Display module and display device

Abstract

The embodiment of the utility model relates to a display module and a display device. The display module comprises: a display panel; the flexible circuit board is connected with the display panel in a binding manner; the back plate and the display panel are oppositely arranged in the thickness direction; the radiating fin is adhered to the back plate; wherein the flexible circuit board comprises a first bonding area and a second bonding area, and the orthographic projection of the first bonding area on the back plate and / or the orthographic projection of the second bonding area on the back plate fall into the orthographic projection of the cooling fin on the back plate; the flexible circuit board comprises a grounding area, under the condition that the flexible circuit board is bonded to the cooling fin, the grounding area is located in the second bonding area, and the conductive structure of the grounding area is electrically connected with the back plate through the cooling fin. Compared with an existing cooling fin, the hollow-out area of the cooling fin is reduced, a heat transmission channel of the cooling fin is widened, the overall cooling efficiency is improved, it is guaranteed that the temperature of the display panel corresponding to the LED backlight source and the IC chip is lowered, the hand scalding feeling of a user during touch control is avoided, and the user experience is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of cleaning devices, and in particular, to a display module and a display device. Background Art

[0002] In current technology, display modules are usually equipped with LED light strips and IC chips. The LED light strips and IC chips will generate a lot of heat when working, but the heat dissipation effect of existing display modules is poor. The concentrated heat can easily cause thermal damage to electronic devices, affecting reliability and service life, and easily cause users to feel hot when touching, resulting in a poor user experience. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art or related technology.

[0004] To this end, a first aspect of the present invention provides a display module.

[0005] A second aspect of the utility model provides a display device.

[0006] In view of this, according to a first aspect of an embodiment of the present application, a display module is proposed, comprising:

[0007] Display panel;

[0008] A flexible circuit board, bound and connected to the display panel;

[0009] A back plate, the back plate and the display panel are arranged opposite to each other in a thickness direction;

[0010] A heat sink bonded to the back plate;

[0011] The flexible circuit board comprises a first bonding area and a second bonding area, and the orthographic projection of the first bonding area on the back plate and / or the orthographic projection of the second bonding area on the back plate falls within the orthographic projection of the heat sink on the back plate;

[0012] The second bonding area includes a grounding area. When the flexible circuit board is bonded to the heat sink, the conductive structure of the grounding area is electrically connected to the back plate through the heat sink.

[0013] In a feasible implementation manner, the heat sink comprises:

[0014] Heat dissipation layer;

[0015] A first double-sided conductive adhesive layer, disposed on a side of the heat dissipation layer facing the back plate;

[0016] The insulating layer is arranged on a side of the heat dissipation layer away from the back plate.

[0017] In a feasible implementation manner, a hollow area is provided on the insulating layer corresponding to the second bonding area, and the heat dissipation layer is used to be electrically connected to the conductive structure through the hollow area.

[0018] In a feasible implementation manner, the heat dissipation layer includes a graphene film layer.

[0019] In a feasible implementation manner, a second double-sided conductive adhesive layer is provided at the heat sink corresponding to the second bonding area;

[0020] The second double-sided conductive adhesive layer passes through the hollow area and is bonded to the graphene film layer.

[0021] In a feasible implementation manner, the second double-sided conductive adhesive layer includes a first structure portion and a second structure portion, the first structure portion is connected to the graphene film layer, and the second structure portion is connected to the conductive structure;

[0022] An orthographic projection of the first structure portion on the heat dissipation layer falls within an orthographic projection of the second structure portion on the heat dissipation layer.

[0023] In a feasible implementation manner, the thickness of the second double-sided conductive adhesive layer is 0.025±0.002 mm.

[0024] In a feasible implementation manner, a double-sided adhesive layer is provided at the heat sink corresponding to the first bonding area, and the double-sided adhesive layer is bonded to the insulating layer.

[0025] In a feasible implementation manner, the thickness of the double-sided adhesive layer is 0.015±0.001 mm.

[0026] According to a second aspect of an embodiment of the present application, a display device is provided, comprising:

[0027] A display module as described in any of the above technical solutions.

