Front heat dissipation pasting roller used for chip-on-film flexible circuit board

Abstract

The utility model relates to the technical field of chip-on-film flexible circuit boards, and discloses a front heat dissipation pasting roller for a chip-on-film flexible circuit board, which comprises a pasting handle, a rotating column is fixedly connected in the pasting handle, a pasting roller is inserted in the surface of the rotating column, and the left end and the right end of the rotating column are in threaded connection with fixing rings. And the pasting rollers are symmetrically distributed with the pasting handle as the center, a fixing plate is fixedly connected to the top of the pasting handle, a positioning groove is formed in the fixing plate, and a scraping plate is inserted into the positioning groove. According to the utility model, the mounting groove formed in the pasting handle is matched with the limiting plate and the limiting rod, so that the mounted connecting frame can be limited and fixed, and the mounting bolt is rotationally taken down from the inner wall of the connecting frame by rotating the mounting bolt; and a worker can conveniently mount and dismount the pasting roller from the front side of the pasting handle, and operation convenience is brought to the worker in use of the equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of chip-on-film flexible circuit boards, in particular to a front heat dissipation pasting roller for chip-on-film flexible circuit boards. Background Art

[0002] The heat dissipation roller is a technical product used to enhance the heat dissipation effect. It is usually used in electronic devices, especially in high-performance computing devices such as servers, personal computers, laptops and other occasions with high heat dissipation requirements.

[0003] Comparative publication number CN 219759535 U A front heat sink roller for a chip-on-film flexible circuit board, the front heat sink roller comprising: a fixed shaft, the fixed shaft is used to be rotatably connected to a heat sink machine; an elastic ring arranged on the outer surface of the fixed shaft, the elastic ring is used to discharge bubbles between the heat sink and both sides of the wafer during rolling; an elastic ring sleeved on the elastic ring, the elasticity of the elastic ring is greater than the elasticity of the elastic ring, the elastic ring is used to face the position of the wafer during rolling and flatten the heat sink, optionally, in some embodiments of the present disclosure, the width of the elastic ring is greater than or equal to the width of the fixed shaft, the thickness of the elastic ring is 1mm to 5mm, optionally, in In some embodiments of the present disclosure, the elastic ring is a silicone ring. Optionally, in some embodiments of the present disclosure, the width of the elastic ring is 1mm~4mm, and the thickness of the elastic ring is 0.5mm~1.9mm. Optionally, in some embodiments of the present disclosure, the elastic ring is a silicone ring. Optionally, in some embodiments of the present disclosure, the elastic ring and the elastic ring are separately arranged, and the elastic ring that is sleeved on the elastic ring and facing the chip first flattens the heat sink, and then relies on the ductility of the heat sink itself to flatten the rest of the heat sink through the elastic ring and discharge the bubbles between the heat sink and the two sides of the chip, thereby being able to flatly attach the heat sink to the chip, ensuring the product yield.

[0004] The front heat dissipation paste roller for the chip-on-film flexible circuit board is sleeved on the elastic ring and the elastic ring facing the wafer first flattens the heat dissipation paste, and then relies on the ductility of the heat dissipation paste to flatten the rest of the heat dissipation paste through the elastic ring, and discharges the bubbles between the heat dissipation paste and the two sides of the wafer, so that the heat dissipation paste can be evenly attached to the wafer, ensuring the product yield. However, when the heat dissipation paste is applied to the product as a whole, it is not convenient to easily install and disassemble the application roller that has been used for a long time. When too many impurities are attached to the surface of the application roller, the processing quality of the equipment when applying the heat dissipation paste is affected. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a front heat dissipation sticker roller for a chip-on-film flexible circuit board.

