Polishing device for improving wafer polishing flatness

Abstract

The polishing device for improving the wafer polishing flatness comprises a base and a polishing bin, the polishing bin is installed at one end of the top of the base, a stepping motor is installed at the end, away from the polishing bin, of the top of the base, a first rotating shaft is installed at the output end of the stepping motor, and a rotating plate is installed at the top of the first rotating shaft; and a third servo motor is mounted at the bottom of the interior of the polishing bin. The polishing device is provided with the second servo motor, the second rotating shaft, the polishing abrasive disc, the magnetic polishing disc, the third rotating shaft and the third servo motor, during polishing, the second servo motor drives the polishing abrasive disc to rotate clockwise through the second rotating shaft, and a wafer can be polished through the polishing abrasive disc; and a third servo motor drives a magnetic polishing disc to rotate anticlockwise through a third rotating shaft, so that the wafer can be driven to rotate, different positions of the wafer can be rotated to the position below a polishing abrasive disc for polishing treatment, and uniform polishing of the wafer is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer polishing equipment, in particular to a polishing device for improving the polishing flatness of a wafer. Background Art

[0002] In the preparation of semiconductor lasers, the wafer needs to be thinned to a certain extent to meet processing requirements. However, since the surface of the thinned wafer is uneven and there is a large surface stress, it is easy for the wafer to bend in the subsequent process. Therefore, the thinned wafer needs to be polished by a polishing device.

[0003] For example, the utility model: "A wafer polishing device", with the announcement number: "CN211728760U", controls the polishing force through a counterweight block to prevent the wafer from being worn out or excessively worn due to excessive wear force, thereby reducing damage to the wafer and improving the quality of the wafer. However, during the implementation of the patent, the positions of the polishing pad and the clamping device are fixed. When polishing wafers of different specifications, it is not easy to contact the polishing equipment with different positions of the wafer, making it difficult to polish the wafer evenly, which affects the polishing effect of the device. Therefore, the utility model provides a polishing device for improving the polishing flatness of the wafer to solve the above-mentioned problem. Utility Model Content

[0004] The utility model aims to provide a polishing device for improving the polishing flatness of a wafer, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a polishing device for improving the polishing flatness of a wafer, comprising a base and a polishing chamber, wherein the polishing chamber is installed at one end of the top of the base, and a stepper motor is installed at the end of the top of the base away from the polishing chamber, a first rotating shaft is installed at the output end of the stepper motor, and a rotating plate is installed at the top of the first rotating shaft, a third servo motor is installed at the bottom inside the polishing chamber, and a control panel is installed at the top of the end of the polishing chamber away from the stepper motor, a first servo motor is installed at the end of the top of the rotating plate close to the polishing chamber, and a threaded rod is installed at the output end of the first servo motor, and the outer thread of the threaded rod is threadedly installed A threaded tube is provided, and a lifting plate is installed at one end of the threaded tube close to the polishing chamber, a second sliding assembly is installed at one end of the bottom of the lifting plate away from the rotating plate, and an L-shaped plate is slidably installed at the bottom of the second sliding assembly, a second servo motor is installed on the top of the L-shaped plate, and a second rotating shaft is installed at the output end of the second servo motor, the second rotating shaft passes through the L-shaped plate, and a polishing grinding disc is installed at the bottom of the second rotating shaft, a fourth servo motor is installed at one end of the bottom of the lifting plate close to the rotating plate, and the output end of the control panel is electrically connected to the input ends of the stepping motor, the first servo motor, the second servo motor, the third servo motor and the fourth servo motor through wires.

[0006] Preferably, a third rotating shaft is installed at the output end of the third servo motor, and a magnetic polishing disk is installed on the top of the third rotating shaft, and a magnetic polishing pad is arranged on the top of the magnetic polishing disk.

[0007] Preferably, a fixed plate is installed at one end of the top of the rotating plate away from the polishing chamber, and a first sliding assembly is installed at one end of the fixed plate close to the polishing chamber, a guide slider is slidably installed at one end of the first sliding assembly away from the fixed plate, and the end of the guide slider away from the first sliding assembly is connected to a threaded tube.

[0008] Preferably, a fourth rotating shaft is installed at the output end of the fourth servo motor, and a turntable is installed at the end of the fourth rotating shaft away from the fourth servo motor, a fixing rod is installed at the edge of the turntable away from the fourth servo motor, and a bearing is installed on the outer side of the fixing rod, a connecting rod is hinged on the outer side of the bearing, and the end of the connecting rod away from the bearing is hinged to the L-shaped plate.

[0009] Preferably, a maintenance chamber cover is provided on one side of the polishing chamber.

[0010] Preferably, a group of reinforcing plates are symmetrically installed on the outer side of the first rotating shaft, and the ends of the reinforcing plates away from the first rotating shaft are all connected to the rotating plates.

