Bonded wafer de-bonding device and de-bonding machine

Abstract

The utility model provides a bonded wafer de-bonding device and a de-bonding machine, and relates to the technical field of semiconductor manufacturing. The bonding wafer de-bonding device comprises a base which is provided with a material placing table which is used for placing a bonding wafer; the lower wafer adsorption mechanism comprises a lower adsorption disc and a first lifting module for driving the adsorption disc to lift; the upper wafer adsorption mechanism comprises an upper adsorption disc; the turnover mechanism is used for driving the upper adsorption disc to be close to or away from the discharging table; and the side jacking mechanism is arranged on the side face of the discharging table. The bonded wafer de-bonding device can avoid the problem of wafer cracking, improve the success rate of de-bonding, prevent the wafer from being damaged, meet the requirements of wafer de-bonding, improve the yield, directly combine the bonded wafer de-bonding device with the semi-closed cavity to form the de-bonding machine of an integrated structure, facilitate direct use of enterprises, and improve the production efficiency. And the production operation is facilitated.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular, to a bonded wafer debonding device and a debonding machine. Background Art

[0002] Wafer bonding technology refers to the process of tightly bonding two mirror-polished homogeneous or heterogeneous wafers together through chemical and physical effects. After the wafers are bonded, the atoms on the interface react under the action of external forces to form covalent bonds to combine them into one, and the bonding interface reaches a specific bonding strength.

[0003] After heat treatment, some bonded wafers need to be debonded before other processing can be carried out, such as separating the temporarily bonded wafer and the carrier, and separating wafers from each other.

[0004] In the prior art, the debonding of bonded wafers is prone to chipping. This is due to poor control of the debonding force, which causes very thin wafers to break during separation. In particular, large-sized wafers, such as 12-inch wafers, are more likely to break during debonding, affecting production. Utility Model Content

[0005] The purpose of the present application is to provide a bonded wafer debonding device, which can be used to improve the problem that the existing bonded wafer is easily broken during debonding.

[0006] Another object of the present application is to provide a debonding machine, which includes the above-mentioned bonded wafer debonding device and has all the characteristics of the bonded wafer debonding device.

[0007] The embodiment of the present application is implemented as follows:

[0008] An embodiment of the present application provides a bonded wafer debonding device, comprising:

[0009] A base, wherein the base is provided with a material placing table, and the material placing table is used for placing the bonding wafer;

[0010] A lower wafer adsorption mechanism, the lower wafer adsorption mechanism is arranged on the base, the lower wafer adsorption mechanism comprises a lower adsorption plate and a first lifting module for driving the adsorption plate to rise and fall, the lower adsorption plate is arranged below the unloading platform to adsorb the lower surface of the bonding wafer;

[0011] An upper wafer adsorption mechanism, wherein the upper wafer adsorption mechanism comprises an upper adsorption plate;

[0012] A flip mechanism, the flip mechanism is used to drive the upper adsorption plate to approach or leave the unloading platform, when the upper adsorption plate approaches the unloading platform, the upper adsorption plate can adsorb the upper surface of the bonding wafer; and

[0013] A side lift mechanism, the side lift mechanism is arranged on the side of the unloading platform;

[0014] Among them, after the lower adsorption plate and the upper adsorption plate adsorb the bonded wafer, the side lifting mechanism is used to lift one side of the upper adsorption plate so that the upper adsorption plate pivots around the output shaft of the flip mechanism.

[0015] In addition, the bonded wafer debonding device provided in the embodiments of the present application may also have the following additional technical features:

[0016] In an optional embodiment of the present application, the flipping mechanism includes a flipping motor, a floating gas joint and a flipping arm, the output shaft of the flipping motor is connected to the flipping arm, the flipping arm is connected to the upper wafer adsorption mechanism, the floating gas joint is connected to the output shaft of the flipping motor, and is used to provide negative pressure gas to the upper wafer adsorption mechanism.

[0017] In an optional embodiment of the present application, the flipping mechanism further includes a third lifting module, and the flipping motor is arranged at an output end of the third lifting module.

[0018] In an optional embodiment of the present application, the bonded wafer debonding device further includes a second lifting module, and the second lifting module is used to drive the wafer on the upper suction plate to rise and fall.

