Wafer bearing device

Abstract

The embodiment of the utility model discloses a wafer bearing device. The wafer bearing device comprises a rack, and a temporary storage module, a transverse moving module, a lifting module and a detection module which are arranged on the rack, the temporary storage module comprises a bottom plate mounted at the top end of the rack and used for bearing the flower basket, an opening allowing the lifting module to pass through is formed in the bottom plate, and the flower basket is borne on the opening; the lifting module is vertically arranged, and the transverse moving module is horizontally arranged; the lifting module is connected with the transverse moving module and driven by the transverse moving module to move in and out of the opening. The top end of the lifting module is connected with a containing plate used for bearing a flower basket, the containing plate is driven by the lifting module to ascend and descend, and the size of the containing plate is smaller than that of the opening. The detection module and the transverse moving module are respectively arranged above and below the temporary storage module; the transverse moving module and the lifting module are combined to carry the flower basket to the temporary storage module for temporary storage, the number of the wafers in the flower basket is detected in cooperation with the detection module arranged above the temporary storage module, space waste caused by simple placement of the wafers is avoided, and meanwhile the number of the temporarily stored wafers can be accurately counted.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer manufacturing, in particular to a wafer carrying device. Background Art

[0002] Semiconductor wafers need to go through various processes in production, and each process is coordinated with its own process equipment, so semiconductor wafers will be transported to different workstations. In order to facilitate the transportation of wafers and avoid damage to wafers by external forces, multiple wafers will be stored in a basket during transportation. The robot will grab the basket containing semiconductor wafers and place it at the corresponding workstation.

[0003] In the prior art, due to the large amount of semiconductor wafers in each batch of production, different stations have different processing volumes of wafers in the same time. It is often the case that semiconductor wafers transferred from the previous station to a station need to queue up for processing. Therefore, a wafer temporary storage position is set in the station to temporarily store the wafers waiting to be processed. The current wafer temporary storage position simply stacks flower baskets carrying wafers, which takes up space but is inconvenient to move, and the number of temporarily stored wafers cannot be accurately counted. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a wafer carrying device to solve the problem that the current wafer temporary storage location occupies space but is inconvenient to move, and the number of temporarily stored wafers cannot be accurately counted.

[0005] Specifically, the utility model provides a wafer carrying device, comprising: a frame, a temporary storage module, a lateral movement module, a lifting module and a detection module installed on the frame;

[0006] The temporary storage module comprises a bottom plate installed on the top of the frame for supporting the flower basket, the bottom plate is provided with an opening for the lifting module to pass through, and the size of the opening is smaller than the horizontal cross-sectional size of the flower basket;

[0007] The lifting module is vertically arranged, and the transverse module is horizontally arranged; the lifting module is connected to the transverse module, and is driven by the transverse module to move into or away from the opening; the top of the lifting module is connected to a placement plate for supporting the flower basket, and the placement plate is driven by the lifting module to rise and fall, and the size of the placement plate is smaller than the size of the opening;

[0008] The detection module is arranged above the temporary storage module, and the transverse movement module is arranged below the temporary storage module.

[0009] The flower basket is transported to the temporary storage module for temporary storage by combining the lateral movement module and the lifting module. The number of wafers in the flower basket is detected by the detection module installed above the temporary storage module to avoid wasting space by simply laying out the wafers. At the same time, the number of temporarily stored wafers can be accurately counted.

[0010] In one embodiment of the above-mentioned wafer supporting device, a limit block is arranged on the top surface of the base plate, and the limit block is used to limit the position of the flower basket; the limit block is arranged at the edge of the opening; the limit block limits the flower basket supported on the opening to prevent the flower basket from sliding and shifting on the base plate.

[0011] In one embodiment of the above-mentioned wafer carrying device, the detection module includes a detection sensor arranged above the base plate, a connecting piece connected to the detection sensor, and a first driver connected to the connecting piece and driving the connecting piece to move along the arrangement direction of the wafers in the flower basket; the detection sensor moves above the flower basket in the temporary storage position along the arrangement direction of the wafers in the flower basket so as to detect all the wafers in the flower basket for accurate counting.

