Silicon wafer double-sided adsorption device

Abstract

The utility model discloses a double-sided adsorption device for silicon wafers, including at least one adsorption mechanism and a negative pressure airway, each group of adsorption mechanisms includes a suction nozzle mounting plate, a first adsorption assembly and a second adsorption assembly, the first adsorption assembly includes at least one first suction nozzle, the second adsorption assembly includes at least one second suction nozzle, all the first suction nozzles and all the second suction nozzles are installed on the suction nozzle mounting plate, and all the first suction nozzles and all the second suction nozzles are connected to the negative pressure airway through a connecting pipe; in each adsorption mechanism, all the first suction nozzles are oriented in the first direction, and all the second suction nozzles are oriented in the second direction, and the suction nozzle mounting plate can double-sidedly adsorb silicon wafers. By adopting the above structure, the double-sided adsorption device for silicon wafers can adsorb two silicon wafers at a time, which greatly improves the efficiency of the double-sided adsorption device for silicon wafers in adsorbing silicon wafers, meets the production needs of enterprises, and enhances the social competitiveness of enterprises.

Description

Technical Field

[0001] The utility model relates to the field of solar photovoltaic cell production, in particular to a silicon slice double-sided adsorption device. Background Art

[0002] Solar photovoltaic cells are devices that use the photovoltaic effect to directly convert light energy into electrical energy, and silicon wafers are the basic materials used to make solar photovoltaic cells. In the process of producing solar photovoltaic cells, graphite boats are needed to load silicon wafers and transport them into the vacuum coating chamber for coating. In order to avoid the robot clamps from damaging the silicon wafers during the process of grabbing the silicon wafers, existing photovoltaic companies generally use silicon wafer negative pressure adsorption devices to load and unload silicon wafers on graphite boats. Most of the existing graphite boats are double-sided, that is, silicon wafers can be placed on both opposite sides of each placement slot of the graphite boat, while the suction cups of the silicon wafer negative pressure adsorption devices currently on the market can only adsorb silicon wafers on one side. Therefore, when loading and unloading silicon wafers, after the suction cups of the silicon wafer negative pressure adsorption devices adsorb the silicon wafers on one side of a placement slot of the graphite boat, the suction cups of the silicon wafer negative pressure adsorption devices need to be reversed 180 degrees, and then the suction cups of the silicon wafer negative pressure adsorption devices can adsorb the silicon wafers on the other side of the placement slot of the graphite boat. The operation is cumbersome. Moreover, since the number of placement slots of the graphite boat is large, the existing silicon wafer negative pressure adsorption devices need to repeatedly adsorb multiple times to complete the silicon wafer loading and unloading operations of the graphite boat, and the operation efficiency is low. Utility Model Content

[0003] The utility model aims to solve one of the problems of the prior art to at least a certain extent. To this end, the utility model proposes a double-sided adsorption device for silicon wafers, which is not only simple in structure, but also capable of adsorbing silicon wafers on both sides, thereby helping to improve the loading and unloading efficiency of silicon wafers.

[0004] According to some embodiments of the utility model, a double-sided adsorption device for silicon wafers is provided, which is used for adsorbing silicon wafers and includes at least one adsorption mechanism and a negative pressure airway. Each group of the adsorption mechanisms includes a nozzle mounting plate, a first adsorption component and a second adsorption component. The first adsorption component includes at least one first nozzle, and the second adsorption component includes at least one second nozzle. All of the first nozzles and all of the second nozzles are mounted on the nozzle mounting plate, and all of the first nozzles and all of the second nozzles are connected to the negative pressure airway through connecting pipes. In each of the adsorption mechanisms, all of the first nozzles are facing the first direction, and all of the second nozzles are facing the second direction, so that the nozzle mounting plate can adsorb silicon wafers on both sides.