[0019] In an optional embodiment of the present application, the side lifting mechanism, the first lifting module and / or the second lifting module are torque electric cylinders.

[0020] In an optional embodiment of the present application, the bonded wafer debonding device is further provided with a first in-place sensor, a second in-place sensor, a first limit buffer and a second limit buffer, and the unloading table includes a left material table and a right material table;

[0021] The first in-place sensor and the first limit buffer are arranged near the side top mechanism and close to the left material platform, and the second in-place sensor and the second limit buffer are close to the right material platform.

[0022] In an optional embodiment of the present application, the bonded wafer debonding device also includes an isolation door and a robot, and the left material table and the right material table are each configured with a set of the isolation door and the robot. When the isolation door is opened, the robot can take and place the wafer on the material placement table.

[0023] In an optional embodiment of the present application, the bonded wafer debonding device further includes an exhaust port and an electrostatic eliminator, the electrostatic eliminator is disposed in the space above the unloading table, and the exhaust port is disposed below the base.

[0024] In an optional embodiment of the present application, the upper adsorption plate and the lower adsorption plate are both provided with ejector pin holes, and the base is provided with an ejector pin group, a part of the ejector pin group can be passed through the lower adsorption plate to support the wafer, and another part of the ejector pin group can be passed through the upper adsorption plate to support the wafer.

[0025] An embodiment of the present application provides a debonding machine, comprising a semi-enclosed chamber and any one of the bonded wafer debonding devices described above, wherein the bonded wafer debonding device is arranged in the semi-enclosed chamber, and the opening and closing of the semi-enclosed chamber is controlled by an isolation door.

[0026] The beneficial effects of this application are:

[0027] The bonded wafer debonding device of the present application applies forces at different positions and directions to the bonded wafer through the lower wafer adsorption mechanism and the side top mechanism, which can avoid the problem of cracking, improve the success rate of debonding, and avoid the wafer from being damaged. It can meet the needs of wafer debonding and improve the yield rate. Even 12-inch wafers can be successfully debonded. The debonding machine that directly combines the bonded wafer debonding device with the semi-enclosed cavity to form an integrated structure can also be convenient for enterprises to use directly, which is more conducive to production operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A schematic diagram of a bonded wafer debonding device provided in an embodiment of the present application;

[0030] Figure 2 A schematic diagram of the lower wafer adsorption mechanism and the side top mechanism from one perspective;

[0031] Figure 3 for Figure 2 Schematic diagram from another perspective;

[0032] Figure 4 for Figure 2 A partial enlarged view of part A;

[0033] Figure 5 A schematic diagram of the upper wafer adsorption mechanism and the flipping mechanism from one perspective;

[0034] Figure 6 for Figure 5 Schematic diagram from another perspective;

[0035] Figure 7 for Figure 5 A partial enlarged view of part B.

[0036] Icons: 100-bonded wafer debonding device; 10-base; 11-discharging table; 111-thrust pin; 112-left table; 1121-base frame; 1122-track; 1123-slider; 113-right table; 1131-support frame; 1132-support plate; 114-blocking rod; 20-lower wafer adsorption mechanism; 21-lower adsorption plate; 211-mounting plate; 22-first lifting module; 30-upper wafer adsorption mechanism; 31-upper adsorption plate ;32-linear slide;40-flip mechanism;41-flip motor;411-connecting block;42-floating air joint;43-flip arm;44-third lifting module;441-guide rail;45-negative pressure adapter plate;50-side top mechanism;60-second lifting module;71-first in-position sensor;72-second in-position sensor;73-first limit buffer;74-second limit buffer;80-isolation door;81-manipulator;82-exhaust vent. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0041] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] Example

[0043] Please combine Figures 1 to 7 , an embodiment of the present application provides a bonded wafer debonding device 100, comprising:

[0044] A base 10 is provided with a material placing table 11, and the material placing table 11 is used to place the bonded wafers (of course, it can also place the separate wafers after debonding);

