High pressure forming die

Abstract

A high-pressure forming mold includes an upper mold base, a grid mounting plate, a film clamping plate, a plurality of mold cores and a lower mold base, wherein the lower end surface of the upper mold base is connected to the grid mounting plate, the lower end surface of the grid mounting plate is connected to the film clamping plate, the lower end surface of the film clamping plate is detachably connected to the lower mold base, and a movable gap is provided between the plurality of mold cores; an air pressure diverter plate is provided in the upper mold base; a heat dissipation grid is installed on the grid mounting plate, and the heat dissipation grid is located between the air pressure diverter plate and the mold core; the lower end of the mold core is movably connected to a mold core support seat, and the mold core support seat is movably installed in the lower mold base; a mold core groove is provided at the lower end of the film clamping plate, and a plurality of perforations are provided on the film clamping plate, and the perforations are communicated with the mold core groove, the mold core is located in the mold core groove, and a movable gap is provided between the outer side of the mold core and an inner side of the mold core groove. When the pattern is offset, the offset problem can be adjusted by simply moving the position of the mold core, which is convenient to operate and highly practical.

Description

Technical Field

[0001] The utility model relates to the technical field of molds, in particular to a high-pressure forming mold. Background Art

[0002] IML process, full name is In Molding Label, is a molding method that prints ink on the inner surface of the sheet, then forms the printed sheet into a 3D shape through hot pressing, then punches the outer shape and inner hole, and finally puts it into the injection mold cavity to form an integrated molding method with plastic. The characteristic of IML process is that the surface of the product is a hardened transparent film, the middle is a printed pattern layer, and the back is a plastic layer. Because the ink is sandwiched in the middle, the product can prevent the surface from being scratched and resistant to friction, and can keep the color bright for a long time and not easy to fade. Most of the molds used for IM process on the market have flush upper and lower clamping plates, and the mold core is installed tightly around without gaps. When the pattern on the film is offset during the high-pressure molding process, the high-pressure offset can only be compensated by adjusting the position of the printed image file. Often a product needs to adjust the position of the printed image file 5 to 10 times, which makes the overall product development cycle long and the cost high.

[0003] Therefore, a high pressure forming die is needed to improve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a high-pressure forming mold, aiming to solve the above-mentioned technical problems. The utility model provides a movable gap between the outer side of the mold core and the inner side of the mold core groove of the film clamping plate, and movable gaps are also provided between multiple mold cores. The movable gaps and movable gaps facilitate the adjustment of the position of the mold core. When the pattern is misaligned, the misalignment problem can be adjusted by only moving the position of the mold core. The utility model is easy to operate, has strong practicality and low cost.

[0005] In order to achieve the above object, the utility model is implemented through the following technical solutions:

[0006] A high-pressure forming mold comprises an upper mold base, a grid mounting plate, a film clamping plate, a plurality of mold cores and a lower mold base, wherein the lower end surface of the upper mold base is connected to the grid mounting plate, the lower end surface of the grid mounting plate is connected to the film clamping plate, the lower end surface of the film clamping plate is detachably connected to the lower mold base, and a movable gap is provided between the plurality of mold cores;

[0007] A gas pressure manifold is provided in the upper die seat;

[0008] A heat dissipation grid is installed on the grid installation plate, and the heat dissipation grid is located between the air pressure manifold plate and the mold core;

[0009] The lower end of the mold core is movably connected to a mold core support seat, and the mold core support seat is movably installed in the lower mold seat;

[0010] A core groove is provided at the lower end of the film clamping plate, and a plurality of through holes are provided on the film clamping plate. The through holes are communicated with the core groove. The core is located in the core groove, and a movable gap is provided between the outer side of the core and an inner side of the core groove.

[0011] Furthermore, a plurality of lower exhaust grooves and lower through holes are provided in the lower die base, and the lower exhaust grooves are communicated with the lower through holes.

[0012] Furthermore, it also includes an upper mold cavity and a lower mold cavity, the upper mold cavity is located in the upper mold base, the lower mold cavity is located in the lower mold base, the air pressure diverter plate is installed in the upper mold cavity, the core support base can be movably installed in the lower mold cavity, and the lower exhaust groove is located in the lower mold cavity.