[0028] Compared with the prior art, the utility model at least includes the following beneficial effects: the display module provided in the embodiment of the present application is provided with a display panel, a flexible circuit board, a back plate and a heat sink. Among them, the flexible circuit board and the display panel are bound and connected for signal transmission of the display panel. The back plate and the display panel are arranged relative to each other in the thickness direction, and the heat sink is bonded to the back plate. The back plate is provided with an LED backlight source and an IC chip for controlling the transmission of photoelectric signals, and the display brightness of the display panel can be improved by the backlight source. The heat sink can dissipate heat for the LED backlight source and the IC chip. The existing heat sink needs to be provided with a larger hollow area for the flexible circuit board to be attached and fixed to the back plate after being folded back. In the present application, the first bonding area and the second bonding area are provided on the flexible circuit board, and the orthographic projection of the first bonding area on the back plate and / or the orthographic projection of the second bonding area on the back plate fall within the orthographic projection of the heat sink on the back plate. And the second bonding area includes a grounding area, and when the flexible circuit board is folded back and bonded to the heat sink, the conductive structure of the grounding area is electrically connected to the back plate through the heat sink. With such a configuration, after the flexible circuit board is folded back, it can be bonded to the heat sink through at least one bonding area while ensuring that the conductive structure of the grounding area can be electrically connected to the back plate. Compared with the existing heat sink, the hollow area of ​​the heat sink is reduced, thereby widening the heat transfer channel of the heat sink, improving the overall heat dissipation efficiency, ensuring that the temperature of the display panel surface area corresponding to the LED backlight source and the IC chip is reduced, avoiding heat concentration and thermal damage to electronic devices, improving reliability and service life, and avoiding users from feeling hot when touching, thereby improving user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not considered to be limitations of the present application. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings.

[0030] In the attached picture:

[0031] Figure 1 A partial schematic structural diagram of a display module at one angle according to an embodiment of the present application;

[0032] Figure 2 A partial schematic structural diagram of a display module according to an embodiment of the present application from another angle;

[0033] Figure 3 A laminated structure of an insulating layer, a heat dissipation layer, and a first double-sided conductive adhesive layer in an embodiment provided in the present application;

[0034] Figure 4A schematic diagram of a stacked structure of a heat sink corresponding to a first bonding area of ​​a flexible circuit board according to an embodiment of the present application;

[0035] Figure 5 A schematic diagram of a stacked structure of a heat sink corresponding to a second bonding area of ​​a flexible circuit board according to an embodiment of the present application.

[0036] in, Figures 1 to 5 The corresponding relationship between the reference numerals and the component names is as follows:

[0037] 100 display modules;

[0038] 110 display panel, 120 flexible circuit board, 130 backplane, 140 heat sink, 150 LED backlight source, 160 IC chip;

[0039] 121 first bonding area, 122 second bonding area, 123 conductive structure, 141 heat dissipation layer, 142 first double-sided conductive adhesive layer, 143 insulating layer, 144 second double-sided conductive adhesive layer, 145 double-sided adhesive layer;

[0040] 1441 first structural part, 1442 second structural part;

[0041] a The orthographic projection of the first bonding area on the heat sink, b The orthographic projection of the second bonding area on the heat sink. DETAILED DESCRIPTION

[0042] In order to better understand the above-mentioned technical scheme, the technical scheme of the embodiments of the present application is described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present application and the specific features in the embodiments are detailed descriptions of the technical scheme of the embodiments of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present application and the technical features in the embodiments may be combined with each other.

[0043] like Figure 1 and Figure 2As shown, according to the first aspect of the embodiment of the present application, a display module 100 is proposed, including: a display panel 110; a flexible circuit board 120, which is bound and connected to the above-mentioned display panel 110; a back plate 130, and the above-mentioned back plate 130 is arranged opposite to the above-mentioned display panel 110 in the thickness direction; a heat sink 140, which is bonded to the above-mentioned back plate 130; wherein the above-mentioned flexible circuit board 120 includes a first bonding area 121 and a second bonding area 122, and the orthographic projection of the above-mentioned first bonding area 121 on the above-mentioned back plate 130 and / or the orthographic projection of the above-mentioned second bonding area 122 on the above-mentioned back plate 130 falls within the orthographic projection of the above-mentioned heat sink 140 on the above-mentioned back plate 130; the above-mentioned second bonding area 122 includes a grounding area, and when the above-mentioned flexible circuit board 120 is bonded to the above-mentioned heat sink 140, the conductive structure 123 of the above-mentioned grounding area is electrically connected to the above-mentioned back plate 130 through the above-mentioned heat sink 140.

