Wafer cleaning machine capable of improving drainage problem

Abstract

The utility model relates to the technical field of cleaning machine tables, and discloses a wafer cleaning machine table capable of improving the drainage problem, which comprises an acid tank and a water tank, a first liquid collecting tank is arranged in the acid tank, a first cleaning tank and a first liquid level meter are arranged in the first liquid collecting tank, and acid liquid in the first cleaning tank can overflow into the first liquid collecting tank; the first liquid level meter measures the liquid level height of the acid liquid in the first liquid collecting tank; a second liquid collecting tank is arranged in the water tank, a second cleaning tank and a second liquid level meter are arranged in the second liquid collecting tank, and cleaning liquid in the second cleaning tank can overflow into the second liquid collecting tank. The second liquid level meter is used for measuring the liquid level height of the cleaning liquid in the second liquid collecting tank; and a switching valve and a valve monitoring module are arranged between the main pipeline and the branch pipeline of the drainage pipeline of the second liquid collecting tank. The multiple monitoring assemblies are arranged in the acid tank and the water tank, so that the liquid amount in the liquid collecting tank and the flow dividing control valve at the water drainage position are monitored in real time, and the occurrence of abnormal water drainage conditions is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning machines, in particular to a wafer cleaning machine for improving the problem of liquid discharge. Background Art

[0002] The acid tank process is a key step in the semiconductor manufacturing process. The acid tank is a major water user in the process, accounting for about 80% of the factory usage. This process is to treat semiconductor wafers with acidic solutions and deionized water to remove the oxide layer on the surface and prepare for subsequent transistor production. The acid tank process mainly includes steps such as silicon wafer cleaning, acid tank treatment, deionized water cleaning and drying. Each step requires precise control to ensure the treatment effect and quality of the silicon wafer. The acid tank machine usually includes a water tank and an acid tank. However, in the prior art, abnormal drainage problems often occur. For example, the water tank may have abnormal drainage switching or drainage pipe blockage. When the switching is abnormal, the collection of wastewater and recycled water may be abnormal, affecting the quality of factory supply or causing a large amount of deionized water waste. The blockage of the water tank will cause deionized water to overflow into the machine suction pipeline, causing abnormalities in other machines. The acid tank blockage problem not only affects the temperature control of the acid tank, but also affects other pipeline problems of the machine.

[0003] Therefore, there is still a need in the prior art for improving wafer cleaning machines that can improve the drainage problem. Utility Model Content

[0004] In view of this, the purpose of the embodiment of the utility model is to propose a wafer cleaning machine that improves the drainage problem. By setting multiple monitoring components in the acid tank and the water tank, the liquid volume in the liquid collecting tank and the diversion control valve at the drainage point are monitored in real time, thereby effectively reducing the occurrence of abnormal drainage.

[0005] Based on the above objectives, the embodiment of the utility model provides an acid tank device for improving the drainage problem, comprising:

[0006] An acid tank, wherein a first liquid collecting tank is arranged in the acid tank, a first cleaning tank and a first liquid level gauge are arranged in the first liquid collecting tank, the acid liquid in the first cleaning tank can overflow into the first liquid collecting tank, and the first liquid level gauge measures the liquid level height of the acid liquid in the first liquid collecting tank;

[0007] A water tank has a second liquid collecting tank in the water tank, a second cleaning tank and a second liquid level gauge are arranged in the second liquid collecting tank, the cleaning liquid in the second cleaning tank can overflow into the second liquid collecting tank, the second liquid level gauge measures the liquid level height of the cleaning liquid in the second liquid collecting tank, and a switching valve and a valve monitoring module are arranged between the main line and the branch line of the drainage pipeline of the second liquid collecting tank.

[0008] In some embodiments, the first level gauge and the second level gauge are pressure sensors.

[0009] In some embodiments, the valve monitoring module includes a gas sensor and an alarm.

