Wafer splitting machine with adjustable height

Abstract

The utility model belongs to the technical field of wafer splitting, and relates to a height-adjustable wafer splitting machine, which comprises a placement box, a protection cover, a wafer splitting device and a loading device, the protection cover is arranged on the placement box, the wafer splitting device slides in the protection cover to split wafers on the loading device, the loading device is arranged on the placement box, and the loading device is arranged on the placement box. The placement box is provided with a first sliding rail and a transmission device, the transmission device drives the wafer splitting device to slide on the first sliding rail, the placement box is provided with an emergency stop button, a control panel, a start button and a reset button, and the height of the wafer splitting device is adjusted to adapt to the thickness of a wafer. And then the transmission device drives the splitting device to slide on the first slide rail to split the semiconductor wafer placed on the carrying device, so that the semiconductor wafer is stressed uniformly during splitting, the yield of the semiconductor wafer is improved, the yield is high, and the production cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer splitting, and in particular relates to a wafer splitting machine with adjustable height. Background Art

[0002] Wafers are the main raw materials for rectifier bridges and diodes, which mainly rely on wafers to achieve rectification. After being tested and laser cut, wafers need to be manually split using a splitting rod. This processing method has low yield, different operators have different pressing forces, and there is a risk of uneven force on the left and right of the splitting rod. In addition, the difference in thickness between wafers can easily cause defects such as wafer conjoining, edge collapse, and excess flesh, affecting product quality. Utility Model Content

[0003] The utility model aims to provide a wafer splitting machine with adjustable height, so as to fine-tune the height of the wafer splitting machine according to the different thicknesses of semiconductor wafer products. The adjustable height rubber roller is fixed to two sets of guide rail sliders, and the semiconductor wafer is split by a motor drive, so that the force is evenly applied when the semiconductor wafer is split, thereby improving the semiconductor wafer yield, increasing the output, and thus reducing the production cost.

[0004] To achieve the above purpose, the specific technical solution of an adjustable height wafer splitting machine of the utility model is as follows:

[0005] A height-adjustable wafer splitting machine comprises a placement box, a protective cover, a splitting device and a carrier, wherein the placement box is provided with a protective cover, the splitting device slides inside the protective cover to split the wafer on the carrier, and the carrier is arranged on the placement box, and is characterized in that the placement box is provided with a first slide rail and a transmission device, the transmission device drives the splitting device to slide on the first slide rail, and the placement box is provided with an emergency stop button, a control panel, a start button and a reset button.

[0006] Furthermore, the number of the first slide rails is two.

[0007] Furthermore, the splitting device includes a movable column, a sliding groove, a mounting plate, a scale column, a sliding track, a movable slide, an adjusting threaded rod, a spring, a mounting block, a rubber roller and a ruler. The movable column slides on the first slide rail through the sliding groove, the mounting plate is arranged on two movable columns, the scale column is arranged on the mounting plate, the sliding track is arranged on the scale column, the movable slide slides on the sliding track, the mounting block is arranged on the movable slide, the adjusting threaded rod is arranged on the mounting plate, the adjusting threaded rod and the mounting block are threadedly matched, the mounting plate and the mounting block are constructed with springs, the rubber roller is arranged on the two mounting blocks, and the ruler is arranged on the mounting block.

[0008] Further, the ruler is adjustable in position on the mounting block.

[0009] Furthermore, the transmission device includes a transmission gear and a transmission belt, the two transmission gear mounting shafts are arranged on the placement box, the transmission belt is arranged on the two transmission gears, and the transmission belt drives the splitting device to move.

[0010] Furthermore, the transmission gear is provided with a matching servo motor.

[0011] Furthermore, the placement box is provided with a protective cover that wraps the transmission gear and the transmission belt.

[0012] Furthermore, the loading device includes a rotating motor, a loading platform, a magnet, a limit bolt and a groove, the loading platform is arranged on the rotating motor, and the magnet, the limit bolt and the groove are arranged on the loading platform.