[0044] It is understandable that if Figure 2As shown, the back plate 130 of the display module 100 may be provided with an LED (Light-Emitting Diode Ligh) backlight source and an IC (integrated circuit) chip for controlling the transmission of photoelectric signals. The current of the LED backlight source 150 is controlled by the IC chip 160 to increase the brightness of the LED backlight source 150 and the display brightness of the display panel 110. Since about 40% of the energy of the LED backlight source 150 is converted into heat energy during the lighting process, resulting in an increase in the temperature of the display side of the display panel 110, a heat sink 140 is required to dissipate heat to reduce the temperature of the display area of ​​the display panel 110 corresponding to the LED backlight source 150 and the IC chip 160. The existing heat sink 140 needs to be provided with at least two hollows, so that after the flexible circuit board 120 is folded back, the double-sided adhesive on the flexible circuit board 120 is adhered to the back plate 130 through one of the hollows, and the conductive structure 123 of the grounding area of ​​the flexible circuit board 120 is adhered to the back plate 130 through the other hollow. Since there are many hollows in the heat sink 140, the heat transfer channel is narrowed, and the overall heat dissipation efficiency of the heat sink 140 is greatly reduced. After heat dissipation, the temperature of the display area of ​​the display panel 110 corresponding to the LED backlight source 150 and the IC chip 160 can still reach more than 50 degrees Celsius, which causes the user to feel hot when touching the display panel 110, reducing the user experience. At the same time, according to the liquid crystal characteristic table, the higher the temperature, the lower the liquid crystal transmittance, resulting in a decrease in the brightness and chromaticity of the liquid crystal display of the display panel 110, causing the user to visually see the display area of ​​the display panel 110 corresponding to the LED backlight source 150 and the IC chip 160. The subjective effect is dark and blue relative to other display areas of the display panel 110, causing uneven display, giving the user a poor visual experience. In addition, the temperature rise is too large, resulting in the reliability of the display module 100 working at high temperature, which will cause the high temperature of the LED light bar to be transmitted to the light guide plate, the light guide plate will be warped by heat, and the extruded film material will produce inverted eight wrinkles, resulting in uneven display. The display module 100 proposed by the embodiment of the present application can solve the above problems.

[0045] It can be understood that the display module 100 provided in the embodiment of the present application is provided with a display panel 110, a flexible circuit board 120, a back plate 130 and a heat sink 140. Among them, the flexible circuit board 120 and the display panel 110 are bound and connected for signal transmission of the display panel 110. The back plate 130 and the display panel 110 are arranged opposite to each other in the thickness direction, and the heat sink 140 is bonded to the back plate 130. The flexible circuit board 120 is provided with a first bonding area 121 and a second bonding area 122, and the orthographic projection of the first bonding area 121 on the back plate 130 and / or the orthographic projection of the second bonding area 122 on the back plate 130 falls within the orthographic projection of the heat sink 140 on the back plate 130. And a grounding area may be provided in the second bonding area 122, and when the flexible circuit board 120 is folded back and bonded to the heat sink 140, the conductive structure 123 of the grounding area is electrically connected to the back plate 130 through the heat sink 140. With such a configuration, after the flexible circuit board 120 is folded back, the conductive structure 123 in the grounding area can be electrically connected to the back plate 130, and can be bonded to the heat sink 140 through at least one bonding area. Compared with the existing heat sink 140, the hollow area of ​​the heat sink 140 is reduced, thereby widening the heat transfer channel of the heat sink 140, improving the overall heat dissipation efficiency, ensuring that the temperature of the surface area of ​​the display panel 110 corresponding to the LED backlight source 150 and the IC chip 160 is reduced, avoiding the user from feeling hot when touching, ensuring that the display panel 110 displays uniformly, avoiding the display module 100 from being deformed by heat, improving the reliability of the display module 100, extending the service life, and improving the user experience.