[0010] In some embodiments, the alarm is a buzzer.

[0011] In some embodiments, the switching valve is a pneumatic solenoid valve.

[0012] In some embodiments, the first liquid level gauge is disposed at 1 / 2 to 3 / 4 of the height of the first liquid collecting tank in the height direction, and the second liquid level gauge is disposed at 1 / 2 to 3 / 4 of the height of the second liquid collecting tank in the height direction.

[0013] In some embodiments, a temperature measuring component is disposed in the first cleaning tank.

[0014] In some embodiments, the first cleaning tank is an ultrasonic tank.

[0015] In some embodiments, a heating component is disposed at the bottom of the first cleaning tank.

[0016] In some embodiments, the first liquid level gauge and the second liquid level gauge are further connected to an alarm device.

[0017] The utility model has at least the following beneficial technical effects:

[0018] The utility model improves the structure of the water tank and the acid tank in the acid tank equipment, and aims at the problem that the water tank has abnormal valve switching and blockage, which will lead to abnormal collection of wastewater and recycled water, resulting in waste of deionized water; and the problem that the acid tank has blockage and affects the temperature control of the acid tank. Liquid level sensors are installed in the water tank and the acid tank, and sensors for checking the normal operation of the switching valve are installed at the switching valve of the drainage pipe of the water tank, so as to realize the monitoring of the drainage of the water tank and the acid tank equipment, effectively reduce the problem of abnormal discharge, and ensure product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other embodiments can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic diagram of an embodiment of an acid tank device for improving drainage problems provided by the utility model.

[0021] Description of reference numerals:

[0022] 10. Acid tank; 11. First liquid collecting tank; 12. First cleaning tank; 13. Drain pipe; 14. First liquid level gauge; 20. Water tank; 21. Second liquid collecting tank; 22. Second cleaning tank; 23. Second liquid level gauge; 24. Drain pipe; 25. Switching valve; 26. Valve monitoring module; 27. Solenoid valve; 30. Wafer. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention; the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. For example, the directions or positions indicated by terms such as "length", "width", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", and "outside" are based on the directions or positions shown in the drawings, which are only for the convenience of description and cannot be understood as limitations on the present technical solution.

[0025] The terms "including" and "having" and any variations thereof in the specification and claims of the present utility model and the above-mentioned drawings are intended to cover non-exclusive inclusions; the terms "first", "second", etc. in the specification and claims of the present utility model or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0026] In the specification and claims of the utility model and the above-mentioned drawings, when an element is referred to as being "fixed on" or "mounted on" or "disposed on" or "connected to" another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it may be directly or indirectly connected to the other element.

[0027] In addition, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0028] Wafer cleaning machines are used to remove contaminants on the surface of wafers, such as organic matter, metal ions, oxides, etc., to ensure that the cleanliness of the wafer surface meets manufacturing requirements. The general process of semiconductor acid tank devices in the cleaning process usually includes four main steps: chemical station treatment, pickling, deionized water washing and drying. Pickling is one of the key steps in the cleaning process and is used to remove metal ions, oxides, etc. on the surface of the wafer. Common pickling solutions include sulfuric acid (SPM), dilute hydrofluoric acid (DHF), etc. These acids can effectively dissolve and remove impurities on the surface of the wafer. After pickling, the wafer needs to be thoroughly rinsed with deionized water (DIW) to remove residual acid and other contaminants. The high purity of deionized water ensures that the wafer surface will not be contaminated again. The last step is the drying process, which aims to remove moisture from the surface of the wafer. Common drying methods include spin drying, IPA (isopropyl alcohol) drying, Marangoni drying, etc. These methods have their own advantages and disadvantages, but they can effectively remove moisture from the surface of the wafer and prevent problems such as water stains.

