Stacked wafer heating device

Abstract

The utility model discloses a stacked wafer heating device which comprises two parallel vertical plates, a plurality of supporting transverse plates are arranged between the two vertical plates, each supporting transverse plate is provided with a heating plate, supporting columns are arranged between the heating plates and the supporting transverse plates, and an action space is formed. Avoiding openings are formed in the two vertical plates corresponding to the action space, two horizontally-arranged lifting arms are arranged in the action space, the two lifting arms are symmetrically arranged, one ends of the two lifting arms penetrate through the adjacent avoiding openings and are connected with lifting air cylinders, the lifting air cylinders are fixed to the outer surfaces of the vertical plates, and a plurality of ejector pins are arranged at the other ends of the lifting arms; guide through holes are formed in the heating plate corresponding to the ejector pins, and one ends of the ejector pins are arranged in the guide through holes and move in the guide direction to extend out of the upper surface of the heating plate. According to the utility model, the longitudinal space in the dispensing equipment can be fully utilized, and the use of the horizontal space is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a stacked wafer heating device. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. In the production process, dispensing of wafer is an essential step. Before dispensing, heating the wafer helps to improve the quality of dispensing.

[0003] Existing heating devices all use a heating plate to heat the wafer. The heating plate is equipped with multiple push rod structures. The push rods are driven up and down by a lifting mechanism. The lifting mechanism is vertically arranged on the bottom plate bracket at the bottom of the heating plate. During the process of placing and removing the wafer, the auxiliary robot lifts the wafer to a certain height to facilitate the robot to grab and place it.

[0004] However, a single heating plate can only heat one wafer at a time. When batch preparation is required in the dispensing equipment, a single heating plate cannot meet the heating speed, so multiple heating plates are arranged. In addition, since the top rod needs to be driven by the bottom lifting mechanism, the vertically arranged lifting mechanism makes the heating mechanism larger in the vertical direction. Multiple heating plates need to be arranged horizontally, which seriously occupies the space in the dispensing equipment and the space is cramped. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide a stacked wafer heating device, which can fully utilize the longitudinal space in the glue dispensing equipment and reduce the use of the horizontal space.

[0006] In order to solve the above technical problems, the utility model provides a stacked wafer heating device, comprising two parallel vertical plates, a plurality of supporting horizontal plates are arranged between the two vertical plates, a heating plate is arranged on each of the supporting horizontal plates, a heating component is arranged in the heating plate, a supporting column is arranged between the heating plate and the supporting horizontal plates to form an action space, avoidance openings are arranged on the two vertical plates corresponding to the action space, two horizontally arranged lifting arms are arranged in the action space, the two lifting arms are symmetrically arranged and one end passes through the adjacent avoidance openings and is connected to a lifting cylinder, the lifting cylinder is fixed on the outer surface of the vertical plate, a plurality of ejectors are arranged on the other end of the lifting arm, a guide through hole is arranged on the heating plate corresponding to the ejector, one end of the ejector is arranged in the guide through hole and moves along the guide direction to extend to the upper surface of the heating plate.

[0007] Furthermore, the heating plate includes a lower base plate and an upper cover plate, the lower base plate is provided with a coil groove, and the heating component is arranged in the coil groove.

[0008] Furthermore, the heating component is a liquid heating coil or an electric heating tube.

[0009] Furthermore, a limit mounting part is provided at the bottom of the ejector pin, and the limit mounting part includes an upper limit disk, a guide column and a lower limit nut which are connected in sequence. A mounting hole is provided on the lifting arm corresponding to the guide column. The guide column passes through the mounting hole and is connected to the limit nut. The distance between the limit nut and the upper limit disk is greater than the thickness of the lifting arm. The diameter of the mounting hole is greater than the diameter of the guide column and smaller than the outer diameter of the upper limit disk and the lower limit nut.

[0010] Furthermore, two L-shaped arms are arranged on the lifting arm in opposition to each other, and a blocking plate is arranged on the top of the L-shaped arm. The blocking plates located on the same side of the two lifting arms cooperate to form a heat-collecting side retaining edge.

[0011] Furthermore, a buffer block is provided between the lifting arm and the supporting cross plate.

[0012] Furthermore, the support column is made of thermal insulation material.

[0013] Beneficial effects of the utility model:

[0014] 1. The horizontally arranged lifting arm is used to drive the ejector to rise and fall, so that the power source of the lifting arm can be set laterally, thereby greatly reducing the volume of the heating part in the longitudinal direction, meeting the space requirements of multi-layer stacking technology, occupying less space inside the dispensing machine, and improving the compactness of the equipment.