[0046] Exemplarily, the heat sink 140 may be hollowed out at the first bonding area 121 corresponding to the flexible circuit board 120, and the heat sink 140 may be fully covered at the second bonding area 122 corresponding to the flexible circuit board 120, so that the orthographic projection of the second bonding area 122 of the flexible circuit board 120 on the back plate 130 falls within the orthographic projection of the heat sink 140 on the back plate 130. In this way, a double-sided adhesive may be provided at the first bonding area 121 of the flexible circuit board 120, and bonded to the back plate 130 through the hollowing. The conductive structure 123 of the grounding area of ​​the second bonding area 122 of the flexible circuit board 120 may be directly bonded to the heat sink 140 and electrically connected to the back plate 130, thereby reducing the hollowing area compared to the existing heat sink 140, thereby widening the heat transfer channel of the heat sink 140 and improving the overall heat dissipation efficiency.

[0047] Exemplarily, the heat sink 140 may be fully arranged at the first bonding area 121 of the flexible circuit board 120, so that the orthographic projection of the first bonding area 121 of the flexible circuit board 120 on the back plate 130 falls within the orthographic projection of the heat sink 140 on the back plate 130. The heat sink 140 may be hollowed out at the second bonding area 122 of the flexible circuit board 120. In this way, the first bonding area 121 of the flexible circuit board 120 may be directly bonded to the heat sink 140, and the conductive structure 123 of the grounding area in the second bonding area 122 of the flexible circuit board 120 may be provided with double-sided conductive adhesive so as to be bonded to the back plate 130 through the hollowing and electrically connected to the back plate 130, thereby reducing the hollowing area compared to the existing heat sink 140, thereby widening the heat transfer channel of the heat sink 140 and improving the overall heat dissipation efficiency.

[0048] Exemplarily, the heat sink 140 can be fully arranged at the first bonding area 121 of the flexible circuit board 120 and the second bonding area 122 of the flexible circuit board 120, so that the first bonding area 121 and the second bonding area 122 of the flexible circuit board 120 can be directly bonded to the heat sink 140, and the conductive structure 123 of the grounding area of ​​the second bonding area 122 of the flexible circuit board 120 can be electrically connected to the back plate 130, so as to maximize the heat transfer channel of the heat sink 140, and enable the temperature of the display area of ​​the display panel 110 corresponding to the LED backlight source 150 and the IC chip 160 to reach below 47 degrees Celsius, thereby avoiding the user from feeling hot when touching, ensuring that the display panel 110 displays uniformly, avoiding heat deformation of the display module 100, improving the reliability of the display module 100, extending the service life, and improving the user experience.

[0049] Exemplarily, the conductive structure 123 may be copper foil.

[0050] In some examples, such as Figure 3 and Figure 5 As shown, the heat sink 140 includes: a heat dissipation layer 141; a first double-sided conductive adhesive layer 142, which is arranged on the side of the heat dissipation layer 141 facing the back plate 130; an insulating layer 143, which is arranged on the side of the heat dissipation layer 141 away from the back plate 130, and the insulating layer 143 is provided with a hollow area corresponding to the second bonding area 122, and the heat dissipation layer 141 is used to be electrically connected to the conductive structure 123 through the hollow area.

[0051] It is understood that the heat sink 140 may be provided with a heat dissipation layer 141, a first double-sided conductive adhesive layer 142 and an insulating layer 143. The heat generated by the LED backlight source 150 and the IC chip 160 may be dissipated through the heat sink 140 to reduce the temperature of the display area of ​​the display panel 110 corresponding to the LED backlight source 150 and the IC chip 160. The heat dissipation layer 141 may be bonded to the back plate 130 through the first double-sided conductive adhesive layer 142, and the heat dissipation layer 141 and the back plate 130 may be electrically connected. The insulating layer 143 can be arranged on the side of the heat dissipation layer 141 away from the back plate 130, and a hollow area can be provided on the insulating layer 143 corresponding to the second bonding area 122 of the flexible circuit board 120, so that when the flexible circuit board 120 is folded back and bonded to the heat sink 140, the conductive structure 123 of the grounding area of ​​the flexible circuit board 120 can be electrically connected to the back plate 130 through the hollow structure, and the remaining part of the flexible circuit board 120 is only bonded to the insulating layer 143, so as to ensure that the display module 100 can display normally.

