High-frequency multilayer circuit board

Abstract

The utility model discloses a high-frequency multilayer circuit board, which relates to the technical field of circuit boards, aims to provide a high-frequency multilayer circuit board which is loose in structure, free of heat concentration and high in heat dissipation efficiency, and is technically characterized by comprising a circuit board body, and an input port and an output port are arranged at two ends of the circuit board body. The circuit board body is provided with an input port and an output port, the input port is used for inputting circuits and signals, the output port is used for outputting the circuits and the signals, and one end, close to the input port, of the circuit board body is provided with a connecting plate. The plurality of circuit board bodies can be combined to work, and sufficient gaps are reserved among the circuit board bodies, so that heat of the circuit board bodies can be quickly diffused into air, and meanwhile, the heat dissipation holes drive hot air flow for heat dissipation of the circuit board bodies to be quickly discharged by using internal fans.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high-frequency multilayer circuit board. Background Art

[0002] High-frequency circuit boards are special circuit boards with higher electromagnetic frequencies. They have very high requirements for physical properties, precision, and technical parameters. They are often used in automotive anti-collision systems, satellite systems, radio systems, and other fields. They are also often used in industrial equipment. Some industrial equipment has high performance requirements for circuit boards. The existing multi-layer circuit board structure is too compact, resulting in high heat generation during operation, which is easy to concentrate and difficult to dissipate, affecting the performance of the circuit board. Utility Model Content

[0003] 1. Technical issues to be solved

[0004] In view of the deficiencies of the prior art, the utility model provides a high-frequency multi-layer circuit board with a loose structure, no heat concentration, and high heat dissipation efficiency.

[0005] (II) Technical solution

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-frequency multi-layer circuit board, comprising a circuit board body, wherein an input port and an output port are provided at both ends of the circuit board body, wherein the input port is used for inputting circuits and signals, and the output port is used for outputting circuits and signals, a connecting plate is provided at one end of the circuit board body close to the input port, wherein the connecting plate is used for connecting multiple circuit board bodies, mounting feet are provided on the side of the connecting plate, a connecting plug is provided on the front of the connecting plate for plugging into the output port, a heat dissipation hole is opened in the connecting plate, the heat dissipation hole faces the circuit board body, and a fan is provided in the heat dissipation hole.

[0007] Preferably, the connection plate is arranged in sections, and an expansion port is provided at the upper end of the connection plate, and an expansion head is provided at the lower end, and the expansion heads of adjacent connections are plugged into the expansion port.

[0008] Preferably, a cover plate is provided on the expansion opening, and the cover plate is used to close the expansion opening on the topmost connecting plate.

[0009] Preferably, the upper end and the side surface of the connecting plate are provided with oblique threaded holes, the oblique threaded holes of adjacent connecting plates correspond to each other, and the oblique threaded holes are used to fix the segmented connecting plates.

[0010] Preferably, a support frame is provided on the front side of the connecting plate, and the support frame is used to support the circuit board body on the upper layer.

[0011] Preferably, a rubber sleeve is provided in the mounting foot, and a mounting bolt passes through the mounting foot through the rubber sleeve, and the rubber sleeve is used to prevent the vibration of the equipment from being transmitted to the connecting plate through the mounting foot.

[0012] Preferably, a protective cover is provided on the back side of the connecting plate at a position corresponding to the heat dissipation hole, and the protective cover is used to prevent debris from entering the heat dissipation hole.

[0013] (III) Beneficial effects

[0014] Compared with the prior art, the utility model provides a high-frequency multi-layer circuit board, which has the following beneficial effects:

[0015] 1. By setting a connecting plate and heat dissipation holes, the connecting plate uses a connecting plug to connect multiple circuit boards and transmit signals and power to the circuit boards, so that multiple circuit boards can be combined to work, and sufficient gaps are left between the circuit boards so that the heat of the circuit boards can be quickly diffused into the air. At the same time, the heat dissipation holes use the internal fan to drive the airflow, so that the hot air flow of the circuit board body can be quickly discharged, further reducing the problem of heat accumulation around the circuit board body.

