VC heat dissipation module

Abstract

The utility model provides a VC heat dissipation module, which belongs to the technical field of heat dissipation and comprises a heat conduction paste, a heat conduction layer is arranged on one side of the heat conduction paste, a vapor chamber is arranged on one side of the heat conduction layer, a fixing plate is arranged on one side of the vapor chamber, cooling fins are arranged on one side of the fixing plate, and mounting holes are formed in four corners of the fixing plate. The device further comprises an adjusting mechanism, the adjusting mechanism is arranged in the mounting hole, a fixing mechanism is arranged in the adjusting mechanism, the adjusting mechanism comprises first sliding grooves formed in the inner walls of the two sides of the mounting hole, and a mounting frame is slidably mounted in the mounting hole. Through the design of the adjusting mechanism, a user is allowed to flexibly adjust the position of the fixing structure according to equipment with different specifications and layouts, and through the horizontal X-axis adjustment of the mounting frame in the first sliding groove and the horizontal Y-axis adjustment of the mounting block in the second sliding groove, the flexibility of the heat dissipation module on the mounting hole position is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation, and in particular relates to a VC heat dissipation module. Background Art

[0002] VC heat dissipation module is a heat dissipation device realized by using vacuum chamber heat sink technology. Through the evaporation and condensation process of the coolant in the vacuum chamber, the heat is quickly conducted and dispersed, thereby reducing the operating temperature of the electronic equipment to ensure the normal operation of the equipment. VC heat dissipation module is widely used in various electronic devices that require efficient heat dissipation, such as smart phones, tablet computers, laptops, desktops, servers, etc., especially in the fields of high-performance computing, gaming and entertainment, VC heat dissipation module is an indispensable and important component.

[0003] Currently, existing VC cooling modules often adopt a fixed installation design and cannot be flexibly adjusted according to equipment of different specifications and layouts. This rigid design limits the adaptability of the cooling module on different equipment or different positions of the same equipment, increases the difficulty and cost of installation, and may also lead to poor cooling effect due to improper installation. Utility Model Content

[0004] The purpose of the utility model is to provide a VC heat dissipation module, aiming to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A VC heat dissipation module, comprising a thermal conductive paste, a heat conductive layer is provided on one side of the thermal conductive paste, a heat spreader is provided on one side of the heat spreader, a fixing plate is provided on one side of the heat spreader, a heat sink is provided on one side of the fixing plate, and mounting holes are provided at four corners of the fixing plate, and further comprising:

[0007] The adjusting mechanism is arranged inside the mounting hole, and a fixing mechanism is arranged inside the adjusting mechanism.

[0008] As a preferred solution of the utility model, the adjustment mechanism includes a first sliding groove opened on the inner walls of both sides of the mounting hole, a mounting frame is slidably installed inside the mounting hole, and first sliding blocks are fixedly installed on both sides of the mounting frame.

[0009] As a preferred solution of the utility model, the first sliding block is slidably installed inside the first sliding groove, the installation frame is a hollow structure, and the inner walls on both sides thereof are provided with second sliding grooves.

[0010] As a preferred solution of the utility model, a mounting block is slidably installed inside the mounting frame, and second sliding blocks are fixedly installed on both sides of the mounting block, and the second sliding blocks are slidably installed inside the second sliding groove.

[0011] As a preferred solution of the utility model, the fixing mechanism includes a through hole opened on the surface of the mounting block, a nut is fixedly installed at one end of the through hole, a bolt is inserted into the through hole, and a spring is sleeved on the outer side of the bolt.

[0012] As a preferred solution of the utility model, the end of the bolt is threadedly connected to the inner side of the nut, and the spring is located between the tail of the bolt and the mounting block.

[0013] As a preferred solution of the utility model, the heat spreader is composed of an upper shell plate and a lower shell plate, and a liquid absorption core is arranged inside the heat spreader.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The VC heat dissipation module allows the user to flexibly adjust the fixed structure position according to devices of different specifications and layouts through the design of the adjustment mechanism. The flexibility of the heat dissipation module in the installation hole position is achieved through the horizontal X-axis adjustment of the mounting frame in the first slide groove and the horizontal Y-axis adjustment of the mounting block in the second slide groove.

[0016] This VC heat dissipation module achieves stable fixation of the entire heat dissipation module through the tightening cooperation of bolts and nuts inside the fixing mechanism and the buffering effect of the spring, which not only ensures the stability of the heat dissipation module during use, but also provides certain buffering protection when subjected to external impact or vibration, reducing the risk of damage to the internal structure of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a top view of the overall structure of the utility model;

[0020] Figure 3 It is a partial structural schematic diagram of the utility model;

[0021] Figure 4 It is a schematic diagram of the partial structure of the adjustment mechanism of the utility model;

[0022] Figure 5 It is a schematic diagram of the fixing mechanism structure of the utility model.

