SMD packaging shell cleaning device
By designing an SMD package housing cleaning device that includes limit loading, drying and convenient transfer functions, the friction and transfer problems of package housing during cleaning in existing equipment are solved, and the cleaning quality and efficiency are improved.
Patent Information
- Application Number
- CN202421451419.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-06-24
AI Technical Summary
The existing SMD package housing cleaning equipment lacks a limit structure, which causes the package housing to easily rub during cleaning, and is inconvenient to transfer and drying, reducing cleaning efficiency and quality.
An SMD package housing cleaning device is designed, including a base, an ultrasonic cleaning machine, a loading assembly and a drying assembly. The loading assembly realizes limit loading of the package housing through the limit strip and the installation groove to avoid friction; the drying assembly realizes drying of the package housing through the fan and exhaust hood; and the transfer assembly realizes convenient transfer of the package housing through the electric slide rail and the electric cylinder.
Through limit loading and drying treatment, the cleaning quality and efficiency of the SMD package housing is improved, the wear of the package housing is reduced, and the transfer and drying process of the package housing is simplified.
Smart Images

Figure CN222753927U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of SMD packaging shells, in particular to a SMD packaging shell cleaning device. Background Art
[0002] Packaging is the process of assembling integrated circuits into chip final products. The SMD package shell needs to be cleaned with cleaning equipment to remove dust and stains when in use. Although the existing cleaning equipment can realize batch cleaning of the package shell, the package shell lacks a limiting structure during cleaning. The shell is prone to friction during cleaning and is inconvenient to transfer and dry, which reduces the cleaning efficiency and cleaning quality.
[0003] Patent No. CN220716947U proposes a cleaning device for SMD package shell, including a first side bracket, a second side bracket, a support frame and a water distribution device. The first side bracket and the second side bracket are arranged at intervals relative to each other. The support frame is a grid structure, and multiple support frames are provided. Each support frame is layered between the first side bracket and the second side bracket. The lower side of each support frame is provided with a water distribution device, which includes a connecting pipe and a water distribution pipe. One end of the connecting pipe is connected to the first side bracket, and the other end of the connecting pipe extends to the middle of the lower side of the support frame. The water distribution pipe is installed on the connecting pipe, and the connecting pipe is connected to the water distribution pipe. The connecting pipe is provided with a water inlet hole, and the water distribution pipe is provided with multiple water distribution holes, each of which is located on the lower side of the water distribution pipe. This cleaning device can realize batch cleaning of SMD package shells, effectively improve cleaning efficiency, and reduce labor costs.
[0004] There are some defects in the above patents. The shell is prone to friction during cleaning, and it is inconvenient to transfer and dry. Therefore, we need to propose an SMD package shell cleaning device. Utility Model Content
[0005] The utility model aims to provide a SMD package shell cleaning device, which has the advantages of improving cleaning quality and cleaning efficiency, so as to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an SMD package shell cleaning device, comprising a base and an ultrasonic cleaning machine, a support assembly for supporting the ultrasonic cleaning machine is installed on the top of the base, and the ultrasonic cleaning machine is embedded in the interior of the support assembly;
[0007] The cleaning chamber of the ultrasonic cleaning machine is provided with a loading component for limiting the loading of the SMD package shell to prevent excessive friction;
[0008] Support rods are installed on both sides of the top of the base, and a transfer assembly for adjusting and transferring the position of the loading assembly is installed on the top of the support rods, and the bottom of the transfer assembly is connected to the top of the loading assembly;
[0009] A drying component for drying the SND package shell is embedded inside the supporting component and located at a side away from the ultrasonic cleaning machine.
[0010] Preferably, the support assembly comprises a plate body, pillars are installed at the four corners of the bottom of the plate body, the bottom of the pillars is connected to the top of the base, and a water retaining ring is installed on the top of the plate body.
[0011] Preferably, the ultrasonic cleaning machine is embedded in one side of the plate body, the bottom of the ultrasonic cleaning machine is in contact with the top of the base, and the drying component is embedded in the other side of the plate body.
[0012] Preferably, the loading assembly includes a frame, in which mesh boxes are equidistantly embedded, the mesh boxes are located in a cleaning chamber of an ultrasonic cleaning machine, and limit bars are equidistantly installed inside the mesh boxes, with installation grooves formed between the limit bars for limiting the loading of the SMD package shell.
[0013] Preferably, a sealing plate is attached to the top of the frame, the top of the sealing plate is connected to the bottom of the transfer assembly, and a rotating rod is rotatably inserted into the top of the sealing plate.
[0014] Preferably, a handle is installed on the top of the rotating rod, a lock hole is opened on the top of the frame, positioning blocks are installed on both sides of the lock hole, and a lock rod that slides and fits with the bottom of the positioning block is installed at the bottom of the rotating rod.
