A pin-positioned thin-film electroplating conductive clip
By designing the pin positioning structure in the electroplating conductive clip, the problem of unsmooth clamping and closing clamping caused by acid mist crystallization is solved, and smooth operation during the electroplating process and the convenience of acid mist crystal cleaning is achieved.
Patent Information
- Application Number
- CN202420472590.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-03-12
AI Technical Summary
During the electroplating process, existing electroplating conductive clips are prone to cause unsmooth clamping and closing clips due to acid mist crystallization, which affects the plating quality.
A thin-film electroplating conductive clip with pin shaft positioning is designed. By setting the positioning boss and slide groove on the conductive lower clamp, and setting long groove positioning holes and limiting columns on the conductive upper clamp, combined with the design of the positioning pin shaft, ensuring that the conductive upper clamp slides smoothly in the slide groove and reducing friction.
It effectively reduces the contact area between the conductive upper clamp and the positioning pin shaft, reduces friction, ensures smooth opening and closing of the conductive clamp during the electroplating process, and simplifies the cleaning of acid mist crystals, avoiding the blind spots that are difficult to clean.
Smart Images
Figure CN222729926U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating equipment, in particular to a thin-film electroplating conductive clip positioned by a pin shaft. Background Art
[0002] In the electroplating industry, horizontal electroplating process and vertical electroplating process are two common and important electroplating methods. The horizontal electroplating process has occupied a place in the electroplating field with its unique operation mode. In order to achieve the automation and efficiency of the electroplating process, the drive devices are cleverly used in the horizontal electroplating process. These drives evenly clamp the edges of the film through well-designed clamps. These clamps not only ensure the stability of the film during the electroplating process, but also enable the film to run smoothly along the tank body in the electroplating tank. In this way, the film can complete the entire electroplating process in the electroplating tank, achieving uniformity and consistency of electroplating.
[0003] The horizontal electroplating process has a wide range of application prospects in the electroplating industry. Through its unique layout design and the application of the drive device, the horizontal electroplating process can realize the automation, efficiency and stabilization of the electroplating process. At the same time, the process also has the advantages of good electroplating uniformity and high production efficiency. It is one of the indispensable and important processes in the electroplating industry.
[0004] In the prior art, the lower clamp in the clamp is fixed on the steel belt. The lower film surface to be plated fits with the upper end surface of the lower clamp, and then moves downward through the upper clamp until the lower end surface of the upper clamp fits with the upper end surface of the film to be plated. In this way, the clamping of the film to be plated is completed. Generally, a guide wheel is set on the upper clamp, which cooperates with the guide rail to make the upper clamp move up and down, so that the clamp can be opened and closed. In general, the conductive clamp is designed with a flat plate contact between the upper clamp and the lower clamp. However, during the electroplating process, the ionization of the electroplating solution is easy to produce acid mist. The acid mist adheres to the conductive clamp and the conductive lower clamp to form acid mist crystals. The flat plate contact easily causes the conductive clamp to open and close unsmoothly, resulting in poor electroplating.
[0005] The above problems need to be solved urgently. Utility Model Content
[0006] In order to overcome the disadvantage of the prior art that the acid mist crystallization affects the smooth opening and closing of the conductive upper clamp and the conductive lower clamp, the utility model provides a pin-positioned thin-film electroplating conductive clamp.
[0007] The technical solution of the utility model is as follows:
[0008] A pin-positioned thin film electroplating conductive clip comprises a conductive upper clip and a conductive lower clip, the conductive lower clip is provided with a positioning boss, the positioning boss is provided with a slide groove and a positioning pin shaft, the slide groove is provided with a limit column, the conductive upper clip is provided with a long slot positioning hole, the conductive upper clip is embedded in the slide groove, and the limit column is inserted into the long slot positioning hole, the conductive upper clip can slide up and down along the slide groove to open and close the clamp; mounting holes are provided on both side walls of the slide groove, and the two ends of the positioning pin shaft are respectively inserted into the mounting holes and connected to the positioning boss, and the positioning pin shaft is located at the front side of the conductive upper clip to prevent the conductive upper clip from moving forward and backward.