[0006] The utility model is implemented by the following technical scheme: a front heat dissipation pasting roller for a chip-on-film flexible circuit board, comprising a pasting handle, a rotating column is fixedly connected inside the pasting handle, a pasting roller is plugged on the surface of the rotating column, and the left and right ends of the rotating column are threadedly connected with fixing rings;

[0007] The application rollers are symmetrically distributed with the application handle as the center, the top of the application handle is fixedly connected with a fixing plate, the interior of the fixing plate is provided with a positioning groove, the interior of the positioning groove is plugged with a scraper, the interior of the scraper is threadedly connected with a positioning bolt, the interior of the application handle is provided with a mounting groove, the interior of the mounting groove is slidably connected with a connecting frame, the interior of the connecting frame is threadedly connected with a mounting bolt, the interior of the mounting groove is plugged with a limiting plate, the bottom of the limiting plate is fixedly connected with a limiting rod, and the top of the application handle is provided with a limiting hole.

[0008] Through the above technical solution, the number of the limiting holes is set to be several, which can cooperate with the limiting plate and the limiting rod to limit the connection frame placed inside the installation groove.

[0009] As a further improvement of the above solution, the installation grooves are symmetrically distributed with the application handle as the center, a limit plate is inserted into the interior of the application handle, and a limit rod is inserted into the interior of the application handle.

[0010] As a further improvement of the above solution, the limiting rods are symmetrically distributed with the limiting plate as the center, and the positioning bolts penetrate the fixing plate and the scraper plate and extend to the interior of the positioning groove.

[0011] Through the above technical solution, the scraper can easily remove impurities attached to the surface of the pasting roller, thereby preventing the impurities from adhering to the pasting roller and affecting the pasting effect of the equipment on the product.

[0012] As a further improvement of the above solution, the mounting bolts are symmetrically distributed with the application handle as the center, the internal threads of the fixing ring are connected with the mounting bolts, and the connecting frame is symmetrically distributed with the application handle as the center.

[0013] As a further improvement of the above solution, the limiting rods are symmetrically distributed with the application handle as the center, the limiting holes are symmetrically distributed with the mounting groove as the center, and an application roller is provided on the front side of the application handle.

[0014] As a further improvement of the above solution, the positioning bolt is arranged on the top of the application handle, the scraper is arranged on the top of the application handle, and the scraper is arranged on the top of the application roller.

[0015] As a further improvement of the above solution, the limit plate is arranged at the left and right ends of the fixed plate, the connecting frame is slidably connected to the left and right sides of the application handle, and the mounting bolts are arranged at the left and right ends of the application roller.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] The utility model can limit and fix the connecting frame after installation by arranging the installation groove opened inside the application handle in cooperation with the limit plate and the limit rod. When the installation bolt is rotated and removed from the inner wall of the connecting frame, the staff can conveniently install and disassemble the application roller from the front side of the application handle, which brings convenience to the staff in using the equipment.

[0018] The utility model provides an application handle to drive the internal rotating column and the application roller to adhere the heat dissipation sticker attached to the surface of the chip-on-film flexible circuit board, and provides a fixing plate at the top of the application handle and a scraper to cooperate with the positioning bolts to conveniently install and disassemble the scraper used for a long time, and provides a fixing ring to facilitate the staff to remove the installation bolts from the inside and the staff to take out the rotating column from the inside of the application roller. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the anatomical structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the scraper disassembly structure of the utility model;

[0022] Figure 4 This is a schematic diagram of the disassembly structure of the limit plate of the utility model;

[0023] Figure 5 It is an enlarged schematic diagram of the structure at point A of the utility model.

