Electrostatic protection structure of TDDI module

Abstract

The utility model discloses an electrostatic protection structure of a TDDI module, comprising a cover plate assembly which is provided with a display area and a non-display area and comprises a protection cover plate and conductive ink, and the conductive ink is arranged on the back surface of the protection cover plate and corresponds to the non-display area; the TDDI assembly is arranged on the back face of the cover plate assembly, corresponds to the display area and comprises a TDDI screen and a high-resistance film, and the high-resistance film is arranged on the surface of the side, facing the cover plate assembly, of the TDDI screen; the flexible circuit board is bound on one side edge of the TDDI screen and is provided with grounding exposed copper; the backlight assembly is arranged on the back surface of the TDDI assembly; the first conductive part is electrically connected between the backlight assembly and the conductive ink of the cover plate assembly; and the second conductive part is electrically connected among the high-resistance film of the TDDI assembly, the grounding exposed copper of the flexible circuit board and the first conductive part. The electrostatic protection structure can improve the electrostatic protection capability of the TDDI module.

Description

Technical Field

[0001] The utility model relates to touch screen technology, in particular to an electrostatic protection structure of a TDDI module. Background Art

[0002] TDDI (Touch and Display Driver Integration) technology, namely the touch control and display driver integration technology, means that after the touch screen and display screen are integrated into one, the same driver IC is used to drive the touch screen and display screen for touch sensing and image display respectively. The advantages of TDDI technology include improving the sensitivity of overall sensing, reducing display noise, making the screen thinner, increasing display brightness, reducing costs and simplifying the supply chain.

[0003] Existing TDDI screens are generally covered with a high-resistance film on their surface, which collects surface static electricity and releases it through the grounding terminal on the flexible circuit board. However, with the application of TDDI screens in automotive products, the electrostatic protection capability of a high-resistance film alone can no longer meet the needs of automotive products. Utility Model Content

[0004] In order to solve the above-mentioned deficiencies in the prior art, the utility model provides an electrostatic protection structure of a TDDI module, which can improve the electrostatic protection capability of the TDDI module.

[0005] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0006] An electrostatic protection structure of a TDDI module, comprising:

[0007] A cover plate assembly having a display area and a non-display area, comprising a protective cover plate and conductive ink, wherein the conductive ink is disposed on the back of the protective cover plate and corresponds to the non-display area;

[0008] A TDDI component is arranged on the back of the cover plate component and corresponds to the display area, and includes a TDDI screen and a high-resistance film, wherein the high-resistance film is arranged on a surface of the TDDI screen facing the cover plate component;

[0009] A flexible circuit board, bound to one side of the TDDI screen, having grounded exposed copper;

[0010] A backlight assembly, disposed on the back side of the TDDI assembly;

[0011] A first conductive member electrically connected between the backlight assembly and the conductive ink of the cover assembly;

[0012] The second conductive member is electrically connected between the high-resistance film of the TDDI component, the grounded exposed copper of the flexible circuit board and the first conductive member.

[0013] Furthermore, the first conductive member includes a conductive double-sided adhesive, and the backlight assembly is bonded to the conductive ink of the cover assembly through the conductive double-sided adhesive.

[0014] Furthermore, the second conductive member is a conductive cloth, which is respectively bonded to the high-resistance film of the TDDI component, the grounding exposed copper of the flexible circuit board, and the first conductive member.

[0015] Furthermore, the second conductive member includes a main body, wing portions located on opposite sides of the main body, and a tail portion located on the other side of the main body, the main body of the second conductive member is bonded to the high-resistance film of the TDDI component to achieve electrical connection, the wing portions on both sides of the second conductive member are bonded to the first conductive member to achieve electrical connection, and the tail portion of the second conductive member is bonded to the grounding exposed copper of the flexible circuit board to achieve electrical connection.

[0016] Furthermore, the main body has a length direction and a width direction, the wing portions are located on both sides of the main body along the length direction, and the tail portion is located on one side of the main body along the width direction.

[0017] Furthermore, the electrostatic protection structure also includes a protective paper, which is attached to the flexible circuit board and the second conductive member and covers the connection between the flexible circuit board and the second conductive member.

[0018] Furthermore, the protective paper also covers the grounding exposed copper of the flexible circuit board.

[0019] Furthermore, the cover plate assembly and the TDDI screen are fixed by bonding with OCA optical adhesive.

[0020] Furthermore, light-shielding ink is provided between the protective cover plate and the conductive ink.

[0021] Furthermore, the light-shielding ink is black ink.

