A 1800W ultra-power high-density color-mixing light source

Abstract

The utility model relates to the technical field of COB light sources, and particularly discloses a 1800W ultra-power high-density mixed-color light source, including a light source mounting substrate and a light source chip, wherein the light source chip is fixedly mounted on the light source mounting substrate, a positive electrode pin is fixedly mounted on the upper end of the light source mounting substrate, and a negative electrode pin is fixedly mounted on the upper end of the light source mounting substrate; wherein the positive electrode pin and the negative electrode pin are symmetrically mounted, and the positive electrode pin, the negative electrode pin and the light source chip are electrically connected; and a plurality of heat dissipation through holes are opened through the light source chip. The utility model adds a heat-conducting copper column and a heat sink to the light-emitting chip on the 1800W ultra-power high-density mixed-color light source, so that when the 1800W ultra-power high-density mixed-color light source is working, the heat generated by the light-emitting chip is conducted to the heat sink by the heat-conducting copper column, and the heat sink dissipates the heat, thereby effectively improving the heat dissipation of the light-emitting chip and increasing the safety of the light source.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light sources, in particular to an 1800W ultra-power high-density color-mixing light source. Background Art

[0002] 1800W ultra-power high-density color-mixing light source is a high-efficiency, high-brightness lighting equipment, usually used in occasions that require high-brightness, multi-color mixed light, such as stage lighting, studio lighting, exhibition display, etc.; this light source has the characteristics of high density, high brightness, good color mixing effect, etc., and can provide more gorgeous and realistic lighting effects, enhance visual effects and artistic sense; ultra-power high-density color-mixing light source usually adopts advanced LED chips and optical design, can achieve color mixing and brightness adjustment of multiple colors, and has a wide adjustable color temperature range, which can be quickly and easily adjusted in different scenes and needs.

[0003] However, due to the high power and high heat generation of this light source, the ordinary chip installation method lacks effective heat dissipation measures to maintain the stable operation of the chip, which is easy to cause chip damage due to overheating. At the same time, it is also easy to cause fire and other safety hazards during use due to overheating. Therefore, in order to solve the above problems, we propose an 1800W ultra-power high-density mixed-color light source. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the utility model provides an 1800W ultra-power high-density mixed-color light source to solve the technical problems that the power of this light source is high, the heat is large, and the ordinary chip installation method lacks effective heat dissipation measures to maintain the stable operation of the chip, which is easy to cause chip damage due to overheating. At the same time, it is also easy to cause fire and other safety hazards due to overheating during use.

[0006] (II) Technical solution

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A 1800W ultra-power high-density color-mixing light source, comprising a light source mounting substrate and a light source chip, wherein the light source chip is fixedly mounted on the light source mounting substrate, a positive electrode pin is fixedly mounted on the upper end of the light source mounting substrate, and a negative electrode pin is fixedly mounted on the upper end of the light source mounting substrate; the positive electrode pin and the negative electrode pin are symmetrically mounted, and the positive electrode pin, the negative electrode pin and the light source chip are connected by telecommunication;

[0009] The light source chip is provided with a plurality of heat dissipation holes, and a plurality of light-emitting chips are fixedly mounted on the light source chip. A heat-conducting copper column is fixedly mounted on the lower end of each of the light-emitting chips, and a heat sink is fixedly mounted on the lower end of each of the heat-conducting copper columns. Each of the light-emitting chips is connected to the light source chip by telecommunication, and the position of each heat dissipation hole is opened corresponding to the light-emitting chip, and each of the heat-conducting copper columns is mounted on the inner side of the heat dissipation hole.

[0010] Preferably: a heat dissipation vent 1 is formed through a side end portion of the light source mounting substrate; the heat dissipation vent 1 is located on one side of the negative electrode pin.

[0011] The inner side wall of the light source installation substrate is provided with a second heat dissipation vent; the second heat dissipation vent is located below the light source chip.

[0012] A heat dissipation cavity is formed through the side end of the light source installation substrate; the heat dissipation cavity and the heat dissipation vent are formed symmetrically.

[0013] Preferably: the heat dissipation cavity is connected through the heat dissipation vent 2; the heat dissipation vent 2 is connected through the heat dissipation vent 1.

[0014] The heat dissipation plate is located on the inner side of the second heat dissipation vent; each of the heat dissipation through holes is connected to the second heat dissipation vent.

[0015] (III) Beneficial effects

[0016] 1. By adding thermal conductive copper columns and heat sinks to the light-emitting chips on the 1800W ultra-power high-density mixed-color light source, when the 1800W ultra-power high-density mixed-color light source is working, the thermal conductive copper columns conduct the heat generated by the light-emitting chips to the heat sink, and the heat sink dissipates the heat, thereby effectively improving the heat dissipation of the light-emitting chips and increasing the safety of the light source.

