Single board and communication equipment
By distributing the radiator and using thermally conductive connectors on the single board of the optical circuit terminal equipment, the problem of insufficient heat dissipation ability of the exchange chip is solved and the working reliability of the equipment is improved.
Patent Information
- Application Number
- CN202420657768.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-30
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-03-30
AI Technical Summary
The heat dissipation ability of the switching chip in the optical circuit terminal equipment is weak, resulting in a decrease in the working reliability of the equipment.
A single board is designed to effectively distribute heat from the exchange chip by providing the first and second radiators on both sides of the circuit board and using thermally conductive connectors and thermal interface materials.
By distributing radiator and thermally conductive connectors, the heat dissipation ability of the veneer is improved, the problem of insufficient heat dissipation area on one side is compensated, and the working reliability of the equipment is enhanced.
Smart Images
Figure CN222786199U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of communication technology, and in particular to a single board and communication equipment. Background Art
[0002] The single board is the basic functional component used to complete data exchange in the optical line terminal equipment. The single board is equipped with a switching chip and an optical module. The switching chip is used to process and forward data packets, and the optical module is used to convert the electrical signals sent by the switching chip into optical signals and output them, as well as convert the received optical signals into electrical signals and send them to the switching chip.
[0003] Driven by 5G, cloud computing, big data, and artificial intelligence, high-speed optical transmission networks are developing in the direction of large capacity, grouping, and intelligence. The performance of switching chips in optical line terminal equipment is constantly improving. At the same time, the power consumption of switching chips is also increasing, which means that switching chips will generate more heat during operation. At present, the heat dissipation area of switching chips in mid-mounted boards is generally insufficient, resulting in poor heat dissipation capacity of switching chips, which affects the working reliability of equipment. Utility Model Content
[0004] The present application provides a single board and a communication device to improve the heat dissipation capability of the single board, thereby improving the reliability of the communication device.
[0005] In the first aspect, the present application provides a single board, which includes a circuit board, a first chip, a first heat sink, and a second heat sink. Among them, the first chip is arranged on one side surface of the circuit board, the first heat sink is arranged on the side of the first chip facing away from the circuit board, and the first heat sink and the first chip are thermally connected so that the heat generated by the first chip when working can be transferred to the first heat sink; the second heat sink is arranged on the side of the circuit board facing away from the first heat sink, that is, the second heat sink and the first heat sink are arranged on both sides of the circuit board, and the second heat sink and the circuit board are spaced apart. In addition, a first boss is arranged on one side of the first heat sink facing the circuit board, and a second boss is arranged on one side of the second heat sink facing the circuit board. The first boss and the second boss are arranged oppositely, and the first boss and the second boss are in thermal contact, so that the heat of the first heat sink can be transferred to the second heat sink through the first boss and the second boss in sequence. In the present application, by arranging the first heat sink and the second heat sink on both sides of the circuit board, after the heat generated by the first chip is transferred to the first heat sink, part of the heat is directly dissipated by the first heat sink, and the other part of the heat can be transferred to the second heat sink through the first boss and the second boss, and dissipated by the second heat sink. That is to say, part of the heat generated by the first chip can be pulled away to the second heat sink on the other side of the circuit board through the first boss and the second boss, thereby compensating for the problem of insufficient heat dissipation area in single-side heat dissipation of the circuit board and effectively improving the heat dissipation capacity of the single board.
[0006] Exemplarily, the first boss and the second boss may be made of a high thermal conductivity material such as copper or aluminum to improve the heat transfer efficiency of the first boss and the second boss.
[0007] In some embodiments, the first boss and the second boss can be connected by a thermal interface material, and the thermal interface material can fill the micro gaps between the first boss and the second boss caused by the surface unevenness, thereby reducing the heat transfer resistance between the first boss and the second boss and improving the heat transfer efficiency between the first boss and the second boss.
[0008] Exemplarily, the thermal interface material includes but is not limited to thermally conductive silicone, thermally conductive silicone grease, and the like.
[0009] In some embodiments, the first boss and the first heat sink may be an integral structure to simplify the assembly process of the single board. Similarly, the second boss and the second heat sink may also be an integral structure.
[0010] In some embodiments, the circuit board is provided with an opening, and the first boss can extend from one side of the circuit board to the other side of the circuit board through the opening, thereby achieving thermal connection with the first heat sink and the second heat sink.
[0011] In some embodiments, the first boss may extend from one side of the circuit board to the other side of the circuit board through the area around the circuit board to facilitate thermal connection with the first heat sink and the second heat sink located on both sides of the circuit board.
[0012] In some embodiments, the single board also includes a fastener, and the first radiator and the second radiator can be fixedly connected by the fastener. In a specific implementation, a first sleeve is provided on a side of the first radiator facing the circuit board, and a through hole is provided at a position of the first radiator corresponding to the first sleeve, and a sleeve is provided on the second radiator facing the first side of the circuit board, and a thread is provided in the second sleeve. The fastener passes through the through hole, the first sleeve, and the second sleeve in sequence, and the fastener and the first sleeve are slidably matched, and the fastener and the second sleeve are threadedly connected. Through this design, the first radiator and the second radiator can be fixed by the threaded connection between the fastener and the second sleeve, and the first sleeve and the second sleeve can also form a protective effect on the fastener, thereby helping to improve the structural reliability of the fastener.
