Wafer double-sided etching contact ratio detection device

Abstract

The utility model belongs to the technical field, and particularly relates to a wafer double-sided etching contact ratio detection device. The device comprises a box body; the transverse moving mechanism is arranged in the box body, and a rotating carrier is arranged on the transverse moving mechanism; the rotating shaft extends out of the box body upper cover and is used for adsorbing a wafer; the first detection mechanism is arranged above the box body and is used for detecting a MARK point on the front surface of the wafer; and the second detection mechanism is arranged in the box body and is used for detecting the MARK point on the back surface of the wafer. According to the wafer double-sided etching overlap ratio detection device, the rotating carrier arranged on the transverse moving mechanism can be used for adsorbing the wafer, the transverse moving mechanism can drive the rotating carrier to move, the rotating carrier can drive the wafer to rotate, and detection of edge MARK points is greatly facilitated; the first detection mechanism and the second detection mechanism can detect the MARK points on the front and back edges of the wafer at the same time, so that the double-sided etching overlap ratio of the wafer can be detected conveniently, and the detection efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field, and in particular relates to a wafer double-sided etching coincidence detection device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8 inches and 12 inches. The main processing methods for wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, laser etching of silicon wafers during silicon wafer processing is an important step from silicon wafers to chips.

[0003] By etching the silicon wafer, regularly arranged "dots" are produced on the silicon wafer. In the microstructure of this "dot", there are complex circuit grooves, which are produced by laser etching. In some application scenarios, the wafer needs to be etched on both sides. Then, the double-sided etching needs to meet the overlap requirements of the front and back etching.

[0004] The prior art CN217505681U discloses a wafer inspection device that can perform double-sided inspection on wafers, reduce the occurrence of wafer warping, and ensure the consistency of multiple inspection results. However, this device has many defects: first, the fixture uses a transparent suction cup, and the camera on the lower side needs to capture images through the transparent suction cup, which requires extremely high light-transmitting materials and cleanliness of the transparent suction cup, otherwise it will affect the inspection effect; secondly, the fixture of the device cannot rotate, and its method of "moving the edge of the carrier ring or the handheld block by hand or tool to move the wafer when the wafer needs to be moved during the inspection process" is very inconvenient, and cannot be used to detect the overlap of the MARK points on the edges of the front and back sides of the wafer after double-sided etching. Utility Model Content

[0005] The utility model aims to provide a wafer double-sided etching coincidence detection device, so as to detect the coincidence of MARK points at the edges of the front and back sides of the wafer after double-sided etching.

[0006] The present application provides a wafer double-sided etching coincidence detection device. The wafer double-sided etching coincidence detection device comprises: a box; a lateral movement mechanism, which is arranged in the box and has a rotating carrier arranged thereon; the rotating carrier extends out of the upper cover of the box and is used to absorb the wafer; a first detection mechanism, which is arranged above the box and is used to detect the MARK point on the front side of the wafer; and a second detection mechanism, which is arranged in the box and is used to detect the MARK point on the back side of the wafer.

[0007] In one embodiment of the present application, the rotating carrier includes: a mounting seat, which is arranged on the transverse movement mechanism; a sleeve, which is fixed on the mounting seat and has a hollow rotating shaft rotatably installed inside; a rotating drive mechanism, which is arranged on the mounting seat and located on one side of the sleeve, and is used to drive the rotating shaft to rotate; a negative pressure plate, which is arranged at the upper end of the rotating shaft and is used to adsorb the wafer; and a rotating joint, which is arranged at the lower end of the rotating shaft and is used to connect the negative pressure air circuit.

[0008] In one embodiment of the present application, a through hole connected to the rotating shaft is provided in the middle of the negative pressure plate; and a plurality of circular grooves connected to and coaxial with the through hole are provided on the periphery of the through hole of the negative pressure plate.

[0009] In one embodiment of the present application, each circular groove is connected to the through hole via a radially arranged groove.

[0010] In one embodiment of the present application, the first detection mechanism includes: a first fixed seat for being installed on a frame; a first translation mechanism installed on the first fixed seat; a first lifting mechanism installed on the first translation mechanism; and a first image acquisition module installed on the first lifting mechanism.

[0011] In one embodiment of the present application, the second detection mechanism includes: a second fixed seat installed on the bottom plate of the box; a second lifting mechanism installed on the second fixed seat; and a second image acquisition module installed on the second lifting mechanism.

[0012] In one embodiment of the present application, a protective cover is provided on the outer side of the first detection mechanism.

