Silicon wafer cleaning auxiliary device and cleaning equipment
By designing a silicon wafer cleaning auxiliary device that can be installed on the shaft of the cleaning equipment, the raised structure drives the silicon wafer to rotate, solving the problem of incomplete cleaning caused by the static silicon wafer, and achieving a more efficient silicon wafer cleaning effect.
Patent Information
- Application Number
- CN202421476733.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-06-26
AI Technical Summary
During the cleaning process of silicon wafers, due to the stationary silicon wafer, the part in contact with the sheet basket cannot fully contact the liquid in the cleaning tank, resulting in a decrease in cleaning capacity and unsatisfactory effect.
A silicon wafer cleaning auxiliary device is designed, including a main body with a polygonal cross-section, extending along the sides of the main body to form a raised structure, which can be installed on the shaft of the cleaning equipment, and by rotating, the protruding structure contacts the silicon wafer to fully contact the liquid in the cleaning tank.
Through the use of silicon wafer cleaning auxiliary devices, the silicon wafer rotates in conjunction with the process of lifting and falling, and can fully contact the liquid in the cleaning tank, avoid cleaning dead corners, and improve the cleaning ability and efficiency of the silicon wafer.
Smart Images
Figure CN222720402U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning auxiliary device and cleaning equipment. Background Art
[0002] With the development of large-scale integrated circuits and the continuous improvement of integration, the quality requirements for semiconductor silicon wafers are becoming higher and higher. Since the surface quality of semiconductor silicon wafers has a great influence on the performance of the device, semiconductor silicon wafers need to be cleaned after wire cutting, chamfering, grinding, etching and annealing in the production process. However, since different processes have different cleaning requirements for silicon wafers, the cleaning methods and technical means used after different processes are also different.
[0003] For cleaning of silicon wafers after grinding, the wafer basket containing silicon wafers is generally placed in a cleaning tank with cleaning solution, and the silicon wafers are immersed in the cleaning solution. However, since the silicon wafer is stationary during the cleaning process, the part in contact with the wafer basket cannot fully contact the solution in the cleaning tank, resulting in a decrease in the cleaning ability of the contact part between the silicon wafer and the wafer basket, and the cleaning effect is not ideal. In the current integrated circuit production, if the silicon wafer is not cleaned thoroughly, all the silicon wafers may be scrapped, or the manufactured devices may have poor performance, stability and reliability.
[0004] Therefore, there is an urgent need for a silicon wafer cleaning auxiliary device and a cleaning equipment to solve the above technical problems. Utility Model Content
[0005] The purpose of the utility model is to provide a silicon wafer cleaning auxiliary device and cleaning equipment to solve the technical problem in the prior art that the silicon wafer is stationary during the cleaning process, so that the part of the silicon wafer in contact with the wafer basket cannot fully contact the liquid in the cleaning tank, resulting in a decrease in the cleaning ability of the part of the silicon wafer in contact with the wafer basket and an unsatisfactory cleaning effect. The preferred technical solution among the many technical solutions provided by the utility model can produce many technical effects as described below.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] The utility model provides a silicon wafer cleaning auxiliary device, comprising a main body with a polygonal cross section, wherein:
[0008] Protruding structures are formed along at least two sides of the main body extending toward the outside of the main body, wherein the length of the protruding structures is not less than 2 / 3 of the length of the side where the protruding structures are located, and the width of the protruding structures is not more than 1 / 2 of the length of the side where the protruding structures are located;
[0009] A containing structure is arranged inside the main body, and the containing structure is used to contain a rotating shaft, and the rotating shaft can drive the main body to rotate.
[0010] Preferably, arc chamfers are provided at the corners of the protruding structures.
[0011] Preferably, anti-slip grooves are provided on the surface of the raised structure.
[0012] Preferably, the anti-slip pattern is a cross pattern.
[0013] Preferably, the cross section of the body is a regular polygon, wherein:
[0014] The two protruding structures form a group, and the protruding structures of one group are arranged on two opposite sides of the main body.
[0015] Preferably, the cross-section of the main body is a regular octagonal structure, and the protruding structures are arranged in two groups, and the two groups of protruding structures are in a "cross" shape.
[0016] Preferably, the main body comprises a first main body and a second main body which are centrally symmetrical, wherein:
[0017] The first main body is provided with a first connecting structure for fixedly connecting with the rotating shaft;
[0018] The second main body is provided with a second connection structure for fixedly connecting with the rotating shaft.
[0019] The utility model provides a silicon wafer cleaning device, comprising a cleaning device body and the above-mentioned silicon wafer cleaning auxiliary device, wherein the silicon wafer cleaning auxiliary device can be installed on the cleaning device body.