[0013] In some embodiments, the first heat sink may include a first substrate and a plurality of first fins. The side of the first substrate facing away from the first chip includes a first area and a second area, the projection of the first area in the vertical direction at least partially overlaps with the projection of the first boss in the vertical direction, and the projection of the second area in the vertical direction covers the projection of the first chip in the vertical direction; part of the first fins is arranged in the first area, and part of the first fins is arranged in the second area. In one implementation, the material density of the first fins in the first area is less than the material density of the first fins in the second area, which can increase the weight of the part of the first heat sink where the second area is located, thereby shifting the center of gravity of the first heat sink to the part where the second area is located, so that the first heat sink can form a good contact with the first chip under the action of gravity, thereby helping to improve the heat transfer efficiency between the first chip and the first heat sink.
[0014] In another implementation, the distribution density of the first fins in the first area is less than the distribution density of the first fins in the second area. This design can also increase the weight of the part of the first heat sink where the second area is located, thereby shifting the center of gravity of the first heat sink toward the part where the second area is located, so that the first heat sink forms good contact with the first chip.
[0015] In some embodiments, the second heat sink may include a second substrate and a plurality of second fins, wherein the plurality of second fins are disposed on a side of the second substrate facing away from the circuit board, and a material density of the second fins is less than a material density of the first fins in the second region. Thus, after the first heat sink is connected to the second heat sink, the center of gravity of the overall structure formed by the first heat sink and the second heat sink can be close to the top of the first chip, thereby helping to further improve the contact effect between the first chip and the first heat sink.
[0016] In some embodiments, the first substrate may be a temperature homogenizing plate, and the first substrate may utilize the internal cooling medium to circulate heat through phase change between liquid and gas to transfer the heat generated by the first chip to various positions of the first substrate, thereby achieving efficient heat dissipation of the first chip. The second substrate may be a metal plate, so as to utilize the good thermal conductivity of metal to improve the heat dissipation effect of the second heat sink.
[0017] In some embodiments, the single board may further include a protective plate, which is disposed on the side of the second radiator facing away from the circuit board, the protective plate is fixedly connected to the circuit board, a positioning pin is disposed on the side of the protective plate facing the second radiator, the second radiator is provided with a positioning hole, and the positioning pin is slidably disposed in the positioning hole along a vertical direction. In the process of fixedly connecting the first radiator and the second radiator, the positioning pin is used to position the second radiator in the vertical direction, thereby reducing the risk of shaking of the second radiator and improving the assembly reliability of the single board.
[0018] In some embodiments, the single board also includes a second chip and a third heat sink. The second chip is arranged on the other side surface of the circuit board facing away from the first chip, and the third heat sink is arranged on the side of the second chip facing away from the circuit board. The third heat sink is thermally connected to the second chip so that the heat generated by the second chip during operation can be dissipated through the third heat sink.
[0019] In some embodiments, a single board includes multiple optical modules, some of which are arranged on one side surface of the circuit board, and other optical modules are arranged on the other side surface of the circuit board. This can increase the deployment density of the optical modules in the single board, thereby meeting the communication needs of the single board.
[0020] In the second aspect, the present application further provides a single board, which includes a circuit board, a first chip, a first radiator, a second radiator and a heat pipe. The first chip is arranged on a side surface of the circuit board, the first radiator is arranged on the side of the first chip facing away from the circuit board, and the first radiator and the first chip are thermally connected so that the heat generated by the first chip when working can be transferred to the first radiator; the second radiator is arranged on the side of the circuit board facing away from the first radiator, that is, the second radiator and the first radiator are arranged on both sides of the circuit board, and the second radiator and the circuit board are spaced apart. The heat pipe includes an evaporation section, a condensation section and a connection section, the evaporation section and the condensation section are arranged on both sides of the circuit board, the evaporation section is thermally connected to the first radiator, the condensation section is thermally connected to the second radiator, and the connection section is connected between the evaporation section and the condensation section. By using the reciprocating flow of the cooling medium in the heat pipe between the evaporation section and the condensation section, the cooling medium can continuously transfer the heat of the first radiator to the second radiator. Therefore, part of the heat generated by the first chip can be pulled away to the second heat sink on the other side of the circuit board through the heat pipe, thereby compensating for the problem of insufficient heat dissipation area when dissipating heat on one side of the circuit board and effectively improving the heat dissipation capacity of the single board.
[0021] In a third aspect, the present application further provides a communication device, the communication device comprising a housing and a single board in any one of the embodiments of the first and second aspects, the single board being arranged in the housing. The single board in the communication device has good heat dissipation performance, so the reliability of the communication device is also improved.
[0022] In some embodiments, the shell is provided with an insertion frame, and the single board is inserted into the insertion frame. Along the height direction of the insertion frame, there is a gap between the circuit board and the top and bottom of the insertion frame. This single-board center-placed design can provide installation space for the first radiator and the second radiator mentioned above, thereby increasing the feasibility of installing the single board in the communication equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 A schematic diagram of the structure of a communication device provided in an embodiment of the present application;
[0024] Figure 2 for Figure 1 A schematic diagram of a partial planar structure of a single board shown in FIG.
