Double-arm type wafer position correction equipment
By designing a double-arm wafer position correction equipment, using a slide rail cylinder, arc positioning plate and multi-axis mechanism, the problem of high cost and low efficiency of wafer position correction equipment in the prior art is solved, and efficient and low-cost wafer position correction effect is achieved.
Patent Information
- Application Number
- CN202422112942.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-08-29
AI Technical Summary
In the prior art, wafer position correction equipment has high cost, low efficiency, and large space occupies, making it difficult to meet the efficient and low-cost wafer position correction needs.
A double-arm wafer position correction device is designed, using a slide rail cylinder to drive the arc positioning plate movement, combining a columnar suction cup and a multi-axis mechanism to achieve efficient wafer position correction.
It realizes efficient and low cost of wafer position correction, reduces the cost of using robots and visual equipment, improves correction efficiency, and saves space.
Smart Images
Figure CN222775294U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor preparation, in particular to a double-arm wafer position correction device. Background Art
[0002] Wafers are the basic materials for manufacturing integrated circuits or chips. During the wafer preparation process, wafers will be continuously grabbed and placed by robots in various processes, such as heating, cooling, dispensing, etching, etc. During the continuous transfer process, the position of the wafer is prone to change, so the wafer needs to be corrected to ensure the accuracy of the position during grabbing, especially during the dispensing process. If the wafer position is offset, the wafer will sway during its rotation and the dispensing position of the dispensing machine will also change, resulting in poor dispensing.
[0003] In the prior art, the position correction of the wafer is usually carried out by using camera vision position correction, and the coordinates after position correction are used in conjunction with a high-precision manipulator to move and grab the wafer. This method has high accuracy, but has the following disadvantages:
[0004] 1. The use cost of the robot and visual equipment is relatively high. The robot can only perform position correction and grasping of one wafer at a time, which is inefficient.
[0005] 2. The installation of visual cameras also requires sufficient space in the vertical direction, and the utilization rate of the upper space is not high. Summary of the invention
[0006] The technical problem to be solved by the utility model is to provide a double-arm wafer position correction device, which has low preparation cost, small occupied space and high use efficiency.
[0007] In order to solve the above technical problems, the utility model provides a double-arm wafer position correction device, including an installation platform, on which a mechanical correction module and a multi-axis mechanism are arranged, the mechanical correction module includes two symmetrically arranged guide cylinders, the slider of the guide cylinder is provided with an arc-shaped positioning plate, and the middle part between the two guide cylinders is provided with a columnar suction cup, the columnar suction cup is used to adsorb and fix the wafer, the arc-shaped positioning plates on the two guide cylinders cooperate to correct the position of the wafer on the columnar suction cup, the multi-axis mechanism includes two electric slides arranged side by side and in parallel, the two electric slides are arranged on a rotating assembly, a lifting assembly is arranged at the bottom of the rotating assembly, a lateral cantilever is arranged on the slide of the electric slide, a vacuum finger plate is arranged on the lateral cantilever, and the vacuum finger plates on the two electric slides are arranged overlapping.
[0008] Furthermore, the mechanical correction module is arranged on the correction platform, and a heightening column is arranged between the bottom of the correction platform and the installation platform.
[0009] Furthermore, two arc-shaped positioning plates are arranged on the slider of each guide rail cylinder, and the two arc-shaped positioning plates are arranged at different heights and are staggered in the moving direction.
[0010] Furthermore, the columnar suction cup is threadedly connected to the mounting seat via an external thread, the bottom of the columnar suction cup is connected to a rotating air joint, and limiting portions are provided on the columnar suction cups on both axial sides of the mounting seat.
[0011] Furthermore, a plurality of positioning columns are arranged on the correction platform around the columnar suction cup, and the top height of the positioning columns is flush with the surface of the columnar suction cup.
[0012] Furthermore, the plurality of positioning posts are fixed on the upper side and the lower side of the correction platform by means of limiting connectors.
[0013] Furthermore, a magnetic attraction structure is provided between the limiting connector and the correction platform.
[0014] Furthermore, at least two abutment wheels are arranged on the arc portion of the arc positioning plate.
[0015] Beneficial effects of the utility model:
[0016] 1. The slide rail cylinder is used to drive the arc positioning plate to move. The two arc positioning plates can move relative to each other to position and squeeze the periphery of the wafer, thereby pushing the wafer to the center position formed by the cooperation of the two arc positioning plates, thereby achieving effective positioning without the need for complex calculations. It is simple and reliable, and has a low preparation cost.
[0017] 2. The two vacuum finger plates are overlapped and can be extended independently. Therefore, two wafers can be grabbed at one time for position correction, which greatly saves time during the movement process and improves correction efficiency.