[0029] However, the following problems exist in the acid pickling and water washing processes: the acid tank is blocked, which affects the temperature control of the acid tank; the water tank has abnormal valve switching and blockage. The abnormal valve switching will lead to abnormal collection of wastewater and recycled water, resulting in waste of deionized water; the blockage will affect the overflow of deionized water to other pipelines of the machine, causing abnormal problems of other machines. Therefore, the utility model proposes a wafer cleaning machine that improves the drainage problem, including:

[0030] An acid tank 10, wherein a first liquid collecting tank 11 is disposed in the acid tank 10, a first cleaning tank 12 and a first liquid level gauge 14 are disposed in the first liquid collecting tank 11, the acid liquid in the first cleaning tank 12 can overflow into the first liquid collecting tank 11, and the first liquid level gauge 14 measures the liquid level height of the acid liquid in the first liquid collecting tank 11;

[0031] The water tank 20 has a second liquid collecting tank 21 in the water tank 20, and a second cleaning tank 22 and a second liquid level meter 23 are arranged in the second liquid collecting tank 21. The cleaning liquid in the second cleaning tank 22 can overflow into the second liquid collecting tank 21. The second liquid level meter 23 measures the liquid level height of the cleaning liquid in the second liquid collecting tank 21. A switching valve 25 and a valve monitoring module 26 are arranged between the main line and the branch line of the drainage pipeline of the second liquid collecting tank 21.

[0032] Furthermore, the first cleaning tank 12 is overheadly disposed in the first liquid collecting tank 11. In some embodiments, the first cleaning tank 12 can be fixed to the first liquid collecting tank 11 by bracket welding. The robot grabs the wafer 30 and moves it to the first cleaning tank 12 for pickling, and the overflowed water during the pickling process directly flows into the first cleaning tank 12.

[0033] Furthermore, the first liquid level gauge 14 and the second liquid level gauge 23 are pressure sensors. When the pressure sensor is applied to liquid level measurement, the liquid level height can be accurately calculated by accurately measuring the pressure at the bottom of the liquid or the pressure difference generated on the liquid surface, and has good stability and reliability.

[0034] Furthermore, the switching valve 25 provided between the main road and the branch road of the drainage pipeline 24 is a pneumatic switching valve. Compressed air is used as a power source to drive the opening and closing action of the valve. Its advantages are fast response speed, high control accuracy, stable and reliable operation, and easy remote control and centralized management. Since the washing water generated by the early cleaning process of the sink is wastewater with a high acid concentration, and the washing water generated by the later cleaning is recyclable water, it is necessary to classify and recycle the washing water through different branch pipelines. The pneumatic switching valve realizes flexible switching and adjustment of the branch pipelines through precise and efficient control methods, and efficiently collects wastewater and recyclable recycled water.

[0035] Furthermore, the valve monitoring module 26 includes a gas sensor and an alarm, and monitors the switching result of the switching valve 25 through the gas sensor. When a switching abnormality is detected, the alarm is used to alarm, and the pneumatic switching valve is monitored in real time. In some embodiments, the alarm is a buzzer.

[0036] Further, the first liquid level gauge 14 is disposed at a height of 1 / 2 to 3 / 4 of the height of the first liquid collecting tank 11 , and the second liquid level gauge 23 is disposed at a height of 1 / 2 to 3 / 4 of the height of the second liquid collecting tank 21 .

[0037] Furthermore, in the semiconductor wafer cleaning process, the chemical reagents used have certain requirements on temperature. Suitable temperature can promote the chemical reaction and improve the cleaning effect. Therefore, a temperature measuring component is provided in the first cleaning tank 12 to monitor the temperature in the acid tank in real time. In some embodiments, a heating component is provided at the bottom 12 of the first cleaning tank to facilitate further regulation based on the temperature feedback of the temperature measuring component.

[0038] Furthermore, the first cleaning tank 12 is an ultrasonic tank. Compared with the traditional cleaning method, the ultrasonic cleaning tank does not need to use a large amount of chemical cleaning agents, reduces wastewater discharge and environmental pollution, and can accurately control the frequency and intensity of the ultrasonic wave, as well as the cleaning time and other parameters through the electronic control system to ensure that each wafer product is accurately cleaned.

