Chip tinning equipment

Abstract

The utility model relates to the technical field of chip processing equipment, in particular to chip tinning equipment. Comprising a shell, a first through hole is formed in the outer wall of one side of the shell, a baffle is arranged on the first through hole, and a feeding plate is arranged on the edge of the bottom of the side, close to a shell cavity, of the baffle; and the two side walls, perpendicular to the baffle, of the feeding plate are slidably connected with the inner walls of the two sides of the first through hole, a plurality of sets of chip machining grooves are formed in the outer wall of the top of the feeding plate in the width direction of the feeding plate at equal intervals, and a set of electromagnets is arranged at the bottom of each set of chip machining groove. After the first tinning work is completed, the electromagnet is powered off to eliminate the adsorption of the electromagnet to the tin planting steel mesh, and the tin planting steel mesh is driven by the spring damping shock absorber to reset. And at the moment, the chip is detected through the camera, and if it is detected that tinning is incomplete, the second-time tinning work is carried out. The manual detection time is saved, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing equipment, in particular to a chip tinning equipment. Background Art

[0002] Chips are highly integrated integrated circuits, made up of a large number of transistors. Different chips have different integration scales, ranging from hundreds of millions to tens or hundreds of transistors. However, these circuits need pins to output and input signals, and the pins need to be connected to other electrical parts with tin to realize the function of the chip.

[0003] After searching, it is now confirmed that the publication number is CN218592019U, and the publication date is 2023-03-10. A patent document of a movable magnetic tinning table is provided, which includes a base, a movable magnet, a positioning plate and a tinning steel mesh. A slide groove is provided on the top surface of the base, and the movable magnet is slidably arranged in the slide groove. The positioning plate is placed on the base, and the tinning steel mesh is placed on the positioning plate. A plurality of chip slots are provided on the positioning plate. The device can support multiple chip tinning positions, save more mold materials, reduce the steps of placing and positioning multiple chips, and improve the efficiency of chip tinning.

[0004] The above embodiment still has the following defects:

[0005] After the chip tinning process is completed in the above embodiment, the chip needs to be manually taken out to check whether there is any leakage or cold soldering. If any leakage or cold soldering is found, the chip is put into the device for a second tinning process, which reduces production efficiency. Utility Model Content

[0006] In view of the above problems, the utility model provides a chip tinning device, comprising a shell, a first through hole is opened on one side outer wall of the shell, a baffle is arranged on the first through hole, a feed plate is arranged at the bottom edge of one side of the baffle close to the shell cavity; the feed plate is perpendicular to the two side walls of the baffle and is slidably connected with the two side inner walls of the first through hole, a plurality of groups of chip processing grooves are opened on the top outer wall of the feed plate along the width direction thereof at equal intervals, and a group of electromagnets are respectively arranged at the bottom of each group of chip processing grooves; the two opposite side inner walls of the shell are respectively A group of fourth electric slides are provided, and the fourth electric slides are horizontally arranged in a direction perpendicular to the second electric slides, and a group of cameras are slidably connected in each group of the fourth electric slides; a group of tin-planting steel meshes are provided in the cavity of the outer shell, and the tin-planting steel meshes are provided with the same number of tin-planting holes as the chip processing grooves, and each group of the tin-planting holes corresponds to directly above a group of chip processing grooves; a number of groups of spring damping shock absorbers are provided on the top outer wall of the outer shell, and the other ends of the several groups of spring damping shock absorbers are connected to the top of the tin-planting steel meshes.

[0007] Furthermore, a power control mechanism is provided on an outer wall of one side of the shell, a first electric slide is provided at the bottom of the cavity of the shell, and the bottom of the feed plate is slidably connected to the first electric slide; the first electric slide is electrically connected to the power control mechanism.

[0008] Furthermore, a second electric slide is arranged on the top inner wall of the shell, the second electric slide is horizontally arranged along the width direction of the shell, and the first sliding block is slidably connected inside the second electric slide.

[0009] Furthermore, an electric telescopic rod is provided at the bottom of the first sliding block, a tin coating gun is connected to the output end of the electric telescopic rod, and a scraper is provided on the side of the tin coating gun away from the first through hole.

[0010] Furthermore, a group of second through holes are respectively opened on two opposite side walls of the shell, and a group of exhaust fans are respectively arranged in each group of the second through holes.

[0011] Furthermore, a plurality of heat dissipation holes are provided on the tin-planting steel net around the tin-planting holes; and a third electric slide is provided on an inner wall of one side of the shell.

[0012] Furthermore, the third electric slide is vertically arranged along the height direction of the shell; the third electric slide is provided with a second slider, and the second slider is provided with a dust suction device.

[0013] Furthermore, the dust suction device is horizontally arranged in a direction perpendicular to the third electric slide, and a dust suction port is arranged on a side of the dust suction device close to the feed plate.