[0018] 3. The multi-axis mechanism can be lifted, rotated and extended to meet the needs of wafer transfer, with a simple structure and low cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0020] Figure 2 It is a schematic diagram of the structure of the mechanical correction module of the utility model;
[0021] Figure 3 This is a schematic diagram of the bottom structure of the correction platform of the utility model;
[0022] Figure 4 It is a front view schematic diagram of a mechanical correction module applicable to the first size in the utility model;
[0023] Figure 5It is a front view schematic diagram of a mechanical correction module suitable for the second size in the utility model. DETAILED DESCRIPTION
[0024] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0025] Reference Figure 1 and Figure 2 As shown, an embodiment of the double-arm wafer position correction device of the utility model includes a mounting platform 1, on which a mechanical correction module 2 and a multi-axis mechanism 3 are arranged, the mechanical correction module includes two symmetrically arranged guide cylinders 4, an arc-shaped positioning plate 5 is arranged on the slider of the guide cylinder, a columnar suction cup 6 is arranged in the middle between the two guide cylinders, the columnar suction cup is used to adsorb and fix the wafer, the arc-shaped positioning plates on the two guide cylinders cooperate to correct the position of the wafer on the columnar suction cup, the multi-axis mechanism includes two parallel and parallel electric slides 7, the two electric slides are arranged on a rotating assembly 8, a lifting assembly 9 is arranged at the bottom of the rotating assembly, a lateral cantilever 10 is arranged on the slide of the electric slide, a vacuum finger plate 11 is arranged on the lateral cantilever, and the vacuum finger plates on the two electric slides are overlapped.
[0026] For the mechanical correction module, the curvature of the two arc-shaped positioning plates is consistent, and the arc-shaped positioning plates are driven to move toward the middle by two guide cylinders. After they are in place, a circular space of fixed size is formed between the two arc-shaped positioning plates, which is the size of the wafer. When the wafer has a position deviation, the two arc-shaped positioning plates will squeeze the offset position of the wafer, thereby forcing the wafer to move into the circular space to achieve a correction effect. Specifically, in order not to cause squeezing damage to the side of the wafer, at least two abutment wheels 20 are provided on the arc-shaped positioning plate. The abutment wheels make point contact with the wafer at the periphery of the wafer to reduce the contact area, and at least four abutment wheels on the two arc-shaped positioning plates can effectively limit the movement of the wafer at the periphery of the wafer. During the adjustment process, the cylindrical suction cup adsorbs and fixes the wafer, and its adsorption force can ensure that the wafer is pushed but does not fall.
[0027] For the multi-axis mechanism, it forms a manipulator structure, which drives the rotating component, electric slide and vacuum finger plate to rise and fall synchronously through the lifting component, the rotating component drives the electric slide and vacuum finger plate to rotate, and the electric slide can drive the vacuum finger plate to extend and retract, thus forming a three-axis movement effect, which can meet the needs of wafer transfer. The vacuum finger plate has a hole inside, and a suction port is set on the surface of one end. Through the access of the vacuum tube, suction is generated on the suction port to support and fix one side of the bottom of the wafer, so that the wafer is transferred to the target position through the cooperation of the lifting component, the rotating component and the electric slide.
[0028] Specifically, during the correction process, since there are two vacuum finger plates, and the two vacuum finger plates can be extended separately, two wafers can be grabbed at one time, that is, one of the vacuum finger plates extends to grab one wafer, which is achieved by the lifting component driving the vacuum finger plate to lift and lower, and retract after grabbing the wafer. The lifting component drives the lifting and lowering so that the second vacuum finger plate is located at the position for grabbing the second wafer, and then the second vacuum finger plate is extended, and the lifting component cooperates with the second vacuum finger plate to grab the second wafer, and then retracts to complete the grabbing of the two wafers. Then the rotating component drives the grabbed two wafers toward the mechanical correction module, and the height of the first wafer to be corrected is adjusted by the lifting component, and then it is extended and placed on the columnar suction cup, and the columnar suction cup absorbs the wafer, and the two arc-shaped positioning plates cooperate to correct the position of the wafer. After the correction is completed, the first vacuum finger plate grabs the wafer and retracts, and then the second vacuum finger plate extends to place the wafer for correction, and retracts after correction, to achieve an efficient correction effect for the two wafers. The position during the placement process is coordinated with the lifting assembly, which is an existing method. The rotating assembly and the lifting assembly both use existing mechanisms and will not be described in detail.
[0029] Reference Figure 2 and Figure 3 As shown, since the size of the two electric slides is larger than the rotating assembly, in order to match the lower limit height of the vacuum fingerboard, the mechanical correction module is set on the correction platform 12, and a heightening column 13 is set between the bottom of the correction platform and the installation platform.
[0030] Each of the above-mentioned guide rail cylinders has two arc-shaped positioning plates on its slider. The two arc-shaped positioning plates are set at different heights and are staggered in the moving direction. The four arc-shaped positioning plates on the two guide rail cylinders cooperate with each other for correction. Figure 4 and Figure 5 As shown, the two arc-shaped positioning plates at the upper part can correct larger wafers, such as 8-inch wafers, and the two arc-shaped positioning plates at the lower part can correct smaller wafers, such as 6-inch wafers, thereby satisfying the effect of multi-size sharing, wherein oblong lock holes can be set on the arc-shaped positioning plates to achieve adjustable installation positions of the arc-shaped positioning plates, which can be adjusted to adapt to the use of wafers of different sizes.
