Printed circuit board PUF (Physical Unclonable Function) auxiliary structure, anti-shoveling plate based on PUF and identity label structure

Abstract

The utility model discloses a printed circuit board PUF auxiliary structure and a PUF-based anti-shoveling plate and identity identification structure, a printed circuit board at least comprises a front surface layer, a PUF signal layer, a common signal layer and a back surface layer, the PUF signal layer is adjacent to the common signal layer; the layers are connected through base plates; a grounding bonding pad, a common signal bonding pad and a PUF signal bonding pad are arranged on the front surface layer, the common signal bonding pad and the PUF signal bonding pad are respectively connected with the common signal layer and the PUF signal layer through interlayer connecting lines, and the PUF signal layer adopts an induction coil form for wiring; the blank positions of the front surface layer and the back surface layer are filled with grounding metal, and shielding layers can be additionally arranged between the PUF signal layer and the front surface layer, between the PUF signal layer and the back surface layer, above the front surface layer and below the back surface layer. The PUF information generated by the structure matched with the PUF functional circuit device is also unique identity information, and the printed circuit board cannot be completely re-carved when being shoveled, so that the PUF information can be used as an identity label of a printed circuit board product.

Description

Technical Field

[0001] The utility model relates to the cross-field of printed circuit boards and data security, and in particular to a PUF auxiliary structure of a printed circuit board and an anti-copying board and identity identification structure based on PUF. Background Art

[0002] Printed circuit boards are commonly used in electronic circuits as circuit substrates with conductive patterns and perforated connection functions. They have device contact points such as pads and vias. The contact points are connected through circuit wiring buried in the circuit board. After welding the devices, they have electrical characteristics such as capacitance, resistance, and inductance. These electrical characteristics are random during the circuit board processing process, which meets the basic characteristics of PUF information carriers. However, after welding devices on conventional printed circuit boards, the capacitance, resistance, and inductance between the contact points change very little during device detection and repeated disassembly and assembly on the board, and cannot cause effective changes in PUF information. Therefore, PUF technology cannot be directly applied to conventional printed circuit boards and device protection to enhance data security capabilities. Utility Model Content

[0003] Technical problems to be solved by the utility model: In view of the above problems of the prior art, a PUF auxiliary structure for a printed circuit board and a PUF-based anti-copying board and identity identification structure are provided. The utility model aims to realize a printed circuit board structure, which cooperates with PUF functional circuit devices. The characteristic changes caused by the detection and repeated disassembly and assembly of the device on the printed circuit board are sufficient to produce effective PUF information changes, and can realize the perception of repeated disassembly and detection of the device on the printed circuit board, apply PUF technology to the protection of printed circuit boards and devices, and enhance data security capabilities. At the same time, the PUF information generated by the structure in conjunction with the PUF functional device is also a unique identity information, which cannot be completely reproduced when the printed circuit board is copied, and can be used as the identity identification of the printed circuit board product.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0005] A PUF auxiliary structure for a printed circuit board, characterized in that the printed circuit board at least comprises: a front surface layer, a PUF signal layer, a common signal layer, and a back surface layer, wherein the PUF signal layer and the common signal layer are adjacent; the layers are connected by a substrate plate; a ground pad, a common signal pad, and a PUF signal pad are provided on the front surface layer, and the common signal pad and the PUF signal pad are respectively connected to the common signal layer and the PUF signal layer through interlayer connections; the PUF signal layer is wired in the form of an induction coil; and grounding metal is filled in the blank positions of the front surface layer and the back surface layer.

[0006] Optionally, the induction coil wiring of the PUF signal layer can be designed in a variety of shapes, including but not limited to circular, rectangular and / or wavy shapes, and can cover the signal pads on the front surface and the ordinary signal layer wiring, ensuring that the PUF signal layer can protect the signal pads on the front surface and the ordinary signal layer wiring.

[0007] Optionally, the induction coil wiring of the PUF signal layer may be in the form of a single coil and / or multiple groups of coils forming an array, so as to protect the signal pads on the front surface and the common signal layer wiring from all directions.

[0008] Optionally, an inductive shielding layer may be added between the PUF signal layer and the front surface layer, between the PUF signal layer and the back surface layer, above the front surface layer and / or below the back surface layer to enhance stability under normal conditions and provide protection for the PUF signal layer.

