Gluing and developing equipment

Abstract

The utility model provides gluing and developing equipment which is characterized by comprising a wafer loading device, a moisture removing device and a process device, the wafer loading device is connected with the moisture removing device, the wafer loading device is used for loading wafers, and the moisture removing device is used for removing moisture on the wafers; the process device is connected with the moisture removing device, the process device and the wafer loading device are located on the two sides of the moisture removing device respectively, and the process device is used for conducting process treatment on the wafer. According to the gluing and developing equipment provided by the utility model, the moisture removing device is arranged between the wafer loading device and the process device, so that the temperature and the humidity of the wafer can be kept to meet specified requirements, the processing effect of the wafer is ensured, and the processing quality of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a glue coating and developing device. Background Art

[0002] In the existing photolithography process of semiconductor processing, the coating equipment, photolithography equipment and development equipment respectively complete the photoresist coating process, photolithography process and development process. With the improvement of the semiconductor processing technology level, the market mainstream connects the coating and development equipment with the photolithography equipment to complete the entire photolithography process. Since the moisture in the coating and development equipment is heavy, if the moisture of the wafer after coating and development by the coating and development equipment cannot be treated to the appropriate range in time, when the wafer reaches the next process module, the moisture will react with the metal components in the wafer, resulting in quality problems. In order to solve this problem, the existing technology will add high-pressure gas to the wafer box loading unit (Load port). After the wafer completes the process on the coating and development equipment, when it returns to the wafer box loading unit, the high-pressure gas begins to purge the wafer to remove moisture, but this approach has the following disadvantages:

[0003] 1. The high-pressure gas for purging the wafer is uniformly provided by the field service. It may change after reaching the equipment end, and the temperature and humidity may not meet the standards, affecting the effect of removing moisture.

[0004] 2. The purity of high-pressure gas is only a simple filtration, which may introduce contaminated particles and thus contaminate the wafer. Utility Model Content

[0005] The utility model aims to provide a glue coating and developing device, which ensures the temperature and humidity requirements of wafers and improves the processing quality of wafers.

[0006] To achieve the above-mentioned purpose, in a first aspect, the utility model provides a glue coating and developing device, including a wafer loading device, a moisture removal device and a process device;

[0007] The wafer loading device is connected to the moisture removing device, the wafer loading device is used to load wafers, and the moisture removing device is used to remove moisture on the wafers;

[0008] The process device is connected to the moisture removal device and is located on both sides of the moisture removal device together with the wafer loading device. The process device is used to perform process treatment on wafers.

[0009] In some embodiments, the moisture removal device includes a processing chamber and a gas supply cabinet;

[0010] The processing chamber is arranged between the process device and the wafer loading device, and a carrying platform is arranged in the processing chamber, and the carrying platform is used to carry the wafer;

[0011] The gas supply cabinet is connected to the processing chamber through a pipeline, and the gas supply cabinet is used to introduce gas into the processing chamber to remove moisture on the wafer.

[0012] In some embodiments, the moisture removal device further comprises a filter;

[0013] An air inlet is provided on one side of the gas supply cabinet, and an air outlet is provided on a side of the gas supply cabinet close to the processing chamber, and the air outlet is communicated with the pipeline;

[0014] The filter is arranged at the air inlet, and is used for filtering impurities in the air.

[0015] In some embodiments, the moisture removal device further comprises a controller, a heater, and a temperature sensor;

[0016] The heater is arranged in the air supply cabinet and is used to heat the air;

[0017] The temperature sensor is disposed in the processing chamber and is used to detect the temperature in the processing chamber;

[0018] The controller is electrically connected to the heater and the temperature sensor, and is used to control the heating temperature of the heater.

[0019] In some embodiments, the moisture removal device further comprises a refrigerator;

[0020] The refrigerator is arranged in the air supply cabinet and is electrically connected to the controller. The refrigerator is used for cooling air.

[0021] In some embodiments, the moisture removal device further comprises a humidifier and a humidity sensor;

[0022] The humidifier is arranged in the air supply cabinet and is electrically connected to the controller, and the humidifier is used to humidify the air;

[0023] The humidity sensor is disposed in the processing chamber and is electrically connected to the controller. The humidity sensor is used to detect the humidity in the processing chamber.

[0024] In some embodiments, the heater and the humidifier are located below the air outlet and are spaced apart from each other.