[0015] 2. The heating plate is fixed on the supporting horizontal plate in an overhead manner, which effectively reduces the heat conduction loss and makes full use of the space between the two, thus providing the possibility of stacking design. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the support effect of a single heating plate of the utility model;

[0018] Figure 3 It is a schematic diagram of the structure of the limit installation part of the utility model;

[0019] Figure 4 It is a schematic diagram of the side baffle action state of the utility model when heating or gathering heat;

[0020] Figure 5 It is a schematic diagram of the action state of the side baffle when taking and placing a wafer in the utility model. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0022] Reference Figures 1 to 3 As shown, an embodiment of a stacked wafer heating device of the utility model comprises two parallel vertical plates 1, a plurality of supporting horizontal plates 2 are arranged between the two vertical plates, a heating plate 3 is arranged on each supporting horizontal plate, a heating component 4 is arranged in the heating plate, a supporting column 111 is arranged between the heating plate and the supporting horizontal plate to form an action space, avoidance openings 5 ​​are arranged on the two vertical plates corresponding to the action space, two horizontally arranged lifting arms 6 are arranged in the action space, the two lifting arms are symmetrically arranged and one end passes through the adjacent avoidance openings and is connected to the lifting cylinder 7, the lifting cylinder is fixed on the outer surface of the vertical plate, a plurality of ejector pins 8 are arranged on the other end of the lifting arm, a guide through hole 9 is arranged on the heating plate corresponding to the ejector pin, one end of the ejector pin is arranged in the guide through hole and moves along the guide direction to extend to the upper surface of the heating plate.

[0023] The above-mentioned two vertical plates and multiple supporting horizontal plates cooperate to form a cabinet frame structure, and both sides are open, and wafers can be placed on both sides, so multiple groups of manipulators can be arranged on both sides to work simultaneously. For the heating of the wafer, the manipulator first grabs the wafer and places it on the heating plate. Specifically, the lifting cylinder drives the lifting arm to rise, and the ejector pin is driven to rise and protrude to the surface of the heating plate. The manipulator is adsorbed on the lower surface of the wafer and places the wafer on the ejector pin. The two groups of ejector pins of the two lifting arms cooperate to support the wafer. The manipulator withdraws and the wafer remains on the two groups of ejector pins. Then the lifting cylinder drives the lifting arm to descend, and the ejector pin is driven to descend and retract into the heating plate. At this time, the wafer is left on the surface of the heating plate, and the heating plate heats the wafer.

[0024] After the heating is completed, the lifting cylinder drives the lifting arm to rise, and the ejector pin is driven to rise and protrude to the surface of the heating plate, thereby lifting the wafer on the surface of the heating plate, so that the heated wafer is separated from the heating plate, and a space is formed between the lower surface of the wafer and the heating plate for the robot to enter. The robot adsorbs on the lower surface of the wafer and takes the wafer away, completing the heating of the single wafer.

[0025] The robot grabs the lower surface of the wafer mainly to avoid contamination of the wafer surface.

[0026] The lifting arm is set horizontally, and the lifting cylinder is located outside the heating space. Therefore, the movement space between the heating plate and the supporting cross plate only needs to meet the lifting stroke of the ejector pin, and the space between the heating plate and the upper supporting cross plate only needs to meet the reserved height and falling height of the wafer. Therefore, the overall structure is flat in the longitudinal direction, and multiple heating plates can be effectively stacked and combined, and each layer can heat the wafer separately.

[0027] When the guide through hole is opened on the heating plate, due to the influence of processing accuracy, there is a slight misalignment between the bottom of the ejector pin and the lifting arm after installation. The ejector pin rubs against the guide through hole during lifting and lowering, which can easily damage the ejector pin and cause malfunction. Therefore, a limit mounting part is provided at the bottom of the ejector pin. The limit mounting part includes an upper limit disk 10, a guide column 11 and a lower limit nut 12 which are connected in sequence. A mounting hole 15 is provided on the lifting arm corresponding to the guide column. The guide column passes through the mounting hole and is connected to the limit nut. The distance between the limit nut and the upper limit disk is greater than the thickness of the lifting arm. The diameter of the mounting hole is greater than the diameter of the guide column and smaller than the outer diameter of the upper limit disk and the lower limit nut.

[0028] An axial limit is formed between the limit mounting part at the bottom of the ejector pin and the lifting arm, and after the limit nut is locked, it and the upper limit plate cannot clamp the lifting arm, and have a certain amount of activity, but have an adaptive amount of activity in the horizontal direction, so that during the rise of the ejector pin, the ejector pin can move up and down adaptively, and the lifting force of the lifting arm is transmitted to the ejector pin through the upper limit plate. When descending, the weight of the ejector pin and the wafer can achieve the descending action. Of course, during the descent of the lifting arm, it can push against the lower limit nut to drive the ejector pin to move downward. The spacing between the lifting arm and the upper limit plate and the lower limit nut is set within 1mm to ensure that the ejector pin can move horizontally adaptively without large movement fluctuations.