[0009] Further, in one embodiment, the inner diameter of the mounting hole is larger than the diameter of the positioning pin shaft, and the positioning pin shaft can rotate in the mounting hole.
[0010] Furthermore, in one embodiment, fixing rings are provided at both ends of the positioning pin shaft, and the fixing rings are sleeved on the positioning pin shaft to prevent the positioning pin shaft from slipping out of the mounting hole.
[0011] Furthermore, in one embodiment, the long slot positioning hole is in a shape of being wider at the bottom and narrower at the top.
[0012] Furthermore, in one embodiment, there are multiple positioning bosses on the conductive lower clip.
[0013] Furthermore, in one embodiment, the limiting column is a cylinder.
[0014] Furthermore, in one embodiment, the conductive upper clamp and the conductive lower clamp are both provided with a sheath on the outer side of the clamping end, and the sheath is made of insulating material.
[0015] Furthermore, in one embodiment, the upper ends of the conductive lower clip and the conductive upper clip are both provided with binding posts, and the binding posts are used to connect wires.
[0016] Furthermore, in one embodiment, the contact surfaces of the clamping openings of the conductive upper clamp and the conductive lower clamp are upward convex arc surfaces.
[0017] The utility model according to the above scheme has the beneficial effect that the present application uses a positioning pin to restrict the conductive upper clip in the slide slot, the positioning pin is cylindrical, and the contact between it and the conductive upper clip is surface-line contact, which effectively reduces the contact area between it and the conductive upper clip, reduces the friction between the conductive upper clip and the positioning pin when the conductive upper clip slides up and down, and ensures smooth opening and closing of the conductive clip during electroplating. And because of the small contact area, it is more convenient to clean the acid mist crystals on the surface of the conductive clip, reducing the cleaning dead corners that are difficult to clean. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1It is a schematic diagram of the structure of the utility model;
[0019] Figure 2 for Figure 1 Exploded diagram of
[0020] Figure 3 for Figure 2 Enlarged view of part A.
[0021] In the figure, 100, conductive lower clamp; 110, positioning boss; 1101, slide groove; 1102, limit column; 1103, mounting hole; 120, positioning pin; 130, fixing ring; 200, conductive upper clamp; 210, long slot positioning hole; 300, terminal. DETAILED DESCRIPTION
[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation methods. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more centered elements can exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more centered elements can exist between them. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are for illustrative purposes only. Unless otherwise specified, "multiple" means two or more. The term "comprising" and any variation thereof are intended to be non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may exist or be added.
[0023] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internally connected between two components. All technical and scientific terms used in this specification have the same meaning as those generally understood by technicians in the technical field of the utility model. The terms used in the specification of the utility model are only for the purpose of describing specific embodiments and are not used to limit the utility model.
[0024] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0025] like Figure 1 and Figure 2As shown, a pin-positioned thin film electroplating conductive clip comprises a conductive upper clip 200 and a conductive lower clip 100, the conductive lower clip 100 is provided with a positioning boss 110, the positioning boss 110 is provided with a slide groove 1101 and a positioning pin 120, the slide groove 1101 is provided with a limiting column 1102, the conductive upper clip 200 is provided with a long slot positioning hole 210, the conductive upper clip 200 is embedded in the slide groove 1101, and the limiting column 1102 is plugged into the long slot positioning hole 210, the conductive upper clip 200 can slide up and down along the slide groove 1101 to open and close the clamp; mounting holes 1103 are provided on the two side walls of the slide groove 1101, and the two ends of the positioning pin 120 are respectively plugged into the mounting holes 1103 and connected to the positioning boss 110, and the positioning pin 120 is located at the front side of the conductive upper clip 200 to prevent the conductive upper clip 200 from moving forward and backward. In the present application, the upper end of the conductive upper clip 200 is embedded in the chute 1101, and can slide up and down along the chute 1101. The positioning pin 120 is arranged on the outer side of the conductive upper clip 200. The positioning pin 120 limits the conductive upper clip 200 in the chute 1101, so that it cannot move forward and backward. The positioning pin 120 is cylindrical, and the contact between it and the conductive upper clip 200 is surface line contact, which effectively reduces the contact area between it and the conductive upper clip 200. Since the size of the friction is proportional to the size of the contact area, the present application design reduces the friction between the conductive upper clip 200 and the positioning pin 120 when the conductive upper clip 200 slides up and down. When the conductive upper clip 200 has acid mist crystallization, it can also ensure that the conductive clip is opened and closed smoothly during electroplating. And because the contact area is small, it is more convenient to clean the acid mist crystallization on the surface of the conductive clip, and it is not easy to produce a hard-to-clean dead angle.