[0025] In some embodiments, the moisture removal device includes a first robot, and the first robot is used to transport the wafer on the carrier into the process device.

[0026] In some embodiments, the wafer loading device includes a transfer chamber, a second robot, and a wafer transfer box;

[0027] The transfer chamber is connected to the moisture removal device;

[0028] The wafer transport box is arranged at one side of the transfer chamber, and the wafer transport box is used to carry wafers;

[0029] The second robot is arranged in the transfer chamber, and is used for transferring the wafers on the wafer transport box to the moisture removal device.

[0030] In some embodiments, the moisture removal device further comprises an organic matter filter, an exhaust pipe, and an exhaust gas collection box;

[0031] The organic matter filter is arranged in the processing chamber and is used to filter harmful gases in the processing chamber;

[0032] One end of the exhaust pipe is communicated with the processing chamber, and the other end of the exhaust pipe is communicated with the exhaust gas collecting box.

[0033] The beneficial effect of the glue coating and developing equipment provided by the utility model is that by arranging a moisture removal device between the wafer loading device and the process device, the temperature and humidity of the wafer can be maintained within the specified requirements, thereby ensuring the processing effect of the wafer and improving the processing quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of the structure of the gluing and developing device provided in the embodiment of the utility model;

[0035] Figure 2 A schematic diagram of the structure of a moisture removal device according to an embodiment of the utility model;

[0036] Figure 3 A schematic diagram of the structure of the filter of the first embodiment provided by the utility model;

[0037] Figure 4 This is a side view of the filter of the second embodiment provided by the utility model.

[0038] Wafer loading device 1, transfer chamber 101, second robot 102, wafer conveying box 103, moisture removal device 2, processing chamber 201, gas supply cabinet 202, carrier platform 203, filter 204, air filter 2041, filter cotton 2042, controller 205, heater 206, temperature sensor 207, refrigerator 208, humidifier 209, humidity sensor 210, first robot 211, organic filter 212, exhaust pipe 213, waste gas collection box 214, pipeline 215, process device 3. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Unless otherwise specified, the "connection" described in this article can be a direct connection or an indirect connection, that is, a connection through an intermediate.

[0040] With the improvement of semiconductor processing technology, the mainstream market connects the coating and developing equipment with the photolithography equipment to complete the entire photolithography process. Since the moisture in the coating and developing equipment is heavy, if the moisture of the wafer after coating and developing by the coating and developing equipment cannot be treated to the appropriate range in time, when the wafer reaches the next process module, the moisture will react with the metal components in the wafer, causing quality problems for the wafer.

[0041] In view of the problems existing in the prior art, the embodiment of the utility model provides a coating and developing device, referring to Figure 1 As shown, the glue coating and developing equipment includes a wafer loading device 1, a moisture removal device 2 and a process device 3. The wafer loading device 1, the moisture removal device 2 and the process device 3 are connected in sequence, and the process device 3 and the wafer loading device 1 are respectively located on opposite sides of the moisture removal device 2. The process device 3 is used to perform glue coating and developing on the wafer. After the wafer is coated and developed, it is transferred to the moisture removal device 2. The moisture removal device 2 is used to remove moisture on the wafer. After the moisture on the surface of the wafer is removed, the wafer can be transferred to the wafer loading device 1. The wafer loading device 1 is used to load the wafer. .

[0042] In this embodiment, when the glue coating and developing process is required, the process device 3 starts working to perform glue coating and developing process on the wafer placed inside. After the glue coating and developing process of the wafer is completed, the processed wafer is transferred to the moisture removal device 2 for dehumidification process, so that the humidity of the wafer surface reaches a suitable range, and finally the dehumidified wafer is transferred to the wafer loading device 1 for storage. Therefore, when the wafer in the wafer loading device 1 is transferred to the next process unit for processing, the situation where the temperature and humidity of the wafer do not meet the process requirements is avoided, thereby ensuring the processing quality of the wafer and improving the processing effect of the wafer.

[0043] refer to Figure 1 and Figure 2 As shown, in some embodiments, the moisture removal device 2 includes a processing chamber 201 and a gas supply cabinet 202. The processing chamber 201 is arranged between the process device 3 and the wafer loading device 1, and a carrier 203 is arranged in the processing chamber 201, and the carrier 203 is used to carry the wafer. The gas supply cabinet 202 is arranged below the processing chamber 201 and is connected to the processing chamber 201 through a pipeline 215. A pump is arranged in the gas supply cabinet 202, and air is sucked in by the pump, and then the air is processed, and the processed gas is introduced into the processing chamber 201 through the pipeline 215 to remove moisture on the wafer, so that the surface moisture of the wafer is within a suitable range.