[0011] Preferably, an anti-rust layer is provided on the outer side of the connecting rod.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The polishing device for improving the polishing flatness of a wafer is equipped with a second servo motor, a second rotating shaft, a polishing abrasive disc, a magnetic polishing disk, a third rotating shaft and a third servo motor. During polishing, the second servo motor drives the polishing abrasive disc to rotate clockwise through the second rotating shaft, and the wafer can be polished by the polishing abrasive disc, and the third servo motor drives the magnetic polishing disk to rotate counterclockwise through the third rotating shaft, so as to drive the wafer to rotate, and different positions of the wafer can be rotated to the bottom of the polishing abrasive disc for polishing, which is conducive to uniformly polishing the wafer;

[0014] 2. The polishing device for improving the polishing flatness of the wafer is equipped with a turntable, a bearing, a fourth rotating shaft, a fourth servo motor and a connecting rod. When in use, the fourth servo motor drives the turntable to rotate at a constant speed through the fourth rotating shaft, so that the connecting rod can push and pull the L-shaped plate back and forth, and the polishing grinding disc can be reciprocated to different positions of the wafer for polishing. When polishing wafers of different diameters, the polishing grinding disc can be brought into contact with different positions of the wafer, thereby ensuring the polishing effect;

[0015] 3. The polishing device for improving the polishing flatness of the wafer is installed with a first servo motor, a threaded rod, a threaded tube and a lifting plate. When in use, the first servo motor drives the threaded rod to rotate, so that the threaded tube moves through the thread, which can drive the polishing grinding plate to rise and fall, so that the polishing grinding plate can fit tightly with the wafer, so that the device can polish wafers of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the front cross-sectional view of the utility model;

[0017] Figure 2 It is a main schematic diagram of the utility model;

[0018] Figure 3 It is a partial structural schematic diagram of the utility model.

[0019] In the figure: 1. base; 2. stepper motor; 3. first rotating shaft; 4. rotating plate; 5. first servo motor; 6. fixed plate; 7. threaded rod; 8. first sliding assembly; 9. guide slider; 10. threaded tube; 11. turntable; 12. lifting plate; 13. second sliding assembly; 14. L-shaped plate; 15. second servo motor; 16. second rotating shaft; 17. polishing abrasive disc; 18. magnetic polishing pad; 19. magnetic polishing disc; 20. third rotating shaft; 21. control panel; 22. third servo motor; 23. polishing chamber; 24. bearing; 25. fourth rotating shaft; 26. fourth servo motor; 27. fixed rod; 28. connecting rod. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3The utility model provides an embodiment: a polishing device for improving the polishing flatness of a wafer, comprising a base 1 and a polishing chamber 23, wherein the polishing chamber 23 is installed at one end of the top of the base 1, and a stepper motor 2 is installed at the end of the top of the base 1 away from the polishing chamber 23, wherein the model of the stepper motor 2 may be PH533HG1-NA, a first rotating shaft 3 is installed at the output end of the stepper motor 2, and a rotating plate 4 is installed at the top of the first rotating shaft 3, a group of reinforcing plates are symmetrically installed on the outer side of the first rotating shaft 3, and the ends of the reinforcing plates away from the first rotating shaft 3 are all connected to the rotating plate 4, so that the first rotating shaft 3 and the rotating plate 4 can be firmly installed, and the polishing chamber 2 A third servo motor 22 is installed at the bottom of the interior of the stepper motor 23. The model of the third servo motor 22 here can be MR-J2S-10A. A control panel 21 is installed at the top of the polishing chamber 23 away from the end of the stepper motor 2. A third rotating shaft 20 is installed at the output end of the third servo motor 22, and a magnetic polishing disc 19 is installed on the top of the third rotating shaft 20. The third servo motor 22 drives the magnetic polishing disc 19 to rotate counterclockwise through the third rotating shaft 20, which can drive the wafer to rotate. The wafer can be rotated at different positions to the bottom of the polishing grinding disc 17 for polishing, which is conducive to uniform polishing of the wafer. A magnetic polishing pad is arranged on the top of the magnetic polishing disc 19. 18, a first servo motor 5 is installed at one end of the top of the rotating plate 4 close to the polishing chamber 23, and the model of the first servo motor 5 here can be MR-J2S-10A, and a threaded rod 7 is installed at the output end of the first servo motor 5, and a threaded tube 10 is installed on the outer thread of the threaded rod 7, and a lifting plate 12 is installed at one end of the threaded tube 10 close to the polishing chamber 23, and a second sliding component 13 is installed at the bottom of the lifting plate 12 away from the rotating plate 4, and an L-shaped plate 14 is slidably installed at the bottom of the second sliding component 13, and a second servo motor 15 is installed on the top of the L-shaped plate 14, and the model of the second servo motor 15 here can be MR-J2S- 10A, and the output end of the second servo motor 15 is installed with a second rotating shaft 16, the second rotating shaft 16 passes through the L-shaped plate 14, and the bottom of the second rotating shaft 16 is installed with a polishing grinding disc 17, and the bottom of the lifting plate 12 is installed with a fourth servo motor 26 at one end close to the rotating plate 4, where the model of the fourth servo motor 26 can be MR-J2S-10A, and the output end of the control panel 21 is electrically connected to the input ends of the stepper motor 2, the first servo motor 5, the second servo motor 15, the third servo motor 22 and the fourth servo motor 26 through wires. An inspection chamber cover is provided on one side of the polishing chamber 23 to facilitate the inspection of the inside of the polishing chamber 23.

