Nozzle device for cleaning wafer

Abstract

The utility model belongs to the technical field of wafer cleaning nozzles, and particularly relates to a nozzle device for cleaning wafers, which is characterized by comprising a mixing block, the top of the mixing block is provided with a medium inlet, the side wall of the mixing block is provided with a gas inlet, and the bottom of the mixing block is provided with a cleaning outlet; according to the nozzle device for cleaning the wafer, pressurized gas can be connected through the gas inlet, so that the spraying effect of the nozzle is improved, and the cleaning strength is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer cleaning nozzles, and in particular relates to a nozzle device for cleaning wafers. Background Art

[0002] After the wafer is polished, a large amount of particles will remain on the surface of the wafer. Therefore, the wafer needs to be cleaned, dried and other post-processing. Wafer cleaning is an important process in the field of chip manufacturing. The wafer cleaning effect determines the yield of chip manufacturing. Wafer cleaning usually uses a cleaning nozzle, and the existing cleaning nozzles usually pressurize the medium for spraying. The spraying effect is unstable and the cleaning force is insufficient, resulting in low cleaning efficiency;

[0003] Therefore, it is necessary to provide a nozzle device for cleaning wafers that can fully pressurize the medium through pressurized gas. Utility Model Content

[0004] The utility model aims to provide a nozzle device for cleaning wafers which can fully pressurize a medium through pressurized gas.

[0005] In order to solve the above technical problems, the utility model provides a nozzle device for cleaning wafers, characterized in that it includes: a mixing block, a medium inlet is arranged at the top of the mixing block, a gas inlet is arranged at the side wall of the mixing block, and a cleaning outlet is arranged at the bottom of the mixing block.

[0006] Preferably, the medium inlet is connected to a first joint, and a tail end of the first joint is connected to a medium pipeline.

[0007] Preferably, the gas inlet is connected to a second joint, the second joint is "L"-shaped, the vertical end of the second joint is arranged upward, and the vertical end of the second joint is connected to a gas pipeline.

[0008] Preferably, a first cover is provided at the front end of the mixing block, a first chamber is formed on the side wall of the first cover, and the mixing block is clamped in the first chamber.

[0009] Preferably, a second cover is provided at the rear end of the first cover, a second chamber is opened in the second cover, and the bottom of the second chamber is penetrated, and the medium pipeline and the gas pipeline are plugged into the second chamber.

[0010] Preferably, a protective pipe is provided at the rear end of the second cover, and the medium pipeline and the gas pipeline are plugged into the protective pipe.

[0011] Preferably, a vertically downward rotating pipe is provided at the tail end of the protection pipe.

[0012] Preferably, the cleaning outlet is connected to a duck-shaped nozzle, and the outlet of the duck-shaped nozzle is inclined to both sides.

[0013] Preferably, a circular cleaning platform is provided at the bottom of the duck-shaped nozzle.

[0014] The beneficial effects of the utility model are:

[0015] 1. By setting the gas inlet, pressurized gas can be connected to improve the spray effect of the nozzle and the cleaning power.

[0016] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.

[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a stereogram of a preferred embodiment of the nozzle device of the utility model;

[0020] Figure 2 yes Figure 1 The enlarged view of point A in the middle;

[0021] Figure 3 It is a front view of a preferred embodiment of the nozzle device of the present utility model.

[0022] In the figure:

[0023] 100. Mixing block; 101. Medium inlet; 102. Gas inlet; 103. Cleaning outlet; 104. First joint; 105. Medium pipeline; 106. Second joint; 107. Gas pipeline; 108. First cover; 109. First chamber; 110. Second cover; 111. Second chamber; 112. Protective pipe; 113. Rotating pipe; 114. Duck-type nozzle; 115. Cleaning station. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Embodiment 1, as Figure 1-3 As shown, a nozzle device for cleaning wafers in this embodiment is characterized in that it includes: a mixing block 100, a medium inlet 101 is provided on the top of the mixing block 100, a gas inlet 102 is provided on the side wall of the mixing block 100, and a cleaning outlet 103 is provided on the bottom of the mixing block 100; in short, by providing the gas inlet 102, pressurized gas can be connected, thereby improving the spraying effect of the nozzle and improving the cleaning force.

[0026] The medium inlet 101 is connected to a first connector 104 , and the tail end of the first connector 104 is connected to a medium pipeline 105 ; in short, the first connector 104 can be threaded or quick-insert to adapt to different media, and the medium pipeline 105 is made of flexible corrosion-resistant materials.