[0013] The advantages of the utility model are:

[0014] The utility model adjusts the height of the splitting device to adapt to the thickness of the wafer, and then the transmission device drives the splitting device to slide on the first slide rail to split the semiconductor wafer placed on the carrier device, so that the semiconductor wafer is evenly stressed during splitting, thereby improving the semiconductor wafer yield, increasing the output, and thus reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is an overall cross-sectional view of the utility model;

[0017] Figure 3 It is a schematic diagram of the transmission structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the splitting device of the utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the object carrying device of the utility model;

[0020] Description of the markings in the figure:

[0021] Placement box 1; protection cover 2; split device 3; moving column 3-1; sliding groove 3-2; mounting plate 3-3; scale column 3-4; sliding track 3-5; moving slide 3-6; adjusting threaded rod 3-7; spring 3-8; mounting block 3-9; rubber roller 3-10; scale 3-11; first slide rail 4; transmission device 5; transmission gear 5-1; transmission belt 5-2; loading device 6; emergency stop button 7; control panel 8; start button 9; reset button 10. DETAILED DESCRIPTION

[0022] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0024] like Figure 1-5 As shown, an adjustable height wafer splitting machine includes a placement box 1, a protective cover 2, a splitting device 3 and a carrier 6, wherein the placement box 1 is provided with a protective cover 2, the splitting device 3 slides inside the protective cover 2 to split the wafer on the carrier 6, and the carrier 6 is arranged on the placement box 1, and is characterized in that the placement box 1 is provided with a first slide rail 4 and a transmission device 5, the transmission device 5 drives the splitting device 3 to slide on the first slide rail 4, and the placement box 1 is provided with an emergency stop button 7, a control panel 8, a start button 9 and a reset button 10.

[0025] By adjusting the height of the splitting device 3 to adapt to the thickness of the wafer, the transmission device 5 then drives the splitting device 3 to slide on the first slide rail 4 to split the semiconductor wafer placed on the carrier device 6, so that the semiconductor wafer is subjected to uniform force during splitting, thereby improving the yield of the semiconductor wafer, increasing the output, and thus reducing the production cost.

[0026] Among them, Figure 1-5 As shown, the number of the first slide rails 4 is two.

[0027] Among them, Figure 1-5As shown, the splitting device 3 includes a moving column 3-1, a sliding groove 3-2, a mounting plate 3-3, a scale column 3-4, a sliding rail 3-5, a moving slide 3-6, an adjusting threaded rod 3-7, a spring 3-8, a mounting block 3-9, a rubber roller 3-10 and a ruler 3-11. The moving column 3-1 slides on the first slide rail 4 through the sliding groove 3-2, the mounting plate 3-3 is arranged on two moving columns 3-1, the scale column 3-4 is arranged on the mounting plate 3-3, the sliding rail 3-5 is arranged on the scale column 3-4, the moving slide 3-6 slides on the sliding rail 3-5, the mounting block 3-9 is arranged on the moving slide 3-6, the adjusting threaded rod 3-7 is arranged on the mounting plate 3-3, the adjusting threaded rod 3-7 and the mounting block 3-9 are threadedly matched, the mounting plate 3-3 and the mounting block 3-9 are constructed with a spring 3-8, the rubber roller 3-10 is arranged on two mounting blocks 3-9, and the ruler 3-11 is arranged on the mounting block 3-9.

[0028] The transmission device 5 drives the moving column 3-1 to slide on the first slide rail 4 by connecting the push plate. The moving moving column 3-1 drives the scale column 3-4, the sliding track 3-5, the moving slide seat 3-6, the adjusting threaded rod 3-7, the spring 3-8, the mounting block 3-9, the rubber roller 3-10 and the ruler 3-11 to move together through the mounting plate 3-3. The moving rubber roller 3-10 splits the semiconductor on the carrier 6, and then the position of the mounting block 3-9 can be adjusted by rotating the adjusting threaded rod 3-7 to adjust the position of the rubber roller 3-10 to adapt to the thickness of the semiconductor. The ruler 3-11 corresponds to the scale on the scale column 3-4, and the mounting block 3-9 slides on the sliding track 3-5 through the moving slide seat 3-6. The height-adjustable rubber roller 3-10 is compressed by the spring, so there is a certain buffer when the wafer is split.

[0029] Among them, Figure 1-5 As shown, the ruler 3-11 can be adjusted in position on the mounting block 3-9.

[0030] Among them, Figure 1-5 As shown, the transmission device 5 includes a transmission gear 5-1 and a transmission belt 5-2. The two mounting shafts of the transmission gears 5-1 are arranged on the placement box 1. The transmission belt 5-2 is arranged on the two transmission gears 5-1. The transmission belt 5-2 drives the splitting device 3 to move.

[0031] Among them, Figure 1-5 As shown, the transmission gear 5-1 is provided with a matching servo motor.

[0032] Among them, Figure 1-5 As shown, the placement box 1 is provided with a protective cover that wraps the transmission gear 5-1 and the transmission belt 5-2.