[0045] A lower wafer adsorption mechanism 20, which is disposed on the base 10, and includes a lower adsorption plate 21 and a first lifting module 22 for driving the adsorption plate to rise and fall, and the lower adsorption plate 21 is disposed below the unloading table 11 to adsorb the lower surface of the bonding wafer;

[0046] An upper wafer adsorption mechanism 30, the upper wafer adsorption mechanism 30 comprises an upper adsorption plate 31;

[0047] A turning mechanism 40, which is used to drive the upper adsorption plate 31 to approach or leave the unloading platform 11. When the upper adsorption plate 31 approaches the unloading platform 11, the upper adsorption plate 31 can adsorb the upper surface of the bonding wafer; and

[0048] A side lift mechanism 50, which is arranged on the side of the unloading platform 11;

[0049] After the lower adsorption plate 21 and the upper adsorption plate 31 adsorb and bond the wafer, the side lift mechanism 50 is used to lift one side of the upper adsorption plate 31 so that the upper adsorption plate 31 pivots around the output shaft of the flip mechanism 40 .

[0050] Please combine Figure 2 and Figure 3 In this embodiment, both the upper adsorption plate 31 and the lower adsorption plate 21 are provided with ejector holes, and the base 10 is provided with an ejector group. A part of the ejector group can be passed through the lower adsorption plate 21 to support the wafer, and another part of the ejector group can be passed through the upper adsorption plate 31 to support the wafer. Furthermore, the unloading table 11 mainly includes a group of ejector pins 111, and the ejector pins 111 can pass through the upper adsorption plate 31 and the lower adsorption plate 21. While supporting the wafer, it will not affect the lifting and lowering movement of the upper adsorption plate 31 and the lower adsorption plate 21, thereby ensuring normal operation. At the same time, a material blocking rod 114 is also provided to prevent the wafer position from shifting and affecting the debonding. When the side ejection mechanism 50 applies force, if there is a deviation in the placement of the bonded wafer itself, the wafer may be poorly stressed and cracked.

[0051] The bonded wafer debonding device 100 further includes a second lifting module 60, which is used to drive the wafer on the upper adsorption plate 31 to rise and fall. It should be noted that the upper adsorption plate here is already above the right material table mentioned below and is desorbed, so that the wafer can be lifted up, which is convenient for the robot arm below to reach in through the isolation door and take it away.

[0052] In the present application, the side lift mechanism 50, the first lifting module 22 and / or the second lifting module 60 are torque electric cylinders. That is, one of the three can use a torque electric cylinder, any two can use a torque electric cylinder, or all can use a torque electric cylinder. The output torque control of the torque electric cylinder is more precise and accurate than that of a general electric cylinder. Further, in the present embodiment, the side lift mechanism 50 and the first lifting module 22 both use torque electric cylinders.

[0053] Please combine Figure 4 and Figure 7 The bonded wafer debonding device 100 is further provided with a first in-position sensor 71, a second in-position sensor 72, a first limit buffer 73 and a second limit buffer 74, and the unloading table 11 includes a left material table 112 and a right material table 113;

[0054] The first in-position sensor 71 and the first limit buffer 73 are arranged near the side lift mechanism 50 and close to the left material table 112 , and the second in-position sensor 72 and the second limit buffer 74 are close to the right material table 113 .

[0055] Specifically, the left material table 112 of the present embodiment is provided with a plurality of base frames 1121, a part of the base frames 1121 is provided with the above-mentioned ejector pins 111 and the material blocking rods 114, and another part of the base frames 1121 is provided with a track 1122, and the mounting plate 211 of the lower adsorption plate 21 is movably arranged on the track 1122 through a slider 1123. When the torque electric cylinder drives the mounting plate 211, the mounting plate 211 is lifted and lowered along the track 1122, thereby driving the lifting and lowering of the lower adsorption plate 21. The lower adsorption plate 21 has an ejector pin hole, so there will be no interference. When the lower adsorption plate 21 is lifted to a certain height, the wafer contacts the lower adsorption plate 21 and is lifted and separated from the ejector pins 111.