[0009] Optionally, the size of the PUF signal pad is at least 30% smaller than the size of the solder joint of the PUF functional circuit device, and the shape may include but is not limited to triangle, rectangle, circle, star and / or parallelogram.

[0010] In addition, the utility model also proposes a printed circuit board anti-copying board structure, characterized in that the ground pad and the PUF signal pad on the front surface of the above-mentioned printed circuit board PUF auxiliary structure are respectively connected to the PUF functional circuit device to form a printed circuit board anti-copying board structure. With the PUF information generated by the PUF functional device, the printed circuit board cannot be completely copied when the board is copied, and can be used for the printed circuit board anti-copying board.

[0011] In addition, the utility model also proposes a printed circuit board identity identification structure, characterized in that the ground pad and the PUF signal pad on the front surface of the printed circuit board PUF auxiliary structure are respectively connected to the PUF functional circuit device to form a printed circuit board identity identification structure. The PUF information generated by the PUF functional device itself is a unique identity information and can be used as the identity identification of the printed circuit board product.

[0012] Compared with the prior art, the utility model mainly has the following advantages: the utility model can expand the characteristic changes caused by device detection and repeated disassembly and assembly through the PUF signal pads and the intermediate signal layer wiring of the printed circuit board, and cooperate with the PUF functional circuit device to ensure that effective PUF information changes can be caused when detecting and repeatedly disassembling the device on the printed circuit board. The utility model aims to realize a printed circuit board structure, which cooperates with the PUF functional circuit device, and the characteristic changes caused by the detection and repeated disassembly of the device on the printed circuit board are sufficient to produce effective PUF information changes, realize the perception of repeated disassembly and detection of the device on the printed circuit board, apply PUF technology to the protection of printed circuit boards and devices, and enhance data security capabilities. At the same time, the PUF information generated by the structure in conjunction with the PUF functional circuit device is also a unique identity information, which cannot be completely reproduced when the printed circuit board is copied, and can be used as an identity identification of the printed circuit board product. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall structure of the first embodiment of the present utility model.

[0014] Figure 2 This is a schematic diagram of the front surface of the first embodiment of the utility model.

[0015] Figure 3 This is a schematic diagram of the overall structure of the second embodiment of the present utility model.

[0016] Figure 4 This is a schematic diagram of the overall structure of the third embodiment of the present utility model.

[0017] Legend: 1. Front surface layer; 2. First PUF signal layer; 3. Ordinary signal layer; 4. Second PUF signal layer; 5. Back surface layer; 6. Substrate material; 7. Interlayer connection; 8. Shielding layer; 11. First PUF input signal pad; 12. First PUF output signal pad; 13. Second PUF input signal pad; 14. Second PUF output signal pad; 15. Ordinary signal pad of PUF functional circuit device; 16. Ordinary device signal pad; 17. PUF functional circuit device ground pad; 18. Ordinary device ground pad; 19. PUF functional circuit device multiplexing signal pad; 101. First PUF signal line; 102. Second PUF signal line; 103. Ordinary signal line; 104. Multiplexing signal line; 201. PUF functional circuit device, 202. Ordinary device. DETAILED DESCRIPTION

[0018] Embodiment 1:

[0019] This embodiment provides a PUF auxiliary structure for a printed circuit board, which can amplify the characteristic changes caused by device detection and repeated disassembly and assembly operations.

[0020] like Figure 1 As shown, as an optional implementation, this embodiment adopts a printed circuit board with a 5-layer structure, including a front surface layer 1, a first PUF signal layer 2, a common signal layer 3, a second PUF signal layer 4, and a back surface layer 5. The first PUF signal layer 2 and the second PUF signal layer 4 are located on both sides of the common signal layer 3, and the layers are connected by a substrate plate 6; wherein, the front surface layer 1 is provided with PUF input signal pads (11, 13), PUF output signal pads (12, 14), common signal pads (15, 16), and ground pads (17, 18); the first PUF signal pads (11, 12) on the front surface layer 1 are respectively connected to the first PUF signal layer 2 through interlayer wiring 7, and the second PUF signal pads (13, 14) on the front surface layer 1 are respectively connected to the second PUF signal layer 4 through interlayer wiring 7, and wiring is performed on the PUF signal layers (2, 4) in the form of induction coils; and the blank positions of the front surface layer 1 and the back surface layer 5 are filled with grounding metal. The PUF functional circuit device 201 is connected to the printed circuit board through the PUF input signal pads (11, 13), the PUF output signal pads (12, 14), the PUF functional circuit device common signal pads 15, and the PUF functional circuit device ground pads 17 on the front surface layer 1, and generates PUF information by sending signals through the PUF input signal pads (11, 13) and receiving the return signal processing through the PUF output signal pads (12, 14). The PUF information is a unique identity information that cannot be completely reproduced when the printed circuit board is copied. It can be used as an identity mark of the printed circuit board product and can be used for the printed circuit board anti-copying board. The ordinary device 202 is connected to the printed circuit board through the ordinary device common signal pads 16 and the ordinary device ground pads 18. The PUF functional circuit device common signal pads 15 and the ordinary device common signal pads 16 are connected to the common signal layer 3 through the interlayer connection line 7, and the signal transmission is carried out through the common signal line 103 in the common signal layer 3.