[0013] Furthermore, the core support seat is provided with a plurality of upper exhaust grooves and upper through holes, the upper exhaust grooves are communicated with the upper through holes, and the upper through holes are located above the lower through holes.

[0014] Furthermore, the grid mounting plate is provided with a plurality of grid clamping grooves and a plurality of grid mounting holes, the grid clamping grooves are communicated with the grid mounting holes, and the grid mounting holes are located above the through holes.

[0015] Furthermore, the heat dissipation grid includes a grid portion and a clamping portion, the clamping portion is arranged at both ends of the grid portion, and the grid portion is located in the grid mounting hole, and one end of the clamping portion is installed in the grid clamping groove.

[0016] Furthermore, it also includes an air intake channel, and the air intake hole of the air intake channel is opened on the side wall of the upper mold base.

[0017] Furthermore, a fitting portion is provided at the upper end of the mold core, and the fitting portion is located in the through hole.

[0018] Furthermore, the mold core is provided with a plurality of mold core assembly holes, the mold core support seat is provided with a plurality of support seat assembly holes, the lower mold seat is provided with a plurality of lower mold assembly holes, the mold core assembly hole, the support seat assembly hole and the lower mold assembly hole are connected, and the aperture of the mold core assembly hole is larger than the aperture of the support seat assembly hole and the lower mold assembly hole.

[0019] The high pressure forming die of the utility model has the following beneficial effects:

[0020] 1. The utility model high-pressure forming mold is provided with a movable interval between the outer side of the mold core and the inner side of the mold core groove of the film clamping plate. The movable interval facilitates the adjustment of the mold core position. When the pattern is offset, the offset problem can be adjusted by simply moving the position of the mold core. The operation is convenient, the practicability is strong, and the cost is low.

[0021] 2. In the utility model high-pressure forming mold, the aperture of the core assembly hole is larger than the aperture of the support seat assembly hole and the aperture of the lower mold assembly hole. When the assembly part is passed through the core assembly hole, the support seat assembly hole and the lower mold assembly hole in sequence, the assembly part leaves an adjustment gap in the core assembly hole. This design is conducive to adjusting the position of the core on the core support seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0023] Figure 2 The structure of the utility model is shown in FIG. Figure 1 ;

[0024] Figure 3 The structure of the utility model is shown in FIG. Figure 2 ;

[0025] Figure 4 It is a top view of the utility model;

[0026] Figure 5 for Figure 4 A cross-sectional view at position A shown;

[0027] Figure 6 for Figure 4 The cross-sectional view at position B shown;

[0028] Figure 7 This is a schematic diagram of the structure of the utility model without the upper die base and the air pressure manifold;

[0029] Figure 8 for Figure 7 The schematic diagram of the structure shown does not include the grid mounting plate, heat dissipation grid and film clamping plate. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with embodiments and drawings.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element; when an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, a high-pressure forming mold includes an upper mold base 1, a grid mounting plate 2, a film clamping plate 3, a plurality of mold cores 4 and a lower mold base 5, wherein the lower end surface of the upper mold base 1 is connected to the grid mounting plate 2, the lower end surface of the grid mounting plate 2 is connected to the film clamping plate 3, the lower end surface of the film clamping plate 3 is detachably connected to the lower mold base 5, and a movable gap 6 is provided between the plurality of mold cores 4; an air pressure diverter plate 8 is provided in the upper mold base 1; a heat dissipation grid 9 is installed on the grid mounting plate 2, and the The heat dissipation grid 9 is located between the air pressure diverter plate 8 and the core 4; the lower end of the core 4 is movably connected to a core support seat 10, and the core support seat 10 is movably installed in the lower mold seat 5; the lower end of the film clamping plate 3 is provided with a core groove 11, and the film clamping plate 3 is provided with a plurality of through holes 12, and the through holes 12 are communicated with the core groove 11, and the core 4 is located in the core groove 11, and an active interval 13 is provided between the outer side of the core 4 and an inner side of the core groove 11. The range of the active interval 13 in this embodiment is 1mm-4mm, which can be 1mm, 2mm, 3mm or 4mm, preferably 3mm. In actual production, the range of the active interval 13 can also be made according to actual needs.