[0056] Please combine Figure 5 and Figure 6 The flip mechanism 40 of this embodiment includes a flip motor 41, a floating gas joint 42 and a flip arm 43. The output shaft of the flip motor 41 is connected to the flip arm 43, and the flip arm 43 is connected to the upper wafer adsorption mechanism 30. The floating gas joint 42 is connected to the output shaft of the flip motor 41 and is used to provide negative pressure gas to the upper wafer adsorption mechanism 30. In this embodiment, the upper adsorption plate 31 of the upper wafer adsorption mechanism 30 is connected to the flip arm 43 through a linear sliding shaft 32, so that the upper adsorption plate 31 is allowed to have a certain buffer after being subjected to force to prevent the wafer from breaking.

[0057] Specifically, the flip mechanism 40 also includes a third lifting module 44, and the flip motor 41 is arranged at the output end of the third lifting module 44. A connecting block 411 is arranged on the output shaft of the flip motor 41, and the bottom of the connecting block 411 is connected to the flip arm 43, and the side of the connecting block 411 is connected to the negative pressure adapter plate 45, and the negative pressure adapter plate 45 is connected to the floating air joint 42, and the negative pressure adapter plate 45 is connected to the upper adsorption disk 31 to achieve negative pressure adsorption. Due to the floating air joint 42, when the upper wafer adsorption mechanism 30 is turned over by the flip motor 41 driving the flip arm 43, the air pipe will not be twisted, thereby ensuring the stability and reliability of the negative pressure adsorption, and avoiding the twisting of the air pipe and affecting the reliable adsorption of the wafer. The third lifting module 44 of this embodiment adopts a cylinder, and a guide rail 441 is provided on the base 10, and the mounting seat body of the flip motor 41 can be slidably arranged on the guide rail 441.

[0058] By setting the third lifting module 44, the height of the flip motor 41 can be adjusted, so that it can adapt to bonded wafers of different thicknesses, so that the bonded wafer debonding device 100 of the present application can be compatible with wafers of different specifications, which is more in line with actual production needs.

[0059] Please combine Figure 1The bonded wafer debonding device 100 also includes an isolation door 80 (the figure mainly shows the installation position of the isolation door, and the isolation door body is hidden to facilitate viewing of the part of the manipulator extending behind the isolation door) and a manipulator 81. The left material table 112 and the right material table 113 are each equipped with a set of isolation doors 80 and manipulators 81. When the isolation door 80 is opened, the manipulator 81 can take and place wafers on the unloading table 11. It can be understood that the manipulator 81 can be a structure of the bonded wafer debonding device 100 or other external mechanisms, and it is not limited that the manipulator 81 must be connected to the base 10 or other structures of the bonded wafer debonding device 100.

[0060] The bonded wafer debonding device 100 further includes an exhaust port 82 and an electrostatic eliminator (not shown). The electrostatic eliminator can generally be disposed in the space above the unloading table 11 , and the exhaust port 82 is disposed below the base 10 .

[0061] Please combine Figure 5 and Figure 6 Specifically, the right material table 113 of the present embodiment is provided with a support frame 1131 and a support plate 1132, the second lifting module 60 is mounted on the support frame 1131, the support frame 1131 is mounted on the base 10, and when the second lifting module 60 adopts a cylinder, the output end is connected to the support plate 1132, and a ejector pin 111 and a material blocking rod 114 are provided on the support plate 1132. The cylinder drives the ejector pin 111 to rise and fall, thereby driving the wafer to rise and fall. When the debonding is completed, the wafer adsorbed by the upper adsorption plate 31 can be lifted up by the ejector pin 111 and separated from the upper adsorption plate 31, and it is convenient for the manipulator 81 to take away the wafer. Of course, the present embodiment uses a torque electric cylinder as an example, and is not limited to this type of cylinder. Other cylinders or linear drive devices can be considered for use.

[0062] An embodiment of the present application provides a debonding machine, including a semi-enclosed chamber (not shown) and the above-mentioned bonded wafer debonding device 100, the bonded wafer debonding device 100 is arranged in the semi-enclosed chamber, and the opening and closing of the semi-enclosed chamber is controlled by an isolation door 80.