[0021] like Figure 1As shown, as an optional implementation, in this embodiment, two PUF input signal pads (11, 13) and two PUF output signal pads (12, 14) are provided on the front surface layer 1, and each PUF signal pad (11, 12, 13, 14) is connected to the PUF signal layer (2, 4) through an interlayer connection line 7, wherein, after the first PUF input signal pad 11 is connected to the first PUF signal layer 2, the first PUF signal line 101 is used to form an induction cloth coil, and then the first PUF output signal pad 12 is connected; after the second PUF input signal pad 13 is connected to the second PUF signal layer 4, the second PUF signal line 102 is used to form an induction cloth coil, and then the second PUF output signal pad 14 is connected; the size of the two induction cloth coils (101, 102) can cover the ordinary signal line 103, forming all-round protection for the ordinary signal layer 3.

[0022] like Figure 2 As shown, as an optional implementation, in this embodiment, the first PUF signal pads (11, 12) are square in design, the second PUF signal pads (13, 14) are triangular in design, and the common signal pads (15, 16) and the ground pads (17, 18) are circular in design; the size of each of the above pads is 30% smaller than the device solder joint. Through the special size and shape design, greater randomness can be generated during welding, thereby generating effective changes during repeated welding.

[0023] During soldering, solder pads designed in various sizes and shapes can ensure that the solder distribution is more random, so the resulting electrical properties are also more random. During repeated soldering, the changes are more random, which is sufficient to produce effective PUF information changes in conjunction with the PUF functional circuit device 201.

[0024] During detection, wiring of different shapes has more sensitive electromagnetic characteristics, so the electrical characteristics change more during detection and welding changes, which is sufficient to produce effective PUF information changes in conjunction with the PUF functional circuit device 201.

[0025] In addition, shielding layers may be added between the first PUF signal layer 2 and the front surface layer 1, between the second PUF signal layer 4 and the back surface layer 5, above the front surface layer 1, and below the back surface layer 5, to enhance the stability of the PUF under normal conditions and to protect the PUF signal layers (2, 4).

[0026] In addition, this embodiment also proposes a printed circuit board anti-copying board structure, where the PUF input signal pads (11, 13), PUF output signal pads (12, 14), PUF functional circuit device common signal pads 15, and PUF functional circuit device ground pads 17 on the front surface layer 1 of the printed circuit board PUF auxiliary structure are respectively connected to the PUF functional circuit device 201 to form a printed circuit board anti-copying board structure. The PUF information generated by the PUF functional circuit device 201 cannot be completely replicated when the printed circuit board is copied, and can be applied to the printed circuit board anti-copying board.

[0027] In addition, this embodiment also proposes a printed circuit board identity identification structure, where the PUF input signal pads (11, 13), PUF output signal pads (12, 14), PUF functional circuit device common signal pads 15, and PUF functional circuit device ground pads 17 on the front surface layer 1 of the printed circuit board PUF auxiliary structure are respectively connected to the PUF functional circuit device 201 to form a printed circuit board identity identification structure. The PUF information generated by the PUF functional circuit device 201 has a unique identity characteristic and can be applied to the printed circuit board identity identification.

