Static-eliminating wear-resistant corrosion-resistant multi-size wafer carrying ceramic mechanical arm

Abstract

The utility model belongs to the technical field of wafer production, and particularly relates to an anti-static wear-resistant corrosion-resistant multi-size wafer carrying ceramic mechanical arm which comprises a bearing arm, an upper positioning groove and a lower positioning groove are formed in one end of the bearing arm from top to bottom, the size of the upper positioning groove is larger than that of the lower positioning groove, and the size of the lower positioning groove is larger than that of the bearing arm. A bearing groove is formed in the surface of the lower positioning groove, a fixing assembly is installed on the surface of the bearing arm, and the fixing assembly comprises a T-shaped pressing plate and a miniature electric push rod; when the bearing arm is used, the upper positioning groove is used for bearing and transferring a 12-inch wafer, the lower positioning groove is used for bearing and transferring an 8-inch wafer, compared with the prior art, the application range of the bearing arm is increased, and the pressing plate is pressed on the top of the wafer for positioning, so that the wafer is prevented from deviating in the process of transporting the wafer by the bearing arm.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a ceramic mechanical arm for transporting wafers of multiple sizes with antistatic, wear-resistant and corrosion-resistant properties. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8-inch and 12-inch.

[0003] Since the robotic arm will produce certain wear after long-term use, the robotic arm will shake up and down during the process of transporting wafers, causing the wafer to slide relative to the arm during the transport process, causing the wafer to shift, resulting in inaccurate wafer positioning during subsequent processing, causing the processed wafer to be unqualified.

[0004] The existing Chinese patent with announcement number CN217086553U discloses a ceramic robotic arm for wafer handling, including a bearing part and a fixed plate, the bearing part including a bearing groove with a concave upper end, and a positioning groove is concavely provided on one side of the bearing groove; the fixing plates are symmetrically provided on the left side wall of the bearing part, and the other ends of the two fixing plates are provided with connecting plates rotatably provided by a rotating rod, and the other end of the connecting plate is provided with a limiting pressure plate, and a micro electric push rod is provided between the right side wall of the connecting plate and the left side wall of the bearing part.

[0005] In view of the above-mentioned and existing related technologies, the inventors believe that the following defects often exist: the device carries the wafer through the positioning groove, and the size of the positioning groove is fixed, and it is only used for wafers of a single size, which makes the robot arm not widely applicable and needs to be improved; therefore, in order to solve the above problems, an anti-static, wear-resistant and corrosion-resistant multi-size wafer handling ceramic robot arm is proposed. Utility Model Content

[0006] In order to make up for the deficiencies of the prior art and solve the above-mentioned technical problems, the utility model proposes an anti-static, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm.

[0007] The technical solution adopted by the utility model to solve its technical problems is: the utility model describes an antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic mechanical arm, comprising a carrying arm, one end of the carrying arm is respectively provided with an upper positioning groove and a lower positioning groove from top to bottom, the size of the upper positioning groove is larger than the lower positioning groove, the surface of the lower positioning groove is provided with a carrying groove, a fixing component is installed on the surface of the carrying arm, the fixing component comprises a T-shaped pressing plate and a miniature electric push rod, the pressing plate passes through the carrying arm, the electric push rod is located on both sides of the pressing plate, the bottom end of the electric push rod is hinged to the carrying arm, and the driving end of the electric push rod is hinged to the pressing plate, when in use, the upper positioning groove is used to carry and transport 12-inch wafers, and the lower positioning groove is used to carry and transport 8-inch wafers, compared with the prior art, the applicable surface of the carrying arm is increased, after the wafer is placed on the positioning groove, the electric push rod is operated, the electric push rod shrinks and drives the pressing plate to slide downward, and presses down on the top of the wafer for positioning, so that the carrying arm can avoid wafer position displacement during the process of transporting the wafer.

[0008] Preferably, the upper positioning groove, the lower positioning groove and the bearing groove are configured to be U-shaped or semicircular, and the upper positioning groove, the lower positioning groove and the bearing groove are coaxially arranged.