[0005] A silicon wafer double-sided adsorption device according to some embodiments of the utility model has the following beneficial effects:

[0006] In this embodiment, a double-sided suction device for silicon wafers is provided with at least one first suction nozzle and at least one second suction nozzle on the suction nozzle mounting plate, and all the first suction nozzles are oriented in the first direction, and all the second suction nozzles are oriented in the second direction, and the first direction and the second direction are opposite, so that the suction nozzle mounting plate of the double-sided suction device for silicon wafers in this embodiment can double-sidedly suction silicon wafers. By adopting the above structure, the double-sided suction device for silicon wafers can suction two silicon wafers at a time, greatly improving the efficiency of the double-sided suction device for silicon wafers to suction silicon wafers, meeting the production needs of enterprises, and enhancing the social competitiveness of enterprises.

[0007] In some embodiments of the present application, each group of the first adsorption components includes three first suction nozzles, and the three first suction nozzles are arranged at three corners of a triangle in a one-to-one correspondence.

[0008] In some embodiments of the present application, the second adsorption assembly includes three second adsorption nozzles, and the three second adsorption nozzles are arranged at three corners of a triangle in a one-to-one correspondence.

[0009] In some embodiments of the present application, the negative pressure airway includes a first negative pressure airway and a second negative pressure airway that are independent of each other, all of the first suction nozzles are connected to the first negative pressure airway through a connecting pipe, and all of the second suction nozzles are connected to the second negative pressure airway through a connecting pipe.

[0010] In some embodiments of the present application, a fixed base is included, and the number of the adsorption mechanisms is multiple, and the multiple adsorption mechanisms are fixedly installed at the lower part of the fixed base, and the multiple adsorption mechanisms are evenly spaced and arranged in a row.

[0011] In some embodiments of the present application, a first manifold and a second manifold are included, and the first manifold and the second manifold are fixedly installed on the upper part of the fixed base along the arrangement direction of the multiple adsorption mechanisms, the first manifold is connected to the first negative pressure airway, and the second manifold is connected to the second negative pressure airway; wherein all of the first suction nozzles are connected to the first manifold through a connecting pipe, and all of the second suction nozzles are connected to the second manifold through a connecting pipe.

[0012] In some embodiments of the present application, in each of the adsorption mechanisms, each of the first suction nozzles is connected to the negative pressure airway through an independent first connecting pipe, and each of the second suction nozzles is connected to the negative pressure airway through an independent second connecting pipe; a connecting pipe mounting groove for installing the first connecting pipe or the second connecting pipe is provided on the surface of the suction nozzle mounting plate, and a limiting structure is provided on the side wall of each of the connecting pipe mounting grooves; wherein, when the first connecting pipe or the second connecting pipe is embedded in the connecting pipe mounting groove, the limiting structure can limit the first connecting pipe or the second connecting pipe from arching or moving to the outside of the connecting pipe mounting groove.

[0013] In some embodiments of the present application, the limiting structure includes at least one group of protrusion assemblies, the protrusion assembly includes at least one protrusion, and the protrusion is arranged on a side groove wall of the connecting pipe installation groove.

[0014] In some embodiments of the present application, the protrusion assembly includes two protrusions, and the two protrusions are arranged on opposite side groove walls of the connecting pipe installation groove in a one-to-one correspondence.

[0015] In some embodiments of the present application, the number of the protrusion assemblies is multiple groups, and the multiple groups of protrusion assemblies are arranged in sequence and at intervals along the length direction of the connecting pipe installation groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a double-sided adsorption device for a silicon wafer according to some embodiments of the present utility model;

[0017] Figure 2 yes Figure 1 A schematic diagram of the structure of a silicon wafer double-sided adsorption device after adsorbing a silicon wafer is shown;

[0018] Figure 3 yes Figure 1 A side view of a silicon wafer double-sided adsorption device after adsorbing a silicon wafer is shown;

[0019] Figure 4 yes Figure 1 A schematic structural diagram of an adsorption mechanism in a double-sided adsorption device for a silicon wafer is shown;

[0020] Figure 5 yes Figure 1 The enlarged schematic diagram of point A in the middle;

[0021] Figure 6 yes Figure 3 The enlarged schematic diagram of point B in the middle;

[0022] Figure 7 yes Figure 1The figure shows a schematic structural diagram of a double-sided adsorption device for silicon wafers used to absorb silicon wafers in a graphite boat. DETAILED DESCRIPTION

[0023] Embodiments of the present embodiment are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present embodiment, and should not be construed as limiting the present embodiment.