[0025] Figure 3 for Figure 2 A side view of the single board shown in;
[0026] Figure 4 A side view of a single board provided in an embodiment of the present application;
[0027] Figure 5 for Figure 4 A schematic diagram of the partial structure of a single board shown in ;
[0028] Figure 6 A side view of another single board provided in an embodiment of the present application;
[0029] Figure 7 A side view of another single board provided in an embodiment of the present application.
[0030] Reference numerals:
[0031] 1000-communication device; 1001-housing; 1002-communication main body; 10021-insertion frame; 100-single board; 110-circuit board; 111-opening;
[0032] 120 - first chip; 130 - optical module; 140 - connector; 150 - second chip; 160 - protective plate; 161 - support column; 162 - positioning pin;
[0033] 170 - first heat sink; 171 - first substrate; 172 - first fin; 173 - first sleeve; 180 - second heat sink; 181 - second substrate;
[0034] 1811 - positioning hole; 182 - second fin; 183 - second sleeve; 190 - heat-conducting connector; 191 - first boss; 192 - second boss;
[0035] 193 - evaporation section; 194 - condensation section; 195 - connection section; 1100 - fastener; 1110 - third radiator; 200 - back plate. DETAILED DESCRIPTION
[0036] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. However, the example implementation can be implemented in various forms and should not be construed as being limited to the implementations set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.
[0037] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the embodiments of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.
[0038] Figure 1 A schematic diagram of the structure of a communication device 1000 provided in an embodiment of the present application. Figure 1 As shown, in the embodiment of the present application, the communication device 1000 can be a router, a switch, a fiber optic transceiver, a fiber optic network card or a base station, etc., or can also be other fiber optic devices with communication functions, and the present application does not limit this. The communication device 1000 may include a housing 1001 and a communication body 1002 disposed in the housing, and the communication device 1000 can use the communication body 1002 to implement the communication function. In addition, the communication device 1000 may also include a power supply device, which is also disposed in the housing 1001, for example, it can be disposed on the top of the communication body 1002, so as to supply power to the communication body 1002.
[0039] In this embodiment, a plurality of plug-in frames 10021 may be provided in the housing 1001, and the plurality of plug-in frames 10021 may be parallel to each other. Exemplarily, the plurality of plug-in frames 10021 may be arranged in parallel along the height direction of the housing 1001. The communication body 1002 includes a plurality of single boards 100 and a backplane 200, and the plurality of single boards 100 may be plugged into each plug-in frame 10021 in a one-to-one correspondence. Exemplarily, the plurality of single boards 100 may include a business board and a control single board. The plug-in direction of the single board 100 is defined as a first direction, and the backplane 200 may be arranged on one side of each single board 100 along the first direction.
[0040] Figure 2 for Figure 1 The schematic diagram of the partial planar structure of the single board 100 is shown in FIG. Figure 3 for Figure 2 A side view of the single board 100 shown in FIG. Figure 2 and Figure 3 As shown, the single board 100 includes a circuit board 110, a first chip 120 and an optical module 130. The circuit board 110 is arranged horizontally, and the first chip 120 and the optical module 130 are respectively arranged on the surface of the circuit board 110. Among them, the first chip 120 can be a switching chip, the optical module 130 is arranged at one end of the circuit board 110 away from the backplane, and the optical module 130 has an optical interface that can send and receive optical signals. The optical module 130 can be used to receive an electrical signal sent by the first chip 120, and convert the electrical signal into an optical signal and then output it from the optical interface, and the optical module 130 is also used to receive an optical signal input by the optical interface, and convert the optical signal into an electrical signal and then send it to the first chip 120, so that the single board 100 can communicate with an external device through the optical module 130.
[0041] In addition, the single board 100 further includes a connector 140, which can be disposed at one end of the circuit board 110 close to the backplane, that is, the connector 140 and the optical module 130 can be disposed at two ends of the single board 100 along the first direction. Figure 1 As shown, the single board 100 can be electrically connected to the backplane 200 through the connector 140. In a specific implementation, the backplane 200 is provided with a counterpart connector that cooperates with the connector 140. When the single board 100 is inserted into the above-mentioned plug-in frame 10021, the connection between the single board 100 and the backplane 200 can be achieved through the cooperation between the connector 140 and the counterpart connector.
[0042] When the communication device 1000 is working, the single board 100 can receive external optical signals through the optical module 130, and convert the optical signals into electrical signals and send them to the first chip 120 for processing. The first chip 120 transmits the processed signals to the backplane 200 through the connector 140, and then the backplane 200 transmits them to other single boards 100. After being processed by the first chips 120 on other single boards 100, they are converted into optical signals by their optical modules 130 and output to the outside, thereby enabling the communication device 1000 to realize network switching or network processing functions.
[0043] In some embodiments, the single board 100 may further include a plurality of second chips 150, and the plurality of second chips 150 may be disposed on the same side surface of the circuit board 110 as the first chip 120, or may be disposed on a different side surface of the circuit board 110 than the first chip 120. For example, the first chip 120 is disposed on the upper surface of the circuit board 110, and the second chip 150 is disposed on the lower surface of the circuit board 110. Exemplarily, the second chip 150 may be a logic chip, such as including but not limited to a central processing unit (CPU), etc., and the second chip 150 may be used to control the single board 100 to perform service reception and transmission, speed regulation, and emergency handling, etc.