[0009] Preferably, the upper positioning groove is used to accommodate a 12-inch wafer, and the lower positioning groove is used to accommodate an 8-inch wafer.

[0010] Preferably, the support arm is made of alumina, aluminum nitride or silicon carbide ceramic materials. Ceramic materials such as alumina, aluminum nitride or silicon carbide have physical properties such as high density, high hardness, and high wear resistance, as well as good heat resistance, excellent mechanical strength, good insulation in high temperature environments, good corrosion resistance and other physical properties. They are excellent materials for making semiconductor equipment robotic arms.

[0011] Preferably, the surface of the carrying arm is coated with an antistatic coating, the main components of which are polytetrafluoroethylene (also known as Teflon or PTFE) and metal phases. Due to the insulating properties of the ceramic material itself, during the transportation of wafers, due to contact, separation, friction, and shear stress, static electricity charges accumulate on the ceramic surface to form a higher voltage. The antistatic coating can solve the static electricity problem on the surface of the ceramic robotic arm.

[0012] Preferably, a plurality of screw through holes and positioning pin holes for assembling the mechanical arm are provided on the surface of the bearing arm.

[0013] Preferably, the pressing plate comprises a sliding seat, and an extension arm is slidably connected inside the sliding seat.

[0014] Preferably, a plurality of anti-skid pads are fixedly connected to the bottom of the extension arm, and the anti-skid effect is improved by the anti-skid pads.

[0015] Preferably, the bottom of the extension arm is fixedly connected to a support spring, and the bottom end of the support spring is fixedly connected to the sliding seat. The extension arm is located above the supporting arm through the support spring. When the pressure plate positions the wafer, the sliding seat slides downward so that the pressure sensor presses down the extension arm, so that the anti-slip pad is pressed down on the top of the wafer to fix it while improving the anti-slip effect.

[0016] Preferably, a pressure sensor is fixedly connected to the upper part of the inner wall of the sliding seat, and the pressure sensor is electrically connected to the electric push rod. The pressure of the extension arm is detected by the pressure sensor, and when the pressure reaches a predetermined value, the electric push rod is controlled to stop running to avoid damage to the wafer due to excessive pressure.

[0017] The utility model is beneficial in that:

[0018] 1. When the utility model is used, the upper positioning groove is used to carry and transport 12-inch wafers, and the lower positioning groove is used to carry and transport 8-inch wafers. Compared with the prior art, the applicable surface of the carrying arm is increased, and the pressure plate is pressed down on the top of the wafer for positioning, so that the carrying arm can avoid wafer position displacement during the wafer transportation process.

[0019] 2. When the pressing plate of the utility model positions the wafer, the anti-skid pad presses down on the top of the wafer to fix it and improve the anti-skid effect. The pressure of the extension arm is detected by the pressure sensor to avoid damage to the wafer caused by excessive pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the load-bearing arm of the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the upper positioning groove and the lower positioning groove of the utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the fixed component of the utility model;

[0025] Figure 5 For this utility model Figure 4 Schematic diagram of the A structure.

[0026] In the figure: 1. load-bearing arm; 3. upper positioning groove; 4. lower positioning groove; 5. load-bearing groove; 6. fixing assembly; 61. pressure plate; 62. electric push rod; 63. pressure sensor; 611. sliding seat; 612. extension arm; 613. anti-slip pad; 614. support spring; 7. positioning pin hole; 8. screw through hole. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Embodiment 1