[0024] The drawings used in this embodiment are schematic and principle and are only used to facilitate the description of this embodiment and simplify the description. Therefore, they should not be understood as limiting this embodiment.

[0025] In the description of this embodiment, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0026] In the description of this embodiment, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this embodiment based on the specific content of the technical solution.

[0027] Figures 1 to 7 It is a schematic diagram of some implementation methods of a silicon wafer double-sided adsorption device of the utility model.

[0028] Reference Figures 1 to 7 , and mainly refer to Figure 1 , Figure 3 and Figure 4 , Figure 5 and Figure 6According to some embodiments of the present invention, a double-sided adsorption device for silicon wafers is provided. For the sake of convenience, it is sometimes referred to as a "double-sided adsorption device for silicon wafers" below. A double-sided adsorption device for silicon wafers is used to adsorb silicon wafers 600, and includes at least one adsorption mechanism 100 and a negative pressure airway. Each group of adsorption mechanisms 100 includes a nozzle mounting plate 110, a first adsorption assembly 120 and a second adsorption assembly 130. The first adsorption assembly 120 includes at least one first suction nozzle 121, and the second adsorption assembly 130 includes at least one second suction nozzle 131. All first suction nozzles 121 and all second suction nozzles 131 are installed on the nozzle mounting plate 110, and all first suction nozzles 121 and all second suction nozzles 131 are connected to the negative pressure airway through a connecting pipe. In each adsorption mechanism 100, all first suction nozzles 121 are oriented in the first direction, and all second suction nozzles 131 are oriented in the second direction. The first direction and the second direction are opposite, so that the nozzle mounting plate 110 can adsorb the silicon wafer 600 on both sides. It should be noted that when the silicon wafer double-sided adsorption device of this embodiment is in use, the negative pressure airway can be connected to an external negative pressure generator. Specifically, the negative pressure generator can be a vacuum pump or an exhaust fan.

[0029] When the double-sided adsorption device of the silicon wafer of the present embodiment is used to unload the silicon wafer of the graphite boat 700, the negative pressure airway is first connected to the external negative pressure generator, and then the external robot or three-axis manipulator is connected to the suction nozzle mounting plate 110 for transmission, and drives the suction nozzle mounting plate 110 to be inserted into a placement slot of the graphite boat 700, the vacuum generator works and makes all the first suction nozzles 121 and all the second suction nozzles 131 form a negative pressure adsorption state, at this time, the robot or three-axis manipulator drives the suction nozzle mounting plate 110 to move closer to the silicon wafer 600 on one side of the placement slot, the first suction nozzle 121 contacts and adsorbs the silicon wafer 600, and then the robot or three-axis manipulator drives the suction nozzle mounting plate 110 to move closer to the silicon wafer 600 on the other side of the placement slot, the second suction nozzle 131 contacts and adsorbs another silicon wafer 600, at this time, silicon wafers 600 are adsorbed on both sides of the suction nozzle mounting plate 110, and the suction nozzle mounting plate 110 achieves double-sided adsorption of silicon wafers 600.