[0013] The beneficial effects of the utility model are:

[0014] Different from the prior art, the present application provides a wafer double-sided etching coincidence detection device. The wafer double-sided etching coincidence detection device includes a rotating carrier arranged on a transverse movement mechanism, which can be used to adsorb the wafer, and the transverse movement mechanism can drive the rotating carrier to move, and the rotating carrier can drive the wafer to rotate, which greatly facilitates the detection of edge MARK points; the first detection mechanism and the second detection mechanism can simultaneously detect the edge MARK points of the front and back sides of the wafer, thereby facilitating the detection of the wafer double-sided etching coincidence and improving the detection efficiency.

[0015] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0016] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a three-dimensional diagram of a wafer double-sided etching coincidence detection device according to a preferred embodiment of the utility model;

[0019] Figure 2 This is a schematic structural diagram of a wafer double-sided etching overlap detection device according to a preferred embodiment of the utility model, with part of the box body hidden;

[0020] Figure 3 is a cross-sectional view of a rotating carrier of a preferred embodiment of the utility model;

[0021] Figure 4 It is a schematic diagram of a negative pressure plate according to a preferred embodiment of the utility model.

[0022] In the figure:

[0023] Box 1, transverse movement mechanism 2, rotating carrier 3, mounting seat 31, sleeve 32, rotating shaft 33, rotating drive mechanism 34, negative pressure plate 35, through hole 351, circular groove 352, groove 353, rotating joint 36, first detection mechanism 4, first fixed seat 41, first translation mechanism 42, first lifting mechanism 43, first image acquisition module 44, protective cover 45, second detection mechanism 5, second fixed seat 51, second lifting mechanism 52, second image acquisition module 53, wafer 100. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The present application provides a wafer double-sided etching coincidence detection device, which is described in detail below. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments of the present application. In the following embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0026] See also Figure 1 , Figure 2 In one embodiment, the wafer double-sided etching coincidence detection device includes: a box body 1; a lateral movement mechanism 2, which is arranged in the box body 1 and has a rotating carrier 3 arranged thereon; the rotating carrier 3 extends out of the upper cover of the box body 1 and is used to adsorb the wafer 100; a first detection mechanism 4, which is arranged above the box body 1 and is used to detect the MARK point on the front side of the wafer 100; a second detection mechanism 5, which is arranged in the box body 1 and is used to detect the MARK point on the back side of the wafer 100.

[0027] In this embodiment, the edge of the wafer 100 is exposed at the edge of the rotating carrier 3. The first detection mechanism 4 and the second detection mechanism 5 are debugged and calibrated before processing. The MARK points on the front and back sides of the wafer 100 can be detected at the same time, thereby facilitating the judgment of the overlap of the front and back MARK points, thereby improving the detection efficiency of the double-sided etching overlap of the wafer.

[0028] In this embodiment, the transverse movement mechanism 2 can drive the rotating carrier 3 carrying the wafer 100 to move to the detection position; the first detection mechanism 4 and the second detection mechanism 5 can simultaneously detect the MARK points of the front and back edges of the wafer; the rotating carrier 3 can drive the wafer 100 to rotate to perform a comprehensive detection of the peripheral edge.

[0029] In this embodiment, optionally, the transverse movement mechanism 2 may be a linear module.

[0030] See also Figure 3 Specifically, the rotating carrier 3 includes: a mounting seat 31, which is arranged on the transverse movement mechanism 2; a sleeve 32, which is fixed on the mounting seat 31, and a hollow rotating shaft 33 is rotatably installed inside the sleeve 32; a rotating drive mechanism 34, which is arranged on the mounting seat 31 and is located on one side of the sleeve 32, and is used to drive the rotating shaft 33 to rotate; a negative pressure plate 35, which is arranged at the upper end of the rotating shaft 33, and is used to adsorb the wafer 100; a rotating joint 36, which is arranged at the lower end of the rotating shaft 33, and is used to connect the negative pressure air circuit.

[0031] In this embodiment, optionally, the rotation driving mechanism 34 can be realized by a motor through a belt to drive the rotating shaft 33 to rotate; the hollow rotating shaft 33 can provide negative pressure to the negative pressure plate 35 to adsorb the wafer 100.

[0032] See also Figure 4Optionally, a through hole 351 communicating with the rotating shaft 33 is provided in the middle of the negative pressure plate 35 ; a plurality of circular grooves 352 communicating with and coaxial with the through hole 351 are provided on the periphery of the through hole 351 of the negative pressure plate 35 .

[0033] Preferably, the circular groove 352 may have a plurality of different diameters to accommodate wafers 100 of different sizes.