[0029] See also Figure 1-4 As shown, a static-dissipating, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm includes a carrying arm 1, one end of the carrying arm 1 is respectively provided with an upper positioning groove 3 and a lower positioning groove 4 from top to bottom, the upper positioning groove 3 is larger than the lower positioning groove 4, and a carrying groove 5 is provided on the surface of the lower positioning groove 4. A fixing component 6 is installed on the surface of the carrying arm 1, and the fixing component 6 includes a T-shaped pressing plate 61 and a miniature electric push rod 62. The pressing plate 61 passes through the carrying arm 1, and the electric push rod 62 is located on both sides of the pressing plate 61. The bottom end is hinged to the carrying arm 1, and the driving end of the electric push rod 62 is hinged to the pressure plate 61. When in use, the upper positioning groove 3 is used to carry and transport 12-inch wafers, and the lower positioning groove 4 is used to carry and transport 8-inch wafers. Compared with the prior art, the applicable surface of the carrying arm 1 is increased. After the wafer is placed on the positioning groove, the electric push rod 62 is operated. The electric push rod 62 contracts and drives the pressure plate 61 to slide downward, and presses down on the top of the wafer for positioning, so that the carrying arm 1 can avoid the wafer position displacement during the wafer transportation process.

[0030] The upper positioning groove 3 , the lower positioning groove 4 and the bearing groove 5 are configured to be U-shaped or semicircular, and the upper positioning groove 3 , the lower positioning groove 4 and the bearing groove 5 are coaxially arranged.

[0031] The upper positioning groove 3 is used to accommodate a 12-inch wafer, and the lower positioning groove 4 is used to accommodate an 8-inch wafer.

[0032] The carrying arm 1 is made of alumina, aluminum nitride or silicon carbide ceramic materials. Alumina, aluminum nitride or silicon carbide ceramic materials have the physical properties of high density, high hardness, high wear resistance, good heat resistance, excellent mechanical strength, good insulation in high temperature environment, good corrosion resistance and other physical properties. They are excellent materials for making semiconductor equipment robotic arms.

[0033] From the perspective of material properties, silicon carbide ceramics have better performance, but from the perspective of economic indicators such as material price and processing difficulty, alumina ceramics are better. Various protective functional films and metal ceramic coatings prepared by surface engineering technologies represented by vapor deposition and spraying can be used to improve the wear resistance, corrosion resistance, heat resistance, fatigue strength and other functions of the surface of metal mechanical parts, ensuring that mechanical equipment has high reliability and long life characteristics under harsh working conditions. Therefore, on the basis of alumina ceramic materials, adding a coating on the surface to improve the performance of alumina ceramic robotic arms has a higher cost-effectiveness.

[0034] The surface of the carrying arm 1 is coated with an antistatic coating, the main components of which are polytetrafluoroethylene (also known as Teflon or PTFE) and metal phases. Due to the insulation of the ceramic material itself, during the transportation of the wafer, due to the contact, separation, friction, and shear stress, static charges accumulate on the ceramic surface, forming a higher voltage.

[0035] The spraying raw materials are configured by polytetrafluoroethylene material and conductive phase powder. This polymer film has extremely low friction coefficient, good wear resistance and excellent chemical stability, which can significantly avoid damage to the ceramic robot arm during use. In the process of mixing the coating, the content of the conductive phase is controlled to be 2wt%-4wt% (too much added content will further reduce the resistance. When the resistance is lower than 106Ω, the coating is a conductive coating). The conductive phase can be selected as metal phases such as Ag, Cu, Ni, Al, Sn, or conductive oxides such as zinc oxide aluminum, indium tin oxide, and carbon black. The coating can adjust the surface resistance within the range of 106-109Ω, so that the ceramic robot arm has the characteristics of an anti-static material, which will not cause a short circuit like a conductor. At the same time, when static electricity charges accumulate on the surface, the charges can be released in time. The static electricity problem on the surface of the ceramic robot arm is solved by the anti-static coating.

[0036] The surface of the carrying arm 1 is provided with a plurality of screw through holes 8 and positioning pin holes 7 for assembling the mechanical arm.

[0037] Embodiment 2

[0038] For comparison with Example 1, please refer to Figure 5 As shown, the utility model provides another embodiment, a plurality of anti-skid pads 613 are fixedly connected to the bottom of the extension arm 612, and the anti-skid pads 613 are used to improve the anti-skid effect.

[0039] The bottom of the extension arm 612 is fixedly connected to a support spring 614, and the bottom end of the support spring 614 is fixedly connected to the sliding seat 611. The extension arm 612 is located above the supporting arm 1 through the support spring 614. When the pressure plate 61 positions the wafer, the sliding seat 611 slides downward so that the pressure sensor 63 presses down the extension arm 612, so that the anti-slip pad 613 is pressed down on the top of the wafer to fix it while improving the anti-slip effect.