[0015] Preferably, the transfer assembly includes an electric slide rail, the bottom of the electric slide rail is connected to the top of the support rod, the power output end of the electric slide rail is installed with an electric cylinder, and the power output end of the electric cylinder is connected to the top of the sealing plate.
[0016] Preferably, the drying assembly includes a drying box embedded in the other side of the top of the plate body, an exhaust hood is embedded in one side of the drying box, a fan is installed on the top of the base, and the exhaust end of the fan is connected to the outside of the exhaust hood.
[0017] Compared with the prior art, the beneficial effects of the utility model are:
[0018] 1. In the utility model, a mounting groove is formed between the limiting bars for limiting the loading of the SMD package shell. When in use, the package shell is placed in the mounting groove, and the position of the SMD package shell is limited by the mounting groove, so that excessive friction will not occur during cleaning, thereby preventing the SMD package shell from being worn and improving the cleaning quality.
[0019] 2. The utility model starts the fan, which transports external gas to the inside of the exhaust hood, and can blow the air into the mesh box through the exhaust hood, so that the SMD packaging shell in the mesh box can be dried, improving the cleaning efficiency. By setting a transfer component, the packaging shell can be easily transferred, improving the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the structure of the utility model;
[0021] Figure 2 For this utility model Figure 1 A partial enlarged schematic diagram of area A in the middle;
[0022] Figure 3 It is a side view structural schematic diagram of the drying box of the utility model;
[0023] Figure 4 It is a side view structural schematic diagram of the ultrasonic cleaning machine of the utility model;
[0024] Figure 5 It is a cross-sectional structural schematic diagram of the ultrasonic cleaning machine of the utility model;
[0025] Figure 6 It is a partial cross-sectional view of the sealing plate of the utility model.
[0026] In the figure: 1. base; 2. ultrasonic cleaning machine; 3. support rod; 4. plate body; 5. pillar; 6. water retaining ring; 7. frame; 8. mesh box; 9. limit strip; 10. sealing plate; 11. rotating rod; 12. handle; 13. lock hole; 14. positioning block; 15. locking rod; 16. electric slide rail; 17. electric cylinder; 18. drying box; 19. exhaust hood; 20. fan; 21. drain pipe; 22. water pump; 22. drain valve. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0028] See also Figure 1-6The utility model provides a technical solution: an SMD package shell cleaning device, including a base 1 and an ultrasonic cleaning machine 2, a support assembly for supporting the ultrasonic cleaning machine 2 is installed on the top of the base 1, and the ultrasonic cleaning machine 2 is embedded in the support assembly; the support assembly includes a plate body 4, and pillars 5 are installed at the four corners of the bottom of the plate body 4, the bottom of the pillar 5 is connected to the top of the base 1, and a water retaining ring 6 is installed on the top of the plate body 4. The water retaining ring 6 and the plate body 4 are provided to prevent the cleaning water from flowing freely.
[0029] The ultrasonic cleaning machine 2 is embedded in one side of the plate body 4, and the bottom of the ultrasonic cleaning machine 2 is in contact with the top of the base 1. The ultrasonic cleaning machine 2 can be supported by providing the plate body 4.
[0030] Furthermore, a loading assembly for limiting the loading of the SMD package shell to prevent excessive friction is provided in the cleaning chamber of the ultrasonic cleaning machine 2; the loading assembly includes a frame 7, and a mesh box 8 is equidistantly embedded inside the frame 7. The mesh box 8 is located in the cleaning chamber of the ultrasonic cleaning machine 2, and limit bars 9 are equidistantly installed inside the mesh box 8. A mounting groove for limiting the loading of the SMD package shell is formed between the limit bars 9. When in use, the package shell is placed in the mounting groove, and the position of the SMD package shell is limited by the mounting groove, so that excessive friction will not occur during cleaning, thereby preventing the SMD package shell from being worn and improving the cleaning quality.
[0031] Specifically, a sealing plate 10 is attached to the top of the frame 7, the top of the sealing plate 10 is connected to the bottom of the transfer assembly, and a rotating rod 11 is rotatably inserted at the top of the sealing plate 10. A handle 12 is installed on the top of the rotating rod 11, a locking hole 13 is opened on the top of the frame 7, and positioning blocks 14 are installed on both sides of the locking hole 13. A locking rod 15 that slides and fits with the bottom of the positioning block 14 is installed at the bottom of the rotating rod 11. The rotating rod 11 is rotated by the handle 12, and the rotating rod 11 drives the locking rod 15 to rotate, and the locking rod 15 is staggered with the positioning block 14, so that the sealing plate 10 can be separated from the frame 7, and the SMD package shell in the mesh box 8 can be taken out, thereby achieving the purpose of convenient loading and unloading.