[0030] In order to facilitate understanding of the difference between the double-sided silicon wafer adsorption device of the present embodiment and the prior art, here we take the unloading of silicon wafers 600 in the six placement slots of the graphite boat 700 as an example. Since silicon wafers 600 are placed on both sides of the six placement slots of the graphite boat 700, there are twelve silicon wafers 600 in total. In the prior art, when the silicon wafer 600 is taken out by the robot operating the silicon wafer adsorption device, only the silicon wafer 600 on one side of the first placement slot can be taken out first, and then the silicon wafer adsorption device is driven to move to the placement position and put down the silicon wafer 600; the robot drives the silicon wafer adsorption device to reverse 180 degrees, and then returns to the first placement slot and takes out the silicon wafer on the other side, and then drives the silicon wafer adsorption device to move to the placement position and put down the silicon wafer 600. To complete the loading and unloading of the silicon wafers 600 in the six placement slots of the graphite boat 700, the robot needs to drive the silicon wafer adsorption device to move back and forth twelve times. With the double-sided silicon wafer adsorption device of this embodiment, the robot drives the double-sided silicon wafer adsorption device to move to the position of a placement slot of the graphite boat 700, and the nozzle mounting plate 110 of the double-sided silicon wafer adsorption device is inserted between the two silicon wafers 600 of the placement slot. The robot then drives the nozzle mounting plate 110 to move slightly to the sides of the placement slot to adsorb the two silicon wafers 600 in the placement slot, and then the robot drives the double-sided silicon wafer adsorption device to drive the two silicon wafers 600 to move to the placement position for unloading. In this way, the robot drives the double-sided silicon wafer adsorption device to complete the loading and unloading of the two silicon wafers 600 in one placement slot of the graphite boat 700 in one round trip. The robot only needs to drive the double-sided silicon wafer adsorption device six times to complete the unloading of the six placement slots of the graphite boat 700, which reduces the round trip time of the robot driving the double-sided silicon wafer adsorption device, improves the speed of loading and unloading silicon wafers by the double-sided silicon wafer adsorption device, and greatly improves the efficiency of enterprises in producing solar photovoltaic cells.

[0031] Reference Figure 4 In order to enable the first adsorption assembly 120 to more firmly adsorb the silicon wafer 600, in some embodiments of the present utility model, each group of the first adsorption assembly 120 includes three first suction nozzles 121, and the three first suction nozzles 121 are arranged one by one at the three corners of the triangle. Specifically, the three first suction nozzles 121 of the first adsorption assembly 120 are arranged in a triangular arrangement on the suction nozzle mounting plate 110. At this time, the three first suction nozzles 121 are located at the three corner positions of the triangle in a one-to-one correspondence. When the silicon wafer double-sided adsorption device of this embodiment is used to adsorb the silicon wafer 600, the suction nozzle mounting plate 110 drives the three first suction nozzles 121 of the first adsorption assembly 120 to move close to and contact the silicon wafer 600. At this time, the three first suction nozzles 121 can adsorb three different positions on the surface of the silicon wafer 600 in a triangular shape. Therefore, the first adsorption assembly 120 can more firmly adsorb the silicon wafer 600 to prevent the silicon wafer 600 from accidentally falling.

[0032] Further, in order to make the second adsorption component 130 better adsorb the silicon wafer 600, in some embodiments of the present utility model, the second adsorption component 130 also includes three second suction nozzles 131, and the three second suction nozzles 131 are arranged one by one at the three corners of the triangle. Specifically, the three second suction nozzles 131 of the second adsorption component 130 are arranged in a triangular arrangement on the suction nozzle mounting plate 110, so the three second suction nozzles 131 are located one by one at the three corner positions of the triangle. When the silicon wafer double-sided adsorption device of this embodiment adsorbs the silicon wafer 600 through the second adsorption component 130, the suction nozzle mounting plate 110 drives the three second suction nozzles 131 of the second adsorption component 130 to move close to and contact the silicon wafer 600. At this time, the three second suction nozzles 131 can adsorb three different positions on the surface of the silicon wafer 600 in a triangular shape. Therefore, the adsorption force between the second adsorption component 130 and the silicon wafer 600 is stronger, which can prevent the silicon wafer 600 from accidentally falling and being damaged, and help protect the silicon wafer 600.

[0033] Reference Figure 1 , Figure 2 and Figure 4 In order to be able to individually control the first adsorption component 120 and / or the second adsorption component 130 to adsorb the silicon wafer 600, in some embodiments of the present invention, the negative pressure air duct includes a first negative pressure air duct 200 and a second negative pressure air duct 300 that are independent of each other, and all the first suction nozzles 121 are connected to the first negative pressure air duct 200 through a connecting pipe, and all the second suction nozzles 131 are connected to the second negative pressure air duct 300 through a connecting pipe. By adopting the above structure, the first negative pressure airway 200 can be connected to a negative pressure generator alone, and the second negative pressure airway 300 can be connected to another negative pressure generator alone. By controlling the operation of different negative pressure generators, the first adsorption component 120 or the second adsorption component 130 can be controlled individually to generate negative pressure to adsorb the silicon wafer 600. Not only can the purpose of adsorbing the silicon wafer 600 be achieved, but the negative pressure generator only needs to make the first adsorption component 120 or the second adsorption component 130 generate negative pressure to adsorb the silicon wafer 600 at a time, and there is no need to make the first adsorption component 120 and the second adsorption component 130 generate negative pressure at the same time, which helps to reduce the load of the negative pressure generator, reduce the power consumption of the negative pressure generator, and save energy.