[0020] Preferably, the cleaning equipment body comprises at least a cleaning tank for accommodating a wafer basket and a power device, a rotating shaft transmission-connected to the power device is arranged in the cleaning tank, the silicon wafer cleaning auxiliary device is mounted on the rotating shaft, and the rotating shaft is located at the bottom of the wafer basket.
[0021] Preferably, the maximum width of the silicon wafer cleaning auxiliary device is smaller than the bottom opening of the wafer basket, and the height of the protruding structure is no greater than 1 / 2 of the depth of the wafer basket.
[0022] The utility model provides a silicon wafer cleaning auxiliary device and cleaning equipment. The silicon wafer cleaning auxiliary device includes a main body with a polygonal cross section, and protruding structures are formed along at least two sides of the main body extending to the outside of the main body. The silicon wafer cleaning auxiliary device can be installed on a rotating shaft set in a cleaning tank of the cleaning equipment, and is located at the bottom of a slice basket. When in use, the rotation of the rotating shaft drives the silicon wafer cleaning auxiliary device to rotate. During the rotation of the silicon wafer cleaning auxiliary device, when the protruding structure set on the main body rotates to contact with the silicon wafer in the slice basket, the protruding structure can lift the silicon wafer. When the protruding structure rotates to contact with the silicon wafer, the silicon wafer falls, and during the rotation of the protruding structure, the protruding structure can drive the silicon wafer to rotate, so that the silicon wafer rotates in coordination during the rise and fall process, so as to achieve the effect that the silicon wafer fully contacts the liquid in the cleaning tank, avoid the silicon wafer cleaning dead corner, and improve the cleaning ability of the silicon wafer. With the reasonable size setting of the protruding structure, the silicon wafer cleaning auxiliary device can be adapted to a variety of silicon wafers of different specifications and shapes, and has stronger applicability. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0024] Figure 1 This is a structural schematic diagram of an embodiment of the silicon wafer cleaning auxiliary device of the utility model;
[0025] Figure 2 yes Figure 1 Main view structure diagram;
[0026] Figure 3 yes Figure 2 AA cross-sectional structural diagram;
[0027] Figure 4 This is a schematic diagram of the structure of the anti-slip pattern in the silicon wafer cleaning auxiliary device of the utility model;
[0028] Figure 5 It is a schematic diagram of the exploded structure of the main body of the silicon wafer cleaning auxiliary device of the utility model;
[0029] Figure 6 It is a structural schematic diagram of an embodiment of the silicon wafer cleaning equipment of the utility model.
[0030] In the figure: 10, main body; 11, first main body; 12, second main body; 101, side; 102, raised structure; 1021, anti-slip pattern; 103, accommodating structure; 110, first connecting structure; 120, second connecting structure;
[0031] 20. cleaning tank; 201. rotating shaft; 202. power device;
[0032] 30. Basket;
[0033] 40. Silicon wafer. DETAILED DESCRIPTION
[0034] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the utility model.
[0035] Embodiment 1
[0036] Figure 1 Schematic diagram of the structure of this embodiment. Figure 1 As shown, this embodiment provides a silicon wafer cleaning auxiliary device, including a main body 10 with a polygonal cross section, and protruding structures 102 extending toward the outside of the main body 10 along at least two side edges 101 of the main body 10. The silicon wafer cleaning auxiliary device in this embodiment can be installed on a rotating shaft 201 set in a cleaning tank 20 of a cleaning device, and is located at the bottom of a wafer basket 30. Specifically, a housing structure 103 is set inside the main body 10, and the housing structure 103 is used to accommodate the rotating shaft 201, and the rotating shaft 201 can drive the main body 10 to rotate. During the rotation of the main body 10, the silicon wafer is assisted to be cleaned.
[0037] The working principle during use is that the rotation of the rotating shaft 201 drives the silicon wafer cleaning auxiliary device to rotate. During the rotation of the silicon wafer cleaning auxiliary device, when the protruding structure 102 arranged on the main body 10 rotates to contact with the silicon wafer 40 in the wafer basket 30, the protruding structure 102 can lift the silicon wafer 40. When the protruding structure 102 rotates and contacts with the silicon wafer 40, the silicon wafer 40 falls, and during the rotation of the protruding structure 102, the protruding structure 102 can drive the silicon wafer 40 to rotate, so that the silicon wafer 40 rotates in coordination during the rising and falling process, so as to achieve the effect that the silicon wafer 40 fully contacts the liquid medicine in the cleaning tank, avoids the cleaning dead corners of the silicon wafer, and improves the cleaning ability of the silicon wafer.