[0012] Furthermore, there are at least two openings, and the detection module further includes a first guide rail arranged along the arrangement direction of the openings;

[0013] The connecting member is slidably connected to the first guide rail, the first guide rail is arranged under the base plate, the first driver is installed at the end of the first guide rail, and the base plate is provided with a first avoidance opening for the connecting member to pass through and translate; the first driver that drives the detection module to move is arranged under the base plate, the structure is more compact, and the setting of the avoidance opening can limit the connecting member, so that the detection sensor is more stable.

[0014] In one embodiment of the above-mentioned wafer carrying device, the lifting module includes a driving member slidably connected to the lateral movement module, and the driving member is connected to the placement plate.

[0015] In one embodiment of the above-mentioned wafer carrying device, the transverse movement module includes a first transverse structure and a second transverse structure which are horizontally arranged, the first transverse structure is parallel to the opening arrangement direction, the second transverse structure is perpendicular to the first transverse structure and is slidably connected to the top of the first transverse structure; the lifting module is slidably connected to the top of the second transverse structure; the transverse movement module is divided into a first transverse structure and a second transverse structure which are horizontal and perpendicular to each other, and can reach any spatial point on the rack in conjunction with the lifting module.

[0016] Furthermore, the first transverse structure includes a second guide rail horizontally arranged and parallel to the opening arrangement direction and a second driver fixed to the end of the second guide rail; the second transverse structure is slidably connected to the second guide rail and connected to the second driver to slide on the second guide rail.

[0017] Further, the second transverse structure includes a third guide rail arranged horizontally and perpendicular to the second guide rail, and a third driver fixed to the end of the third guide rail, and the third guide rail is slidably connected to the top of the second guide rail;

[0018] The lifting module is slidably connected to the top of the third guide rail, and the lifting module is connected to the third driver and driven by the third driver to slide along the third guide rail.

[0019] In one embodiment of the above-mentioned wafer carrying device, the temporary storage module includes at least two rows of bottom plates arranged along the lifting direction of the lifting module;

[0020] An equal number of openings with the same spacing are provided on at least two rows of bottom plates, and the openings in different rows are arranged along the lifting direction of the lifting module; multiple rows of fixed bottom plates are provided, and the openings in different rows are arranged along the lifting direction of the lifting module, so that the lifting module can carry the flower basket from the side into the opening and then descend so that the flower basket is supported at the opening for temporary storage.

[0021] In one embodiment of the above-mentioned wafer carrying device, the temporary storage module includes a row of first bottom plates and a row of second bottom plates, the first bottom plates are located between the lateral movement module and the second bottom plates, the second bottom plates are connected to a fourth driver for driving the lifting and lowering thereof through a support member, the fourth driver is fixed under the first bottom plate, and a second avoidance opening is provided on the first bottom plate for the passage of the support member; the upper bottom plate can be raised and lowered to adjust the spacing between the bottom plates to accommodate flower baskets carrying wafers of different sizes.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The disclosure of the present invention will become easier to understand with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention.

[0024] Additionally, like numerals are used to denote like parts in the drawings, wherein:

[0025] Figure 1This is a front view of the wafer carrying device provided by the embodiment of the utility model;

[0026] Figure 2 It is a front view of the wafer carrying device provided by the embodiment of the utility model;

[0027] Figure 3 It is a side view of the wafer carrying device provided by the embodiment of the utility model;

[0028] Figure 4 It is a top view of the wafer carrying device provided by an embodiment of the utility model.

[0029] Description of Reference Numerals

[0030] Among them: 1. Rack; 2. Temporary storage module; 21. Bottom plate; 211. First avoidance; 22. Opening; 23. Limit block; 24. Support member; 25. Fourth driver; 3. Transverse movement module; 31. First transverse structure; 311. Second guide rail; 312. Second driver; 32. Second transverse structure; 321. Third guide rail; 322. Third driver; 4. Lifting module; 41. Driving member; 5. Detection module; 51. Detection sensor; 52. Connector; 53. First driver; 54. First guide rail; 6. Flower basket; 7. Placement plate. DETAILED DESCRIPTION

[0031] Some embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0032] As described in the background technology, the prior art device for temporarily storing wafers takes up a large space and is inconvenient to accurately count the number of temporarily stored wafers when temporarily storing the same number of flower baskets carrying wafers. In order to solve the above problems, the utility model provides a wafer carrying device, which uses a lateral movement module and a lifting module to transport the flower basket to a temporary storage module for temporary storage, and cooperates with a detection module arranged above the temporary storage module to detect the number of wafers in the flower basket, thereby avoiding the waste of space by simply laying out the wafers, and can accurately count the number of temporarily stored wafers.