[0022] like Figure 1-2As shown, a fixed plate 6 is installed at one end of the top of the rotating plate 4 away from the polishing chamber 23, and a first sliding component 8 is installed at one end of the fixed plate 6 close to the polishing chamber 23. A guide slider 9 is slidably installed at one end of the first sliding component 8 away from the fixed plate 6, and the end of the guide slider 9 away from the first sliding component 8 is connected to the threaded tube 10. The threaded tube 10 is limited by the guide slider 9 to prevent the threaded tube 10 from rotating together with the threaded rod 7.

[0023] like Figure 1-3 As shown, a fourth rotating shaft 25 is installed at the output end of the fourth servo motor 26, and a turntable 11 is installed at one end of the fourth rotating shaft 25 away from the fourth servo motor 26, a fixing rod 27 is installed at the edge position of the turntable 11 away from the fourth servo motor 26, and a bearing 24 is installed on the outer side of the fixing rod 27, a connecting rod 28 is hinged on the outer side of the bearing 24, and the end of the connecting rod 28 away from the bearing 24 is hinged to the L-shaped plate 14. When in use, the fourth servo motor 26 drives the turntable 11 to rotate at a uniform speed through the fourth rotating shaft 25, so that the connecting rod 28 can push and pull the L-shaped plate 14 back and forth to move, and the polishing grinding plate 17 can be reciprocated to different positions of the wafer for polishing. When polishing wafers of different diameters, the polishing grinding plate 17 can be brought into contact with different positions of the wafer, thereby ensuring the polishing effect. An anti-rust layer is provided on the outer side of the connecting rod 28, which is beneficial to extending the service life of the connecting rod 28.

[0024] Working principle:

[0025] When in use, the device is powered on, and the staff can first start the stepper motor 2 through the control panel 21, so that the stepper motor 2 drives the first rotating shaft 3 to rotate 180 degrees clockwise, and the lifting plate 12 can be moved away from the polishing chamber 23 as a whole. Then the staff can magnetically attract the magnetic polishing pad 18 to the magnetic polishing plate 19 and place the wafer on the magnetic polishing pad 18;

[0026] After the wafer is installed, the staff starts the stepper motor 2 through the control panel 21, so that the stepper motor 2 drives the first rotating shaft 3 to rotate clockwise 180 degrees again, and the lifting plate 12 can be rotated as a whole to above the polishing chamber 23. Then the staff can start the first servo motor 5 through the control panel 21, so that the first servo motor 5 drives the threaded rod 7 to rotate clockwise, and the threaded tube 10 outside the threaded rod 7 is limited by the guide slider 9, so that the threaded tube 10 cannot rotate with the threaded rod 7, so that the threaded tube 10 can only move downward through the thread;

[0027] At this time, the threaded tube 10 drives the guide slider 9 to slide along a straight line on the first sliding assembly 8, and the threaded tube 10 drives the lifting plate 12 to move downward together, so that the polishing grinding plate 17 can be closely attached to the wafer;

[0028] During polishing, the staff can start the second servo motor 15 and the third servo motor 22 through the control panel 21, and the second servo motor 15 drives the polishing disc 17 to rotate clockwise through the second rotating shaft 16, so that the wafer can be polished by the polishing disc 17, and the third servo motor 22 drives the magnetic polishing disc 19 to rotate counterclockwise through the third rotating shaft 20, so that the wafer can be driven to rotate, and different positions of the wafer can be rotated to the bottom of the polishing disc 17 for polishing, which is conducive to uniform polishing of the wafer;

[0029] Meanwhile, during the polishing process, the staff can start the fourth servo motor 26 through the control panel 21, so that the fourth servo motor 26 drives the turntable 11 to rotate at a constant speed through the fourth rotating shaft 25, and the turntable 11 drives the fixed rod 27 to rotate. Since the fixed rod 27 is installed on the inner ring of the bearing 24, and the connecting rod 28 is installed on the outer ring of the bearing 24, the connecting rod 28 can rotate independently outside the fixed rod 27 through the bearing 24, so that the connecting rod 28 will not affect the rotation of the fixed rod 27.