[0014] The beneficial effects of the utility model are:

[0015] 1. After the first tinning is completed, the electromagnet is powered off to eliminate its adsorption on the tinning steel mesh, and the tinning steel mesh is reset under the drive of the spring damping shock absorber. At this time, the chip is inspected by the camera. If it is detected that the tinning is incomplete, the second tinning work will be carried out. It saves the time of manual inspection and improves production efficiency.

[0016] 2. The dust suction device is driven to move to the top of the chip by the second slider. When the chip on the chip processing groove passes through the dust suction device, the dust on its surface is sucked away, thereby preventing the dust and metal debris on the chip surface from causing uneven tin on the chip surface during the tinning work. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic structural diagram of a tinning device according to an embodiment of the utility model is shown;

[0019] Figure 2 A front cross-sectional schematic diagram of a tinning device according to an embodiment of the utility model is shown;

[0020] Figure 3 An exploded schematic diagram of a feed plate according to an embodiment of the utility model is shown;

[0021] Figure 4 A left side cross-sectional schematic diagram of a tinning device according to an embodiment of the utility model is shown.

[0022] In the figure: 1. shell; 2. baffle; 3. feed plate; 4. exhaust fan; 5. dust suction device; 6. first electric slide; 7. electromagnet; 8. chip processing groove; 9. second electric slide; 10. electric telescopic rod; 11. tinning gun; 12. scraper; 13. camera; 14. spring damping shock absorber; 15. tinning hole; 16. heat dissipation vent; 17. third electric slide; 18. second slider; 19. tinning steel mesh; 131. fourth electric slide. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] The present utility model provides a chip tinning device, which is illustratively as follows: Figure 1 As shown. It comprises a housing 1, a power control mechanism is arranged on one side outer wall of the housing 1, a first through hole is opened on one side outer wall of the housing 1 close to the power control mechanism, a baffle 2 is arranged on the first through hole, and a feed plate 3 is arranged at the bottom edge of one side of the baffle 2 close to the cavity of the housing 1. The feed plate 3 is perpendicular to the two side walls of the baffle 2 and is slidably connected to the two side inner walls of the first through hole.

[0025] For example, Figure 2 and Figure 3 As shown. A first electric slide 6 is provided at the bottom of the cavity of the housing 1, and the bottom of the feed plate 3 is slidably connected to the first electric slide 6. The first electric slide 6 is electrically connected to the power control mechanism. A plurality of groups of chip processing grooves 8 are provided on the top outer wall of the feed plate 3 at equal intervals along its width direction, and a group of electromagnets 7 are provided at the bottom of each group of chip processing grooves 8. A second electric slide 9 is provided on the top inner wall of the housing 1, and the second electric slide 9 is horizontally arranged along the width direction of the housing 1. A first slider is slidably connected in the second electric slide 9, and an electric telescopic rod 10 is provided at the bottom of the first slider. A tinning gun 11 is connected to the output end of the electric telescopic rod 10, and a scraper 12 is provided on the side of the tinning gun 11 away from the first through hole. A group of fourth electric slides 131 are respectively provided on the inner walls on both sides of the opposite sides of the housing 1, and the fourth electric slides 131 are horizontally arranged in a direction perpendicular to the second electric slide 9, and a group of cameras 13 are slidably connected in each group of the fourth electric slides 131. A group of second through holes are respectively formed on two opposite side walls of the housing 1 , and a group of exhaust fans 4 are respectively disposed in each group of the second through holes.

[0026] For example, Figure 4 As shown. A group of tin-planting steel meshes 19 are arranged in the cavity of the shell 1, and the tin-planting steel meshes 19 are provided with the same number of tin-planting holes 15 as the chip processing grooves 8, and each group of the tin-planting holes 15 corresponds to the top of a group of chip processing grooves 8. The tin-planting steel meshes 19 are provided with a plurality of groups of heat dissipation air holes 16 around the tin-planting holes 15. A plurality of groups of spring damping shock absorbers 14 are arranged on the top outer wall of the shell 1, and the other ends of the plurality of groups of spring damping shock absorbers 14 are connected to the top of the tin-planting steel mesh 19. A third electric slide 17 is arranged on the inner wall of one side of the shell 1, and the third electric slide 17 is vertically arranged along the height direction of the shell 1. A second slider 18 is arranged on the third electric slide 17, and a dust suction device 5 is arranged on the second slider 18, and the dust suction device 5 is horizontally arranged in a direction perpendicular to the third electric slide 17, and a dust suction port is arranged on the side of the dust suction device 5 close to the feed plate 3.