[0034] It should be noted that the present embodiment is provided with a plurality of mold cores 4, which can process and mold a plurality of products at a time, thereby improving production efficiency; and a movable gap 6 is also provided between the plurality of mold cores 4, which is convenient for adjusting the position of the mold core 4. The movable gap 6 of the present embodiment ranges from 1 mm to 3 mm, and can be 1 mm, 2 mm or 3 mm, preferably 2 mm. In actual production, the range of the movable gap 6 can also be made according to actual needs.

[0035] like Figure 5 As shown, the mold core 4 is provided with a plurality of core assembly holes 14, the mold core support seat 10 is provided with a plurality of support seat assembly holes 15, and the lower mold seat 5 is provided with a plurality of lower mold assembly holes 16. The mold core assembly holes 14, the support seat assembly holes 15 and the lower mold assembly holes 16 are connected, and the mold core 4, the mold core support seat 10 and the lower mold seat 5 can be connected by assembly parts through the mold core assembly holes 14, the support seat assembly holes 15 and the lower mold assembly holes 16.

[0036] like Figure 5 and Figure 8 As shown, the diameter of the core assembly hole 14 is larger than the diameter of the support seat assembly hole 15 and the diameter of the lower mold assembly hole 16. When the assembly part passes through the core assembly hole 14, the support seat assembly hole 15 and the lower mold assembly hole 16 in sequence, the assembly part leaves an adjustment gap in the core assembly hole 14. The adjustment gap range of this embodiment is 1mm-3mm, which can be 1mm, 2mm or 3mm, preferably 1mm. This design is conducive to adjusting the position of the core 4 on the core support seat 10. In actual production, the adjustment gap range can also be made according to actual needs.

[0037] like Figure 2 As shown, a plurality of lower exhaust grooves 17 and lower through holes 18 are further provided in the lower die base 5 , and the lower exhaust grooves 17 are communicated with the lower through holes 18 .

[0038] like Figure 2 and Figure 3 As shown, it also includes an upper mold cavity 19 and a lower mold cavity 20, the upper mold cavity 19 is located in the upper mold base 1, the lower mold cavity 20 is located in the lower mold base 5, the air pressure diverter plate 8 is installed in the upper mold cavity 19, the core support base 10 is movably installed in the lower mold cavity 20, and the lower exhaust groove 17 is located in the lower mold cavity 20.

[0039] like Figure 2 As shown, the core support seat 10 is provided with a plurality of upper exhaust grooves 21 and upper through holes 22 , the upper exhaust grooves 21 are communicated with the upper through holes 22 , the upper through holes 22 are located above the lower through holes 18 , and the upper through holes 22 are communicated with the lower through holes 18 .

[0040] like Figure 1 As shown, a gap 23 is provided between the upper end of the mold core 4 and the other inner side of the core groove 11 , and the gap 23 enables the through hole 12 to communicate with the movable spacer 13 and the upper exhaust groove 21 , so that the air in the mold can be discharged smoothly through the lower through hole 18 .

[0041] It should be noted that after the product to be bonded is formed, a tool such as a push column can be used to sequentially pass through the lower through hole 18 and the upper through hole 22 to push the core mold 4 upward, so that the core mold 4 and the core mold support seat 10 can be separated from the lower mold seat 5 together, which is convenient to operate.

[0042] like Figure 2 and Figure 3As shown, the grid mounting plate 2 is provided with a plurality of grid clamping grooves 24 and a plurality of grid mounting holes 25, the grid clamping grooves 24 are in communication with the grid mounting holes 25, and the grid mounting holes 25 are located above the through-holes 12. The heat dissipation grid 9 plays a role in reducing the heat absorption of the film surface. The heat dissipation grid 9 includes a grid portion 26 and a clamping portion 27. During installation, the clamping portion 27 is arranged at both ends of the grid portion 26, and the grid portion 26 is located in the grid mounting hole 25, and one end of the clamping portion 27 is installed in the grid clamping groove 24. During installation, a fastener is used to fasten the clamping portion 27 in the grid clamping groove 24. The fasteners and assembly parts of this embodiment can be common fastening components such as screws or bolts.