[0034] It should be noted that, in the above embodiment, the first negative pressure airway 200 is connected to a negative pressure generator alone, and the second negative pressure airway 300 is connected to another negative pressure generator alone. In other embodiments of the utility model, the first negative pressure airway 200 and the second negative pressure airway 300 can be connected to the negative pressure generator through a two-position three-way solenoid valve, that is, by controlling the switching of the two-position three-way solenoid valve, the first negative pressure airway 200 and the second negative pressure airway 300 can be connected to the negative pressure generator alone, without the need to configure two negative pressure generators, which can be determined according to actual needs.

[0035] In order to enable the double-sided adsorption device of the silicon wafer of the present invention to absorb more silicon wafers 600 at one time, a double-sided adsorption device of a silicon wafer in some embodiments of the present invention further includes a fixed base 400. Specifically, the fixed base 400 is a long strip-shaped plate. It should be noted that the fixed base 400 can also be set to other shapes, such as square, oval or polygonal, etc., and is not limited to the above-mentioned long strip-shaped plate. It can be determined according to actual needs. The number of adsorption mechanisms 100 is multiple, and multiple adsorption mechanisms 100 are fixedly installed at the lower part of the fixed base 400, and multiple adsorption mechanisms 100 are evenly spaced and arranged in a row. In this embodiment, multiple adsorption mechanisms 100 are evenly spaced and arranged in a row along the length direction of the fixed base 400. By adopting the above structure, the double-sided adsorption device of the silicon wafer of this embodiment can adsorb multiple silicon wafers 600 at one time, which greatly improves the efficiency of the double-sided adsorption device of the silicon wafer adsorption of the silicon wafer 600.

[0036] In order to make it easier for the first adsorption assembly 120 and the second adsorption assembly 130 of the plurality of adsorption mechanisms 100 to be connected to the first negative pressure airway 200 and the second negative pressure airway 300 in one-to-one correspondence, the double-sided adsorption device of a silicon wafer in some embodiments of the present invention further includes a first manifold 210 and a second manifold 310, and the first manifold 210 and the second manifold 310 are fixedly installed on the upper part of the fixed base 400 along the arrangement direction of the plurality of adsorption mechanisms 100. Specifically, the first manifold 210 and the second manifold 310 are arranged on the upper part of the fixed base 400 along the length direction of the fixed base 400. On the opposite sides, the first manifold 210 is connected to the first negative pressure air duct 200, the second manifold 310 is connected to the second negative pressure air duct 300, all the first suction nozzles 121 are connected to the first manifold 210 through the connecting pipe, and all the second suction nozzles 131 are connected to the second manifold 310 through the connecting pipe. By adopting the above structure, the first adsorption components 120 and the second adsorption components 130 of the multiple adsorption mechanisms 100 are connected to the first negative pressure air duct 200 and the second negative pressure air duct 300 one by one, and the structure of the double-sided adsorption device for the silicon wafer is more compact, which is convenient for production and processing.

[0037] It should be noted that the first conduit 210 and the first negative pressure airway 200 can be an integrated structure, or the first conduit 210 and the first negative pressure airway 200 can be detachably connected; the second conduit 310 and the second negative pressure airway 300 can be an integrated structure, or the second conduit 310 and the second negative pressure airway 300 can be detachably connected.