[0024] Description of main symbols:

[0025] 1. Application handle; 2. Application roller; 3. Fixed ring; 4. Rotating column; 5. Fixed plate; 6. Scraper; 7. Positioning bolt; 8. Mounting groove; 9. Limiting plate; 10. Connecting frame; 11. Mounting bolt; 12. Positioning groove; 13. Limiting rod; 14. Limiting hole. DETAILED DESCRIPTION

[0026] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0027] Example:

[0028] Please combine Figure 1-5 The present embodiment is a front heat dissipation pasting roller for a chip-on-film flexible circuit board, comprising a pasting handle 1, a rotating column 4 is fixedly connected to the inside of the pasting handle 1, a pasting roller 2 is plugged into the surface of the rotating column 4, and a fixing ring 3 is threadedly connected to the left and right ends of the rotating column 4;

[0029] The application roller 2 is symmetrically distributed with the application handle 1 as the center. The top of the application handle 1 is fixedly connected with a fixing plate 5, and a positioning groove 12 is opened inside the fixing plate 5. A scraper 6 is inserted inside the positioning groove 12, and a positioning bolt 7 is threadedly connected to the scraper 6. An installation groove 8 is opened inside the application handle 1, and a connecting frame 10 is slidably connected inside the installation groove 8. The connecting frame 10 is threadedly connected with a mounting bolt 11. A limiting plate 9 is inserted inside the installation groove 8, and a limiting rod 13 is fixedly connected to the bottom of the limiting plate 9. A limiting hole 14 is opened at the top of the application handle 1. By setting the installation groove 8 opened inside the application handle 1, the limiting plate 9 and the limiting rod 13 can be used to limit and fix the connecting frame 10 after installation. When the installation bolt 11 is rotated and removed from the inner wall of the connecting frame 10, it is convenient for the staff to conveniently install and disassemble the application roller 2 from the front of the application handle 1, which brings operational convenience to the staff in using the equipment.

[0030] The number of the limiting holes 14 is set to be several, and can cooperate with the limiting plate 9 and the limiting rod 13 to limit the connection frame 10 placed inside the installation groove 8.

[0031] As a further improvement of the above solution, the mounting grooves 8 are symmetrically distributed with the application handle 1 as the center, a limiting plate 9 is inserted into the interior of the application handle 1, and a limiting rod 13 is inserted into the interior of the application handle 1.

[0032] The limiting rods 13 are symmetrically distributed with the limiting plate 9 as the center, and the positioning bolts 7 penetrate the fixing plate 5 and the scraper plate 6 and extend to the inside of the positioning groove 12 .

[0033] The scraper 6 can conveniently remove impurities attached to the surface of the application roller 2 to prevent the impurities from adhering to the application roller 2 and affecting the application effect of the equipment on the product.

[0034] The mounting bolts 11 are symmetrically distributed with the application handle 1 as the center, the internal threads of the fixing ring 3 are connected with the mounting bolts 11 , and the connecting frame 10 is symmetrically distributed with the application handle 1 as the center.

[0035] The limiting rods 13 are symmetrically distributed with the application handle 1 as the center, the limiting holes 14 are symmetrically distributed with the mounting groove 8 as the center, and the front side of the application handle 1 is provided with an application roller 2 .

[0036] The positioning bolt 7 is arranged at the top of the application handle 1, the scraper 6 is arranged at the top of the application handle 1, and the scraper 6 is arranged at the top of the application roller 2. The application handle 1 is arranged to drive the internal rotating column 4 and the application roller 2 to stick the heat dissipation sticker attached to the surface of the chip-on-film flexible circuit board. The fixing plate 5 and the scraper 6 at the top of the application handle 1 are arranged in cooperation with the positioning bolt 7 to conveniently install and disassemble the scraper 6 used for a long time. The fixing ring 3 is arranged to facilitate the staff to remove the installation bolt 11 from the inside, and to facilitate the staff to remove the rotating column 4 from the inside of the application roller 2.

[0037] The limiting plates 9 are arranged at the left and right ends of the fixing plate 5 , the connecting frame 10 is arranged to be slidably connected to the left and right sides of the application handle 1 , and the mounting bolts 11 are arranged at the left and right ends of the application roller 2 .