[0022] The utility model has the following beneficial effects: the utility model arranges the conductive ink on the back of the protective cover plate, and electrically connects the backlight assembly to the conductive ink on the protective cover plate through the first conductive member, and then electrically connects the high-resistance film of the TDDI assembly, the grounded exposed copper of the flexible circuit board and the first conductive member through the second conductive member. In this way, the backlight surface static electricity generated by the backlight assembly can be sequentially transferred to the grounded exposed copper of the flexible circuit board through the conductive ink, the first conductive member and the second conductive member, and the conductive ink can also collect the cover plate surface static electricity generated by the protective cover plate, and transfer the collected cover plate surface to the grounded exposed copper of the flexible circuit board through the first conductive member and the second conductive member in turn. The high-resistance film can also collect the screen surface static electricity generated by the TDDI screen, and transfer the collected screen surface static electricity to the grounded exposed copper of the flexible circuit board through the second conductive member. Finally, the grounded copper foil on the flexible circuit board performs grounding treatment on the backlight surface static electricity, the cover plate surface static electricity and the screen surface static electricity, thereby greatly improving the electrostatic protection capability of the TDDI module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a front structural schematic diagram of the electrostatic protection structure provided by the utility model.

[0024] Figure 2 for Figure 1 AA cross-sectional structural schematic diagram of the electrostatic protection structure shown.

[0025] Figure 3 for Figure 1 BB cross-sectional structural schematic diagram of the electrostatic protection structure shown.

[0026] Figure 4 This is a schematic diagram of the stacking structure of TDDI components in the electrostatic protection structure provided by the utility model.

[0027] Figure 5 This is a front structural schematic diagram of a backlight assembly and a first conductive member in the electrostatic protection structure provided by the utility model.

[0028] Figure 6 This is a front structural schematic diagram of the TDDI component, the flexible circuit board and the second conductive member in the electrostatic protection structure provided by the utility model. DETAILED DESCRIPTION

[0029] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0030] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] Embodiment 1

[0034] like Figure 1-3 As shown, an electrostatic protection structure of a TDDI module includes:

[0035] The cover plate assembly 10 has a display area 101 and a non-display area 102, including a protective cover plate 11 and a conductive ink 13, wherein the conductive ink 13 is disposed on the back of the protective cover plate 11 and corresponds to the non-display area 102;

[0036] The TDDI component 20 is disposed on the back of the cover assembly 10 and corresponds to the display area 101, and includes a TDDI screen 21 and a high-resistance film 22, wherein the high-resistance film 22 is disposed on a side surface of the TDDI screen 21 facing the cover assembly 10;

[0037] A flexible circuit board 30 is bound to one side of the TDDI screen 21 and has a grounding copper strip 31;

[0038] A backlight assembly 40 is disposed on the back side of the TDDI assembly 20;

[0039] A first conductive member 50 electrically connected between the backlight assembly 40 and the conductive ink 13 of the cover assembly 10;

[0040] The second conductive member 60 is electrically connected between the high resistance film 22 of the TDDI assembly 20 , the grounding exposed copper 31 of the flexible circuit board 30 , and the first conductive member 50 .

[0041] The electrostatic protection structure of the utility model is provided with the conductive ink 13 on the back side of the protective cover plate 11, and the backlight assembly 40 is electrically connected to the conductive ink 13 on the protective cover plate 11 through the first conductive member 50, and the high resistance film 22 of the TDDI assembly 20, the grounding exposed copper 31 of the flexible circuit board 30 and the first conductive member 50 are electrically connected through the second conductive member 60. In this way, the backlight surface static electricity generated by the backlight assembly 40 can be sequentially transmitted to the grounding exposed copper 31 of the flexible circuit board 30 through the conductive ink 13, the first conductive member 50 and the second conductive member 60, and the conductive member 60 is electrically connected to the grounding exposed copper 31 of the flexible circuit board 30. The ink 13 can also collect the static electricity on the cover surface generated by the protective cover 11, and transfer the collected static electricity on the cover surface to the grounded exposed copper 31 of the flexible circuit board 30 through the first conductive member 50 and the second conductive member 60 in turn. The high-resistance film 22 can also collect the static electricity on the screen surface generated by the TDDI screen 21, and transfer the collected static electricity on the screen surface to the grounded exposed copper 31 of the flexible circuit board 30 through the second conductive member 60. Finally, the grounded copper foil on the flexible circuit board 30 grounds the static electricity on the backlight surface, the static electricity on the cover surface, and the static electricity on the screen surface, thereby greatly improving the static electricity protection capability of the TDDI module.

[0042] The TDDI screen 21 can be an In-Cell display screen or an On-Cell display screen that integrates touch function and display function, and a TDDI chip 23 that integrates touch drive and display drive is also bound to the side bound to the flexible circuit board 30.