[0044] In some embodiments, the single board 100 further includes a protective plate 160, which is disposed on one side of the circuit board 110, for example, on the side of the circuit board 110 facing away from the first chip 120. The protective plate 160 is fixedly connected to the circuit board 110 to support the circuit board 110. In a specific implementation, there may be a certain interval between the protective plate 160 and the circuit board 110 to facilitate avoiding the device disposed on the side of the circuit board 110 facing away from the first chip 120. Exemplarily, the protective plate 160 and the circuit board 110 may be fixedly connected via a support column 161, which may be, but is not limited to, a stud or other rigid column structure.
[0045] For reference Figures 1 to 3 In the embodiment of the present application, the communication device 1000 may further include a fan (not shown in the figure), which may be used to dissipate heat from the communication body 1002. Inside the communication device 1000, an air duct may be formed between adjacent boards 100, and a fan may be provided at one end of each air duct to send air into the air duct, thereby removing the heat generated by the board 100 when working by air cooling. In one implementation, each air duct may be provided along the second direction, and the second direction is perpendicular to the first direction.
[0046] With the upgrade and evolution of communication networks, the volume and transmission rate of communication data in communication networks have been significantly improved. In order to meet the communication needs of communication devices, in addition to optimizing the performance of the optical module 130, it can also be achieved by increasing the deployment density of the optical module 130 in the single board 100. For example, refer to Figure 3 As shown in , the single board 100 includes a plurality of optical modules 130, some of which are arranged on one side surface of the circuit board 110, and other parts of which are arranged on the other side surface of the circuit board 110, so that the space on both sides of the circuit board 110 can be fully utilized, and it is feasible to arrange more optical modules 130 on the circuit board 110. In addition, this design can achieve good heat dissipation for the optical modules 130 arranged on both sides of the circuit board 110, so it is helpful to improve the working reliability of the optical modules 130.
[0047] It is worth mentioning that the reference Figure 1 and Figure 3 , in Figure 3When the single board 100 shown in the figure is installed in the plug-in frame 10021 of the communication device 1000, along the height direction of the plug-in frame 10021, there is a certain gap between the circuit board 110 and the top of the plug-in frame 10021 and the bottom of the plug-in frame 10021, so as to provide accommodation space for the optical module 130 and other devices on the upper and lower surfaces of the circuit board 110. Exemplarily, the circuit board 110 can be centrally arranged in the plug-in frame 10021, or the circuit board 110 can be located at a position slightly above or slightly below the middle of the plug-in frame 10021, and the single board 100 that adopts this matching mode with the plug-in frame 10021 can be called a centrally arranged single board.
[0048] For the middle-mounted single board 100, since the space on both sides of the circuit board 110 in the plug-in frame 10021 is relatively limited, the electrical components with high power consumption in the single board 100 are prone to insufficient heat dissipation area. Taking the first chip 120 as an example, the first chip 120 is responsible for processing and forwarding data packets in the single board 100. With the rapid development of communication networks, the power consumption of the first chip 120 is also increasing, which means that the first chip 120 will generate more heat during operation. Therefore, how to improve the heat dissipation performance of the first chip 120 in the middle-mounted single board is a technical problem that needs to be solved urgently.
[0049] In view of the above problems, the embodiment of the present application adopts a remote heat dissipation solution, which moves part of the heat generated by the first chip 120 located on one side of the circuit board 110 to the other side of the circuit board 110, thereby making full use of the space on the upper and lower sides of the circuit board 110 for heat dissipation, effectively improving the heat dissipation effect of the first chip 120, and further improving the overall heat dissipation performance of the single board 100. Figures 4 to 6 The heat dissipation solution of the single board is described in detail.
[0050] refer to Figure 4 As shown, Figure 4 A side view of a single board 100 provided in an embodiment of the present application. In the embodiment of the present application, the single board 100 may also include a first heat sink 170, a second heat sink 180 and a heat conductive connector 190. The first heat sink 170 is disposed on the side of the first chip 120 facing away from the circuit board 110, and the first heat sink 170 is heat conductively connected to the first chip 120 so that the heat generated by the first chip 120 during operation can be transferred to the first heat sink 170. The second heat sink 180 is disposed on the side of the circuit board 110 facing away from the first heat sink 170. The heat conductive connector 190 is heat conductively connected to the first heat sink 170 and the second heat sink 180 respectively so as to transfer part of the heat of the first heat sink 170 to the second heat sink 180.
[0051] In this embodiment, the first heat sink 170 and the second heat sink 180 are disposed on both sides of the circuit board 110. After the heat generated by the first chip 120 is transferred to the first heat sink 170, part of the heat is directly dissipated by the first heat sink 170, and the other part of the heat can be transferred to the second heat sink 180 through the heat conductive connector 190 and dissipated by the second heat sink 180. In other words, part of the heat generated by the first chip 120 can be pulled away to the second heat sink 180 on the other side of the circuit board 110 through the heat conductive connector 190 for dissipation, thereby compensating for the problem of insufficient heat dissipation area existing in the heat dissipation on one side of the circuit board 110, and effectively improving the heat dissipation effect of the first chip 120.
[0052] The heat conductive connector 190 may be one or more, and the present application does not limit this. When there are more than one heat conductive connector 190, the heat transfer efficiency between the first heat sink 170 and the second heat sink 180 can be effectively improved by using the multiple heat conductive connectors 190, thereby providing a better heat dissipation effect for the first chip 120.
