A square chip diffraction time-of-flight ultrasonic detection probe

Abstract

The utility model relates to the field of TOFD detection, and in particular to a square chip diffraction time-of-flight ultrasonic detection probe. The detection probe is a TOFD probe, characterized in that the TOFD probe includes a TOFD probe body (101), and the chip at the end of the TOFD probe body (101) is a square chip (104). The utility model adopting the above technical solution has the following beneficial effects compared with the prior art: by changing the shape of the diffraction time-of-flight ultrasonic detection probe chip. The change in the shape of the probe reduces the tailing problem, and correspondingly reduces the measurement error in the defect length direction and reduces the detection blind area. 1. The tailing problem of the image is significantly reduced; 2. The resolution of the image is improved.

Description

Technical Field

[0001] The utility model relates to the TOFD detection field, in particular to a square chip diffraction time difference method ultrasonic detection probe. Background Art

[0002] TOFD is the abbreviation of Time Of Flight Diffraction, which is a non-destructive testing method that uses the time difference of ultrasonic diffraction for detection.

[0003] In the conventional round wafer TOFD probe, the half diffusion angle along the length of the weld is large during the scanning process, resulting in reduced resolution due to image tailing during the inspection process. It is difficult to distinguish some defects that are close to each other, resulting in defects with a certain distance being evaluated as one defect, causing unnecessary repairs and increasing manufacturing and installation costs. In addition, the existing round wafer probe has serious image tailing along the length of the weld and poor resolution.

[0004] Therefore, the defect of the prior art is that the existing circular wafer probe has a serious image tailing and poor resolution along the length direction of the weld. Utility Model Content

[0005] Purpose of the utility model: to provide a square wafer diffraction time-of-flight ultrasonic detection probe with better effect. The specific purpose can be seen in the multiple substantial technical effects of the specific implementation part.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A square chip time-of-flight diffraction ultrasonic detection probe is a TOFD probe, which is characterized in that the TOFD probe comprises a TOFD probe body 101, and the chip at the end of the TOFD probe body 101 is a square chip 104.

[0008] A further technical solution of the present invention is that the half diffusion angle of the square wafer 104 is 10.26°.

[0009] A further technical solution of the utility model is that the area of ​​the square wafer 104 is 20mm 2 .

[0010] A further technical solution of the present invention is that the size of the square wafer 104 is 2.0 mm wide and 10 mm long.

[0011] The utility model adopting the above technical solution has the following beneficial effects compared with the prior art: by changing the shape of the diffraction time difference method ultrasonic detection probe wafer. The change in the shape of the probe reduces the tailing problem and correspondingly reduces the measurement error in the defect length direction. 1. The image tailing problem is significantly reduced and the detection blind area is reduced; 2. The image resolution is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to further illustrate the present invention, the following is further described in conjunction with the accompanying drawings:

[0013] Figure 1 A schematic diagram of the structure of the front side of the invention;

[0014] Figure 2 A schematic diagram of the structure of the side surface of the invention;

[0015] Figure 3 A schematic diagram of the top view of the structure of the invention;

[0016] Figure 4 This is a schematic diagram of the blind area of ​​the diffraction time-of-flight ultrasonic detection probe;

[0017] Figure 5 is a schematic diagram of the detection process;

[0018] Figure 6 This is a comparison effect diagram of the first embodiment of the invention;

[0019] Figure 7 This is a comparison effect diagram of the second embodiment of the invention;

[0020] Wherein: 1.TOFD probe; 2.workpiece; 3.probe diffusion angle; 4.blind area; 5.welding area; 6.weld; 7.reflection space; 101.TOFD probe body; 102.probe fixing side; 103.fixing bolt; 104.square wafer. DETAILED DESCRIPTION

[0021] The present invention is further explained below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention. In the description of the present invention, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "top", "bottom", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be a connection between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0023] This patent provides a variety of parallel solutions. The different expressions are improved solutions or parallel solutions based on the basic solution. Each solution has its own unique characteristics. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. The fixing method not described in the text can be any fixing method such as thread fixing, bolt fixing or glue bonding.

[0024] The square chip probe has improved resolution along the length of the weld due to its small diffusion angle. Along the width of the weld, the chip width is consistent with the diameter of the conventional circular chip, so the sound beam coverage is almost the same. Ultimately, both the probe's emission energy and the coverage along the thickness of the weld are guaranteed.

[0025] The main purpose of the present invention is to solve the problem of probe image tailing along the length direction of the weld.

[0026] During the TOFD inspection process, in order to better cover the workpiece and reduce the blind area in the thickness direction of the workpiece, the blind area of ​​the probe is reduced when the sound beam diffusion angle is increased.

[0027] Conventional round wafer 7.5Mφ3mm probe in the workpiece thickness direction according to The half diffusion angle is 8.4° and the chip area is 7.065mm 2 .

[0028] Square wafer 7.5M2.0×10 in the workpiece thickness direction according to The half diffusion angle is 10.26° and the chip area is 20mm 2 This means that the square probe chip has a 1.86° larger half-diffusion angle than the circular probe chip, and the chip area is 12.935mm larger. 2 .

[0029] Along the weld direction square wafer probe 7.5M2.0×10 according to The half-diffusion angle is 2.052°, which is equivalent to that the half-diffusion angle of the square chip probe is 6.348° smaller than that of the circular chip probe.

[0030] Principle: When the moving direction of the probe device is consistent with the direction of the defect, and the edge of the probe sound beam reaches the boundary of the reflector, the sound path is the largest and the image has a tail. When the main sound beam direction of the probe is perpendicular to the length direction of the defect, the signals produce mutually canceling interference, so that the combined image given by the diffraction signals of each point in the middle of the defect is a straight line. Therefore, when the diffusion angle of the probe moving direction is reduced, the tail will be reduced accordingly, and the measurement error of the defect will also be reduced accordingly.

[0031] Embodiment 1: Combination Figure 6 The workpiece specification is DN450*12.5mm; the material is 20# steel; the groove form is V-shaped. From the figure below, it can be seen that the detection effect of the square chip probe is better than that of the round chip probe in terms of both resolution and defect tailing.

[0032] Embodiment 2: Combination Figure 7 The workpiece specification is DN450*9.6mm; the material is 20# steel; the groove form is V-shaped. From the figure below, it can be seen that the detection effect of the square chip probe is better than that of the round chip probe in terms of both resolution and defect tailing.

[0033] It should be noted that the multiple solutions provided by this patent include the basic solution itself, which are independent of each other and do not restrict each other, but they can also be combined with each other without conflict to achieve multiple effects together.

[0034] The basic principle, main features and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the protection required.

Claims

1. A square wafer time-of-flight diffraction ultrasonic detection probe, the detection probe is a TOFD probe, characterized in that: The TOFD probe comprises a TOFD probe body (101), and the chip at the end of the TOFD probe body (101) is a square chip (104); The half diffusion angle of the square wafer (104) is 10.26°; The area of ​​the square wafer (104) is 20 mm 2 ; The dimensions of the square wafer (104) are 2.0 mm wide and 10 mm long.

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