[0043] In this embodiment, Figure 4As shown, the TDDI screen 21 is an LCD screen, which includes an upper polarizer 211, an upper substrate 212, a lower substrate 213 and a lower polarizer 214 in sequence from the cover assembly 10 along the direction of the backlight assembly 40, wherein the high-resistance film 22 can be located on the side surface of the upper polarizer 211 facing the cover assembly 10, or on the side surface of the upper polarizer 211 facing the upper substrate 212. When the high-resistance film 22 is located on the side surface of the upper polarizer 211 facing the upper substrate 212, the edge of the high-resistance film 22 needs to extend outside the upper polarizer 211 to be electrically connected to the second conductive member 60.

[0044] Preferably, the first conductive member 50 includes a conductive double-sided adhesive 51 , and the backlight assembly 40 is adhered to the conductive ink 13 of the cover assembly 10 via the conductive double-sided adhesive 51 .

[0045] The electrostatic protection structure of the present invention adopts the conductive double-sided adhesive 51 as the first conductive member 50, which, in addition to transmitting the static electricity on the backlight surface, is also used to relatively bond and fix the backlight assembly 40 and the cover assembly 10; and in order to achieve the bonding and fixation between the backlight assembly 40 and the cover assembly 10, the laying area of ​​the conductive double-sided adhesive 51 on the backlight assembly 40 needs to be large enough, which also enables the conductive double-sided adhesive 51 to have the ability to collect the static electricity on the backlight surface generated by the backlight assembly 40.

[0046] In this embodiment, Figure 5 As shown, there are two conductive double-sided adhesives 51, which are respectively arranged on the opposite side edges of the backlight assembly 40 and laid along the extension direction of the side edges; insulating double-sided adhesives 52 are also respectively provided on the other pair of side edges of the backlight assembly 40, and are bonded to the cover assembly 10 through the insulating double-sided adhesives 52 to increase the bonding area between the cover assembly 10.

[0047] Preferably, the conductive double-sided adhesive 51 and the insulating double-sided adhesive 52 are both light-shielding double-sided adhesives, and the most preferred is black double-sided adhesive, so as to play the role of light shielding and light leakage prevention.

[0048] The backlight assembly 40 includes a backlight frame 41, a backlight bar 42, a light guide plate 43 and an optical film (not shown in the figure), the backlight bar 42, the light guide plate 43 and the optical film are all arranged in the backlight frame 41, and the backlight bar 42 is arranged on the light incident surface of the light guide plate 43, and the optical film is arranged on the light emitting surface of the light guide plate 43; in this embodiment, the backlight bar 42 can be but is not limited to an LED light bar, and the optical film can be but is not limited to include at least one of a light diffusion film and a light brightening film.

[0049] The conductive double-sided adhesive 51 and the insulating double-sided adhesive 52 are both disposed on a surface of the backlight frame 41 facing the TDDI screen.

[0050] Preferably, Figure 6 As shown, the second conductive member 60 is a conductive cloth, which is respectively bonded to the high-resistance film 22 of the TDDI component 20, the grounding exposed copper 31 of the flexible circuit board 30 and the first conductive member 50. The surface of the second conductive member 60 facing the TDDI screen 21 is sticky, and includes a main body 61, wing portions 62 located on opposite sides of the main body 61, and a tail portion 63 located on the other side of the main body 61. The main body 61 of the second conductive member 60 is bonded to the high-resistance film 22 of the TDDI component 20 to achieve electrical connection, the wing portions 62 on both sides of the second conductive member 60 are bonded to the first conductive member 50 to achieve electrical connection, and the tail portion 63 of the second conductive member 60 is bonded to the grounding exposed copper 31 of the flexible circuit board 30 to achieve electrical connection.

[0051] The electrostatic protection structure of the present invention uses the conductive cloth as the second conductive member 60 , and the back side of the conductive cloth (the side surface facing the cover assembly 10 ) is insulated, which can prevent the second conductive member 60 from being short-circuited with surrounding electronic devices.

[0052] The main body 61 has a length direction and a width direction. The wing portions 62 are located on both sides of the main body 61 along the length direction. The tail portion 63 is located on one side of the main body 61 along the width direction.

[0053] The electrostatic protection structure further includes a protective paper 70 , which is attached to the flexible circuit board 30 and the second conductive member 60 and covers the connection between the flexible circuit board 30 and the second conductive member 60 .

[0054] The utility model improves the connection strength between the flexible circuit board 30 and the second conductive member 60 by attaching the protective paper 70 at the connection between the flexible circuit board 30 and the second conductive member 60 to prevent the flexible circuit board 30 and the second conductive member 60 from falling off.

[0055] The protective paper 70 also covers the grounding exposed copper 31 of the flexible circuit board 30 to improve the strength of the grounding exposed copper 31 and increase the thickness of the insulation layer above the grounding exposed copper 31 .