[0052] In some examples, the heat dissipation layer 141 includes a graphene film layer.

[0053] It is understandable that the heat dissipation layer 141 may be a graphene film layer, which has good thermal conductivity and a thermal radiation coefficient exceeding 0.95, and thus has good heat dissipation performance. It is also easy to process to meet the design shape of the heat sink 140. The graphene film layer has electrical conductivity, so that the conductive structure 123 of the grounding area of ​​the flexible circuit board 120 can be electrically connected to the back plate 130 through the graphene film layer, ensuring that the display module 100 can work normally and stably, and improving reliability.

[0054] In some examples, the thickness of the first double-sided conductive adhesive layer 142 is 0.01±0.001 mm; the thickness of the graphene film layer is 0.017±0.002 mm; and the thickness of the insulating layer 143 is 0.01±0.001 mm.

[0055] It is understandable that the thickness of the first double-sided conductive adhesive layer 142 can be set to 0.01±0.001 mm, which ensures that the first double-sided conductive adhesive layer 142 has sufficient conductivity and viscosity to ensure the electrical connectivity between the graphene film layer and the back plate 130, while allowing the graphene film layer to be stably and firmly bonded to the back plate 130. In addition, it is prevented that the thickness of the first double-sided conductive adhesive layer 142 is too thick, which affects the overall thickness of the heat sink 140, thereby affecting the overall spatial layout of the display module 100.

[0056] It is understandable that according to the existing process and the properties of graphene materials, the thickness of the graphene film layer can be reduced from the existing 0.025mm to 0.17mm. On the one hand, the flexible circuit board 120 can be bonded to the surface of the graphene film layer without increasing the overall thickness of the heat sink 140, which is convenient for the spatial layout of the display module 100; on the other hand, reducing the thickness of the graphene film layer according to the above size has little effect on the heat dissipation performance, which can meet the customer's requirements for the thermal conductivity of graphite, which can be greater than or equal to 1500W / (mk), where W is in watts, m is in meters, and k is in °C.

[0057] It is understandable that the thickness of the insulating layer 143 is set to 0.01±0.001 mm, which ensures the insulating performance of the insulating layer 143 while preventing the insulating layer 143 from being too thick, affecting the overall thickness of the heat sink 140 and thus affecting the overall spatial layout of the display module 100 .

[0058] It is understandable that by setting the thickness of the first double-sided conductive adhesive layer 142 to 0.01±0.001 mm, the thickness of the graphene film layer to 0.017±0.002 mm, and the thickness of the insulating layer 143 to 0.01±0.001 mm, the overall thickness of the heat sink 140 can be controlled to 0.05±0.01 mm, so as to ensure the design size and spatial layout of each part of the display module 100.

[0059] In some examples, such as Figure 5 As shown, the heat sink 140 is provided with a second double-sided conductive adhesive layer 144 corresponding to the second bonding area 122; the second double-sided conductive adhesive layer 144 passes through the hollow area and is bonded to the graphene film layer.

[0060] It is understandable that a second double-sided conductive adhesive layer 144 may be provided at the heat sink 140 corresponding to the second bonding area 122. Specifically, one side of the second double-sided conductive adhesive layer 144 may pass through the hollow area provided at the second bonding area 122 of the insulating layer 143 and be bonded to the graphene film layer, and the other side of the second double-sided conductive adhesive layer 144 may be bonded to the conductive structure 123 of the grounding area of ​​the flexible circuit board 120. This allows the conductive structure 123 to be electrically connected to the heat dissipation layer 141 and the back plate 130 to ensure that the display module 100 can display normally. Compared with the heat sink 140 in the prior art, the heat sink 140 corresponding to the second bonding area 122 can be covered with a graphene film layer without hollowing, thereby widening the heat transfer channel of the heat sink 140 and improving the overall heat dissipation efficiency.

[0061] Exemplarily, a hollow may be provided at the heat sink 140 corresponding to the first bonding area 121, and a double-sided adhesive may be provided at the first bonding area 121 of the flexible circuit board 120, and the double-sided adhesive may pass through the hollow and be bonded to the graphene film layer, so that the flexible circuit board 120 is bonded to the heat sink 140 as a whole. Alternatively, the graphene film layer and the insulating layer 143 may be fully covered at the heat sink 140 corresponding to the first bonding area 121, and the double-sided adhesive may be applied on the insulating layer 143, so that the flexible circuit board 120 is bonded to the heat sink 140.