[0032] Furthermore, support rods 3 are installed on both sides of the top of the base 1, and a transfer assembly for adjusting and transferring the position of the loading assembly is installed on the top of the support rods 3, and the bottom of the transfer assembly is connected to the top of the loading assembly; the transfer assembly includes an electric slide rail 16, the bottom of the electric slide rail 16 is connected to the top of the support rod 3, and an electric cylinder 17 is installed at the power output end of the electric slide rail 16, and the power output end of the electric cylinder 17 is connected to the top of the sealing plate 10. By starting the electric cylinder 18, the power output end of the electric cylinder 18 drives the sealing plate 10, the frame 7 and the mesh box 8 to move, and can enter or leave the cleaning chamber of the ultrasonic cleaning machine 2.
[0033] It is worth noting that a drying component for drying the SND package shell is embedded inside the support component and located on a side away from the ultrasonic cleaning machine 2, and the drying component is embedded on the other side of the plate body 4. By starting the ultrasonic cleaning machine 2, the SMD package shell in the mesh box 8 can be cleaned, and after cleaning, the mesh box 8 can be transferred to the drying box 18 through the transfer component. The dripping water can be discharged through the drain pipe 21 on one side of the drying box 18.
[0034] Furthermore, the drying assembly includes a drying box 18 embedded in the other side of the top of the plate body 4, an exhaust hood 19 is embedded in one side of the drying box 18, a fan 20 is installed on the top of the base 1, and the exhaust end of the fan 20 is connected to the outside of the exhaust hood 19. By starting the fan 20, the fan 20 transports the external gas to the inside of the exhaust hood 19, and the air flow can be blown into the mesh box 8 through the exhaust hood 19, so that the SMD package shell in the mesh box 8 can be dried, thereby improving the cleaning efficiency.
[0035] In addition, a water pump 21 is installed outside the ultrasonic cleaning machine 2. The water pump 21 can inject cleaning liquid into the cleaning chamber of the ultrasonic cleaning machine 2, and a drain valve 22 for discharging waste water is connected below the water pump 21.
[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A SMD package shell cleaning device, comprising a base (1) and an ultrasonic cleaning machine (2), characterized in that: A support assembly for supporting an ultrasonic cleaning machine (2) is installed on the top of the base (1), and the ultrasonic cleaning machine (2) is embedded inside the support assembly; The cleaning chamber of the ultrasonic cleaning machine (2) is provided with a loading component for limiting the loading of the SMD package shell to prevent excessive friction; Support rods (3) are installed on both sides of the top of the base (1), and a transfer assembly for adjusting and transferring the position of the loading assembly is installed on the top of the support rods (3), and the bottom of the transfer assembly is connected to the top of the loading assembly; A drying component for drying the SND package shell is embedded inside the support component and on a side away from the ultrasonic cleaning machine (2).
2. The SMD package shell cleaning device according to claim 1, characterized in that: The support assembly comprises a plate body (4), pillars (5) are installed at the four corners of the bottom of the plate body (4), the bottom of the pillar (5) is connected to the top of the base (1), and a water retaining ring (6) is installed on the top of the plate body (4).
3. The SMD package shell cleaning device according to claim 2, characterized in that: The ultrasonic cleaning machine (2) is embedded in one side of the plate body (4), the bottom of the ultrasonic cleaning machine (2) is in contact with the top of the base (1), and the drying component is embedded in the other side of the plate body (4).
4. The SMD package shell cleaning device according to claim 3, characterized in that: The loading assembly comprises a frame (7), mesh boxes (8) are equidistantly embedded inside the frame (7), the mesh boxes (8) are located in a cleaning chamber of an ultrasonic cleaning machine (2), and limit bars (9) are equidistantly installed inside the mesh boxes (8), and mounting grooves for limiting loading of SMD package shells are formed between the limit bars (9).
5. The SMD package shell cleaning device according to claim 4, characterized in that: A sealing plate (10) is attached to the top of the frame (7), the top of the sealing plate (10) is connected to the bottom of the transfer assembly, and a rotating rod (11) is rotatably inserted into the top of the sealing plate (10).
6. The SMD package shell cleaning device according to claim 5, characterized in that: A handle (12) is installed on the top of the rotating rod (11), a locking hole (13) is opened on the top of the frame (7), positioning blocks (14) are installed on both sides of the locking hole (13), and a locking rod (15) is installed at the bottom of the rotating rod (11) and is slidably fitted with the bottom of the positioning block (14).
7. The SMD package shell cleaning device according to claim 6, characterized in that: The transfer assembly comprises an electric slide rail (16), the bottom of the electric slide rail (16) is connected to the top of the support rod (3), the power output end of the electric slide rail (16) is installed with an electric cylinder (17), and the power output end of the electric cylinder (17) is connected to the top of the sealing plate (10).
8. The SMD package shell cleaning device according to claim 7, characterized in that: The drying assembly comprises a drying box (18) embedded on the other side of the top of the plate body (4), an exhaust hood (19) is embedded on one side of the drying box (18), a fan (20) is installed on the top of the base (1), and the exhaust end of the fan (20) is connected to the outer side of the exhaust hood (19).