[0028] In summary, the PUF auxiliary structure of a printed circuit board in this embodiment can expand the characteristic changes caused by operations such as device detection and repeated disassembly and assembly through the PUF signal pads and the intermediate signal layer wiring of the printed circuit board, and cooperate with the PUF functional circuit device to ensure that effective PUF information changes can be caused when detecting and repeatedly disassembling the device on the board. The utility model aims to realize a printed circuit board structure, which cooperates with the PUF functional circuit device, and the characteristic changes caused by the detection and repeated disassembly of the device on the printed circuit board structure are sufficient to produce effective PUF information changes, and can realize the perception of repeated disassembly and detection of the device on the printed circuit board, and apply the PUF technology to the protection of printed circuit boards and devices, and enhance data security capabilities. At the same time, the PUF information generated by the structure in conjunction with the PUF functional circuit device is also a unique identity information, which cannot be completely reproduced when the printed circuit board is copied, and can be used as an identity identification of the printed circuit board product.

[0029] Embodiment 2:

[0030] The overall scheme of this embodiment is basically the same as that of the first embodiment, and the main differences are as follows: Figure 3 As shown, in this embodiment, the common signal line 103 is placed on the front surface layer 1, and the common signal layer 3, the second PUF signal layer 4 and the related pads (13, 14) and wiring (102) are eliminated. At the same time, a shielding layer 8 is added above the common signal line 103 in the front surface layer 1 to play a shielding and protective role. This solution reduces the pin occupancy of the PUF functional circuit device, while reducing the number of printed circuit board layers and reducing the complexity of printed circuit board wiring.

[0031] Embodiment three:

[0032] The overall scheme of this embodiment is basically the same as that of the second embodiment, and the main difference is that: Figure 4 As shown, in this embodiment, the PUF functional circuit device reuse pad 19 replaces the first PUF signal input pad 11 and the PUF functional circuit device common signal pad 15, and the reused signal line 104 replaces the first PUF signal line 101 and the common signal line 103. This solution uses pad and line multiplexing to combine PUF detection and common signal transmission, which can further reduce the pin occupancy of the PUF functional circuit device and the complexity of printed circuit board wiring.

[0033] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A PUF auxiliary structure for a printed circuit board, characterized in that: The printed circuit board at least includes: a front surface layer, a PUF signal layer, a common signal layer, and a back surface layer, wherein the PUF signal layer is adjacent to the common signal layer; the layers are connected by substrate plates; a ground pad, a common signal pad, and a PUF signal pad are provided on the front surface layer, and the common signal pad and the PUF signal pad are respectively connected to the common signal layer and the PUF signal layer through interlayer connections; the PUF signal layer is wired in the form of an induction coil; and grounding metal is filled in the blank positions of the front surface layer and the back surface layer.

2. The PUF auxiliary structure for a printed circuit board according to claim 1, characterized in that: The induction coil wiring shape of the PUF signal layer is circular, rectangular and / or wavy, and can cover the signal pads on the front surface layer and the common signal layer routing.

3. The PUF auxiliary structure for a printed circuit board according to claim 2, characterized in that: The induction coil wiring of the PUF signal layer adopts a single coil form and / or adopts a plurality of coils to form an array form.

4. The printed circuit board PUF auxiliary structure according to claim 1, 2 or 3, characterized in that: A shielding layer is added between the PUF signal layer and the front surface layer, between the PUF signal layer and the back surface layer, above the front surface layer and / or below the back surface layer.

5. The PUF auxiliary structure for a printed circuit board according to claim 1, characterized in that: The size of the PUF signal pad is at least 30% smaller than the size of the solder joint of the PUF functional circuit device, and the shape is triangle, square, rectangle, circle, star and / or parallelogram.

6. A printed circuit board anti-copying plate structure, characterized in that: The ground pad and the PUF signal pad on the front surface of the printed circuit board PUF auxiliary structure described in any one of claims 1, 2, 3 or 5 are respectively connected to the PUF functional circuit device to form a printed circuit board anti-copying board structure.

7. A printed circuit board anti-copying plate structure, characterized in that: The ground pad and the PUF signal pad on the front surface layer of the PUF auxiliary structure of the printed circuit board as claimed in claim 4 are respectively connected to the PUF functional circuit device to form a printed circuit board anti-copying board structure.

8. A printed circuit board identification structure, characterized in that: The ground pad and the PUF signal pad on the front surface layer of the PUF auxiliary structure of the printed circuit board as described in any one of claims 1, 2, 3 or 5 are respectively connected to the PUF functional circuit device to form a printed circuit board identity identification structure.

9. A printed circuit board identification structure, characterized in that: The ground pad and the PUF signal pad on the front surface layer of the PUF auxiliary structure of the printed circuit board described in claim 4 are respectively connected to the PUF functional circuit device to form a printed circuit board identity identification structure.

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