[0027] The gas inlet 102 is connected to a second joint 106, which is "L"-shaped, with the vertical end of the second joint 106 set upward, and the vertical end of the second joint 106 is connected to a gas pipeline 107; in short, by setting the vertical end of the second joint 106 upward, the gas pipeline 107 can be stored on the same side of the medium pipeline 105.

[0028] A first cover 108 is provided at the front end of the mixing block 100, and a first chamber 109 is opened on the side wall of the first cover 108, and the mixing block 100 is clamped in the first chamber 109; the mixing block 100 is fixed to the first cover 108 by bolts, and the mixing block 100 is clamped in the first chamber 109, which can effectively protect the mixing block 100 from collision, thereby improving the service life of the nozzle device.

[0029] A second cover 110 is provided at the rear end of the first cover 108, and a second chamber 111 is opened in the second cover 110, and the bottom of the second chamber 111 is penetrated, and the medium pipeline 105 and the gas pipeline 107 are inserted in the second chamber 111; in short, the second cover 110 can accommodate and reverse the medium pipeline 105 and the gas pipeline 107.

[0030] A protective pipe 112 is provided at the rear end of the second cover 110, and the medium pipeline 105 and the gas pipeline 107 are plugged into the protective pipe 112; in short, since the cleaning outlet 103 needs to be placed above the axis of the wafer, the medium pipeline 105 and the gas pipeline 107 can be effectively protected by the protective pipe 112.

[0031] The tail end of the protection pipe 112 is provided with a vertically downward rotating pipe 113; in short, the medium pipeline 105 and the gas pipeline 107 can be reversed through the rotating pipe 113, and the rotating pipe 113 is connected to the rotating mechanism to rotate and store the cleaning outlet 103, which is convenient for taking the wafer.

[0032] The cleaning outlet 103 is connected to a duck-shaped nozzle 114 , and the outlet of the duck-shaped nozzle 114 is inclined toward both sides; in short, the outlet of the duck-shaped nozzle 114 is inclined toward both sides, which can make the liquid medicine spray more uniform.

[0033] A circular cleaning platform 115 is disposed at the bottom of the duck-shaped nozzle 114 ; in short, a wafer can be placed on the cleaning platform 115 to complete the cleaning of the wafer.

[0034] All devices (parts without specific structure) selected in this application are universal standard parts or parts known to those skilled in the art, and their structures and principles can be known by those skilled in the art through technical manuals or conventional experimental methods. In addition, the software programs involved in this application are all prior art, and this application does not involve any improvement to the software programs.

[0035] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0037] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0038] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0039] In addition, each functional unit in each embodiment of the present utility model may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0040] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A nozzle device for cleaning a wafer, characterized in that: include: A mixing block, wherein a medium inlet is disposed at the top of the mixing block, a gas inlet is disposed at the side wall of the mixing block, and a cleaning outlet is disposed at the bottom of the mixing block; The medium inlet is connected to a first joint, and the tail end of the first joint is connected to a medium pipeline; The gas inlet is connected to a second joint, the second joint is "L" shaped, the vertical end of the second joint is arranged upward, and the vertical end of the second joint is connected to a gas pipeline.

2. The nozzle device for cleaning a wafer according to claim 1, characterized in that: A first cover is disposed at the front end of the mixing block, a first chamber is formed on the side wall of the first cover, and the mixing block is clamped in the first chamber.

3. The nozzle device for cleaning a wafer according to claim 2, characterized in that: A second cover is provided at the rear end of the first cover, a second chamber is opened in the second cover, and the bottom of the second chamber is penetrated, and the medium pipeline and the gas pipeline are plugged into the second chamber.

4. The nozzle device for cleaning a wafer according to claim 3, characterized in that: A protective pipeline is arranged at the rear end of the second cover, and the medium pipeline and the gas pipeline are plugged into the protective pipeline.

5. The nozzle device for cleaning a wafer as claimed in claim 4, characterized in that: A vertically downward rotating pipe is arranged at the tail end of the protection pipe.

6. The nozzle device for cleaning a wafer according to claim 5, characterized in that: The cleaning outlet is connected with a duck-shaped nozzle, and the outlet of the duck-shaped nozzle is inclined to both sides.

7. The nozzle device for cleaning a wafer according to claim 6, characterized in that: A circular cleaning platform is arranged at the bottom of the duck-shaped nozzle.

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