[0044] Furthermore, an air inlet is provided on one side of the gas supply cabinet 202, and an air outlet is provided on one side of the gas supply cabinet 202 close to the processing chamber 201, and the air outlet is communicated with the pipeline 215. The moisture removal device 2 further includes a filter 204, which is provided at the air inlet, and is used to filter impurities in the air to provide relatively pure gas to the processing chamber 201, thereby preventing the gas from contaminating the wafers in the processing chamber 201.

[0045] refer to Figure 3 As shown, in this embodiment, the filter 204 may be an air filter, which is attached to the air inlet to filter impurities in the air.

[0046] In other embodiments, reference Figure 4 As shown, the filter 204 includes an air filter 2041 and filter cotton 2042 . There are two air filters 2041 , and the filter cotton 2042 is filled between the two air filters 2041 .

[0047] Continue to refer Figure 2As shown, in some embodiments, the moisture removal device 2 further includes a controller 205, a heater 206 and a temperature sensor 207. The heater 206 is disposed in the gas supply cabinet 202 for heating air. The temperature sensor 207 is disposed in the processing chamber 201 for detecting the temperature in the processing chamber 201. The controller 205 is electrically connected to the heater 206 and the temperature sensor 207, and the controller 205 is used to control the heating temperature of the heater 206.

[0048] In this embodiment, the temperature sensor 207 is arranged near the carrier 203. When the temperature sensor 207 detects that the temperature in the processing chamber 201 is greater than the specified temperature required by the wafer, the temperature sensor 207 feeds back the detected temperature information to the controller 205, and the controller 205 controls the heater 206 to stop working to reduce the temperature in the processing chamber 201. When the temperature sensor 207 detects that the temperature in the processing chamber 201 is less than the specified temperature required by the wafer, the temperature sensor 207 feeds back the detected temperature information to the controller 205, and the controller 205 controls the heater 206 to continue working. The heater 206 heats the air and delivers the heated gas to the processing chamber 201 to increase the temperature in the processing chamber 201. The heater 206 may be a heating resistance wire.

[0049] In some embodiments, the moisture removal device 2 further includes a refrigerator 208 , which is disposed in the air supply cabinet 202 and electrically connected to the controller 205 . The refrigerator 208 is used to cool the air.

[0050] In this embodiment, the refrigerator 208 can be a semiconductor refrigerator 208. When the temperature sensor 207 detects that the temperature in the processing chamber 201 is greater than the specified temperature required by the wafer, in order to quickly reduce the temperature in the processing chamber 201, the controller 205 controls the refrigerator 208 to operate. After the refrigerator 208 cools the gas, the gas supply cabinet 202 delivers the low-temperature gas to the processing chamber 201 to achieve rapid cooling in the processing chamber 201.

[0051] In some embodiments, the moisture removal device 2 further includes a humidifier 209 and a humidity sensor 210. The humidifier 209 is disposed in the gas supply cabinet 202 and is electrically connected to the controller 205. The humidifier 209 is used to humidify the air. The humidity sensor 210 is disposed in the processing chamber 201 and is electrically connected to the controller 205. The humidity sensor 210 is used to detect the humidity in the processing chamber 201.

[0052] In this embodiment, when the humidity sensor 210 detects that the humidity in the processing chamber 201 is lower than the specified humidity required by the wafer, the humidity sensor 210 feeds back the detected humidity information to the controller 205, and the controller 205 controls the humidifier 209 to work to humidify the air. The gas supply cabinet 202 transports the humidified gas to the processing chamber 201 so that the humidity in the processing chamber 201 reaches the specified humidity required by the wafer.

[0053] In some embodiments, the heater 206 and the humidifier 209 are located below the air outlet and are spaced apart from each other.

[0054] In this embodiment, the humidifier 209 is arranged below the heater 206. When the temperature in the processing chamber 201 needs to be lowered, the humidifier 209 can be turned on while the heater 206 is turned off. The humidifier 209 can cool the heater 206 to quickly cool the heater 206, thereby achieving rapid cooling of the processing chamber 201.

[0055] In some embodiments, the moisture removal device 2 further includes a first robot 211 , which is disposed close to the carrier 203 and is used to deliver the wafer on the carrier 203 to the process device 3 for process treatment.

