Heating structure and thin film deposition equipment

Abstract

The utility model provides a heating structure and thin film deposition equipment, the heating structure comprises a mica sheet and a heating wire, one side surface of the mica sheet is provided with a heating surface, the heating surface is provided with grooves, and the grooves extend on the heating surface and are uniformly distributed on the heating surface; and the heating wire is embedded into the groove along the extending path of the groove. The heating surface is arranged on one side surface of the mica sheet, the grooves are uniformly distributed in the heating surface, and the heating wires are embedded into the grooves along the extension paths of the grooves, so that the heating wires are uniformly and tightly wound on the mica sheet; therefore, the heating of the heating wire is more uniform, and the heating efficiency is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a heating structure and a thin film deposition device. Background Art

[0002] With the continuous advancement of semiconductor coating technology, the requirements for coating thickness and uniformity are becoming more and more stringent. Among them, temperature has a great influence on the process performance of coating, such as heating temperature, heating efficiency, heating uniformity, etc. Among them, the degree of heating uniformity directly determines the quality of coating. At present, heating rods are usually used for heating, but the heating method of heating rods is uneven and the heating efficiency is low. In order to meet the heating requirements, it can only be achieved by increasing the heating power, which is not energy-saving. Utility Model Content

[0003] The embodiments of the utility model provide a heating structure and a thin film deposition device, so as to improve the heating efficiency and heating uniformity of the heating structure while maintaining energy saving, thereby improving the heating efficiency and product quality of the thin film deposition device.

[0004] The utility model provides a heating structure, which comprises:

[0005] A mica sheet, one side of which is provided with a heating surface, the heating surface is provided with grooves, the grooves extend on the heating surface and are evenly distributed on the heating surface;

[0006] A heating wire is embedded in the groove along an extension path of the groove.

[0007] In the heating structure provided by the utility model, the extension path of the groove is in a maze shape.

[0008] In the heating structure provided by the utility model, the heating structure further comprises two insulating members, and the two insulating members are respectively covered on both side surfaces of the mica sheet.

[0009] In the heating structure provided by the utility model, the heating structure further comprises two fixing members, and the two fixing members are respectively covered on both sides of the two insulating members.

[0010] In the heating structure provided by the utility model, the fixing piece is made of stainless steel.

[0011] In the heating structure provided by the utility model, the heating structure includes a locking hole, which passes through the two fixing parts, the two insulating parts and the mica sheet, and is fastened to the locking hole by a fastener to fix the two fixing parts, the two insulating parts and the mica sheet.

[0012] In the heating structure provided by the utility model, the heating structure also includes a through hole, which passes through the two fixing members, the two insulating members and the mica sheet, and is fastened to the through hole by bolts to fix the heating structure and other structural members.

[0013] In the heating structure provided by the utility model, the heating structure further comprises an escape opening, and the escape opening is formed by being recessed inwards along the outer edges of the two fixing members, the two insulating members and the mica sheet.

[0014] The heating structure provided by the utility model includes a first mounting component and a second mounting component, wherein the first mounting component and the second mounting component both include the mica sheet, the two insulating parts covering the two sides of the mica sheet, and the two fixing parts covering the two sides of the two insulating parts; wherein the first mounting component and the second mounting component both have a semicircular arc structure.

[0015] The utility model also provides a thin film deposition device, which includes:

[0016] roof;

[0017] A heating structure, wherein the heating structure is any of the heating structures described above, and the heating structure is fixedly connected to the top plate.