[0038] Specifically, Figure 2 yes Figure 1 Main structure diagram, Figure 3 yes Figure 2 AA cross-sectional structure diagram of Figure 2 and Figure 3As shown, in this embodiment, at least two protruding structures 102 are extended toward the outside of the main body 10 along at least two side edges 101 of the main body 10, and the length L1 of the protruding structure 102 is not less than 2 / 3 of the length L2 of the side edge 101 where it is located, and the width W1 of the protruding structure 102 is not greater than 1 / 2 of the length L2 of the side edge 101 where it is located.
[0039] By setting the length L1 of the protruding structure 102 to be no less than 2 / 3 of the length L2 of the side 101 where it is located, the length of the protruding structure 102 is long enough, so that the protruding structure 102 can be extended from the bottom opening of the sheet basket 30 into the interior of the sheet basket, and then contact the silicon wafer in the sheet basket 30, so as to achieve the purpose of lifting the silicon wafer 40 and assisting the rotation of the silicon wafer 40. By setting the width W1 of the protruding structure 102 to be no more than 1 / 2 of the length L2 of the side 101 where it is located, it is convenient to make the width of the protruding structure 102 appropriate, so as to drive the silicon wafer 40 to rotate more smoothly. By setting the protruding structure 102 to have an appropriate length and width, it can be adapted to a variety of silicon wafers of different specifications in actual use. Combined with the common silicon wafer sizes, this main body 10 can be adapted to 4-inch, 5-inch, and 6-inch silicon wafers at the same time, and can be used for auxiliary cleaning of round silicon wafers and special-shaped silicon wafers.
[0040] As an optional implementation, the corners of the protruding structure 102 are all provided with arc chamfers to ensure that the protruding structure 102 drives the silicon wafer to rotate in a gentle rotational motion, so as to avoid damage to the silicon wafer 40 in contact with the protruding structure 102 during the rotation of the protruding structure 102. In this embodiment, considering the physical hardness of the silicon wafer, the material of the main body 10 is selected as PP material to ensure that the hardness of the main body 10 is moderate and the service life is long.
[0041] Optionally, in this embodiment, anti-skid patterns 1021 are provided on the surface of the protruding structure 102 . The anti-skid patterns 1021 can increase the roughness of the surface of the protruding structure 102 , thereby increasing the friction force, so that the protruding structure 102 can smoothly drive the silicon wafer 40 to rotate.
[0042] Specifically, Figure 4 Schematic diagram of the structure of the anti-slip pattern in this embodiment. Figure 4 As shown, the anti-slip pattern 1021 in this embodiment is preferably a cross pattern, specifically, a raised anti-slip structure with a rounded rectangular cross section, with a gap set between every two adjacent anti-slip patterns, and arranged in a "cross" shape.
[0043] As an optional embodiment, the cross section of the main body 10 is a regular polygon. That is, the lengths of the multiple sides 101 of the main body 10 are the same. This arrangement facilitates the molding of the main body 10 and the protruding structure 102 arranged thereon. It can be understood that the lengths of the multiple sides 101 in this embodiment are the same, and the length and width of the protruding structure 102 arranged on each side 101 are also the same.
[0044] Among them, two protrusion structures 102 form a group, and a group of protrusion structures 102 are respectively arranged on two opposite sides 101 of the main body 10, that is, on the two opposite sides 101, one protrusion structure 102 is arranged on each side 101. In this way, during the process of one rotation of the main body 10, the silicon wafer 40 can complete at least two lifting and rotating actions, which can greatly improve the cleaning efficiency and cleaning effect of the silicon wafer.
[0045] Specifically, the cross section of the main body 10 in this embodiment is a regular octagonal structure, and two groups of protrusion structures 102 are provided, and the two groups of protrusion structures 102 are in a "cross" shape, that is, in this embodiment, protrusion structures 102 are provided on four side edges 101 spaced apart from each other on the regular octagonal structure. Under the premise of making the main body 10 easy to use, the silicon wafer 40 can complete four lifting and rotating actions when the main body 10 rotates one circle, which greatly improves the cleaning efficiency and cleaning effect of the silicon wafer.
[0046] As an optional implementation, Figure 5 Schematic diagram of the exploded structure of the main body of this embodiment. Figure 5 As shown, the main body 10 includes a first main body 11 and a second main body 12 which are centrally symmetrical. The main body 10 adopts a split structure, which is convenient for replacing parts damaged during use, and can save costs.