[0031] When correcting wafers of different sizes, since the correction heights are not on the same horizontal plane, it is necessary to adjust the height position of the columnar suction cup. For this purpose, an effective design is made. The columnar suction cup is threadedly connected to the mounting seat 15 through an external thread. The mounting seat can be a nut. The bottom of the columnar suction cup is connected to the rotating air joint 16. During the rotation of the columnar suction cup, the rotating air joint can maintain the effectiveness of the vacuum without affecting the operation. The position adjustment at different heights can be effectively achieved through rotation.
[0032] When the adjustment size is 6-inch and 8-inch wafers, limiting parts 17 can also be set on the columnar suction cups on both sides of the axis of the mounting seat. The height adjustment requirements can be met by rotating the columnar suction cups to the lower limit or upper limit. The operation is convenient. The limiting part can be a nut, or a limiting ring for locking.
[0033] During the wafer correction process, the periphery of the wafer will be stressed. In order to form a stable support effect at the bottom of the wafer, a number of positioning columns 18 are also set on the correction platform around the columnar suction cup. The top height of the positioning column is flush with the surface of the columnar suction cup, so as to cooperate with the top of the columnar suction cup to achieve support and prevent the wafer from falling. As the columnar suction cup is adjusted, the height of the positioning column also needs to be adjusted synchronously. Therefore, a number of positioning columns are fixed on the upper and lower sides of the correction platform by limit connectors 19. The limit connectors integrate the four positioning columns into one, so that the four positioning columns rise and fall synchronously when moving. When the positioning column is in the lower limit position, the limit assembly at the upper part abuts against the correction platform to ensure that the positioning column will not continue to drop. When it is in the upper limit position, the dead weight of the positioning column will cause it to fall downward. Therefore, it needs to be fixed at the upper limit position. For this purpose, an easy-to-operate solution is provided, that is, a magnetic structure is provided between the limit connector and the correction platform. At the upper limit position, the limit connector and the correction platform are magnetically adsorbed and will not fall. When adjustment is required, only force is applied to press down. The operation is convenient and reliable.
[0034] Reference Figure 4 As shown, the positioning column and the columnar suction cup are both located at the upper limit position, the limit connector at the bottom of the positioning column abuts and is fixed to the bottom surface of the correction platform, and the limit part at the bottom of the columnar suction cup abuts against the bottom surface of the correction platform, that is, the columnar suction cup cannot rotate and rise. Figure 5 As shown in the figure, the positioning column and the columnar suction cup are both located at the lower limit position, the limit connector on the upper part of the positioning column abuts and fixes with the surface of the correction platform, and the limit part on the upper part of the columnar suction cup abuts with the surface of the correction platform, that is, the columnar suction cup cannot rotate and fall. The overall operation is convenient and reliable, and the lifting height is determined by the limit, which greatly reduces the complexity of adjustment.
[0035] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or modification made by a person skilled in the art based on the present invention is within the protection scope of the present invention.
Claims
1. A double-arm wafer position correction device, characterized in that: It includes an installation platform, on which a mechanical correction module and a multi-axis mechanism are arranged, the mechanical correction module includes two symmetrically arranged guide cylinders, the slider of the guide cylinder is provided with an arc-shaped positioning plate, the middle part between the two guide cylinders is provided with a columnar suction cup, the columnar suction cup is used to adsorb and fix the wafer, the arc-shaped positioning plates on the two guide cylinders cooperate to correct the position of the wafer on the columnar suction cup, the multi-axis mechanism includes two parallel and parallel electric slides, the two electric slides are arranged on a rotating assembly, a lifting assembly is arranged at the bottom of the rotating assembly, a lateral cantilever is arranged on the slide of the electric slide, a vacuum finger plate is arranged on the lateral cantilever, and the vacuum finger plates on the two electric slides are overlapped.
2. The dual-arm wafer position correction device according to claim 1, characterized in that: The mechanical correction module is arranged on the correction platform, and a heightening column is arranged between the bottom of the correction platform and the installation platform.
3. The dual-arm wafer position correction device according to claim 2, characterized in that: Two arc-shaped positioning plates are arranged on the slider of each guide rail cylinder. The two arc-shaped positioning plates are arranged at different heights and are staggered in the moving direction.
4. The dual-arm wafer position correction device according to claim 3, characterized in that: The columnar suction cup is threadedly connected to the mounting seat via an external thread, the bottom of the columnar suction cup is connected to a rotating air joint, and limiting portions are provided on the columnar suction cups on both axial sides of the mounting seat.
5. The dual-arm wafer position correction device according to claim 3, characterized in that: A plurality of positioning columns are arranged on the correction platform around the columnar suction cup, and the top height of the positioning columns is flush with the surface of the columnar suction cup.
6. The dual-arm wafer position correction device according to claim 5, characterized in that: The plurality of positioning posts are fixed on the upper side and the lower side of the correction platform through limiting connectors.
7. The dual-arm wafer position correction device according to claim 6, characterized in that: A magnetic attraction structure is arranged between the limit connecting piece and the correction platform.
8. The dual-arm wafer position correction device according to claim 1, characterized in that: At least two abutment wheels are arranged on the arc portion of the arc positioning plate.