[0053] In the embodiment of the present application, the first heat sink 170 may include a first substrate 171 and a plurality of first fins 172, the first substrate 171 is in contact with the first chip 120, and the plurality of first fins 172 are arranged on the side of the first substrate 171 facing away from the first chip 120. The plurality of first fins 172 can effectively increase the surface area of the first heat sink 170, thereby improving the heat exchange efficiency between the first heat sink 170 and the air flowing through its surface. Similarly, the second heat sink 180 may include a second substrate 181 and a plurality of second fins 182, the second substrate 181 is connected to the heat conductive connector 190, and the plurality of second fins 182 are arranged on the side of the second substrate 181 facing away from the circuit board 110. The plurality of second fins 182 can effectively increase the surface area of the second heat sink 180, thereby improving the heat exchange efficiency between the second heat sink 180 and the air flowing through its surface.
[0054] Among them, the first substrate 171 can be a vapor chamber (VC) liquid cooling heat sink. The VC liquid cooling heat sink can also be called a planar heat pipe, a temperature equalizing plate, a heat spreader, etc. It can use the internal cooling medium (such as water) to circulate heat between liquid and gas to transfer the heat generated by the first chip 120 to various positions of the first substrate 171, thereby achieving efficient heat dissipation of the first chip 120. The second substrate 181 can be a metal substrate. Exemplarily, the material of the second substrate 181 includes but is not limited to metal materials such as copper and aluminum with good thermal conductivity.
[0055] Of course, in some other embodiments, the first substrate 171 and the second substrate 181 may all be temperature equalizing plates, or the first substrate 171 and the second substrate 181 may all be metal substrates, which are all within the protection scope of the present application.
[0056] In the embodiment of the present application, the side of the first substrate 171 facing away from the circuit board 110 may include a first area A1 and a second area A2, wherein the projection of the first area A1 in the vertical direction at least partially overlaps with the projection of the thermal conductive connector 190 in the vertical direction, and the projection of the second area A2 in the vertical direction covers the projection of the first chip 120 in the vertical direction. Here, the vertical direction can be understood as the thickness direction of the single board 100. Among the multiple first fins 172, some of the first fins 172 are located in the first area A1, and some of the first fins 172 are located in the second area A2.
[0057] In one implementation, the material density of the first fin 172 in the first area A1 is less than the material density of the first fin 172 in the second area A2. For example, the first fin 172 in the first area A1 may be made of aluminum, and the material of the first fin 172 in the second area A2 may be made of copper. Since the projection of the thermally conductive connector 190 in the vertical direction at least partially overlaps with the projection of the first area A1 in the vertical direction, without considering the first fin 172, the weight of the portion of the first heat sink 170 corresponding to the first area A1 will be greater than the weight of the portion corresponding to the second area A2. By setting the first fin 172 in the first area A1 and the first fin 172 in the second area A2 to two different materials, and making the material density of the first fin 172 in the first area A1 greater than the material density of the first fin 172 in the second area A2, the weight of the portion where the second area A2 is located can be increased, thereby shifting the center of gravity of the first heat sink 170 toward the portion where the second area A2 is located.
[0058] Alternatively, in another implementation, the weight of the portion where the second area A2 is located can also be increased by increasing the distribution density of the first fins 172 in the second area A2. Of course, the above two implementations can also be applied to the first heat sink 170, that is, the first fins 172 in the first area A1 are aluminum fins, the first fins 172 in the second area A2 are copper fins, and the distribution density of the first fins in the first area A1 is less than the distribution density of the first fins 172 in the second area A2.
[0059] For the second radiator 180, the multiple second fins 182 of the second radiator 180 can all be made of aluminum, which helps to reduce the overall weight of the second radiator 180. Alternatively, the multiple second fins 182 of the second radiator 180 can also be set with reference to the multiple first fins 172 of the first radiator 170, and the details are not repeated here.
[0060] Based on the above structural description of the first heat sink 170 and the second heat sink 180, by reasonably designing the areas of the first region A1 and the second region A2 on the first substrate 171 and the material or distribution density of the first fins 172 in the two regions, the center of gravity of the overall structure formed by the first heat sink 170, the second heat sink 180 and the thermally conductive connector 190 can be maintained above the first chip 120, so that the first heat sink 170 can form a good contact with the first chip 120 under the action of gravity, thereby helping to improve the heat transfer efficiency between the first chip 120 and the first heat sink 170.
[0061] Figure 5 for Figure 4 The partial structural diagram of the single board 100 is shown in FIG. Figure 4 and Figure 5 As shown, in the embodiment of the present application, the first heat sink 170 and the second heat sink 180 can be relatively fixed by a fastener 1100. Exemplarily, a first sleeve 173 can be provided on one side of the first heat sink 170 facing the circuit board 110 (i.e., the side of the first heat sink 170 facing the second heat sink 180), and a through hole (not shown in the figure) is provided at a position of the first heat sink 170 corresponding to the first sleeve 173; a second sleeve 183 can be provided on one side of the second heat sink 180 facing the circuit board 110 (i.e., the side of the second heat sink 180 facing the first heat sink 170), and a thread is provided in the second sleeve 183. The fastener 1100 is penetrated by a through hole, a first sleeve 173 and a second sleeve 183 in sequence on the side of the first radiator 170 facing away from the second radiator 180. The fastener 1100 and the first sleeve 173 are slidably matched, and the end of the fastener 1100 is tightened in the second sleeve 183. In this way, the first radiator 170 and the second radiator 180 can be fixed by the threaded connection between the fastener 1100 and the second sleeve 183, and the first sleeve 173 and the second sleeve 183 can also form a protective effect on the fastener 1100, thereby helping to improve the structural reliability of the fastener 1100.