[0062] In some examples, such as Figure 5 As shown, the second double-sided conductive adhesive layer 144 includes a first structure portion 1441 and a second structure portion 1442, the first structure portion 1441 is connected to the graphene film layer, and the second structure portion 1442 is connected to the conductive structure 123; the orthographic projection of the first structure portion 1441 on the heat dissipation layer 141 falls within the orthographic projection of the second structure portion 1442 on the heat dissipation layer 141, and the distance between the edge of the orthographic projection of the first structure portion 1441 on the heat dissipation layer 141 and the edge of the orthographic projection of the second structure portion 1442 on the heat dissipation layer 141 is 0.5±0.1mm.

[0063] It can be understood that the second double-sided conductive adhesive layer 144 can be provided with a first structure part 1441 and a second structure part 1442. Among them, the first structure part 1441 can pass through the hollow structure and be connected to the graphene film layer, one end of the second structure part 1442 is connected to the first structure part 1441, and the other end of the second structure part 1442 is connected to the conductive structure 123, so that the conductive structure 123 is electrically connected to the graphene film layer. And the size of the second structure part 1442 is larger than the size of the first structure part 1441, so that the orthographic projection of the first structure part 1441 on the heat dissipation layer 141 falls into the orthographic projection of the second structure part 1442 on the heat dissipation layer 141. So that the second double-sided conductive adhesive layer 144 is integrally covered in the hollow area of ​​the insulating layer 143. Specifically, the distance between the orthographic projection edge of the first structure part 1441 on the heat dissipation layer 141 and the orthographic projection edge of the second structure part 1442 on the heat dissipation layer 141 is 0.5±0.1mm. This is to prevent the graphene material of the graphene film layer from leaking out from the hollow area and to improve reliability.

[0064] In some examples, the thickness of the second double-sided conductive adhesive layer 144 is 0.025±0.002 mm.

[0065] It is understandable that the thickness of the second double-sided conductive adhesive layer 144 can be set to 0.025±0.002 mm, which ensures that the second double-sided conductive adhesive layer 144 has sufficient conductivity and viscosity to ensure the electrical connectivity between the conductive structure 123 and the graphene film layer, while allowing the conductive structure 123 to be stably and firmly bonded to the graphene film layer. It also avoids the first double-sided conductive adhesive layer 142 being too thick, which affects the overall thickness of the heat sink 140, thereby affecting the overall spatial layout of the display module 100.

[0066] In some examples, such as Figure 4 As shown, a double-sided adhesive layer 145 is disposed at the heat sink 140 corresponding to the first adhesive region 121 , and the double-sided adhesive layer 145 is bonded to the insulating layer 143 .

[0067] It is understandable that a double-sided adhesive layer 145 may be provided at the heat sink 140 corresponding to the first bonding area 121, and the double-sided adhesive layer 145 may be bonded to the insulating layer 143. In this way, after the flexible circuit board 120 is folded back, the first bonding area 121 is bonded to the heat sink 140 through the double-sided adhesive layer 145. Compared with the heat sink 140 of the prior art, the heat sink 140 corresponding to the first bonding area 121 may be covered with a graphene film layer without hollowing out, thereby widening the heat transfer channel of the heat sink 140 and improving the overall heat dissipation efficiency.

[0068] Exemplarily, a hollow may be provided at the heat sink 140 corresponding to the second bonding area 122, and a double-sided conductive adhesive may be provided on the peripheral side of the conductive structure 123 of the grounding area in the second bonding area 122 of the flexible circuit board 120, so that the conductive structure 123 can pass through the hollow and be bonded to the back plate 130 through the double-sided conductive adhesive. Alternatively, the heat sink 140 corresponding to the second bonding area 122 may be covered with a graphene film layer, and the insulating layer 143 at the heat sink 140 corresponding to the second bonding area 122 may be provided with a hollow area, one end of the second double-sided conductive adhesive layer 144 is bonded to the conductive structure 123, and the other end passes through the hollow area and is bonded to the graphene layer.