[0018] The utility model provides a heating structure and a thin film deposition device, wherein the heating structure comprises a mica sheet and a heating wire, a heating surface is provided on one side surface of the mica sheet, a groove is provided on the heating surface, the groove extends on the heating surface and is evenly distributed on the heating surface; the heating wire is embedded in the groove along the extension path of the groove. The present application provides a heating surface on one side surface of the mica sheet, a groove is provided on the heating surface, the groove extends evenly and covers the heating surface, and the heating wire is embedded in the groove along the extension path of the groove, so that the heating wire is evenly and tightly wound on the mica sheet, so that the heating of the heating wire is more even and the heating efficiency is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a structural diagram of the heating structure in the embodiment of the utility model;

[0021] Figure 2This is a structural diagram of a mica sheet in an embodiment of the utility model;

[0022] Figure 3 This is a structural diagram of the first insulating member in an embodiment of the utility model;

[0023] Figure 4 This is a structural diagram of the second insulating member in the embodiment of the utility model;

[0024] Figure 5 This is a structural diagram of the first fixing member in the embodiment of the utility model;

[0025] Figure 6 This is a structural diagram of the second fixing member in the embodiment of the utility model;

[0026] Figure 7 It is an assembly diagram of the top plate and the heating structure in the embodiment of the utility model;

[0027] The reference numerals in the figures are:

[0028] 100, heating structure; 110, mica sheet; 111, groove; 120, heating wire; 130, insulating member; 131, first insulating member; 132, second insulating member; 140, fixing member; 141, first fixing member; 142, second fixing member; 150, locking hole; 160, through hole; 170, avoidance; 181, ceramic column; 182, network cable; 183, electrical connector; 200, top plate; 210, side wall. DETAILED DESCRIPTION

[0029] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.

[0030] Reference Figures 1 to 7 As shown, it shows an embodiment of the heating structure 100 and thin film deposition equipment of the utility model. The heating structure 100 includes a mica sheet 110 and a heating wire 120. A heating surface is provided on one side of the mica sheet 110. The heating surface is provided with grooves 111. The grooves 111 extend on the heating surface and are evenly distributed on the heating surface. The heating wire 120 is embedded in the groove 111 along the extension path of the groove 111.

[0031] Specifically, the mica sheet 110 has insulation, high temperature resistance and low loss thermal resistance functions. One side of the mica sheet 110 is set as a heating surface, and the heating surface is used to heat the heated object. A groove 111 is set on the heating surface, and the groove 111 extends from one end of the heating surface to the other end, and evenly fills the heating surface, that is, the heating surface of the mica sheet 110 is evenly covered with the grooves 111, and the grooves 111 are used to accommodate the heating wire 120; the extension path of the groove 111 refers to the path of the groove 111 extending from one end of the heating surface to the other end of the mica sheet 110, and the heating wire 120 is embedded in the groove 111 along the extension path of the groove 111, so that the heating wire 120 is fixed on the mica sheet 110, and because the grooves 111 are evenly covered with the heating surface, the heating wire 120 120 is embedded in the groove 111 along the extension path of the groove 111, and the heating wire 120 is evenly distributed on the heating surface. When the heating structure 100 is powered on, the heating wire 120 generates heat, so that the heating wire 120 is evenly heated on the heating surface, thereby improving the heating uniformity of the heating structure 100; and the heating wire 120 is embedded in the groove 111, so that the mica sheet 110 equipped with the heating wire 120 is in a flat state, so that the mica sheet 110 and other structural parts are in close contact, and the heating surface is a surface structure, so the heating structure and the heated object are in surface contact, thereby increasing the heat conduction area of ​​the heating structure 100, so as to improve the heating efficiency of the heating structure 100; at the same time, the heating wire 120 is embedded in the mica sheet 110 to increase the service life of the heating structure 100.

[0032] In particular, the mica sheet 110 is a planar structure. In this embodiment, the groove 111 is dug on the mica sheet 110 by machining, and the groove 111 is extended from one end of the heating surface to the other end. The groove 111 evenly fills the heating surface, so the groove 111 fills the heating surface uninterruptedly and as much as possible, so that when the heating wire 120 is installed in the groove 111, only one heating wire 120 is embedded from one end of the heating surface to the other end of the heating surface along the extension path of the groove 111, thereby ensuring that the heating wire 120 is evenly and covers the heating surface as much as possible, so as to improve the heating uniformity of the mica sheet 110, and at the same time facilitate the installation of the heating wire 120 into the groove 111 and improve the structural stability of the mica sheet 110.