[0038] The implementation principle of a front heat dissipation paste roller for a chip-on-film flexible circuit board in the embodiment of the present application is as follows: the device is placed in a suitable position, and the connection frame 10 after installation can be limited and fixed by setting the installation groove 8 opened inside the application handle 1 in cooperation with the limit plate 9 and the limit rod 13. When the installation bolt 11 is rotated and removed from the inner wall of the connection frame 10, it is convenient for the staff to conveniently install and remove the application roller 2 from the front of the application handle 1, which brings operational convenience to the staff in using the equipment. The application handle 1 is provided to drive the internal rotating column 4 and the application roller 2 to stick the heat dissipation paste attached to the surface of the chip-on-film flexible circuit board. The scraper 6 used for a long time is conveniently installed and removed by setting the fixing plate 5 and the scraper 6 at the top of the application handle 1 in cooperation with the positioning bolt 7. The fixing ring 3 is provided to facilitate the staff to remove the installation bolt 11 from the inside, and to facilitate the staff to remove the rotating column 4 from the inside of the application roller 2.

[0039] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A front heat dissipation pasting roller for a chip-on-film flexible circuit board, comprising a pasting handle (1), a rotating column (4) fixedly connected to the inside of the pasting handle (1), a pasting roller (2) plugged into the surface of the rotating column (4), and a fixing ring (3) threadedly connected to the left and right ends of the rotating column (4); It is characterized in that The application roller (2) is symmetrically distributed with the application handle (1) as the center; a fixing plate (5) is fixedly connected to the top of the application handle (1); a positioning groove (12) is provided inside the fixing plate (5); a scraper (6) is inserted into the positioning groove (12); a positioning bolt (7) is threadedly connected to the inside of the scraper (6); a mounting groove (8) is provided inside the application handle (1); a connecting frame (10) is slidably connected to the inside of the mounting groove (8); a mounting bolt (11) is threadedly connected to the inside of the connecting frame (10); a limiting plate (9) is inserted into the inside of the mounting groove (8); a limiting rod (13) is fixedly connected to the bottom of the limiting plate (9); and a limiting hole (14) is provided at the top of the application handle (1).

2. A front heat dissipation roller for a chip-on-film flexible circuit board according to claim 1, characterized in that: The installation grooves (8) are symmetrically distributed with the application handle (1) as the center; a limit plate (9) is inserted into the interior of the application handle (1); and a limit rod (13) is inserted into the interior of the application handle (1).

3. The front heat dissipation roller for a chip-on-film flexible circuit board according to claim 1, characterized in that: The limiting rods (13) are symmetrically distributed with the limiting plate (9) as the center, and the positioning bolts (7) penetrate the fixing plate (5) and the scraper plate (6) and extend to the inside of the positioning groove (12).

4. A front heat dissipation roller for a chip-on-film flexible circuit board as claimed in claim 3, characterized in that: The mounting bolts (11) are symmetrically distributed with the application handle (1) as the center, the internal threads of the fixing ring (3) are connected with the mounting bolts (11), and the connecting frame (10) is symmetrically distributed with the application handle (1) as the center.

5. The front heat dissipation roller for a chip-on-film flexible circuit board according to claim 1, characterized in that: The limiting rods (13) are symmetrically distributed with the application handle (1) as the center, the limiting holes (14) are symmetrically distributed with the mounting groove (8) as the center, and an application roller (2) is provided on the front side of the application handle (1).

6. A front heat dissipation roller for a chip-on-film flexible circuit board as claimed in claim 5, characterized in that: The positioning bolt (7) is arranged at the top end of the application handle (1), the scraper (6) is arranged at the top end of the application handle (1), and the scraper (6) is arranged at the top end of the application roller (2).

7. A front heat dissipation roller for a chip-on-film flexible circuit board according to claim 6, characterized in that: The limiting plate (9) is arranged at the left and right ends of the fixing plate (5), the connecting frame (10) is arranged to be slidably connected to the left and right sides of the application handle (1), and the mounting bolts (11) are arranged at the left and right ends of the application roller (2).

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