[0069] In some examples, the thickness of the double-sided adhesive layer 145 is 0.015±0.001 mm.

[0070] It is understandable that the thickness of the double-sided adhesive layer 145 can be set to 0.015±0.001 mm. This ensures that the double-sided adhesive layer 145 has sufficient viscosity to ensure that the flexible circuit board 120 can be stably and firmly bonded to the heat sink 140. It also avoids the thickness of the double-sided adhesive layer 145 being too thick, which affects the overall thickness of the heat sink 140, thereby affecting the overall spatial layout of the display module 100.

[0071] In some examples, the viscosity of at least one of the first double-sided conductive adhesive layer 142 , the second double-sided conductive adhesive layer 144 , and the double-sided adhesive layer 145 is greater than or equal to 1200 gf.

[0072] It is understood that the viscosity of at least one of the first double-sided conductive adhesive layer 142, the second double-sided conductive adhesive layer 144 and the double-sided adhesive layer 145 needs to be greater than or equal to 1200gf. Gf is the abbreviation of gram-force, where 1gf is the gravity force exerted on an object with a mass of 1 gram in a standard gravity field. This ensures that the first double-sided conductive adhesive layer 142 has sufficient adhesion to bond the graphene film layer and the back plate 130; ensures that the second double-sided conductive adhesive layer 144 has sufficient adhesion to bond the conductive structure 123 of the grounding area in the second bonding area 122 of the flexible circuit board 120 and the heat sink 140; and ensures that the double-sided adhesive layer 145 has sufficient adhesion to bond the first bonding area 121 of the flexible circuit board 120 and the heat sink 140.

[0073] According to a second aspect of an embodiment of the present application, a display device is proposed, comprising: a display module 100 as described in any one of the above technical solutions.

[0074] It can be understood that, since the display device is provided with the display module 100 described in any one of the above technical solutions, it has all the beneficial effects of the above display module 100, which will not be described in detail here.

[0075] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0076] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0077] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0078] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A display module, characterized in that: include: Display panel; A flexible circuit board, bound and connected to the display panel; a back plate, the back plate being arranged opposite to the display panel in a thickness direction; A heat sink bonded to the back plate; Wherein, the flexible circuit board comprises a first bonding area and a second bonding area, and the orthographic projection of the first bonding area on the back plate and / or the orthographic projection of the second bonding area on the back plate falls within the orthographic projection of the heat sink on the back plate; The second bonding area includes a grounding area. When the flexible circuit board is bonded to the heat sink, the conductive structure of the grounding area is electrically connected to the back plate through the heat sink.

2. The display module according to claim 1, characterized in that: The heat sink comprises: Heat dissipation layer; A first double-sided conductive adhesive layer, disposed on a side of the heat dissipation layer facing the back plate; The insulating layer is arranged on a side of the heat dissipation layer away from the back plate.

3. The display module according to claim 2, characterized in that: The insulating layer is provided with a hollow area corresponding to the second bonding area, and the heat dissipation layer is used to be electrically connected to the conductive structure through the hollow area.

4. The display module according to claim 3, characterized in that: The heat dissipation layer includes a graphene film layer.

5. The display module according to claim 4, characterized in that: A second double-sided conductive adhesive layer is provided at the heat sink corresponding to the second bonding area; The second double-sided conductive adhesive layer passes through the hollow area and is bonded to the graphene film layer.

6. The display module according to claim 5, characterized in that: The second double-sided conductive adhesive layer includes a first structure portion and a second structure portion, the first structure portion is connected to the graphene film layer, and the second structure portion is connected to the conductive structure; The orthographic projection of the first structure portion on the heat dissipation layer falls within the orthographic projection of the second structure portion on the heat dissipation layer.

7. The display module according to claim 5, characterized in that: The thickness of the second double-sided conductive adhesive layer is 0.025±0.002 mm.

8. The display module according to claim 2, characterized in that: A double-sided adhesive layer is provided at the heat sink corresponding to the first bonding area, and the double-sided adhesive layer is bonded to the insulating layer.

9. The display module according to claim 8, characterized in that: The thickness of the double-sided adhesive layer is 0.015±0.001 mm.

10. A display device, characterized in that: include: The display module according to any one of claims 1 to 9.

Images