[0047] The first body 11 is provided with a first connection structure 110 for fixedly connecting with the rotating shaft 201; the second body 12 is provided with a second connection structure 120 for fixedly connecting with the rotating shaft 201. In this embodiment, both the first connection structure 110 and the second connection structure 120 are hole structures, and the first body 11 and the second body 12 can be fixedly connected to the rotating shaft 201 by connecting members such as pins passing through the first connection structure 110 and the second connection structure 120.
[0048] In some embodiments, the main body 10 may also be provided as an integrated structure.
[0049] Embodiment 2
[0050] Figure 6 Schematic diagram of the structure of this embodiment. Figure 6 As shown, this embodiment provides a silicon wafer cleaning device, including a cleaning device body and the silicon wafer cleaning auxiliary device in Embodiment 1, and the silicon wafer cleaning auxiliary device can be installed on the cleaning device body.
[0051] Specifically, the cleaning device body at least includes a cleaning tank 20 for accommodating a wafer basket and a power device 202. A rotating shaft 201 is provided in the cleaning tank 20 and is connected to the power device 202. The silicon wafer cleaning auxiliary device is installed on the rotating shaft 201. The rotating shaft 201 is located at the bottom of the wafer basket 30. In this embodiment, the power device 202 can be a motor, and the transmission structure can be a chain and a gear. The working principle is that the motor drives the chain, the chain drives the gear, and the gear drives the rotating shaft 201 to rotate.
[0052] The maximum width W2 of the silicon wafer cleaning auxiliary device in this embodiment is smaller than the bottom opening of the wafer basket 30, and the height of the protruding structure 102 is no greater than 1 / 2 of the depth of the wafer basket 30, so that the silicon wafer cleaning auxiliary device can be better used in conjunction with the wafer basket 30 during use to assist in cleaning the silicon wafer 40 inside the wafer basket 30, so that the silicon wafer 40 can fully contact the liquid in the cleaning tank, thereby improving the cleaning ability of the silicon wafer.
[0053] After adopting the silicon wafer cleaning auxiliary device, the one-time cleaning yield is increased to 99.84%. Compared with the one-time cleaning yield of 89.75% in the prior art without adopting the silicon wafer cleaning auxiliary device, the actual benefit effect is significant.
[0054] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A silicon wafer cleaning auxiliary device, characterized in that: Includes bodies with polygonal cross-sections where: Protruding structures are formed along at least two sides of the main body extending toward the outside of the main body, wherein the length of the protruding structures is not less than 2 / 3 of the length of the side where the protruding structures are located, and the width of the protruding structures is not more than 1 / 2 of the length of the side where the protruding structures are located; A containing structure is arranged inside the main body, and the containing structure is used to contain a rotating shaft, and the rotating shaft can drive the main body to rotate.
2. The silicon wafer cleaning auxiliary device according to claim 1, characterized in that: Arc chamfers are arranged at the corners of the raised structures.
3. The silicon wafer cleaning auxiliary device according to claim 1, characterized in that: The surface of the protruding structure is provided with anti-slip grooves.
4. The silicon wafer cleaning auxiliary device according to claim 3, characterized in that: The anti-slip pattern is a cross pattern.
5. The silicon wafer cleaning auxiliary device according to any one of claims 1 to 4, characterized in that: The cross section of the body is a regular polygon, wherein: The two protruding structures form a group, and the protruding structures of one group are arranged on two opposite sides of the main body.
6. The silicon wafer cleaning auxiliary device according to claim 5, characterized in that: The cross section of the main body is a regular octagonal structure, and the protruding structures are arranged in two groups, and the two groups of protruding structures are in a "cross" shape.
7. The silicon wafer cleaning auxiliary device according to any one of claims 1 to 4, characterized in that: The main body comprises a first main body and a second main body which are centrally symmetrical, wherein: The first main body is provided with a first connecting structure for fixedly connecting with the rotating shaft; The second main body is provided with a second connection structure for fixedly connecting with the rotating shaft.
8. A silicon wafer cleaning device, characterized in that: It comprises a cleaning equipment body and the silicon wafer cleaning auxiliary device according to any one of claims 1 to 7, and the silicon wafer cleaning auxiliary device can be installed on the cleaning equipment body.
9. The silicon wafer cleaning equipment according to claim 8, characterized in that: The cleaning equipment body at least includes a cleaning tank for accommodating a wafer basket and a power device. A rotating shaft drivingly connected to the power device is arranged in the cleaning tank. The silicon wafer cleaning auxiliary device is installed on the rotating shaft, and the rotating shaft is located at the bottom of the wafer basket.
10. The silicon wafer cleaning equipment according to claim 9, characterized in that: The maximum width of the silicon wafer cleaning auxiliary device is smaller than the bottom opening of the wafer basket, and the height of the protruding structure is no greater than 1 / 2 of the depth of the wafer basket.