[0038] Reference Figure 1 , Figure 4 and Figure 5 In order to facilitate the production and processing of the double-sided adsorption device for silicon wafers, in certain embodiments of the present utility model, in each adsorption mechanism 100, each first suction nozzle 121 is connected to the negative pressure airway through an independent first connecting pipe 122, and each second suction nozzle 131 is connected to the negative pressure airway through an independent second connecting pipe 132. A connecting pipe installation groove 111 for installing the first connecting pipe 122 or the second connecting pipe 132 is provided on the surface of the suction nozzle mounting plate 110, and a limiting structure is provided on the side wall of each connecting pipe installation groove 111; wherein, when the first connecting pipe 122 or the second connecting pipe 132 is embedded in the connecting pipe installation groove 111, the limiting structure can limit the first connecting pipe 122 or the second connecting pipe 132 from arching or moving to the outside of the connecting pipe installation groove 111. By adopting the above structure, the first suction nozzle 121, the second suction nozzle 131, the first connecting pipe 122, the second connecting pipe 132 and the suction nozzle mounting plate 110 can be separately manufactured, and then the first suction nozzle 121, the second suction nozzle 131, the first connecting pipe 122, the second connecting pipe 132 and the suction nozzle mounting plate 110 can be assembled, so that the production and processing of the double-sided suction device of the silicon wafer is simpler and more convenient, which helps to reduce the production cost. In addition, the side wall of each connecting pipe mounting groove 111 is provided with a limiting structure. Even if the first connecting pipe 122 or the second connecting pipe 132 is deformed by heat due to the high temperature of the graphite boat 700, the above limiting structure can also limit the first connecting pipe 122 or the second connecting pipe 132 from arching or moving to the outside of the connecting pipe mounting groove 111, so that the first connecting pipe 122 or the second connecting pipe 132 can be prevented from protruding from the first suction nozzle 121 or the second suction nozzle 131 of the suction nozzle mounting plate 110 and scratching the silicon wafer 600, which helps to protect the silicon wafer 600.

[0039] In certain embodiments of the utility model, in each adsorption mechanism 100, the surface of the nozzle mounting plate 110 is provided with the same number of connection pipe mounting grooves 111 as all the first connection pipes 122 and all the second connection pipes 132. All the first connection pipes 122 and all the second connection pipes 132 are embedded in the corresponding connection pipe mounting grooves 111 in a one-to-one correspondence, so each connection pipe mounting groove 111 can limit the first connection pipe 122 or the second connection pipe 132 located therein through a limiting structure. By adopting the above structure, the first connection pipe 122 or the second connection pipe 132 can be effectively prevented from being deformed by heat and arched to scratch the silicon wafer 600 or moved to scratch the silicon wafer 600.

[0040] It should be noted that, in the above embodiment, all the first connecting pipes 122 can be directly connected to the first manifold 210, or all the first connecting pipes 122 are connected to the first manifold 210 through adapters, and all the second connecting pipes 132 can be directly connected to the second manifold 310, or all the second connecting pipes 132 are connected to the second manifold 310 through adapters, which can be determined according to actual needs. Since the above adapters are well-known in the art, they will not be described in detail here.

[0041] In order to facilitate the production and processing of the nozzle mounting plate 110, in some embodiments of the present utility model, the limiting structure includes at least one group of protrusion components 500, and the protrusion component 500 includes at least one protrusion 510, and the protrusion 510 is arranged on one side of the groove wall of the connecting pipe mounting groove 111. Further, the protrusion component 500 includes two protrusions 510, and the two protrusions 510 are arranged on the opposite side groove walls of the connecting pipe mounting groove 111 in a one-to-one correspondence. By adopting the above structure, when the first connecting pipe 122 or the second connecting pipe 132 is embedded in the connecting pipe mounting groove 111, the two protrusions 510 can be engaged with the two side walls of the first connecting pipe 122 or the second connecting pipe 132, thereby limiting the first connecting pipe 122 or the second connecting pipe 132 in the connecting pipe mounting groove 111.

[0042] Furthermore, the number of the bump components 500 is multiple groups, and the multiple groups of bump components 500 are arranged in sequence and at intervals along the length direction of the connecting pipe installation groove 111. By adopting the above structure, when the first connecting pipe 122 or the second connecting pipe 132 is embedded in the connecting pipe installation groove 111, the multiple groups of bump components 500 can restrict the first connecting pipe 122 or the second connecting pipe 132 from different position points, so that the first connecting pipe 122 or the second connecting pipe 132 will not protrude from the first suction nozzle 121 or the second suction nozzle 131 of the suction nozzle installation plate 110 when heated, which helps to protect the silicon wafer 600.