[0056] refer to Figure 1 As shown, in some embodiments, the wafer loading device 1 includes a transfer chamber 101, a second robot 102 and a wafer transfer box 103. The transfer chamber 101 is connected to the moisture removal device 2, the wafer transfer box 103 is arranged on one side of the transfer chamber 101, the wafer transfer box 103 is used to carry wafers, and the second robot 102 is arranged in the transfer chamber 101, and is used to transfer the wafers in the wafer transfer box 103 to the moisture removal device 2.

[0057] refer to Figure 2 As shown, in some embodiments, the moisture removal device 2 also includes an organic filter 212, an exhaust pipe 213 and a waste gas collection box 214. The organic filter 212 is arranged in the processing chamber 201, and is used to filter harmful gases in the processing chamber 201. One end of the exhaust pipe 213 is connected to the processing chamber 201, and the other end of the exhaust pipe 213 is connected to the waste gas collection box 214. The waste gas collection box 214 is used to collect waste gas in the processing chamber 201.

[0058] In this embodiment, the organic matter filter 212 may be an activated carbon filter.

[0059] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. A coating and developing device, characterized in that: Includes wafer loading equipment, moisture removal equipment and process equipment; The wafer loading device is connected to the moisture removing device, the wafer loading device is used to load wafers, and the moisture removing device is used to remove moisture on the wafers; The process device is connected to the moisture removal device and is located on both sides of the moisture removal device together with the wafer loading device. The process device is used to perform process treatment on wafers.

2. The coating and developing device according to claim 1, characterized in that: The moisture removal device includes a processing chamber and a gas supply cabinet; The processing chamber is arranged between the process device and the wafer loading device, and a carrying platform is arranged in the processing chamber, and the carrying platform is used to carry the wafer; The gas supply cabinet is connected to the processing chamber through a pipeline, and the gas supply cabinet is used to introduce gas into the processing chamber to remove moisture on the wafer.

3. The coating and developing device according to claim 2, characterized in that: The moisture removal device also includes a filter; An air inlet is provided on one side of the gas supply cabinet, and an air outlet is provided on a side of the gas supply cabinet close to the processing chamber, and the air outlet is communicated with the pipeline; The filter is arranged at the air inlet, and is used for filtering impurities in the air.

4. The coating and developing device according to claim 3, characterized in that: The moisture removal device also includes a controller, a heater and a temperature sensor; The heater is arranged in the air supply cabinet and is used to heat the air; The temperature sensor is disposed in the processing chamber and is used to detect the temperature in the processing chamber; The controller is electrically connected to the heater and the temperature sensor, and is used to control the heating temperature of the heater.

5. The gum coating and developing device according to claim 4, characterized in that: The moisture removal device also includes a refrigerator; The refrigerator is arranged in the air supply cabinet and is electrically connected to the controller. The refrigerator is used for cooling air.

6. The gum coating and developing device according to claim 4, characterized in that: The moisture removal device also includes a humidifier and a humidity sensor; The humidifier is arranged in the air supply cabinet and is electrically connected to the controller, and the humidifier is used to humidify the air; The humidity sensor is disposed in the processing chamber and is electrically connected to the controller. The humidity sensor is used to detect the humidity in the processing chamber.

7. The gum coating and developing device according to claim 6, characterized in that: The heater and the humidifier are arranged below the air outlet and are spaced apart from each other.

8. The gum coating and developing device according to claim 2, characterized in that: The moisture removal device includes a first robot, and the first robot is used to send the wafer on the carrier into the process device.

9. The gum coating and developing device according to claim 1, characterized in that: The wafer loading device comprises a transfer chamber, a second robot and a wafer transfer box; The transfer chamber is connected to the moisture removal device; The wafer transport box is arranged at one side of the transfer chamber, and the wafer transport box is used to carry wafers; The second robot is arranged in the transfer chamber, and is used for transferring the wafers on the wafer transport box to the moisture removal device.

10. The gum coating and developing device according to claim 4, characterized in that: The moisture removal device also includes an organic matter filter, an exhaust pipe and an exhaust gas collection box; The organic matter filter is arranged in the processing chamber and is used to filter harmful gases in the processing chamber; One end of the exhaust pipe is communicated with the processing chamber, and the other end of the exhaust pipe is communicated with the exhaust gas collecting box.

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