[0017] Second, by providing heat dissipation vent 1, heat dissipation vent 2 and heat dissipation cavity on the 1800W ultra-power high-density mixed-color light source, when the 1800W ultra-power high-density mixed-color light source is working, the heat dissipation of the heat dissipation plate accelerates the air circulation between the heat dissipation vent 1, heat dissipation vent 2 and the heat dissipation cavity, thereby accelerating the heat dissipation efficiency of the heat dissipation plate and effectively improving the practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings.

[0019] Figure 1This is a structural diagram of the overall color mixing light source of the utility model;

[0020] Figure 2 This is a structural diagram of the color-mixing light source of the utility model;

[0021] Figure 3 This is a structural diagram of the heat dissipation through hole of the utility model;

[0022] Figure 4 This is a structural diagram of the heat dissipation plate of the utility model.

[0023] Legend: 1. Light source mounting substrate; 11. Positive electrode pin; 12. Negative electrode pin; 13. Heat dissipation vent 1; 14. Heat dissipation vent 2; 15. Heat dissipation cavity; 2. Light source chip; 21. Heat dissipation through hole; 22. Light emitting chip; 23. Thermal conductive copper column; 24. Heat sink. DETAILED DESCRIPTION

[0024] The embodiment of the present application provides an 1800W ultra-power high-density mixed-color light source, which effectively solves the technical problems that due to the high power and high heat generation of this light source, the ordinary chip installation method lacks effective heat dissipation measures to maintain the stable operation of the chip, which is easy to be damaged due to chip overheating, and it is also easy to cause fire and other safety hazards due to overheating during use.

[0025] Example

[0026] like Figure 1 , Figure 2 , Figure 3 ,and Figure 4 As shown, the technical solution in the embodiment of the present application effectively solves the technical problem that due to the high power and high heat generation of such light source, the ordinary chip installation method lacks effective heat dissipation measures to maintain the stable operation of the chip, and the chip is easily damaged due to overheating. At the same time, it is also easy to cause fire and other safety hazards during use due to overheating. The overall idea is based on the following:

[0027] In view of the problems existing in the prior art, the utility model provides an 1800W ultra-power high-density mixed-color light source, including a light source mounting substrate 1 and a light source chip 2, the light source chip 2 is fixedly mounted on the light source mounting substrate 1, the upper end of the light source mounting substrate 1 is fixedly mounted with a positive electrode pin 11, and the upper end of the light source mounting substrate 1 is fixedly mounted with a negative electrode pin 12; wherein the positive electrode pin 11 and the negative electrode pin 12 are symmetrically mounted, and the positive electrode pin 11, the negative electrode pin 12 and the light source chip 2 are connected by telecommunication; a plurality of heat dissipation through holes 21 are opened through the light source chip 2, and a plurality of light-emitting crystals are fixedly mounted on the light source chip 2 The light emitting chip 22 has a heat-conducting copper column 23 fixedly mounted on the lower end of each light emitting chip 22, and a heat sink 24 is fixedly mounted on the lower end of each heat-conducting copper column 23; the light emitting chip 22 generates heat during operation, and the heat-conducting copper column 23 conducts the heat generated by the light emitting chip 22, and the light emitting chip 22 conducts the heat to the heat sink 24, and the heat sink 24 dissipates the heat of the light emitting chip 22, wherein each light emitting chip 22 is connected to the light source chip 2 by telecommunication, and the position of each heat dissipation through-hole 21 is opened corresponding to the light emitting chip 22, and each heat-conducting copper column 23 is installed on the inner side of the heat dissipation through-hole 21.

[0028] A heat dissipation vent 13 is provided through the side end of the light source mounting substrate 1; wherein the heat dissipation vent 13 is located on one side of the negative electrode pin 12; a heat dissipation vent 2 14 is provided on the inner side wall of the light source mounting substrate 1; wherein the heat dissipation vent 2 14 is located below the light source chip 2; a heat dissipation cavity 15 is provided through the side end of the light source mounting substrate 1; wherein the heat dissipation cavity 15 and the heat dissipation vent 1 13 are symmetrically provided; the heat dissipation cavity 15 is connected throughly with the heat dissipation vent 2 14; wherein the heat dissipation vent 2 14 is connected throughly with the heat dissipation vent 1 13; the heat dissipation plate 24 is located on the inner side of the heat dissipation vent 2 14; wherein each heat dissipation through hole 21 is connected throughly with the heat dissipation vent 2 14, the heat dissipation plate 24 dissipates heat to heat the air in the heat dissipation cavity 15, and the heated air is discharged from one side of the heat dissipation vent 1 13 or the heat dissipation vent 2 14, and when the gas flows, new air will enter the heat dissipation cavity 15, thereby accelerating the heat dissipation efficiency of the heat dissipation plate 24.