[0033] Meanwhile, in the selection of the heating wire 120 , the user can select a suitable resistance heating wire 120 according to specific temperature requirements, and embed and wind the heating wire 120 on the mica sheet 110 .

[0034] The present application provides a heating surface on one side of the mica sheet 110, and opens a groove 111 on the heating surface. The groove 111 extends evenly and covers the heating surface, and the heating wire 120 is embedded in the groove 111 along the extension path of the groove 111, so that the heating wire 120 is evenly and tightly wound on the mica sheet 110, so that the heating of the heating wire 120 is more even and the heating efficiency is higher.

[0035] In one embodiment, referring to Figure 2 As shown, the extension path of the groove 111 is in a maze shape. Specifically, the extension path of the groove 111 is in a maze shape, that is, one end of the groove 111 starts from one end of the heating surface, and is extended along the shape of the heating surface in a maze structure on the heating surface, so that the groove 111 fills the heating surface evenly and as much as possible, until the other end of the groove 111 is located at the other end of the heating surface. At this time, the shape of the groove 111 is an uninterrupted and complex maze structure, and the maze structure is mainly in an "S" shape. The heating wire 120 is arranged along the structure of the groove 111. Embedded in the groove 111, the heating wire 120 per unit area on the mica sheet 110 can be more tightly and evenly embedded in the mica sheet 110, further improving the heating uniformity of the heating structure 100; and the maze structure has a complete path, so a heating wire 120 can be embedded and wound from one end of the heating surface to the other end of the heating surface along the extension path of the groove 111, which is convenient for winding the heating wire 120, while improving the heating uniformity of the heating structure 100 and simplifying production.

[0036] In one embodiment, referring to Figure 3 and Figure 4 As shown, the heating structure 100 further includes two insulating members 130, which are respectively covered on the two sides of the mica sheet 110. Specifically, the heating structure 100 further includes two insulating members 130, which are used to prevent the heating wire 120 from leaking electricity to the outside when it is powered on for heating. The heating wire 120 is embedded in the groove 111, that is, the heating wire 120 is wound around the heating surface, and the two insulating members 130 are respectively covered on the two side surfaces of the mica sheet 110. The two insulating members 130 are respectively in close contact with the two side surfaces of the mica sheet 110 and are fixedly connected, so that the mica sheet 110 embedded with the heating wire 120 is sandwiched between the two insulating members 130, and the heating wire 120 is insulated to prevent leakage.

[0037] In particular, the insulating member 130 in this embodiment is made of mica material, and includes a first insulating member 131 and a second insulating member 132. The first insulating member 131 is tightly connected to one side of the mica sheet 110 where the heating wire 120 is embedded, and the second insulating member 132 is connected to the other side of the mica sheet 110.

[0038] In a specific embodiment, refer to Figure 5 and Figure 6 As shown, the heating structure 100 further includes two fixing members 140, which are respectively covered on both sides of the two insulating members 130. Specifically, the heating structure 100 further includes two fixing members 140, which are used to fix the two insulating members 130 and the mica sheet 110, and to fix the heating structure 100 with other structural members; the two fixing members 140 are respectively covered on both sides of the two insulating members 130, that is, the two fixing members 140 are respectively arranged on one side of the two insulating members 130 away from the mica sheet 110, so as to protect the insulating members 130 and the mica sheet 110 and improve the service life of the heating mechanism; at the same time, the two insulating members 130 and the mica sheet 110 are fixed between the two fixing members 140, so as to facilitate the installation of the heating structure 100 and improve the production efficiency.

[0039] The fixing member 140 includes a first fixing member 141 and a second fixing member 142 . The first fixing member 141 is connected to the first insulating member 131 , and the second fixing member 142 is connected to the second insulating member 132 .