[0056] Preferably, the cover plate assembly 10 and the TDDI screen 21 are bonded and fixed by OCA optical adhesive 80 .

[0057] The OCA optical adhesive 80, whose full name is Optically Clear Adhesive, is a special adhesive used to bond transparent optical components. It belongs to a type of pressure-sensitive adhesive and has the characteristics of colorless transparency, high light transmittance, and high adhesion. The OCA optical adhesive 80 has high clarity and a total light transmittance of more than 99%, which ensures high light transmittance. The OCA optical adhesive 80 has good bonding strength and can ensure a tight connection between optical components. The OCA optical adhesive 80 has excellent weather resistance and water resistance, and will not cause yellowing, peeling, and deterioration problems after long-term use. The OCA optical adhesive 80 can be cured at room temperature or medium temperature, and has small curing shrinkage, and is suitable for use at various ambient temperatures. The OCA optical adhesive 80 can resist the erosion of ultraviolet rays and maintain long-term stability and reliability.

[0058] A light shielding ink 12 is further provided between the protective cover plate 11 and the conductive ink 13 to define the display area 101 of the cover plate assembly 10 and shield the electronic devices located in the non-display area 102 .

[0059] Preferably, the light-shielding ink 12 is black ink, and its OD value (absorbance) should be guaranteed to be above 4 to meet the light-shielding effect. The thickness of the light-shielding ink 12 is between 1.5-1.9 μm, and the number of layers is at least two. If the light-shielding property of the material of the light-shielding ink 12 is low, the thickness of the light-shielding ink 12 can be appropriately increased. If the light-shielding property of the material of the light-shielding ink 12 is high, the thickness of the light-shielding ink 12 can be appropriately reduced, and it should not be limited to this.

[0060] The black ink uses carbon black as a colorant, which is doped and mixed in an ink base material and formed on the back of the protective cover plate 11 through a silk screen printing process. It has the characteristics of high density, high viscosity, high hiding power, etc. It has good printability, can be printed on various substrates, and has good weather resistance and durability.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model rather than to limit them. Although the embodiments of the utility model are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the utility model can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. An electrostatic protection structure of a TDDI module, characterized in that: include: A cover plate assembly having a display area and a non-display area, comprising a protective cover plate and conductive ink, wherein the conductive ink is disposed on the back of the protective cover plate and corresponds to the non-display area; A TDDI component is arranged on the back of the cover plate component and corresponds to the display area, and includes a TDDI screen and a high-resistance film, wherein the high-resistance film is arranged on a surface of the TDDI screen facing the cover plate component; A flexible circuit board, bound to one side of the TDDI screen, having grounded exposed copper; A backlight assembly, disposed on the back side of the TDDI assembly; A first conductive member electrically connected between the backlight assembly and the conductive ink of the cover assembly; The second conductive member is electrically connected between the high-resistance film of the TDDI component, the grounded exposed copper of the flexible circuit board and the first conductive member.

2. The electrostatic protection structure according to claim 1, characterized in that: The first conductive member includes a conductive double-sided adhesive, and the backlight assembly is bonded to the conductive ink of the cover assembly through the conductive double-sided adhesive.

3. The electrostatic protection structure according to claim 1, characterized in that: The second conductive member is a conductive cloth, which is respectively bonded to the high-resistance film of the TDDI component, the grounding exposed copper of the flexible circuit board and the first conductive member.

4. The electrostatic protection structure according to claim 1, characterized in that: The second conductive member includes a main body, wing portions located at opposite sides of the main body, and a tail portion located at the other side of the main body. The main body of the second conductive member is bonded to the high-resistance film of the TDDI component to achieve electrical connection, the wing portions at both sides of the second conductive member are bonded to the first conductive member to achieve electrical connection, and the tail portion of the second conductive member is bonded to the grounding exposed copper of the flexible circuit board to achieve electrical connection.

5. The electrostatic protection structure according to claim 4, characterized in that: The main body has a length direction and a width direction, the wing parts are located on both sides of the main body along the length direction, and the tail part is located on one side of the main body along the width direction.

6. The electrostatic protection structure according to claim 1, characterized in that: The electrostatic protection structure further includes a protective paper, which is attached to the flexible circuit board and the second conductive member and covers the connection between the flexible circuit board and the second conductive member.

7. The electrostatic protection structure according to claim 6, characterized in that: The protective paper also covers the grounding exposed copper of the flexible circuit board.

8. The electrostatic protection structure according to claim 1, characterized in that: The cover plate assembly and the TDDI screen are bonded and fixed by OCA optical adhesive.

9. The electrostatic protection structure according to claim 1, characterized in that: Light-shielding ink is also provided between the protective cover plate and the conductive ink.

10. The electrostatic protection structure according to claim 9, characterized in that: The light-shielding ink is black ink.

Images