[0043] like Figure 6 As shown, an air inlet channel 28 is also included, and an air inlet hole of the air inlet channel 28 is opened on the side wall of the upper mold base 1.

[0044] like Figure 3 As shown, the upper die base 1 is provided with an upper die assembly hole 29, and the air pressure manifold plate 8 is provided with a manifold plate assembly hole 30. Fasteners can be used to pass through the manifold plate assembly hole 30 and the upper die assembly hole 29 to install the air pressure manifold plate 8 in the upper die cavity 19 of the upper die base 1;

[0045] It should be further explained that a raised mounting portion 31 is provided inside the upper mold base 1. The raised mounting portion 31 allows a gap to be left between the air pressure diverter plate 8 and the upper mold base 1, so that the air outlet of the air inlet channel 28 is connected to the upper mold cavity 19 through the gap, thereby diverting the high-pressure gas input into the air inlet channel 28 to the product below.

[0046] like Figure 2 As shown, the upper end of the mold core 4 is provided with a bonding portion 32, and the bonding portion 32 is located in the perforation 12. The bonding portion 32 is used to place the film sheet to be bonded.

[0047] like Figure 2 As shown, the side of the upper die base 1 is provided with an upper limit groove 33, and the side of the lower die base 5 is provided with a lower limit groove 34. When the mold is closed, the limiter of the high pressure forming equipment presses against the upper limit groove 33 and the lower limit groove 34, thereby firmly limiting the position of the upper die base 1 and the lower die base 5, avoiding position deviation, and stabilizing the working process.

[0048] like Figure 2 As shown, a plurality of clamping plate connecting holes 35 are provided at both ends of the film clamping plate 3, so as to facilitate the clamping parts of the high-pressure forming equipment to lift or drop the film clamping plate 3.

[0049] like Figure 3As shown, the upper die base 1 is also provided with a first positioning hole 36 and a plurality of second positioning holes 37, the grid mounting plate 2 is also provided with a third positioning hole 38 and a plurality of fourth positioning holes 39, the film clamping plate 3 is also provided with a fifth positioning hole 40 and a plurality of sixth positioning holes 41, and the lower die base 5 is also provided with a seventh positioning hole 42 and a plurality of eighth positioning holes 43. The first positioning hole 36, the third positioning hole 38, the fifth positioning hole 40 and the seventh positioning hole 42 are connected, and the second positioning hole 37, the fourth positioning hole 39, the sixth positioning hole 41 and the eighth positioning hole 43 are connected. When the mold is closed, the positioning column of the equipment passes through the second positioning hole 37, the fourth positioning hole 39, the sixth positioning hole 41 and the eighth positioning hole 43 in sequence to position and fix the upper die base 1, the grid mounting plate 2, the film clamping plate 3 and the lower die base 5, thereby improving the working stability. At the same time, the limiting column is used to pass through the first positioning hole 36, the third positioning hole 38, the fifth positioning hole 40 and the seventh positioning hole 42 to further improve the stability.

[0050] like Figures 1 to 8 As shown, the working principle of the utility model is as follows:

[0051] The utility model is used in conjunction with high-pressure molding equipment. First, the film clamping plate 3 is lifted, and the core support seat 10 and the core 4 are placed on the lower mold seat 5 together. Then, the film sheet to be bonded is placed on the bonding portion 32 of the core 4, and then the film clamping plate 3 is lowered to close the mold between the upper mold seat 1 and the lower mold seat 5. The high-pressure gas is evenly distributed on the film sheet to be formed after passing through the air pressure diverter plate 8 from the air inlet channel 28, so that the film sheet is stretched downward and tightly attached to the bonding portion 32 of the core 4. At the same time, the gas in the mold is discharged to the outside through the lower through hole 18, and the molding operation of the product can be completed; finally, the film clamping plate 3 is lifted, and tools such as a push column are used to pass through the lower through hole 18 and the upper through hole 22 in sequence to push the core 4 upward, so that the core 4 and the core support seat 10 can be separated from the lower mold seat 5 together, and then the assembly parts are taken out, and the molded core 4 product can be separated from the core support seat 10.