[0063] Among them, the semi-enclosed cavity can be a constructed building, which is in a semi-enclosed state, and the bonded wafer debonding device 100 can be accommodated inside. The isolation door 80 of the bonded wafer debonding device 100 can realize the closure and opening of the cavity, so that the wafer can only be taken in and out from the isolation door 80. The semi-enclosed cavity can also be a shell that can provide a closed structure, and its open position is also the location of the isolation door 80, and the wafer can only be taken in and out through the isolation door 80. Regardless of the form, or other improved forms, an FFU (static eliminator) can be set above it, so as to cooperate with the exhaust port 82 of the bonded wafer debonding device 100 to take away the particles generated after debonding and avoid wafer contamination.

[0064] It can be understood that the static eliminator can be a part of the bonded wafer debonding device 100, which can then be installed on the top of the semi-enclosed cavity, or it can be a mechanism preset in the semi-enclosed cavity, that is, the cavity that already has a static eliminator can choose a bonded wafer debonding device 100 with a more streamlined structure, which saves the company the cost of equipment modification and is more conducive to the actual value of this application.

[0065] The principle of this embodiment is:

[0066] The bonding wafer is sent to the left material table 112 by the robot 81, and then the first lifting module 22 lifts the lower suction plate 21 and engages with the bonding wafer. The torque cylinder of the first lifting module 22 continues to drive the lower suction plate 21 to rise, so that the bonding wafer contacts and is adsorbed by the upper suction plate 31 above.

[0067] Then the output end of the torque electric cylinder of the side-lifting mechanism 50 is lifted upward, so that one end of the flip arm 43 is pushed up. Since the other end of the flip arm 43 is connected to the output shaft of the flip motor 41, the flip arm 43 can pivot in a small range when lifting. The output end of the side-lifting mechanism 50 is provided with a roller, which can make the side-lifting process smoother and avoid the large friction between the flip arm 43 and the output end, which causes the wafer to be instantly overstressed and broken. The flip arm 43 is connected to the upper adsorption plate 31. The left and right forces of the upper adsorption plate 31 are uneven, so that the upper wafer in the bonded wafer can also be subjected to different forces on the left and right, and the lower wafer is fixed by the lower adsorption plate 21, so that the left side of the upper wafer can have a tendency to move upward relative to the lower wafer. At the same time, the torque electric cylinder of the first lifting module 22 drives the lower adsorption plate 21 to descend. Under the synchronous action of the above-mentioned trends, the bonded wafers can be separated smoothly.

[0068] The present application cleverly applies forces in different directions to the upper and lower wafers of the bonded wafer, so that the directions of the forces on the two wafers have a certain angle, just like when a person separates two bonded thin sheets, he would insert his fingernails or other objects into the edge between the two thin sheets and then separate them. The position of the force is precisely controlled, and the output force of the torque cylinder is also controlled with high precision. When the position and size of the force are accurate, the debonding process is very stable and reliable, which greatly reduces the breakage rate of the bonded wafer during the debonding process.

[0069] After the upper wafer is separated, the flip motor 41 drives the upper suction plate 31 to flip 180° and move to above the right material table 113. The upper suction plate 31 is no longer adsorbed, and the second lifting module 60 drives the supporting plate 1132 to rise. The ejector pin 111 supports and further lifts the upper wafer and separates it from the upper suction plate 31. After the upper wafer rises to a certain height, the robot 81 takes it away.

[0070] After the new bonded wafer is fed to the left material table 112, the flip arm 43 drives the upper suction plate 31 to flip over the bonded wafer, and the above operation is repeated. A first in-position sensor 71, a first limit buffer 73, a second in-position sensor 72 and a second limit buffer 74 are provided at the two extreme positions where the flip arm 43 drives the upper suction plate 31 to flip back and forth, so that the stroke of the flip arm 43 is accurately controlled and fed back to the control system so that the control system controls the operation of different components.

[0071] If the thickness of the bonded wafer to be debonded changes, the height of the flip motor 41 can be adjusted by the third lifting module 44, so that when the upper adsorption plate 31 moves to the left material table 112, its height is different to fit the new bonded wafer and avoid damaging the wafer. In the above separation process, the static eliminator cooperates with the exhaust port 82 below to take away the particles generated after debonding and avoid contamination of the upper and lower wafers.