[0026] In a preferred embodiment, the inner diameter of the mounting hole 1103 is larger than the diameter of the positioning pin 120, and the positioning pin 120 can rotate in the mounting hole 1103. The positioning pin 120 forms a surface line contact with the outer surface of the conductive upper clip 200. When the conductive upper clip 200 starts to slide up and down, it drives the positioning pin 120 to rotate, and the friction between the two is sliding friction. If the positioning pin 120 is not rotatable, when the conductive upper clip 200 starts to slide up and down, the friction between the conductive upper clip 200 and the positioning pin 120 is static friction. Since the sliding friction is much smaller than the static friction, the rotatable fixed pin can reduce the friction between the conductive upper clip 200 when it starts to slide, so as to facilitate the uniform sliding of the conductive upper clip 200.
[0027] like Figure 2 and Figure 3As shown, in a preferred embodiment, both ends of the positioning pin 120 are provided with fixing rings 130, which are sleeved on the positioning pin 120 to prevent the positioning pin 120 from sliding out of the mounting hole 1103. The end points of both ends of the positioning pin 120 extend out of the mounting hole 1103, and the two fixing rings 130 are respectively fixed on both ends of the positioning pin 120 to prevent the positioning pin 120 from sliding left and right in the mounting hole 1103, and prevent the positioning pin 120 from sliding off the positioning boss 110 when the conductive upper clip 200 slides up and down.
[0028] In a preferred embodiment, the long slot positioning hole 210 is wide at the bottom and narrow at the top. During the opening process of the conductive clip, the conductive upper clip 200 moves upward, and the limiting column 1102 moves from the small end to the large end of the long slot positioning hole 210, and the gap becomes larger and larger, so that when the conductive upper clip 200 moves, the contact between the wall surface of the long slot positioning hole 210 and the cylindrical surface of the limiting column 1102 is reduced, thereby reducing the friction resistance. During the closing process of the conductive clip, the limiting column 1102 moves from the large end to the small end of the long slot positioning hole 210, and the gap becomes smaller and smaller, so that the conductive upper clip 200 is automatically aligned with the conductive lower clip 100, reducing the alignment error and ensuring the clamping effect. The center distance between the upper and lower arcs of the long slot positioning hole 210 is equivalent to the stroke of the conductive upper clip 200, which controls the lifting range of the conductive upper clip 200, thereby controlling the opening range of the conductive clip.
[0029] In a preferred embodiment, there are multiple positioning bosses 110 on the conductive lower clip 100. In this embodiment, there are two positioning bosses 110, so that the conductive upper clip 200 can slide up and down on the conductive lower clip 100 more stably and is not prone to forward and backward displacement.
[0030] In a preferred embodiment, the limiting column 1102 is a cylinder. The cylindrical limiting column 1102 allows the limiting column 1102 to form a surface-line contact with the long slot positioning 210, reducing the friction resistance between the two and facilitating the upward and downward movement of the conductive upper clip. The limiting column 1102 can also be hollow to reduce the weight of the positioning column, thereby reducing the overall weight of the conductive clip used in thin film electroplating, which is conducive to reducing production power consumption.