[0062] In a specific implementation, the first sleeve 173 may be disposed on a side of the first substrate 171 facing the second heat sink 180. For example, the first sleeve 173 and the first substrate 171 may be an integral structure. Similarly, the second sleeve 183 may be disposed on a side of the second substrate 181 facing the first heat sink 170. For example, the second sleeve 183 and the second substrate 181 may be an integral structure.
[0063] It is worth mentioning that the first sleeve 173 and the second sleeve 183 can be multiple, respectively, and the first heat sink 170 and the second heat sink 180 are fixedly connected by corresponding multiple fasteners 1100 to improve the connection strength between the two. In one implementation, the distribution of the multiple first sleeves 173 on the first substrate 171 can be relatively dispersed, and correspondingly, the distribution of the second sleeve 183 on the second substrate 181 is also relatively dispersed to improve the uniformity of the force on the first heat sink 170 and the second heat sink 180. In addition, the positions of the circuit board 110 corresponding to the first sleeve 173 and the second sleeve 183 can be provided with avoidance holes to prevent interference between the two sleeves and the fasteners 1100 and the circuit board.
[0064] In some other embodiments, the first heat sink 170 and the second heat sink 180 may be respectively provided with through holes, and the fastener 1100 is sequentially provided with two through holes from the side of the first heat sink 170 facing away from the second heat sink 180. A nut matching the fastener 1100 may be fixedly provided on the side of the second substrate 181 facing away from the first heat sink 170, and the end of the fastener 1100 may be locked in the nut. This method can also fix the first heat sink 170 and the second heat sink 180.
[0065] In the embodiment of the present application, in order to increase the heat dissipation area of the second heat sink 180, the second heat sink 180 can be appropriately extended in the horizontal direction. Considering that electrical components will also be arranged on the side surface of the circuit board 110 facing away from the first chip 120, in order not to occupy the area of the side surface of the circuit board 110, the second heat sink 180 and the circuit board 110 can be arranged at a distance, so as to utilize the space between the second heat sink 180 and the circuit board 110 to avoid the relevant electrical components and their heat sinks, which will not affect the installation and heat dissipation of the electrical components on the side surface of the circuit board 110, and also help to achieve a large-area design of the second heat sink 180.
[0066] For example, in the case where the second chip 150 is disposed on the surface of the circuit board 110 facing away from the first chip 120, the single board 100 may further include a third heat sink 1110, which is disposed on the side of the second chip 150 facing away from the circuit board 110, and the third heat sink 1110 is thermally connected to the second chip 150, so that the heat generated by the second chip 150 during operation can be dissipated through the third heat sink 1110. At this time, the distance between the second heat sink 180 and the circuit board 110 may not be less than the sum of the thickness of the second chip 150 and the thickness of the third heat sink 1110.
[0067] Please continue to refer to Figure 4As shown, in the embodiment of the present application, the heat-conducting connector 190 may include a first boss 191 and a second boss 192, the first boss 191 is disposed on the side of the first heat sink 170 facing the circuit board 110, the second boss 192 is disposed on the side of the second heat sink 180 facing the circuit board 110, and the first boss 191 and the second boss 192 are disposed opposite to each other along the thickness direction of the single board 100, and the first boss 191 and the second boss 192 are mutually abutted. In this way, the heat of the first heat sink 170 can be transferred to the second heat sink 180 through the first boss 191 and the second boss 192 in sequence.
[0068] In this embodiment, the circuit board 110 is provided with an opening 111, which is opposite to the first boss 191 and the second boss 192, and the cross-sectional area of the opening 111 is greater than or equal to the cross-sectional area of the first boss 191 and the second boss 192, or it can be understood that the projection of the first boss 191 and the second boss 192 in the thickness direction of the single board 100 is located within the projection of the opening 111 in the thickness direction of the single board 100, so that the first boss 191 and the second boss 192 can be connected through the opening 111. It can also be understood that the thermal conductive connector 190 can extend from one side of the circuit board 110 to the other side of the circuit board 110 through the opening 111, thereby achieving thermal conductive connection with the first heat sink 170 and the second heat sink 180.
[0069] The first boss 191 and the second boss 192 may also be made of a highly thermally conductive material such as copper or aluminum to improve the heat transfer efficiency of the thermally conductive connector 190. In one implementation, the first boss 191 and the first heat sink 170 may be an integral structure to simplify the assembly process of the first heat sink 170. In another implementation, the first boss 191 and the first heat sink 170 may also be fixedly connected by welding or the like. Similarly, the second boss 192 and the second heat sink 180 may be either an integral structure or a split structure fixedly connected by welding or the like.