[0040] In particular, the heating structure 100 is a five-layer structure, that is, the heating structure 100 is the mica sheet 110 with the heating wire 120, the two insulating members 130 and the two fixing members 140, and the mica sheet 110 is used as a symmetry axis, the two insulating members 130 and the two fixing members 140 are symmetrically arranged on both sides of the mica sheet 110, and the five-layer structure of the heating structure 100 is, from top to bottom, the first fixing member 141, the first insulating member 131, the fixing member 141 embedded with the heating wire 120, and the two insulating members 130 and the fixing member 140 are symmetrically arranged on both sides of the mica sheet 110. The mica sheet 110, the second insulating member 132 and the second fixing member 142 of the heating wire 120 are connected to the heating structure 100; thus, the heating temperature of the heating structure 100 can be heated to 500°C, and the power is 1.8KW, so as to provide a heating structure 100 with high heating performance, and the heating structure 100 is a planar structure, so that the heating structure 100 can be in surface contact with the heated object, so that the heating area of ​​the heated object is increased to improve the heating efficiency of the heating structure 100. Among them, the mica sheet 110 with the heating wire 120, the two insulating members 130 and the two fixing members 140 have the same shape, so that the structural stability of the fixedly connected mica sheet 110, the two insulating members 130 and the two fixing members 140 is higher.

[0041] In one embodiment, the fixing member 140 is made of stainless steel. Specifically, the heating structure 100 is applied to an annular thin film deposition device, so as to facilitate semiconductor coating. The outer ring of the top plate 200 of the thin film deposition device is heated, so the heating structure 100 is fixed on the outer ring of the top plate 200, and the side wall 210 of the top plate 200 is passed with radio frequency current. Since the current of the heating wire 120 after being energized will generate a magnetic field, the magnetic field will interfere with the radio frequency current. In order to avoid the magnetic field of the heating wire 120 after being energized from interfering with the radio frequency current, the fixing member 140 is set to be made of stainless steel, and the two insulating members 130 and the mica sheet 110 embedded with the heating wire 120 are fixed between the two fixing members 140, so that the two fixing members 140 can shield the magnetic field generated by the current of the heating wire 120 after being energized, so that the heating structure 100 will not interfere with the radio frequency current, so the fixing member 140 has a shielding effect, making the structure of the thin film deposition device more stable.

[0042] In a specific embodiment, refer to Figures 1 to 6As shown, the heating structure 100 includes a locking hole 150, which passes through the two fixing members 140, the two insulating members 130 and the mica sheet 110, and is fastened to the locking hole 150 by a fastener to fix the two fixing members 140, the two insulating members 130 and the mica sheet 110. Specifically, the locking hole 150 is used to be fixed with a fastener to fix the two fixing members 140, the two insulating members 130 and the mica sheet 110, that is, in this embodiment, the two fixing members 140, the two insulating members 130 and the mica sheet 110 are fixed by riveting; the mica sheet 110 embedded with the heating wire 120 is used as a symmetric axis, the two insulating members 130 and the two fixing members 140 are respectively arranged on both sides of the mica sheet 110, and the locking hole 150 passes through the two fixing members 140, the two insulating members 130 and the mica sheet 110. That is, the locking hole 150 passes through the first insulating member 131, the mica sheet 110, the second insulating member 132 and the second fixing member 142 respectively from one end of the first fixing member 141, and then one end of the fastener passes through the locking hole 150 from one end of the locking hole 150 and is located at the other end of the locking hole 150, and finally the fastener is locked and fixed with the locking hole 150, so that the two fixing members 140, the two insulating members 130 and the mica sheet 110 are fixedly connected in sequence. This fixing method is simple, so that the installation of the heating structure 100 is simple and convenient.