[0016] 2. By setting up an expansion port and an expansion head, the expansion head can be plugged into the expansion port and transmit current and signals to each other, so that the connection board can be assembled and expanded, so that it can be expanded to a suitable number according to the number of layers required by the circuit board body, thereby improving its combination diversity and adapting it to the use requirements of various devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0018] Figure 2 It is a three-dimensional schematic diagram of the connection plate of the utility model;

[0019] Figure 3 It is a three-dimensional schematic diagram of the connection plug of the utility model;

[0020] Figure 4 It is a three-dimensional schematic diagram of the protective net of the utility model.

[0021] In the figure: 1. Circuit board body; 2. Output port; 3. Input port; 4. Connection plate; 5. Heat dissipation hole; 6. Fan; 7. Mounting foot; 8. Rubber sleeve; 9. Cover plate; 10. Oblique threaded hole; 11. Connecting plug; 12. Support frame; 13. Extension port; 14. Extension head; 15. Protective cover. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4 A high-frequency multilayer circuit board comprises a circuit board body 1, an input port 3 and an output port 2 are arranged at both ends of the circuit board body 1, the input port 3 is used for inputting circuits and signals, and the output port 2 is used for outputting circuits and signals, a connecting plate 4 is arranged at one end of the circuit board body 1 close to the input port 3, the connecting plate 4 is used for connecting a plurality of circuit board bodies 1, a mounting foot 7 is arranged on the side of the connecting plate 4, a connecting plug 11 plugged with the output port 2 is arranged on the front of the connecting plate 4, a heat dissipation hole 5 is opened in the connecting plate 4, the heat dissipation hole 5 faces the circuit board body 1, and a fan 6 is arranged in the heat dissipation hole;

[0024] In the utility model, a connecting plate 4 and a fan 6 are provided. The connecting plate 4 can connect a plurality of circuit board bodies 1 by means of a connecting plug 11, so that the circuit board bodies 1 can be installed in combination to meet the use requirements of the equipment, and the circuit board bodies 1 are separated so that the heat of the circuit board bodies 1 can be quickly dissipated into the air, and then the fan 6 discharges the hot air from each circuit board body 1, thereby achieving the effect of efficient heat dissipation of the multi-layer circuit board body 1.

[0025] The connecting plate 4 is arranged in sections, and an expansion port 13 is provided at the upper end of the connecting plate 4, and an expansion head 14 is provided at the lower end, and adjacent expansion heads 14 are plugged into the expansion port 13;

[0026] By providing the expansion port 13 and the expansion head 14, the expansion port 13 and the expansion head 14 can transmit signals and currents after being plugged in, so that the connection board 4 can be spliced ​​and expanded, and can be adjusted according to the number of circuit board bodies 1, thereby improving the diversity of combinations.

[0027] A cover plate 9 is provided on the expansion opening 13, and the cover plate 9 is used to close the expansion opening 13 on the topmost connecting plate 4;

[0028] By providing the cover plate 9 , the cover plate 9 can close the expansion opening 13 on the uppermost connecting plate 4 , thereby preventing dust or impurities from falling into the expansion opening 13 , thereby ensuring the safety of the connecting plate 4 and the expansion opening 13 .

[0029] The upper end and the side of the connecting plate 4 are provided with oblique threaded holes 10, and the oblique threaded holes 10 of the adjacent connecting plates 4 correspond to each other. The oblique threaded holes 10 are used to fix the segmented connecting plates 4;

[0030] By providing the oblique threaded holes 10 , the stacked connecting plates 4 can be connected and fixed by using the oblique threaded holes 10 , thereby improving the overall firmness of the connecting plates 4 after splicing, and ensuring the strength and stability of the connecting plates 4 after splicing and assembly.

[0031] A support frame 12 is provided on the front of the connecting plate 4, and the support frame 12 is used to support the circuit board body 1 on the upper layer;

[0032] By setting the support frame 12, the support frame 12 can be attached under the circuit board body 1 to apply supporting force to the circuit board body 1, thereby ensuring the stability of the circuit board body 1 after installation with the connecting plate 4, and avoiding the problem of long-term stress on the output port 2 and the connecting plug 11, which may cause damage to the components.