[0033] The present invention will be described in detail below through specific embodiments.

[0034] Embodiment 1: This embodiment provides a wafer carrying device, referring to Figures 1 to 4 As shown, it includes: a frame 1, a temporary storage module 2 installed on the frame 1, a lateral movement module 3, a lifting module 4 and a detection module 5;

[0035] The temporary storage module 2 includes a bottom plate 21 installed on the top of the frame 1 to support the flower basket 6, and an opening 22 is provided on the bottom plate 21 for the lifting module 4 to pass through, and the size of the opening 22 is smaller than the horizontal cross-sectional size of the flower basket 6; the top of the flower basket 6 is open, and a plurality of slots arranged layer by layer are provided therein to vertically accommodate a plurality of wafers, and an opening is provided on the top for loading and unloading wafers;

[0036] The lifting module 4 is vertically arranged, and the transverse module 3 is horizontally arranged; the lifting module 4 is connected to the transverse module 3 and is driven by the transverse module 3 to move into or away from the opening 22; the top of the lifting module 4 is connected to a placement plate 7 for supporting the flower basket 6, and the placement plate 7 is driven by the lifting module 4 to rise and fall, and the size of the placement plate 7 is smaller than the size of the opening 22;

[0037] The detection module 5 is disposed above the temporary storage module 2 , and the lateral movement module 3 is disposed below the temporary storage module 2 .

[0038] The flower basket 6 is transported to the temporary storage module 2 for temporary storage by combining the lateral movement module 3 and the lifting module 4. The number of wafers in the flower basket 6 is detected by the detection module 5 arranged above the temporary storage module to avoid wasting space by simply laying out the wafers. At the same time, the number of temporarily stored wafers can be accurately counted. When the flower basket 6 is transported to the temporary storage module 2 for temporary storage, the flower basket 6 is first transferred from the preceding station to the placement plate 7. The placement plate 7 is driven by the lateral movement module 3 to translate toward the opening 22 along with the connected lifting module 4. The lifting module 4 drives the placement plate 7 to rise until the bottom surface height of the flower basket 6 is higher than the height of the opening 22. After the lifting module 4 is driven by the lateral movement module 3 to enter the opening 22, the lifting module 4 drives the placement plate 7 to descend. The flower basket 6 is supported on the opening 22. Since the size of the placement plate 7 is smaller than the size of the opening 22, the placement plate 7 descends from the opening 22 to leave the bottom of the flower basket 6 and is driven back by the lateral movement module 3.

[0039] In one embodiment of the above-mentioned wafer carrying device, a limit block 23 is set on the top surface of the base plate 21, and the limit block 23 is used to limit the position of the flower basket 6; the limit block 23 is set at the edge of the opening 22; the limit block 23 limits the flower basket 6 supported on the opening 22 to prevent the flower basket 6 from sliding and shifting on the base plate 21.

[0040] In one embodiment of the above-mentioned wafer carrying device, the detection module 5 includes a detection sensor 51 disposed above the bottom plate 21, a connector 52 connected to the detection sensor 51, and a first driver 53 connected to the connector 52 and driving the connector 52 to move along the arrangement direction of the wafers in the basket 6; the detection sensor 51 moves above the basket 6 in the temporary storage position along the arrangement direction of the wafers in the basket 6, so as to detect all the wafers in the basket 6 for accurate counting. Preferably, there are two detection sensors 51, which are distributed on both sides above the basket 6 and fixedly connected by a transverse fixing member connected to the end of the connector 52. The two detection sensors 51 detect and record the number of wafers in the basket 6 from two directions to prevent false alarms.