[0029] Working principle:

[0030] The first step is that when the ultra-power high-density mixed-color light source is used, the positive pin 11 and the negative pin 12 are connected to the power supply. After the positive pin 11 and the negative pin 12 are energized, the light-emitting chip 22 on the light source chip 2 starts to work, and the light-emitting chip 22 generates heat. The thermal conductive copper column 23 conducts the heat generated by the light-emitting chip 22, and the light-emitting chip 22 conducts the heat to the heat sink 24, and the heat sink 24 dissipates the heat of the light-emitting chip 22. By adding the thermal conductive copper column 23 and the heat sink 24 to the light-emitting chip 22 on the 1800W ultra-power high-density mixed-color light source, the heat-conductive copper column 23 conducts the heat generated by the light-emitting chip 22 to the heat sink 24 during the operation of the 1800W ultra-power high-density mixed-color light source, and the heat sink 24 dissipates the heat, thereby effectively improving the heat dissipation of the light-emitting chip 22 and increasing the safety of the light source.

[0031] The second step is that when the ultra-power high-density mixed-color light source is in use, the light-emitting chip 22 generates heat during operation, and the heat-conducting copper column 23 conducts the heat generated by the light-emitting chip 22, and the light-emitting chip 22 conducts the heat to the heat sink 24, and the heat sink 24 dissipates the heat of the light-emitting chip 22. The heat sink 24 dissipates the heat to heat the air in the heat dissipation cavity 15, and the heated air is discharged from the side of the heat dissipation vent 1 13 or the heat dissipation vent 2 14. When the gas flows, new air will enter the heat dissipation cavity 15, thereby accelerating the heat dissipation efficiency of the heat sink 24. By providing the heat dissipation vent 1 13, the heat dissipation vent 2 14 and the heat dissipation cavity 15 on the 1800W ultra-power high-density mixed-color light source, the 1800W ultra-power high-density mixed-color light source can accelerate the air circulation between the heat dissipation vent 1 13, the heat dissipation vent 2 14 and the heat dissipation cavity 15 during the operation of the 1800W ultra-power high-density mixed-color light source, thereby accelerating the heat dissipation efficiency of the heat sink 24 and effectively improving the practicality.

[0032] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A 1800W ultra-power high-density color-mixing light source, comprising a light source mounting substrate (1) and a light source chip (2), characterized in that: The light source chip (2) is fixedly mounted on the light source mounting substrate (1), a positive electrode pin (11) is fixedly mounted on the upper end of the light source mounting substrate (1), and a negative electrode pin (12) is fixedly mounted on the upper end of the light source mounting substrate (1); The positive electrode pin (11) and the negative electrode pin (12) are symmetrically installed, and the positive electrode pin (11), the negative electrode pin (12) and the light source chip (2) are electrically connected. The light source chip (2) is provided with a plurality of heat dissipation through holes (21), a plurality of light-emitting chips (22) are fixedly mounted on the light source chip (2), a heat-conducting copper column (23) is fixedly mounted on the lower end of each of the light-emitting chips (22), and a heat-dissipating plate (24) is fixedly mounted on the lower end of each of the heat-conducting copper columns (23); Each of the light-emitting chips (22) is connected to the light source chip (2) via telecommunication, the position of each of the heat dissipation holes (21) is opened corresponding to the light-emitting chip (22), and each of the heat-conducting copper pillars (23) is installed on the inner side of the heat dissipation hole (21).

2. The 1800W ultra-power high-density color-mixing light source according to claim 1, characterized in that: A heat dissipation vent (13) is provided through the side end of the light source installation substrate (1); Wherein, the heat dissipation vent 1 (13) is located on one side of the negative electrode pin (12).

3. The 1800W ultra-power high-density color-mixing light source according to claim 2, characterized in that: The inner side wall of the light source installation substrate (1) is provided with a second heat dissipation vent (14); Wherein, the heat dissipation vent 2 (14) is located below the light source chip (2).

4. The 1800W ultra-power high-density color-mixing light source according to claim 3, characterized in that: A heat dissipation cavity (15) is provided through the side end of the light source installation substrate (1); Wherein, the heat dissipation cavity (15) and the heat dissipation vent (13) are opened symmetrically.

5. The 1800W ultra-power high-density color-mixing light source according to claim 4, characterized in that: The heat dissipation cavity (15) is connected through the heat dissipation vent 2 (14); Wherein, the heat dissipation vent 2 (14) is connected through the heat dissipation vent 1 (13).

6. The 1800W ultra-power high-density color-mixing light source according to claim 5, characterized in that: The heat dissipation plate (24) is located inside the heat dissipation vent 2 (14); Wherein, each of the heat dissipation through holes (21) is connected through the second heat dissipation vent (14).

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