[0070] In one implementation, a thermal interface material may be provided between the first boss 191 and the second boss 192, and the thermal interface material may fill the micro gap between the first boss 191 and the second boss 192 due to the uneven surface, thereby reducing the heat transfer resistance between the first boss 191 and the second boss 192 and improving the heat transfer efficiency of the thermally conductive connector 190. By way of example, the thermal interface material includes, but is not limited to, thermally conductive silicone, thermally conductive silicone grease, and the like.
[0071] In addition, according to the aforementioned connection method between the first radiator 170 and the second radiator 180, the threaded connection between the fastener 1100 and the second sleeve 183 of the second radiator 180 can be used to make the position of the second radiator 180 in the vertical direction adjustable. In this way, the distance between the first radiator 170 and the second radiator 180 can be shortened by moving the second radiator 180 upward, so that the distance between the first radiator 170 and the second radiator 180 can meet the tight connection requirement of the first boss 191 and the second boss 192, thereby helping to further improve the heat transfer efficiency of the thermal conductive connector 190.
[0072] Exemplarily, the sum of the heights of the first sleeve 173 and the second sleeve 183 can be equal to or slightly less than the sum of the heights of the first boss 191 and the second boss 192, so that when the second heat sink 180 is moved until the first sleeve 173 and the second sleeve 183 contact each other, the first boss 191 and the second boss 192 can be made to abut against each other.
[0073] The fastener 1100 used to fix the first radiator 170 and the second radiator 180 can be a fixed-distance screw. The fixed-distance screw can not only fix the first radiator 170 and the second radiator 180, but also maintain a certain distance between the first radiator 170 and the second radiator 180. By reasonably designing the pitch of the fixed-distance screw, the distance between the first radiator 170 and the second radiator 180 can meet the close fit requirement of the first boss 191 and the second boss 192, thereby helping to further improve the heat transfer efficiency of the thermal conductive connector 190.
[0074] Continue to refer Figure 4 and Figure 5 In this embodiment, a positioning pin 162 may be provided on the side of the protective plate 160 facing the second heat sink 180, and correspondingly, the second heat sink 180 is provided with a positioning hole 1811, and specifically, the positioning hole 1811 may be provided on the second substrate 181. The positioning pin 162 is slidably provided in the positioning hole 1811 in the vertical direction, that is, the second heat sink 180 can slide relative to the protective plate 160 through the cooperation between the positioning pin 162 and the positioning hole 1811, so that in the process of fixing the first heat sink 170 and the second heat sink 180 with the fastener 1100, the positioning pin 162 is used to position the second heat sink 180 in the vertical direction, thereby reducing the risk of shaking of the second heat sink 180 and improving the assembly reliability of the single board 100.
[0075] When assembling the single board 100, first place the second radiator 180 on one side of the protective plate 160 so that the positioning pin 162 of the protective plate 160 is inserted into the positioning hole 1811 of the second radiator 180, and then place the circuit board 110 on the side of the second radiator 180 that is away from the protective plate 160, and fix the circuit board 110 and the protective plate 160 together through the support column 161. Finally, place the first radiator 170 on the side of the circuit board 110 that is away from the second radiator 180, and fix the first radiator 170 and the second radiator 180 together through the fastener 1100, so that the first boss 191 and the second boss 192 are thermally connected through the thermal interface material.
[0076] Figure 6 This is a side view of another single board 100 provided in an embodiment of the present application. Figure 6 As shown, in the embodiment of the present application, the heat-conducting connector 190 can extend from one side of the circuit board 110 to the other side of the circuit board 110 through the peripheral area of the circuit board 110, so as to be heat-conductingly connected to the first heat sink 170 and the second heat sink 180 located on both sides of the circuit board 110. Similarly, taking the heat-conducting connector 190 including the first boss 191 and the second boss 192 abutting against each other as an example, one side edge of the first heat sink 170 is arranged beyond the circuit board 110, and the corresponding side edge of the second heat sink 180 is also arranged beyond the circuit board 110. The first boss 191 is arranged in the area where the first heat sink 170 exceeds the circuit board 110, and the second boss 192 is arranged in the area where the second heat sink 180 exceeds the circuit board 110, so that the first boss 191 and the second boss 192 can be butted against each other without opening a hole.
[0077] In addition, in this embodiment, the first heat sink 170 and the second heat sink 180 can also be relatively fixed by the fastener 1100. The installation method of the fastener can refer to Figure 4 and Figure 5 The example in is used for setting, and no further description is given here.
[0078] Figure 7 This is a side view of another single board 100 provided in an embodiment of the present application. Figure 7As shown, in the embodiment of the present application, the heat-conducting connector 190 may be a heat pipe, and the heat-conducting connector 190 includes an evaporation section 193, a condensation section 194, and a connection section 195, wherein the evaporation section 193 and the condensation section 194 are respectively arranged on both sides of the circuit board 110, the evaporation section 193 contacts the first heat sink 170, the condensation section 194 contacts the second heat sink 180, the connection section 195 extends from one side of the circuit board 110 to the other side of the circuit board 110, and the connection section 195 connects the evaporation section 193 and the condensation section 194. Exemplarily, the evaporation section 193 may contact the side of the first substrate 171 of the first heat sink 170 that is not facing the circuit board 110, the condensation section 194 may contact the side of the second substrate 181 of the second heat sink 180 that is not facing the circuit board 110, and the connection section 195 is respectively connected to the ends of the evaporation section 193 and the condensation section 194, and at this time, the heat-conducting connector 190 may be substantially a "C"-shaped structure.