[0041] Furthermore, there are at least two openings 22, and the detection module 5 also includes a first guide rail 54 arranged along the arrangement direction of the openings 22; the connecting member 52 is slidably connected to the first guide rail 54, and the first guide rail 54 is arranged below the base plate 21, and the first driver 53 is installed at the end of the first guide rail 54, and the base plate 21 is provided with a first avoidance opening 211 for the connecting member 52 to pass through and translate; the first driver 53 that drives the detection module 5 to move is arranged below the base plate 21, and the structure is more compact, and the setting of the first avoidance opening 211 can limit the connecting member 52, so that the detection sensor 51 is more stable.

[0042] In one embodiment of the wafer carrying device described above, the lifting module 4 includes a driving member 41 slidably connected to the traverse module 3, and the driving member 41 is connected to the placement plate 7. The driving member 41 can be connected to the end or bottom surface of the placement plate 7, as long as the driving member 41 can stably drive the placement plate 7 to rise and fall. Preferably, the driving member 41 is fixedly connected to the center of the bottom surface of the placement plate 7, so that the force applied to the placement plate 7 is more stable.

[0043] In one embodiment of the above-mentioned wafer carrying device, the transverse movement module 3 includes a first transverse structure 31 and a second transverse structure 32 which are horizontally arranged, the first transverse structure 31 is parallel to the arrangement direction of the opening 22, the second transverse structure 32 is perpendicular to the first transverse structure 31 and is slidably connected to the top of the first transverse structure 31; the lifting module 4 is slidably connected to the top of the second transverse structure 32; the transverse movement module 3 is divided into a first transverse structure 31 and a second transverse structure 32 which are horizontal and perpendicular to each other, and can reach any spatial point on the frame 1 in conjunction with the lifting module 4.

[0044] Furthermore, the first transverse structure 31 includes a second guide rail 311 horizontally arranged and parallel to the arrangement direction of the openings 22 and a second driver 312 fixed to the end of the second guide rail 311; the second transverse structure 32 is slidably connected to the second guide rail 311, and is connected to the second driver 312 and driven by the second driver 312 to slide on the second guide rail 311.

[0045] Furthermore, the second transverse structure 32 includes a third guide rail 321 arranged horizontally and perpendicular to the second guide rail 311, and a third driver 322 fixed to the end of the third guide rail 321, and the third guide rail 321 is slidably connected to the top of the second guide rail 311;

[0046] The lifting module 4 is slidably connected to the top of the third guide rail 321 . The lifting module 4 is connected to the third driver 322 and is driven by the third driver 322 to slide along the third guide rail 321 .

[0047] In one embodiment of the above-mentioned wafer carrying device, the temporary storage module 2 includes a row of first bottom plates and a row of second bottom plates and a fourth driver 25 arranged in the frame, the first bottom plate is located between the lateral movement module 3 and the second bottom plate, the driving end of the fourth driver 25 is connected to a support 24, the second bottom plate is connected to the support 24 to be driven up and down by the fourth driver 25, and a second avoidance opening (not shown) for the support 24 to pass through is provided on the first bottom plate. Of course, at least one row of third bottom plates can be provided between the first bottom plate and the second bottom plate, the driving end of the fourth driver 25 is also connected to the third bottom plate through the support 24 to drive the third bottom plate to be raised and lowered, and a second avoidance opening for the support 24 to pass through is also provided on the third bottom plate; other bottom plates other than the bottom layer can be raised and lowered, and the spacing between the bottom plates can be adjusted to accommodate flower baskets carrying wafers of different sizes.

[0048] Embodiment 2: The difference between this embodiment and embodiment 1 is that: in this embodiment, the temporary storage module 2 includes at least two rows of bottom plates 21 arranged along the lifting direction of the lifting module 4; the at least two rows of bottom plates 21 are provided with openings 22 of equal number and same spacing, and the openings 22 of different rows are arranged along the lifting direction of the lifting module 4; multiple rows of fixed bottom plates 21 are provided, and the openings 22 of different rows are arranged along the lifting direction of the lifting module 4, so that the lifting module 4 can carry the flower basket 6 from the side into the opening 22 and then descend so that the flower basket 6 is supported at the opening 22 for temporary storage, and the lifting module 4 drives the flower basket 6 supported on the placement plate 7 to be placed on the opening 22 of the bottom plate 21 of the corresponding height by controlling the lifting module 4 to drive the placement plate 7 to rise.