[0027] Working principle: put the chip to be processed into the chip processing groove 8, drive the feed plate 3 into the cavity of the shell 1 through the first electric slide 6, and the second slider 18 drives the dust suction device 5 to move above the chip. When the chip on the chip processing groove 8 passes through the dust suction device 5, the dust on its surface is adsorbed away. The cleaned chip continues to move in the cavity of the shell 1 driven by the first electric slide 6 until the baffle 2 reaches the first through hole. At this time, the electromagnet 7 is started, and the tin-planting steel mesh 19 moves downward under the magnetic adsorption of the electromagnet 7 until it is close to the surface of the chip. Then the electric telescopic rod 10 drives the tin coating gun 11 and the scraper 12 to descend to the surface of the tin-planting steel mesh 19. The tin coating gun 11 is used to apply solder paste in the tin-planting hole 15 on the tin-planting steel mesh 19, and the tin is placed at the corresponding position of the chip. After the first tinning work is completed, the adsorption of the tin-planting steel mesh 19 is eliminated by turning off the power of the electromagnet 7, and the tin-planting steel mesh 19 is reset under the drive of the spring damping shock absorber 14. At this time, the chip is inspected by the camera 13, and if it is detected that the tinning is incomplete, a second tinning operation is performed.

[0028] Beneficial effects:

[0029] 1. After the first tinning is completed, the electromagnet 7 is powered off to eliminate its adsorption on the tinning steel mesh 19, and the tinning steel mesh 19 is reset under the drive of the spring damping shock absorber 14. At this time, the chip is inspected by the camera 13. If it is detected that the tinning is incomplete, the second tinning is carried out. This saves the time of manual inspection and improves production efficiency.

[0030] 2. The dust collecting device 5 is driven by the second slider 18 to move to the top of the chip. When the chip on the chip processing groove 8 passes through the dust collecting device 5, the dust on its surface is sucked away, thereby preventing the dust and metal debris on the chip surface from causing uneven tin on the chip surface during the tinning process.

[0031] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip tinning device, comprising a housing (1), characterized in that: A first through hole is provided on one side outer wall of the shell (1), a baffle (2) is provided on the first through hole, and a feed plate (3) is provided at the bottom edge of one side of the baffle (2) close to the cavity of the shell (1); the feed plate (3) is slidably connected to the inner walls of both sides of the first through hole perpendicular to the two side walls of the baffle (2), and a plurality of groups of chip processing grooves (8) are provided on the top outer wall of the feed plate (3) at equal intervals along its width direction, and a group of electromagnets (7) are respectively provided at the bottom of each group of chip processing grooves (8); a group of fourth electric slides (131) are respectively provided on the inner walls of the two opposite sides of the shell (1), and the fourth electric slide (1 31) is horizontally arranged in a direction perpendicular to the second electric slide (9), and each group of the fourth electric slide (131) is slidably connected to a group of cameras (13); a group of tin-planting steel meshes (19) are arranged in the cavity of the shell (1), and the tin-planting steel meshes (19) are provided with the same number of tin-planting holes (15) as the chip processing grooves (8), and each group of the tin-planting holes (15) corresponds to the top of a group of chip processing grooves (8); a plurality of groups of spring damping shock absorbers (14) are arranged on the top outer wall of the shell (1), and the other ends of the plurality of groups of spring damping shock absorbers (14) are connected to the top of the tin-planting steel mesh (19).

2. The chip tinning device according to claim 1, characterized in that: A power control mechanism is provided on one side outer wall of the shell (1), a first electric slide (6) is provided at the bottom of the cavity of the shell (1), and the bottom of the feed plate (3) is slidably connected to the first electric slide (6); the first electric slide (6) is electrically connected to the power control mechanism.

3. The chip tinning device according to claim 1, characterized in that: A second electric slide (9) is arranged on the top inner wall of the housing (1); the second electric slide (9) is arranged horizontally along the width direction of the housing (1); and a first sliding block is slidably connected inside the second electric slide (9).

4. The chip tinning device according to claim 3, characterized in that: An electric telescopic rod (10) is arranged at the bottom of the first sliding block, a tin coating gun (11) is connected to the output end of the electric telescopic rod (10), and a scraper (12) is arranged on the side of the tin coating gun (11) away from the first through hole.

5. The chip tinning device according to claim 1, characterized in that: A group of second through holes are respectively provided on two opposite side walls of the housing (1), and a group of exhaust fans (4) are respectively arranged in each group of the second through holes.

6. The chip tinning device according to claim 1, characterized in that: The tin-planting steel mesh (19) is provided with a plurality of groups of heat dissipation holes (16) around the tin-planting holes (15); and a third electric slide (17) is provided on an inner wall of one side of the housing (1).

7. The chip tinning device according to claim 6, characterized in that: The third electric slide (17) is vertically arranged along the height direction of the housing (1); a second sliding block (18) is arranged on the third electric slide (17), and a dust collecting device (5) is arranged on the second sliding block (18).

8. The chip tinning device according to claim 7, characterized in that: The dust suction device (5) is horizontally arranged in a direction perpendicular to the third electric slide (17), and a dust suction port is arranged on a side of the dust suction device (5) close to the feed plate (3).

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