[0079] When the heat-conducting connector 190 is working, the cooling medium in the evaporation section 193 becomes gaseous through evaporation and heat exchange with the first radiator 170, and the gaseous cooling medium flows to the condensation section 194 through the connecting section 195, and condenses into liquid through condensation and heat exchange with the second radiator 180 in the condensation section 194, and the liquid cooling medium returns to the evaporation section 193 through the connecting section 195 again. In this process, the first radiator 170 achieves heat dissipation and cooling by heat exchange with the cooling medium in the evaporation section 193, and the second radiator 180 increases its temperature by heat exchange with the cooling medium in the condensation section 194. In this reciprocating cycle, the heat-conducting connector 190 can continuously transfer the heat of the first radiator 170 to the second radiator 180.
[0080] In this embodiment, the end of the evaporation section 193 and the end of the condensation section 194 can be respectively arranged beyond the edge of the circuit board 110, so that the connection section 195 can extend from one side of the circuit board 110 to the other side of the circuit board 110 through the peripheral area of the circuit board 110. Of course, in some other embodiments, the circuit board 110 can also be provided with an opening so that the connection section 195 extends from one side of the circuit board 110 to the other side of the circuit board 110 through the opening.
[0081] Similarly, in this embodiment, the first heat sink 170 and the second heat sink 180 can also be relatively fixed by fasteners. The installation method of the fasteners can refer to Figure 4 and Figure 5 The example in is used for setting, and no further description is given here.
[0082] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A single board, characterized in that: It includes a circuit board, a first chip, a first heat sink, and a second heat sink, wherein: The first chip is disposed on a side surface of the circuit board; The first heat sink is arranged on a side of the first chip facing away from the circuit board, and the first heat sink is thermally connected to the first chip, and a first boss is arranged on a side of the first heat sink facing the circuit board; The second heat sink is arranged on a side of the circuit board facing away from the first heat sink, the second heat sink is spaced from the circuit board, a second boss is arranged on a side of the second heat sink facing the circuit board, the second boss is arranged opposite to the first boss, and the second boss is in thermal contact with the first boss.
2. The single board according to claim 1, characterized in that The first boss and the second boss are thermally connected via a thermal interface material.
3. The single board according to claim 1 or 2, characterized in that: The first boss and the first heat sink are an integral structure, and the second boss and the second heat sink are an integral structure.
4. The single board according to any one of claims 1 to 3, characterized in that: The circuit board is provided with an opening, and the first boss extends from one side of the circuit board to the other side of the circuit board through the opening.
5. The single board according to any one of claims 1 to 3, characterized in that: The first boss extends from one side of the circuit board to the other side of the circuit board through an area around the circuit board.
6. The single board according to any one of claims 1 to 5, characterized in that: The single board also includes a fastener; A first sleeve is disposed on a side of the first heat sink facing the circuit board, and a through hole is disposed on the first heat sink at a position corresponding to the first sleeve; a second sleeve is disposed on a side of the second heat sink facing the circuit board, and a thread is disposed inside the second sleeve; The fastener is sequentially inserted into the through hole, the first sleeve and the second sleeve, and the fastener is threadedly connected to the second sleeve.
7. The single board according to any one of claims 1 to 6, characterized in that: The first heat sink includes a first substrate and a plurality of first fins; A side of the first substrate facing away from the first chip includes a first area and a second area, a projection of the first area in a vertical direction at least partially overlaps with a projection of the first boss in the vertical direction, and a projection of the second area in the vertical direction covers a projection of the first chip in the vertical direction; Part of the first fins is arranged in the first area, and another part of the first fins is arranged in the second area, and the material density of the first fins in the first area is less than the material density of the first fins in the second area; or, the distribution density of the first fins in the first area is less than the distribution density of the first fins in the second area.
8. The single board according to claim 7, characterized in that The second heat sink includes a second substrate and a plurality of second fins. The plurality of second fins are arranged on a side of the second substrate facing away from the circuit board, and a material density of the second fins is smaller than a material density of the first fins in the second area.
9. The single board according to claim 8, characterized in that The first substrate is a temperature equalizing plate, and the second substrate is a metal plate.
10. The single board according to any one of claims 1 to 9, characterized in that: The single board includes a protective plate, which is arranged on a side of the second radiator facing away from the circuit board, the protective plate is fixedly connected to the circuit board, and a positioning pin is arranged on a side of the protective plate facing the second radiator; The second heat sink is provided with a positioning hole, and the positioning pin is slidably arranged in the positioning hole along a vertical direction.
11. The single board according to any one of claims 1 to 10, characterized in that: The single board includes a second chip and a third heat sink. The second chip is arranged on the other side surface of the circuit board facing away from the first chip. The third heat sink is arranged on the side of the second chip facing away from the circuit board, and the third heat sink is thermally connected to the second chip.
12. A communication device, characterized in that: It comprises a shell and a single board as described in any one of claims 1 to 11, wherein the single board is arranged in the shell.
13. The communication device according to claim 12, characterized in that An inserting frame is arranged in the shell, and the single board is inserted in the inserting frame. Along the height direction of the inserting frame, there is a gap between the circuit board and the top and bottom of the inserting frame.