[0049] The first, second, third, and fourth drivers and driving members may be any structures or devices such as motors and cylinders that can drive the connected components to achieve linear motion of the connected components, and the present invention does not make any specific limitations on this.

[0050] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] In addition, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", and "fourth" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0052] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A wafer carrying device, characterized in that: include: A rack, a temporary storage module, a lateral movement module, a lifting module and a detection module installed on the rack; The temporary storage module comprises a bottom plate installed on the top of the frame for supporting the flower basket, the bottom plate is provided with an opening for the lifting module to pass through, and the size of the opening is smaller than the horizontal cross-sectional size of the flower basket; The lifting module is vertically arranged, and the transverse module is horizontally arranged; the lifting module is connected to the transverse module, and is driven by the transverse module to move into or away from the opening; the top of the lifting module is connected to a placement plate for supporting the flower basket, and the placement plate is driven by the lifting module to rise and fall, and the size of the placement plate is smaller than the size of the opening; The detection module is arranged above the temporary storage module, and the transverse movement module is arranged below the temporary storage module.

2. The wafer carrier device according to claim 1, characterized in that: A limiting block is arranged on the top surface of the bottom plate, and the limiting block is used to limit the position of the flower basket; the limiting block is arranged at the edge of the opening.

3. The wafer carrier device according to claim 1, characterized in that: The detection module includes a detection sensor disposed above the bottom plate, a connecting piece connected to the detection sensor, and a first driver connected to the connecting piece and driving the connecting piece to move along the wafer arrangement direction in the flower basket.

4. The wafer carrier device according to claim 3, characterized in that: There are at least two openings, and the detection module further includes a first guide rail arranged along the arrangement direction of the openings; The connecting member is slidably connected to the first guide rail, the first guide rail is arranged below the bottom plate, the first driver is installed at the end of the first guide rail, and the bottom plate is provided with a first avoidance opening for the connecting member to pass through and translate.

5. The wafer carrier device according to claim 1, characterized in that: The lifting module comprises a driving member slidably connected to the transverse movement module, and the driving member is connected to the placement plate.

6. The wafer carrying device according to claim 1, characterized in that: The transverse movement module includes a first transverse structure and a second transverse structure which are horizontally arranged, wherein the first transverse structure is parallel to the opening arrangement direction, and the second transverse structure is perpendicular to the first transverse structure and is slidably connected to the top of the first transverse structure; the lifting module is slidably connected to the top of the second transverse structure.

7. The wafer carrying device according to claim 6, characterized in that: The first transverse structure includes a second guide rail horizontally arranged and parallel to the opening arrangement direction and a second driver fixed to the end of the second guide rail; the second transverse structure is slidably connected to the second guide rail and connected to the second driver to slide on the second guide rail.

8. The wafer carrying device according to claim 7, characterized in that: The second transverse structure includes a third guide rail arranged horizontally and perpendicular to the second guide rail, and a third driver fixed to an end of the third guide rail, wherein the third guide rail is slidably connected to the top of the second guide rail; The lifting module is slidably connected to the top of the third guide rail, and the lifting module is connected to the third driver and driven by the third driver to slide along the third guide rail.

9. The wafer carrying device according to claim 1, characterized in that: The temporary storage module comprises at least two rows of bottom plates arranged along the lifting direction of the lifting module; The at least two rows of bottom plates are provided with openings of equal quantity and at the same intervals, and the openings in different rows are arranged along the lifting direction of the lifting module.

10. The wafer carrier device according to claim 1, characterized in that: The temporary storage module includes a row of first bottom plates and a row of second bottom plates arranged along the lifting direction of the lifting module and a fourth driver arranged in the frame, the first bottom plate is located between the transverse movement module and the second bottom plate, the driving end of the fourth driver is connected to a support member, the second bottom plate is connected to the support member to be driven to rise and fall by the fourth driver, and a second avoidance opening for the support member to pass through is opened on the first bottom plate.

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