[0043] In particular, the locking hole 150 is provided with a thread; the heating structure 100 is provided with a plurality of the locking holes 150, and the plurality of locking holes 150 are arranged at circumferential intervals along the two fixing members 140, the two insulating members 130 and the mica sheet 110, thereby improving the fastening degree of the fastener and the locking hole 150, so that the fastening between the two fixing members 140, the two insulating members 130 and the mica sheet 110 is more stable, thereby improving the structural stability of the heating structure 100.

[0044] In one embodiment, referring to Figures 1 to 6As shown, the heating structure 100 further includes a through hole 160 , which passes through the two fixing members 140 , the two insulating members 130 and the mica sheet 110 , and is fixedly connected to the heating structure 100 and other structural members by bolts fastened to the through hole 160 . Specifically, the through hole 160 is used to be fastened with the bolt to fix the heating structure 100 and other structural parts. The through hole 160 passes through the two fixing parts 140, the two insulating parts 130 and the mica sheet 110, that is, the through hole 160 passes through the first insulating part 131, the mica sheet 110, the second insulating part 132 and the second fixing part 142 respectively from one end of the first fixing part 141; wherein the two fixing parts 140, the two insulating parts 130 and the mica sheet 110 after fastening are fixed to the other structural parts by the connection between the bolt and the through hole 160. In the present embodiment, the other structural parts refer to the top plate 200 of the thin film deposition equipment, and the fixed connection method between the heating structure 100 and the other structural parts is simple.

[0045] In particular, a plurality of through holes 160 are provided, and the plurality of through holes 160 are evenly spaced apart, thereby improving the fastening degree between the heating structure 100 and the other structural components and improving the structural stability of the thin film deposition device.

[0046] In a specific embodiment, refer to Figures 1 to 7 As shown, the heating structure 100 further includes an escape opening 170, and the escape opening 170 is formed by being recessed inwardly along the outer edges of the two fixing members 140, the two insulating members 130, and the mica sheet 110. Specifically, the heating structure 100 is applied to an annular thin film deposition device, so as to facilitate semiconductor coating. The outer ring of the top plate 200 of the thin film deposition device is heated, so the heating structure 100 is fixed on the outer ring of the top plate 200, and the side wall 210 of the top plate 200 is passed with radio frequency current, and the escape opening 170 is used to avoid the side wall 210 of the top plate 200; the escape opening 170 is formed by being recessed inwardly along the outer edges of the two fixing members 140, the two insulating members 130, and the mica sheet 110, The avoidance opening 170 passes through the two fixing members 140, the two insulating members 130 and the mica sheet 110, and the outer edge refers to the edge of one side of the two fixing members 140, the two insulating members 130 and the mica sheet 110 away from their respective centers of circles. Therefore, when installing the heating structure 100 to the top plate 200, the avoidance opening 170 can avoid the side wall 210 of the top plate 200, which is convenient for fixing and connecting the heating structure 100 and the top plate 200, and the structural stability of the heating structure is higher.

[0047] In a specific embodiment, refer to Figure 2 As shown, it includes a first mounting component and a second mounting component, and the first mounting component and the second mounting component both include the mica sheet 110, the two insulating members 130 covering the two sides of the mica sheet 110, and the two fixing members 140 covering the two sides of the two insulating members 130; wherein, the first mounting component and the second mounting component are both semicircular arc structures. Specifically, the heating structure 100 is applied to an annular thin film deposition device, so as to facilitate semiconductor coating. The outer ring of the top plate 200 of the thin film deposition device is heated. Due to the complex structure of the outer ring of the top plate 200, when the heating structure 100 is installed on the top plate 200 of the thin film deposition device, it is necessary to consider the installation problem of the heating structure 100 and the problem that the heating structure 100 is easily deformed after generating heat. Therefore, the present embodiment is provided with a first mounting component and a second mounting component, and the first mounting component and the second mounting component both include the mica sheet 110, the two insulating members 130 covering the two sides of the mica sheet 110, and the two fixing members 140 covering the two insulating members 130. The two fixing members 140 on both sides of 130, wherein the first mounting component and the second mounting component are set as a semi-circular arc structure; and the first mounting component and the second mounting component are adapted to each other, and the two ends of the first mounting component and the second mounting component can be fixedly connected so that the first mounting component and the second mounting component form a circular ring shape to adapt to the top plate 200 of the thin film deposition equipment, so that the top plate 200 can be completely heated; in this embodiment, the first mounting component and the second mounting component are set as a semi-circular arc structure, so as to facilitate the installation of the heating structure and reduce the thermal deformation problem of the first mounting component and the second mounting component.