[0040] A pressure sensor 63 is fixedly connected to the upper inner wall of the sliding seat 611. The pressure sensor 63 is electrically connected to the electric push rod 62. The pressure of the extension arm 612 is detected by the pressure sensor 63, and when the pressure reaches a predetermined value, the electric push rod 62 is controlled to stop running to avoid damage to the wafer due to excessive pressure.

[0041] Working principle: when in use, the upper positioning groove 3 is used to carry and transport 12-inch wafers, and the lower positioning groove 4 is used to carry and transport 8-inch wafers. Compared with the prior art, the applicable surface of the carrying arm 1 is increased. After the wafer is placed on the positioning groove, the electric push rod 62 is operated. The electric push rod 62 contracts and drives the pressure plate 61 to slide downward, and presses down on the top of the wafer for positioning, so that the carrying arm 1 can avoid the wafer position displacement during the wafer transportation process.

[0042] The extension arm 612 is located above the carrying arm 1 through the support spring 614. When the pressure plate 61 positions the wafer, the sliding seat 611 slides downward so that the pressure sensor 63 presses down the extension arm 612, so that the anti-slip pad 613 is pressed down on the top of the wafer to fix it while improving the anti-slip effect. The pressure of the extension arm 612 is detected by the pressure sensor 63, and when the pressure reaches a predetermined value, the electric push rod 62 is controlled to stop running to avoid damage to the wafer due to excessive pressure.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0044] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A ceramic robot arm for handling multi-size wafers with anti-static, wear-resistant and corrosion-resistant properties, comprising a carrying arm (1), characterized in that: An upper positioning groove (3) and a lower positioning groove (4) are respectively provided at one end of the load-bearing arm (1) from top to bottom, the size of the upper positioning groove (3) is larger than the lower positioning groove (4), and a load-bearing groove (5) is provided on the surface of the lower positioning groove (4). A fixing component (6) is installed on the surface of the load-bearing arm (1), and the fixing component (6) comprises a T-shaped pressing plate (61) and a miniature electric push rod (62). The pressing plate (61) passes through the load-bearing arm (1), and the electric push rod (62) is located on both sides of the pressing plate (61). The bottom end of the electric push rod (62) is hinged to the load-bearing arm (1), and the driving end of the electric push rod (62) is hinged to the pressing plate (61).

2. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 1 is characterized in that: The upper positioning groove (3), the lower positioning groove (4) and the bearing groove (5) are configured to be U-shaped or semicircular, and the upper positioning groove (3), the lower positioning groove (4) and the bearing groove (5) are coaxially arranged.

3. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 1 is characterized in that: The upper positioning groove (3) is used to accommodate a 12-inch wafer, and the lower positioning groove (4) is used to accommodate an 8-inch wafer.

4. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 1 is characterized in that: The carrying arm (1) is made of alumina, aluminum nitride or silicon carbide ceramic material.

5. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 1 is characterized in that: The surface of the carrying arm (1) is coated with an antistatic coating.

6. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 1 is characterized by: The surface of the bearing arm (1) is provided with a plurality of screw through holes (8) and positioning pin holes (7) for assembling the mechanical arm.

7. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 1 is characterized by: The pressing plate (61) comprises a sliding seat (611), and an extension arm (612) is slidably connected inside the sliding seat (611).

8. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 7 is characterized in that: A plurality of anti-slip pads (613) are fixedly connected to the bottom of the extension arm (612).

9. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 7 is characterized in that: The bottom of the extension arm (612) is fixedly connected to a support spring (614), and the bottom end of the support spring (614) is fixedly connected to the sliding seat (611).

10. The antistatic, wear-resistant, and corrosion-resistant multi-size wafer handling ceramic robot arm according to claim 7, characterized in that: A pressure sensor (63) is fixedly connected above the inner wall of the sliding seat (611).

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