[0034] Furthermore, each circular groove 352 is connected to the through hole 351 via a radially arranged groove 353 ; in this embodiment, in addition to connecting the through hole 351 and the circular groove 352 , the groove 353 can also absorb the wafer 100 in the radial direction.

[0035] See also Figure 2 Optionally, the first detection mechanism 4 includes: a first fixed seat 41 for being installed on a frame; a first translation mechanism 42 installed on the first fixed seat 41; a first lifting mechanism 43 installed on the first translation mechanism 42; and a first image acquisition module 44 installed on the first lifting mechanism 43.

[0036] Furthermore, the second detection mechanism 5 includes: a second fixing seat 51 installed on the bottom plate of the box body 1; a second lifting mechanism 52 installed on the second fixing seat 51; and a second image acquisition module 53 installed on the second lifting mechanism 52.

[0037] In this embodiment, the first translation mechanism 42 can facilitate the alignment of the two image acquisition modules.

[0038] In an application scenario, the first image acquisition module 44 and the second image acquisition module 53 can be cameras electrically connected to the processing module; the first image acquisition module 44 and the second image acquisition module 53 can transmit the acquired images of the front and back sides of the wafer edge containing the MARK points to the processing module, and the processing module determines the overlap of the front and back sides containing the MARK points, thereby determining the overlap of the front and back side etching.

[0039] It should be noted that the present application does not improve the image recognition program, and those skilled in the art can fully adopt the algorithms and programs in the prior art to implement image processing and coincidence judgment.

[0040] In this embodiment, optionally, a protective cover 45 is provided on the outer side of the first detection mechanism 4 .

[0041] To sum up, the wafer double-sided etching overlap detection device of the present application includes a rotating carrier arranged on a transverse movement mechanism, which can be used to adsorb the wafer, and the transverse movement mechanism can drive the rotating carrier to move, and the rotating carrier can drive the wafer to rotate, which greatly facilitates the detection of edge MARK points; the first detection mechanism and the second detection mechanism can simultaneously detect the edge MARK points of the front and back sides of the wafer, thereby facilitating the detection of the double-sided etching overlap of the wafer and improving the detection efficiency.

[0042] The various devices selected in this application (components whose specific structures are not described) are all universal standard parts or components known to technical personnel in this field, and their structures and principles can be known to technical personnel through technical manuals or through conventional experimental methods.

[0043] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0045] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer double-sided etching overlap detection device, characterized in that: include: Box; The transverse movement mechanism is arranged in the box body and a rotating carrier is arranged on the transverse movement mechanism; The rotating carrier extends out of the upper cover of the box body and is used to absorb the wafer; The first detection mechanism is arranged above the box body and is used to detect the MARK point on the front side of the wafer; The second detection mechanism is arranged in the box body and is used for detecting the MARK point on the back side of the wafer.

2. The wafer double-side etching coincidence detection device according to claim 1, characterized in that: The rotating carrier comprises: A mounting seat, arranged on the transverse movement mechanism; The sleeve is fixed on the mounting seat, and a hollow rotating shaft is rotatably mounted inside the sleeve; A rotary drive mechanism, disposed on the mounting seat and located on one side of the sleeve, for driving the rotating shaft to rotate; A negative pressure plate, arranged at the upper end of the rotating shaft, for adsorbing the wafer; The rotary joint is arranged at the lower end of the rotating shaft and is used for connecting the negative pressure gas circuit.

3. The wafer double-side etching coincidence detection device according to claim 2, characterized in that: A through hole communicating with the rotating shaft is provided in the middle of the negative pressure plate; A plurality of circular grooves are arranged on the outer periphery of the through hole of the negative pressure plate, which are connected with the through hole and are coaxial with the through hole.

4. The wafer double-side etching coincidence detection device according to claim 3, characterized in that: Each circular groove is communicated with the through hole through a radially arranged groove.

5. The wafer double-side etching coincidence detection device according to claim 1, characterized in that: The first detection mechanism comprises: A first fixing seat, used for mounting on a frame; A first translation mechanism is mounted on a first fixed seat; A first lifting mechanism, mounted on the first translation mechanism; and The first image acquisition module is installed on the first lifting mechanism.

6. The wafer double-side etching coincidence detection device according to claim 1, characterized in that: The second detection mechanism comprises: A second fixing seat is mounted on the bottom plate of the box body; A second lifting mechanism is installed on the second fixed base; and The second image acquisition module is installed on the second lifting mechanism.

7. The wafer double-side etching coincidence detection device according to claim 1, characterized in that: A protective cover is arranged on the outer side of the first detection mechanism.

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