[0043] Although examples of the present embodiment have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present embodiment, and the scope of the present embodiment is defined by the claims and their equivalents.

Claims

1. A double-sided adsorption device for silicon wafers, used for adsorbing silicon wafers, characterized in that: include: at least one adsorption mechanism, each group of the adsorption mechanisms comprises a nozzle mounting plate, a first adsorption assembly and a second adsorption assembly, the first adsorption assembly comprises at least one first suction nozzle, the second adsorption assembly comprises at least one second suction nozzle, all the first suction nozzles and all the second suction nozzles are mounted on the nozzle mounting plate, A negative pressure airway, wherein all of the first suction nozzles and all of the second suction nozzles are connected to the negative pressure airway via a connecting pipe; In each of the adsorption mechanisms, all of the first adsorption nozzles are oriented toward a first direction, and all of the second adsorption nozzles are oriented toward a second direction, so that the adsorption nozzle mounting plate can adsorb silicon wafers on both sides.

2. A silicon wafer double-sided adsorption device according to claim 1, characterized in that: Each group of the first adsorption components includes three first suction nozzles, and the three first suction nozzles are arranged at three corners of a triangle in a one-to-one correspondence.

3. The double-sided adsorption device for silicon wafer according to claim 1, characterized in that: The second adsorption assembly includes three second suction nozzles, and the three second suction nozzles are arranged at three corners of a triangle in a one-to-one correspondence.

4. A silicon wafer double-sided adsorption device according to claim 1, 2 or 3, characterized in that: The negative pressure airway includes a first negative pressure airway and a second negative pressure airway that are independent of each other, all of the first suction nozzles are connected to the first negative pressure airway through a connecting pipe, and all of the second suction nozzles are connected to the second negative pressure airway through a connecting pipe.

5. The double-sided adsorption device for silicon wafer according to claim 4, characterized in that: It comprises a fixed base, a plurality of adsorption mechanisms, the plurality of adsorption mechanisms are fixedly installed at the lower part of the fixed base, and the plurality of adsorption mechanisms are evenly arranged in a row.

6. The double-sided adsorption device for silicon wafer according to claim 5, characterized in that: The first conduit and the second conduit are fixedly installed on the upper part of the fixed base along the arrangement direction of the plurality of adsorption mechanisms, the first conduit is connected to the first negative pressure airway, and the second conduit is connected to the second negative pressure airway; Wherein, all the first suction nozzles are connected to the first manifold through a connecting pipe, and all the second suction nozzles are connected to the second manifold through a connecting pipe.

7. The double-sided adsorption device for silicon wafer according to claim 1, characterized in that: In each of the adsorption mechanisms, each of the first suction nozzles is connected to the negative pressure airway through an independent first connecting pipe, and each of the second suction nozzles is connected to the negative pressure airway through an independent second connecting pipe; A connecting pipe installation groove for installing the first connecting pipe or the second connecting pipe is provided on the surface of the nozzle installation plate, and a limiting structure is provided on the side wall of each connecting pipe installation groove; Wherein, when the first connecting pipe or the second connecting pipe is embedded in the connecting pipe installation groove, the limiting structure can limit the first connecting pipe or the second connecting pipe from arching or moving toward the outside of the connecting pipe installation groove.

8. The double-sided adsorption device for silicon wafer according to claim 7, characterized in that: The limiting structure includes at least one group of protrusion components, and the protrusion component includes at least one protrusion, and the protrusion is arranged on a side groove wall of the connecting pipe installation groove.

9. The double-sided adsorption device for silicon wafer according to claim 8, characterized in that: The protrusion assembly includes two protrusions, and the two protrusions are arranged on the groove walls on both sides opposite to each other in a one-to-one correspondence with each other on the connecting pipe installation groove.

10. A silicon wafer double-sided adsorption device according to claim 8 or 9, characterized in that: The number of the protrusion assemblies is multiple groups, and the multiple groups of protrusion assemblies are arranged in sequence and at intervals along the length direction of the connecting pipe installation groove.

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