[0031] In a preferred embodiment, the conductive upper clip 200 and the conductive lower clip 100 are both provided with a sheath on the outer side of the clamping end, and the sheath is made of insulating material, so that the conductive upper clip 200 and the conductive lower clip 100 are only exposed at the part in contact with the film, ensuring good conductivity, and by providing the insulating material sheath to reduce the exposed position, reduce the deposition of the coating on the conductive clip, reduce the cleaning frequency, and reduce material waste.
[0032] In a preferred embodiment, the upper ends of the conductive lower clip 100 and the conductive upper clip 200 are both provided with a terminal 300, and the terminal 300 is used to connect the wire. The conductive lower clip 100 is connected to the cathode of the power supply, and the conductive upper clip 200 is electrically connected to the conductive lower clip 100 through the wire, so that the conductive upper clip 200 and the cathode of the power supply maintain a stable electrical connection, so that the upper and lower surfaces of the film can be well connected to the cathode of the power supply, thereby ensuring a good electroplating effect.
[0033] In a preferred embodiment, the contact surface of the clamping opening of the conductive upper clamp 200 and the conductive lower clamp 100 is an upward convex arc surface. The clamping contact surface of the conductive lower clamp 100 and the conductive upper clamp 200 is an arc surface that fits each other. When the two arc surfaces are in contact, they can be automatically aligned, so that the film can be better clamped.
[0034] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.
[0035] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.
Claims
1. A pin-positioned thin-film electroplating conductive clip, comprising a conductive upper clip and a conductive lower clip, characterized in that: The conductive lower clamp is provided with a positioning boss, a slide groove and a positioning pin are provided on the positioning boss, a limit column is provided in the slide groove, and the conductive upper clamp is provided with a long slot positioning hole, the conductive upper clamp is embedded in the slide groove, and the limit column is inserted into the long slot positioning hole, and the conductive upper clamp can slide up and down along the slide groove to open and close the clamp mouth; mounting holes are provided on both side walls of the slide groove, and both ends of the positioning pin are respectively inserted into the mounting holes and connected with the positioning boss, and the positioning pin is located at the front side of the conductive upper clamp to prevent the conductive upper clamp from moving forward and backward.
2. The pin-positioned thin-film electroplated conductive clip according to claim 1, characterized in that: The inner diameter of the mounting hole is larger than the diameter of the positioning pin shaft, and the positioning pin shaft can rotate in the mounting hole.
3. The pin-positioned thin-film electroplated conductive clip according to claim 2, characterized in that: Both ends of the positioning pin shaft are provided with fixing rings, and the fixing rings are sleeved on the positioning pin shaft to prevent the positioning pin shaft from slipping out of the mounting hole.
4. The pin-positioned thin-film electroplated conductive clip according to claim 1, characterized in that: The long slot positioning hole is in a shape that is wide at the bottom and narrow at the top.
5. The pin-positioned thin-film electroplated conductive clip according to claim 1, characterized in that: There are multiple positioning bosses on the conductive lower clip.
6. The pin-positioned thin-film electroplated conductive clip according to claim 1, characterized in that: The limiting column is a cylinder.
7. The pin-positioned thin-film electroplated conductive clip according to claim 1, characterized in that: The conductive upper clamp and the conductive lower clamp are both provided with sheaths on the outer sides of the clamping ends, and the sheaths are made of insulating material.
8. The pin-positioned thin-film electroplated conductive clip according to claim 1, characterized in that: The upper ends of the conductive lower clamp and the conductive upper clamp are both provided with binding posts, and the binding posts are used to connect wires.
9. The pin-positioned thin-film electroplated conductive clip according to claim 1, characterized in that: The contact surfaces of the clamping openings of the conductive upper clamp and the conductive lower clamp are upward convex arc surfaces.