[0072] In summary, the bonded wafer debonding device 100 of the present application applies forces at different positions and directions to the bonded wafer through the lower wafer adsorption mechanism 20 and the side top mechanism 50, which can avoid the problem of cracking, improve the success rate of debonding, avoid the wafer from being damaged, meet the needs of wafer debonding, and improve the yield rate. Even 12-inch wafers can be successfully debonded. Directly combining the bonded wafer debonding device 100 with a semi-enclosed cavity to form a debonding machine with an integrated structure can also be convenient for enterprises to use directly, which is more conducive to production operations.

[0073] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A bonded wafer debonding device, characterized in that: include: A base, wherein the base is provided with a material placing table, and the material placing table is used for placing the bonding wafer; A lower wafer adsorption mechanism, the lower wafer adsorption mechanism is arranged on the base, the lower wafer adsorption mechanism comprises a lower adsorption plate and a first lifting module for driving the adsorption plate to rise and fall, the lower adsorption plate is arranged below the unloading platform to adsorb the lower surface of the bonding wafer; An upper wafer adsorption mechanism, wherein the upper wafer adsorption mechanism comprises an upper adsorption plate; A flip mechanism, the flip mechanism is used to drive the upper adsorption plate to approach or leave the unloading platform, when the upper adsorption plate approaches the unloading platform, the upper adsorption plate can adsorb the upper surface of the bonding wafer; and A side lift mechanism, the side lift mechanism is arranged on the side of the unloading platform; Among them, after the lower adsorption plate and the upper adsorption plate adsorb the bonded wafer, the side lifting mechanism is used to lift one side of the upper adsorption plate so that the upper adsorption plate pivots around the output shaft of the flip mechanism.

2. The bonded wafer debonding device according to claim 1, characterized in that: The flipping mechanism includes a flipping motor, a floating gas joint and a flipping arm. The output shaft of the flipping motor is connected to the flipping arm, and the flipping arm is connected to the upper wafer adsorption mechanism. The floating gas joint is connected to the output shaft of the flipping motor and is used to provide negative pressure gas to the upper wafer adsorption mechanism.

3. The bonded wafer debonding device according to claim 2, characterized in that: The flipping mechanism further includes a third lifting module, and the flipping motor is arranged at an output end of the third lifting module.

4. The bonded wafer debonding device according to claim 1, characterized in that: The bonded wafer debonding device further includes a second lifting module, and the second lifting module is used to drive the wafer on the upper adsorption plate to rise and fall.

5. The bonded wafer debonding device according to claim 4, characterized in that: The side lifting mechanism, the first lifting module and / or the second lifting module are torque electric cylinders.

6. The bonded wafer debonding device according to claim 1, characterized in that: The bonded wafer debonding device is further provided with a first in-place sensor, a second in-place sensor, a first limit buffer and a second limit buffer, and the unloading platform includes a left platform and a right platform; The first in-place sensor and the first limit buffer are arranged near the side top mechanism and close to the left material platform, and the second in-place sensor and the second limit buffer are close to the right material platform.

7. The bonded wafer debonding device according to claim 6, characterized in that: The bonded wafer debonding device also includes an isolation door and a robot. The left material table and the right material table are each configured with a set of the isolation door and the robot. When the isolation door is opened, the robot can take and place wafers on the material placement table.

8. The bonded wafer debonding device according to claim 1, characterized in that: The bonded wafer debonding device also includes an exhaust port and an electrostatic eliminator. The electrostatic eliminator is arranged in the space above the unloading table, and the exhaust port is arranged below the base.

9. The bonded wafer debonding device according to claim 1, characterized in that: The upper adsorption plate and the lower adsorption plate are both provided with ejector pin holes, and the base is provided with an ejector pin group, a part of the ejector pin group can be passed through the lower adsorption plate to support the wafer, and another part of the ejector pin group can be passed through the upper adsorption plate to support the wafer.

10. A debonding machine, characterized in that: It comprises a semi-enclosed cavity and the bonded wafer debonding device according to any one of claims 1 to 9, wherein the bonded wafer debonding device is arranged in the semi-enclosed cavity, and the opening and closing of the semi-enclosed cavity is controlled by an isolation door.

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