[0039] Furthermore, the first liquid level meter 14 and the second liquid level meter 23 are further connected to an alarm device, which generates an alarm when the liquid level exceeds a threshold value.

[0040] The above are exemplary embodiments disclosed by the present utility model, but it should be noted that various changes and modifications may be made without departing from the scope of the present utility model embodiments disclosed by the claims. The functions, steps and / or actions of the method claims according to the disclosed embodiments described herein do not need to be performed in any particular order. In addition, although the elements disclosed by the present utility model embodiments may be described or required in individual form, they may also be understood as multiple unless explicitly limited to the singular.

[0041] It should be understood that, as used herein, the singular forms "a", "an" are intended to include the plural forms as well, unless the context clearly supports an exception. It should also be understood that, as used herein, "and / or" refers to any and all possible combinations including one or more of the associated listed items.

[0042] The serial numbers of the embodiments disclosed in the above-mentioned embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0043] Those skilled in the art should understand that the discussion of any of the above embodiments is only exemplary and is not intended to imply that the scope of the disclosure of the embodiments of the utility model (including the claims) is limited to these examples; under the idea of ​​the embodiments of the utility model, the technical features in the above embodiments or different embodiments can also be combined, and there are many other changes in different aspects of the above embodiments of the utility model, which are not provided in detail for the sake of simplicity. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the utility model should be included in the protection scope of the embodiments of the utility model.

Claims

1. A wafer cleaning machine for improving the drainage problem, characterized in that: include: An acid tank, wherein a first liquid collecting tank is provided in the acid tank, a first cleaning tank and a first liquid level gauge are provided in the first liquid collecting tank, the acid liquid in the first cleaning tank can overflow into the first liquid collecting tank, and the first liquid level gauge measures the liquid level height of the acid liquid in the first liquid collecting tank; A water tank, wherein the water tank has a second liquid collecting tank, wherein the second liquid collecting tank is provided with a second cleaning tank and a second liquid level gauge, the cleaning liquid in the second cleaning tank can overflow into the second liquid collecting tank, the second liquid level gauge measures the liquid level height of the cleaning liquid in the second liquid collecting tank, and a switching valve and a valve monitoring module are provided between the main line and the branch line of the drainage pipeline of the second liquid collecting tank.

2. The wafer cleaning machine for improving the drainage problem according to claim 1, characterized in that: The first liquid level gauge and the second liquid level gauge are pressure sensors.

3. The wafer cleaning machine for improving the drainage problem according to claim 1, characterized in that: The valve monitoring module includes a gas sensor and an alarm.

4. The wafer cleaning machine for improving the drainage problem according to claim 3, characterized in that: The alarm is a buzzer.

5. The wafer cleaning machine for improving the drainage problem according to claim 1, characterized in that: The switching valve is a pneumatic solenoid valve.

6. The wafer cleaning machine for improving the drainage problem according to claim 1, characterized in that: The first liquid level gauge is arranged at 1 / 2 to 3 / 4 of the height of the first liquid collecting tank in the height direction, and the second liquid level gauge is arranged at 1 / 2 to 3 / 4 of the height of the second liquid collecting tank in the height direction.

7. The wafer cleaning machine for improving the drainage problem according to claim 1, characterized in that: A temperature measuring component is arranged in the first cleaning tank.

8. The wafer cleaning machine for improving the drainage problem according to claim 1, characterized in that: The first cleaning tank is an ultrasonic tank.

9. The wafer cleaning machine for improving the drainage problem according to claim 1, characterized in that: A heating component is arranged at the bottom of the first cleaning tank.

10. The wafer cleaning machine for improving the drainage problem according to claim 1, characterized in that: The first liquid level meter and the second liquid level meter are further connected to an alarm device.

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