[0029] Reference Figure 1 , Figure 4 and Figure 5 As shown, two L-shaped arms 13 arranged opposite to each other are added to each lifting arm, and a blocking plate 14 is arranged on the top of the L-shaped arm. The blocking plate is located on the outer side of the supporting cross plate, and the blocking plates located on the same side of the two lifting arms cooperate to form a heat-gathering side rib. There are two heat-gathering side ribs on both sides of the two lifting arms, that is, they form a shield on both sides of the feeding direction of the heating plate, which are located on the upper part of the heating plate. The heat after heating by the heating plate will be blocked by the upper supporting cross plate and overflow to both sides. At this time, the two heat-gathering side ribs can effectively reduce the overflow, that is, during the wafer heating process, the upper surface of the wafer has an auxiliary heating effect, and during the preheating process of the heating plate, the heat loss is reduced to improve the heating effect.

[0030] The L-shaped arm is linked to the lifting arm, that is, it is linked to the ejector pin. When the ejector pin descends, the blocking plate cooperates with the upper supporting horizontal plate to form a heat gathering space above the heating plate. When the ejector pin rises, the blocking plate also rises accordingly, which does not affect the robot arm's grasping of the wafer and does not cause interference.

[0031] The above-mentioned heating plate includes a lower base plate and an upper cover plate. The lower base plate is provided with a disc groove, and the heating component is arranged in the disc groove for easy repair and maintenance. The disc-shaped design can make the surface of the heating plate heat up evenly and have a good heating effect. The heating component is a liquid heating coil or an electric heating tube. The liquid heating coil is connected to the thermal circulation device, and the electric heating tube is directly powered. A buffer block is also provided between the lifting arm and the supporting cross plate. When the lifting arm descends to approach the heating plate, it has a good buffering effect, avoiding excessive impact force on the wafer on the surface of the heating plate, thereby ensuring the quality of the wafer. The support column is made of insulating material, which can be made of polypropylene and polyethylene, has good supporting strength, poor thermal conductivity, reduces heat loss, and reduces the impact on other equipment components.

[0032] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or modification made by a person skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A stacked wafer heating device, characterized in that: It includes two parallel vertical plates, a plurality of supporting horizontal plates are arranged between the two vertical plates, a heating plate is arranged on each of the supporting horizontal plates, a heating component is arranged in the heating plate, a supporting column is arranged between the heating plate and the supporting horizontal plate to form an action space, avoidance openings are arranged on the two vertical plates corresponding to the action space, two horizontally arranged lifting arms are arranged in the action space, the two lifting arms are symmetrically arranged and one end of the two lifting arms passes through the adjacent avoidance openings and is connected to the lifting cylinder, the lifting cylinder is fixed on the outer surface of the vertical plate, a plurality of ejectors are arranged on the other end of the lifting arm, a guide through hole is arranged on the heating plate corresponding to the ejector, one end of the ejector is arranged in the guide through hole and moves along the guide direction to extend to the upper surface of the heating plate.

2. The stacked wafer heating device according to claim 1, characterized in that: The heating plate comprises a lower bottom plate and an upper cover plate, the lower bottom plate is provided with a coiling groove, and the heating component is arranged in the coiling groove.

3. The stacked wafer heating device according to claim 2, characterized in that: The heating component is a liquid heating coil or an electric heating tube.

4. The stacked wafer heating device according to claim 1, characterized in that: A limit mounting part is provided at the bottom of the ejector pin, and the limit mounting part includes an upper limit disk, a guide column and a lower limit nut connected in sequence. A mounting hole is provided on the lifting arm corresponding to the guide column. The guide column passes through the mounting hole and is connected to the limit nut. The distance between the limit nut and the upper limit disk is greater than the thickness of the lifting arm. The diameter of the mounting hole is greater than the diameter of the guide column and smaller than the outer diameter of the upper limit disk and the lower limit nut.

5. The stacked wafer heating device according to claim 1, characterized in that: Two L-shaped support arms are arranged opposite to each other on the lifting arm, and a blocking plate is arranged on the top of the L-shaped support arm. The blocking plates located on the same side of the two lifting arms cooperate to form a heat collecting side retaining edge.

6. The stacked wafer heating device according to claim 1, characterized in that: A buffer block is also arranged between the lifting arm and the supporting cross plate.

7. The stacked wafer heating device according to claim 1, characterized in that: The support column is made of heat-insulating material.

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