust the tightness of the synchronous belt 3.

[0021] The specific working process of the utility model is as follows:

[0022] The operator places the bonded silicon wafers 9 group on the primary conveyor belt 2 through the loading device, and the primary conveyor belt 2 transports the silicon wafers 9 group to move in the washing tank 1, chemically corroding and cleaning the silicon wafers 9. When the silicon wafers 9 move to the end of the primary conveyor belt 2, the slicing nozzle 4 sprays the side of the silicon wafers 9 group, and under the impact of the liquid, the bonded silicon wafers 9 are separated. The primary conveyor belt 2 continues to transport the separated silicon wafers 9 until the separated silicon wafers 9 approach the receiving section 62 of the secondary conveyor belt 6. The negative pressure holes on the receiving section 62 absorb the approaching single silicon wafer 9 on the surface, and transport the silicon wafer 9 along the feeding section 61 and the receiving section 62, and move out of the washing tank 1 to the processing device of the next process.

[0023] It can be seen that the above-mentioned silicon wafer transmission device does not require human intervention in the process from cleaning to feeding, and automatically transfers, thereby improving the degree of automation and reducing the damage rate of silicon wafers 9. In addition, the wafer separation mechanism separates the bonded silicon wafers 9 by spraying liquid impact, and the silicon wafers 9 immersed in the washing tank 1 are separated by the impact of the liquid. While separating the silicon wafers 9, the silicon wafers 9 can be effectively protected, further reducing the damage rate of the silicon wafers 9.

[0024] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0025] The above embodiments only express several implementation methods of the utility model, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A silicon wafer transfer device, characterized in that: include, washing basin; A primary conveyor belt is arranged in the material washing tank; A secondary conveyor belt, comprising a receiving section near the end of the primary conveyor belt and a feeding section extending upward from the material washing pool, wherein the conveying direction of the receiving section is perpendicular to the conveying direction of the primary conveyor belt, and a negative pressure hole is provided on the secondary conveyor belt; The slicing nozzle is perpendicular to the conveying direction of the primary conveyor belt, the slicing nozzle is connected to a water pump, and the slicing nozzle points to the end of the primary conveyor belt.

2. The silicon wafer transfer device according to claim 1, wherein: The primary conveyor belt and the secondary conveyor belt are installed on a conveyor belt bracket. A long strip-shaped adjustment groove is provided on the conveyor belt bracket, and the conveyor belt bracket is connected to the roller via the adjustment groove.

3. The silicon wafer transfer device according to claim 1, wherein: A synchronous belt is also arranged on the side of the primary conveyor belt.

4. The silicon wafer transfer device according to claim 3, wherein: Two synchronous belts are provided, and the two synchronous belts are arranged on both sides of the primary conveyor belt.

5. The silicon wafer transfer device according to claim 3, wherein: A long strip-shaped adjusting groove is provided on a synchronous belt bracket for installing the synchronous belt, and the synchronous belt bracket is connected to the roller via the adjusting groove.

6. The silicon wafer transfer device according to claim 1, wherein: Also included is a duckbill nozzle, which is vertical and directed toward the conveying surface of the secondary conveyor belt.

7. The silicon wafer transfer device according to claim 1, wherein: It also includes a synchronous roller, which is close to the conveying surface of the receiving section and presses against the silicon wafer on the surface of the receiving section.

8. The silicon wafer transfer device according to claim 1, wherein: It also includes a leveling roller, which is arranged above the primary conveyor belt and presses against the silicon wafer on the primary conveyor belt.

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