[0052] The above description is only a preferred embodiment of the utility model and does not limit the utility model in any form. Any ordinary technician in the industry can smoothly implement the utility model as shown in the drawings of the specification and described above. However, any technician familiar with the profession can make some changes, modifications and equivalent changes made by using the technical content disclosed above without departing from the scope of the technical solution of the utility model, which are all equivalent embodiments of the utility model. At the same time, any changes, modifications and evolutions of any equivalent changes made to the above embodiments based on the essential technology of the utility model are still within the protection scope of the technical solution of the utility model.

Claims

1. A high pressure forming die, characterized in that: It includes an upper die base, a grid mounting plate, a film clamping plate, a plurality of mold cores and a lower die base, wherein the lower end surface of the upper die base is connected to the grid mounting plate, the lower end surface of the grid mounting plate is connected to the film clamping plate, the lower end surface of the film clamping plate is detachably connected to the lower die base, and a movable gap is provided between the plurality of mold cores; A gas pressure manifold is provided in the upper die seat; A heat dissipation grid is installed on the grid installation plate, and the heat dissipation grid is located between the air pressure manifold plate and the mold core; The lower end of the mold core is movably connected to a mold core support seat, and the mold core support seat is movably installed in the lower mold seat; A core groove is provided at the lower end of the film clamping plate, and a plurality of through holes are provided on the film clamping plate. The through holes are communicated with the core groove. The core is located in the core groove, and a movable gap is provided between the outer side of the core and an inner side of the core groove.

2. The high pressure forming die according to claim 1, characterized in that: A plurality of lower exhaust grooves and lower through holes are provided in the lower die base, and the lower exhaust grooves are communicated with the lower through holes.

3. The high pressure forming die according to claim 2, characterized in that: It also includes an upper mold cavity and a lower mold cavity, the upper mold cavity is located in the upper mold base, the lower mold cavity is located in the lower mold base, the air pressure diverter plate is installed in the upper mold cavity, the core support base is movably installed in the lower mold cavity, and the lower exhaust groove is located in the lower mold cavity.

4. The high pressure forming die according to claim 3, characterized in that: The core support seat is provided with a plurality of upper exhaust grooves and upper through holes, the upper exhaust grooves are communicated with the upper through holes, and the upper through holes are located above the lower through holes.

5. The high pressure forming die according to claim 4, characterized in that: The grid installation plate is provided with a plurality of grid clamping grooves and a plurality of grid installation holes, the grid clamping grooves are communicated with the grid installation holes, and the grid installation holes are located above the through holes.

6. The high pressure forming die according to claim 5, characterized in that: The heat dissipation grid includes a grid portion and a clamping portion, wherein the clamping portion is arranged at two ends of the grid portion, and the grid portion is located in the grid mounting hole, and one end of the clamping portion is installed in the grid clamping groove.

7. The high pressure forming die according to claim 6, characterized in that: It also includes an air intake channel, and the air intake hole of the air intake channel is opened on the side wall of the upper mold base.

8. The high pressure forming die according to claim 7, characterized in that: The upper end of the mold core is provided with a fitting portion, and the fitting portion can move in the perforation.

9. The high pressure forming die according to claim 8, characterized in that: The mold core is provided with a plurality of mold core assembly holes, the mold core support seat is provided with a plurality of support seat assembly holes, the lower mold seat is provided with a plurality of lower mold assembly holes, the mold core assembly hole, the support seat assembly hole and the lower mold assembly hole are connected, and the aperture of the mold core assembly hole is larger than the aperture of the support seat assembly hole and the lower mold assembly hole.

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