[0033] Among them, Figure 1-5As shown, the loading device 6 includes a rotating motor 6-1, a loading platform 6-2, a magnet 6-3, a limit bolt 6-4 and a groove 6-4, the loading platform 6-2 is arranged on the rotating motor 6-1, and the magnet 6-3, the limit bolt 6-4 and the groove 6-4 are arranged on the loading platform 6-2.

[0034] The stage 6-2 is slightly higher than the lowest point of the rubber roller 3-10. When the rubber roller 3-10 passes through the stage 6-2, the height-adjustable rubber roller 3-10 passes through the compression spring 3-8, and there is a certain buffer when the wafer is split. Press the start button with both hands, the transmission gear 5-1 drives the transmission belt 5-2, and the transmission belt 5-2 drives the rubber roller 3-10 to move, and the crystal on the stage 6-2 is split once, and stops after reaching the limit. The rotating motor 6-1 drives the stage 6-2 to automatically rotate 90° clockwise and stop. The height-adjustable rubber roller 3-10 moves in the opposite direction through the stage for secondary splitting and reaches the initial position. The stage 6-2 automatically rotates 90° counterclockwise and returns to the initial position and stops. Remove the wrapped gauze steel ring and the wafer after splitting.

[0035] It is understood that the present invention is described by some embodiments, and those skilled in the art are aware that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. A height-adjustable wafer splitting machine, comprising a placement box (1), a protective cover (2), a splitting device (3) and a carrier (6), wherein the placement box (1) is provided with a protective cover (2), the splitting device (3) slides inside the protective cover (2) to split the wafer on the carrier (6), and the carrier (6) is arranged on the placement box (1), characterized in that: The placement box (1) is provided with a first slide rail (4) and a transmission device (5), the transmission device (5) drives the splitting device (3) to slide on the first slide rail (4), and the placement box (1) is provided with an emergency stop button (7), a control panel (8), a start button (9) and a reset button (10); The splitting device (3) comprises a moving column (3-1), a sliding groove (3-2), a mounting plate (3-3), a scale column (3-4), a sliding track (3-5), a moving slide seat (3-6), an adjusting threaded rod (3-7), a spring (3-8), a mounting block (3-9), a rubber roller (3-10) and a scale (3-11); the moving column (3-1) slides on the first slide rail (4) through the sliding groove (3-2); the mounting plate (3-3) is arranged on the two moving columns (3-1); and the scale column (3-4) is arranged on the mounting plate (3-3). The sliding track (3-5) is arranged on the scale column (3-4), the movable slide seat (3-6) slides on the sliding track (3-5), the mounting block (3-9) is arranged on the movable slide seat (3-6), the adjusting threaded rod (3-7) is arranged on the mounting plate (3-3), the adjusting threaded rod (3-7) and the mounting block (3-9) are threadedly matched, the mounting plate (3-3) and the mounting block (3-9) are constructed with a spring (3-8), the rubber roller (3-10) is arranged on the two mounting blocks (3-9), and the scale (3-11) is arranged on the mounting block (3-9).

2. The height-adjustable wafer splitting machine according to claim 1, characterized in that: The number of the first slide rails (4) is two.

3. The height-adjustable wafer splitting machine according to claim 1, characterized in that: The ruler (3-11) is adjustable in position on the mounting block (3-9).

4. The height-adjustable wafer splitting machine according to claim 1, characterized in that: The transmission device (5) comprises a transmission gear (5-1) and a transmission belt (5-2); the two transmission gear (5-1) mounting shafts are arranged on the placement box (1); the transmission belt (5-2) is arranged on the two transmission gears (5-1); and the transmission belt (5-2) drives the splitting device (3) to move.

5. The height-adjustable wafer splitting machine according to claim 4, characterized in that: The transmission gear (5-1) is provided with a matching servo motor.

6. The height-adjustable wafer splitting machine according to claim 1, characterized in that: The placement box (1) is provided with a protective cover that wraps the transmission gear (5-1) and the transmission belt (5-2).

7. The height-adjustable wafer splitting machine according to claim 1, characterized in that: The object carrying device (6) comprises a rotating motor (6-1), an object carrying platform (6-2), a magnet (6-3), a limit bolt (6-4) and a groove (6-5); the object carrying platform (6-2) is arranged on the rotating motor (6-1); and the magnet (6-3), the limit bolt (6-4) and the groove (6-5) are arranged on the object carrying platform (6-2).

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