[0033] A rubber sleeve 8 is provided inside the mounting foot 7, and a mounting bolt passes through the mounting foot 7 through the rubber sleeve 8. The rubber sleeve 8 is used to prevent the vibration of the equipment from being transmitted to the connecting plate 4 through the mounting foot 7;

[0034] By setting the rubber sleeve 8, when installing the bolt, the rubber sleeve 8 can be used to separate the bolt and the mounting foot 7. In this way, when the equipment drives the bolt to vibrate, the rubber sleeve 8 can absorb the vibration force to prevent the bolt from driving the mounting foot 7 and the connecting plate 4 to vibrate.

[0035] A protective cover 15 is provided on the back of the connecting plate 4 at a position corresponding to the heat dissipation hole 5, and the protective cover 15 is used to prevent debris from entering the heat dissipation hole 5;

[0036] By providing the protective cover 15 , when the fan 6 is working, the airflow can drive debris into the heat dissipation hole 5 , so that the debris interferes with the normal operation of the fan 6 .

[0037] Working principle:

[0038] During installation, the connecting plates 4 are spliced ​​according to the number of circuit board bodies 1, the connecting plates 4 are connected using the expansion head 14 and the expansion port 13, and are fixed by the oblique threaded hole 10, and then the circuit board body 1 is plugged into the connecting plug 11 through the input port 3 to combine the circuit board body 1. During operation, the heat of the circuit board body 1 is dissipated into the air in the gap, and then the fan 6 discharges the heat dissipated by the circuit board body 1 through the heat dissipation hole 5.

[0039] The above are only specific embodiments of the utility model, but the technical features of the utility model are not limited thereto. Any simple changes, equivalent replacements or modifications made based on the utility model to solve basically the same technical problems and achieve basically the same technical effects are all included in the protection scope of the utility model.

Claims

1. A high-frequency multilayer circuit board, comprising a circuit board body (1), characterized in that: An input port (3) and an output port (2) are provided at both ends of the circuit board body (1), the input port (3) being used for inputting circuits and signals, and the output port (2) being used for outputting circuits and signals. A connecting plate (4) is provided at one end of the circuit board body (1) close to the input port (3), the connecting plate (4) being used for connecting a plurality of circuit board bodies (1), a mounting foot (7) being provided on the side of the connecting plate (4), a connecting plug (11) being plugged into the output port (2) being provided on the front of the connecting plate (4), a heat dissipation hole (5) being provided in the connecting plate (4), the heat dissipation hole (5) being directed toward the circuit board body (1), and a fan (6) being provided in the heat dissipation hole (5).

2. A high frequency multilayer circuit board according to claim 1, characterized in that: The connecting plate (4) is arranged in sections, and an expansion port (13) is provided at the upper end of the connecting plate (4), and an expansion head (14) is provided at the lower end, and the adjacently connected expansion heads (14) are plugged into the expansion port (13).

3. A high frequency multilayer circuit board according to claim 2, characterized in that: A cover plate (9) is provided on the expansion opening (13), and the cover plate (9) is used to close the expansion opening (13) on the topmost connecting plate (4).

4. A high frequency multilayer circuit board according to claim 2, characterized in that: The upper end and the side surface of the connecting plate (4) are provided with oblique threaded holes (10), and the oblique threaded holes (10) of adjacent connecting plates (4) correspond to each other. The oblique threaded holes (10) are used to fix the segmented connecting plates (4).

5. A high frequency multilayer circuit board according to claim 1, characterized in that: A support frame (12) is provided on the front side of the connection plate (4), and the support frame (12) is used to support the circuit board body (1) on the upper layer.

6. A high frequency multilayer circuit board according to claim 1, characterized in that: A rubber sleeve (8) is provided inside the mounting foot (7), and a mounting bolt passes through the rubber sleeve (8) and penetrates the mounting foot (7). The rubber sleeve (8) is used to prevent vibration of the equipment from being transmitted to the connecting plate (4) through the mounting foot (7).

7. A high frequency multilayer circuit board according to claim 1, characterized in that: A protective cover (15) is provided on the back side of the connection plate (4) at a position corresponding to the heat dissipation hole (5), and the protective cover (15) is used to prevent debris from entering the heat dissipation hole (5).

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