[0048] Specifically, a ceramic column 181 is respectively provided at one end of the connection between the first mounting component and the second mounting component, and each of the ceramic columns 181 is connected to a high-temperature resistant shielded mesh cable 182. The other ends of the two mesh cables 182 are connected to an electrical connector 183. Therefore, when the electrical connector 183 is energized, the first mounting component and the second mounting component are heated at the same time, so that the heating of the heating structure is more uniform.

[0049] Reference Figure 7 As shown, the present application also provides a thin film deposition device, which includes a top plate 200 and a heating structure 100. The heating structure 100 is any one of the heating structures 100 described above. The heating structure 100 is fixedly connected to the top plate 200. Since the heating structure 100 is described in detail in the above embodiments, it will not be repeated here.

[0050] Specifically, the top plate 200 is a component of the thin film deposition equipment, and the outer ring of the top plate 200 is heated, so the heating structure 100 is fixed on the outer ring of the top plate 200 to be in close contact with the heated object and to heat it. Since the thin film deposition equipment adopts the heating structure 100 in this embodiment, the heating efficiency of the heating structure 100 is high and the heating uniformity is good, so that the heating efficiency of the thin film deposition equipment is high and the quality of the products produced is better. The thin film deposition equipment in this embodiment is mainly used in the field of semiconductor processing technology, that is, the thin film deposition equipment is mainly used for semiconductor coating, so the coating quality of the thin film deposition equipment is better.

[0051] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A heating structure, characterized in that: include: A mica sheet, one side of which is provided with a heating surface, the heating surface is provided with grooves, the grooves extend on the heating surface and are evenly distributed on the heating surface; A heating wire is embedded in the groove along an extension path of the groove.

2. The heating structure according to claim 1, characterized in that: The extending path of the groove is in a maze shape.

3. The heating structure according to claim 1, characterized in that: The heating structure also includes two insulating members, which are respectively covered on two side surfaces of the mica sheet.

4. The heating structure according to claim 3, characterized in that: The heating structure further comprises two fixing members, and the two fixing members are respectively covered on two sides of the two insulating members.

5. The heating structure according to claim 4, characterized in that: The fixing piece is made of stainless steel.

6. The heating structure according to claim 4, characterized in that: The heating structure comprises a locking hole, which passes through the two fixing members, the two insulating members and the mica sheet, and is fastened to the locking hole by a fastener to fix the two fixing members, the two insulating members and the mica sheet.

7. The heating structure according to claim 4, characterized in that: The heating structure also includes a through hole, which passes through the two fixing members, the two insulating members and the mica sheet, and is fastened to the through hole by bolts to fix the heating structure and the top plate of the thin film deposition device.

8. The heating structure according to claim 4, characterized in that: The heating structure further comprises an escape opening, which is formed by being recessed inwardly along the outer edges of the two fixing members, the two insulating members and the mica sheet.

9. The heating structure according to any one of claims 4 to 8, characterized in that: It includes a first mounting component and a second mounting component, wherein the first mounting component and the second mounting component both include the mica sheet, the two insulating components covering the two sides of the mica sheet, and the two fixing components covering the two sides of the two insulating components; wherein the first mounting component and the second mounting component both have a semicircular arc structure.

10. A thin film deposition device, characterized in that: include: roof; A heating structure, wherein the heating structure is the heating structure according to any one of claims 1 to 9, and the heating structure is fixedly connected to the top plate.

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