[0030] When the fixed rod 27 rotates to one end away from the rotating plate 4, the fixed rod 27 drives the connecting rod 28 to move through the bearing 24, so that the connecting rod 28 is subjected to force and pushes the L-shaped plate 14 to move, thereby driving the polishing disc 17 to move;

[0031] When the fixed rod 27 rotates to be close to one end of the rotating plate 4, the fixed rod 27 drives the connecting rod 28 to move through the bearing 24, so that the connecting rod 28 is subjected to force and pulls the L-shaped plate 14 to move, thereby driving the polishing disc 17 to move;

[0032] Since the fourth servo motor 26 drives the turntable 11 to rotate at a constant speed through the fourth rotating shaft 25, the connecting rod 28 can push and pull the L-shaped plate 14 back and forth, and the polishing disc 17 can be reciprocated to different positions of the wafer for polishing. When polishing wafers of different diameters, the polishing disc 17 can be brought into contact with different positions of the wafer, thereby ensuring the polishing effect.

[0033] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A polishing device for improving the polishing flatness of a wafer, comprising a base (1) and a polishing chamber (23), characterized in that: A polishing chamber (23) is installed at one end of the top of the base (1), and a stepper motor (2) is installed at one end of the top of the base (1) away from the polishing chamber (23); a first rotating shaft (3) is installed at the output end of the stepper motor (2), and a rotating plate (4) is installed at the top of the first rotating shaft (3); a third servo motor (22) is installed at the bottom of the polishing chamber (23), and a control panel (21) is installed at the top of the end of the polishing chamber (23) away from the stepper motor (2); a first servo motor (5) is installed at one end of the top of the rotating plate (4) close to the polishing chamber (23), and a threaded rod (7) is installed at the output end of the first servo motor (5); a threaded tube (10) is installed on the outer thread of the threaded rod (7), and a lifting plate (12) is installed at one end of the threaded tube (10) close to the polishing chamber (23). A second sliding assembly (13) is installed at one end of the bottom of the lifting plate (12) away from the rotating plate (4), and an L-shaped plate (14) is slidably installed at the bottom of the second sliding assembly (13); a second servo motor (15) is installed at the top of the L-shaped plate (14), and a second rotating shaft (16) is installed at the output end of the second servo motor (15), the second rotating shaft (16) passes through the L-shaped plate (14), and a polishing grinding disc (17) is installed at the bottom of the second rotating shaft (16); a fourth servo motor (26) is installed at one end of the bottom of the lifting plate (12) close to the rotating plate (4), and the output end of the control panel (21) is electrically connected to the input ends of the stepping motor (2), the first servo motor (5), the second servo motor (15), the third servo motor (22) and the fourth servo motor (26) through wires.

2. A polishing device for improving wafer polishing flatness according to claim 1, characterized in that: A third rotating shaft (20) is installed at the output end of the third servo motor (22), and a magnetic polishing disc (19) is installed on the top of the third rotating shaft (20), and a magnetic polishing pad (18) is arranged on the top of the magnetic polishing disc (19).

3. A polishing device for improving wafer polishing flatness according to claim 1, characterized in that: A fixed plate (6) is installed at one end of the top of the rotating plate (4) away from the polishing chamber (23), and a first sliding assembly (8) is installed at one end of the fixed plate (6) close to the polishing chamber (23). A guide slider (9) is slidably installed at one end of the first sliding assembly (8) away from the fixed plate (6), and one end of the guide slider (9) away from the first sliding assembly (8) is connected to a threaded tube (10).

4. A polishing device for improving wafer polishing flatness according to claim 1, characterized in that: A fourth rotating shaft (25) is installed at the output end of the fourth servo motor (26), and a turntable (11) is installed at one end of the fourth rotating shaft (25) away from the fourth servo motor (26), a fixing rod (27) is installed at the edge of the turntable (11) away from the fourth servo motor (26), and a bearing (24) is installed on the outer side of the fixing rod (27), a connecting rod (28) is hinged on the outer side of the bearing (24), and one end of the connecting rod (28) away from the bearing (24) is hinged to the L-shaped plate (14).

5. A polishing device for improving wafer polishing flatness according to claim 1, characterized in that: A maintenance chamber cover is provided on one side of the polishing chamber (23).

6. A polishing device for improving wafer polishing flatness according to claim 1, characterized in that: A group of reinforcing plates are symmetrically mounted on the outer side of the first rotating shaft (3), and the ends of the reinforcing plates away from the first rotating shaft (3) are connected to the rotating plates (4).

7. A polishing device for improving wafer polishing flatness according to claim 4, characterized in that: The outer side of the connecting rod (28) is provided with an anti-rust layer.

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