[0023] In the figure: 1. thermal conductive paste; 2. thermal conductive layer; 3. heat spreader; 4. fixing plate; 5. heat sink; 6. mounting hole; 7. adjustment mechanism; 701. first slide groove; 702. mounting frame; 703. first slider; 704. second slide groove; 705. mounting block; 706. second slider; 8. fixing mechanism; 801. through hole; 802. nut; 803. bolt; 804. spring. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments. Example

[0027] Refer to the figure Figure 1-5 , which is the first embodiment of the utility model, and this embodiment provides a VC heat dissipation module, including a thermal conductive paste 1, a thermal conductive layer 2 is arranged on one side of the thermal conductive paste 1, a heat spreader 3 is arranged on one side of the thermal conductive layer 2, a fixing plate 4 is arranged on one side of the heat spreader 3, a heat sink 5 is arranged on one side of the fixing plate 4, and mounting holes 6 are opened at four corners of the fixing plate 4, and also includes: an adjustment mechanism 7, the adjustment mechanism 7 is arranged inside the mounting hole 6, and a fixing mechanism 8 is arranged inside the adjustment mechanism 7.

[0028] Specifically, the adjustment mechanism 7 includes a first sliding groove 701 formed on the inner walls of both sides of the mounting hole 6 , a mounting frame 702 is slidably mounted inside the mounting hole 6 , and first sliding blocks 703 are fixedly mounted on both sides of the mounting frame 702 .

[0029] Furthermore: the thermal paste 1 is in direct contact with the heat source, and the thermal conductive layer 2 is made of a material with a high thermal conductivity coefficient and has excellent thermal conductivity, which further enhances the efficiency of heat transfer from the thermal paste 1 to the heat spreader 3. Through its high thermal conductivity, it ensures that the heat is evenly distributed on the thermal conductive layer 2 to avoid local overheating. The heat spreader 3 quickly and evenly disperses and conducts heat in the vacuum cavity through the phase change process of liquid evaporation and condensation, thereby increasing the heat conduction area and path and improving the heat dissipation efficiency. The fixed plate 4 provides structural support for the heat dissipation module to ensure the stability and reliability of the heat dissipation module during use, and provides an installation basis for components such as the heat sink 5 and the adjustment mechanism 7, thereby ensuring the close connection and coordinated work between the components of the heat dissipation module. The heat sink 5 is composed of multiple metal sheets and has a large surface area. It dissipates heat into the environment through air convection, increases the contact area with the air by increasing the surface area, and improves the heat exchange efficiency. The adjustment mechanism 7 is used to adjust the position of the fixed structure so that it can adapt to equipment of different specifications.

[0030] Specifically, the first slider 703 is slidably installed inside the first slide groove 701, the mounting frame 702 is a hollow structure, and the inner walls on both sides thereof are provided with second slide grooves 704, the mounting frame 702 is slidably installed inside with a mounting block 705, and the two sides of the mounting block 705 are fixedly installed with second sliders 706, and the second slider 706 is slidably installed inside the second slide groove 704.

[0031] Further: the first slide groove 701 provides a sliding track for the first slider 703 to realize horizontal adjustment of the installation frame 702 in the installation hole 6. The installation frame 702 is slidably installed in the installation hole 6. Through the cooperation of the first slider 703 and the first slide groove 701, flexible movement along the horizontal X-axis direction is realized. The hollow structure inside it provides an installation space for the installation block 705. The second slide groove 704 is opened on the inner walls on both sides of the installation frame 702 to provide a sliding track for the second slider 706. The installation block 705 is slidably installed inside the installation frame 702. Through the cooperation of the second slider 706 and the second slide groove 704, free movement along the horizontal Y-axis direction is realized. The installation block 705 is used to install the fixing mechanism 8. At the same time, the fixing mechanism 8 can be synchronously moved by moving the installation block 705.

[0032] Specifically, the fixing mechanism 8 includes a through hole 801 opened on the surface of the mounting block 705, a nut 802 is fixedly installed at one end of the through hole 801, a bolt 803 is inserted into the inside of the through hole 801, a spring 804 is sleeved on the outside of the bolt 803, the end of the bolt 803 is threadedly connected to the inner side of the nut 802, and the spring 804 is located between the tail of the bolt 803 and the mounting block 705.

[0033] Furthermore: through the setting of the fixing mechanism 8, the whole heat dissipation module is firmly fixed, and has a certain buffering function. The through hole 801 serves as a channel for the bolt 803 to pass through, and at the same time provides a fixing position for the nut 802. The nut 802 is fixedly installed at one end of the through hole 801, and has an internal thread for cooperating with the threaded part of the bolt 803 to achieve a tightening function. The bolt 803 is inserted through the through hole 801, and its threaded part cooperates with the nut 802. When the bolt 803 is rotated, it will move along the thread direction, thereby achieving tightening or loosening with the nut 802. The spring 804 is sleeved on the outside of the bolt 803, and is located between the tail of the bolt 803 and the mounting block 705. The spring 804 will be compressed when the bolt 803 is tightened, generating a certain preload and buffering effect. When subjected to external shock or vibration, the spring 804 can absorb part of the energy to reduce the impact on the bolt 803 and the fixing structure.

[0034] Specifically, the heat spreader 3 is composed of an upper shell plate and a lower shell plate, and a liquid wick is arranged inside the heat spreader 3 .

[0035] Furthermore: the heat spreader 3 is composed of an upper shell plate and a lower shell plate with high thermal conductivity, and is filled with a high-efficiency liquid-absorbing core material in the middle. The liquid-absorbing core material has excellent capillary action and can quickly absorb and store the working liquid. When the heat source heats, the working liquid quickly evaporates under the action of the capillary structure and absorbs a large amount of heat; then it condenses and releases heat in a colder area, forming a thermal cycle.

[0036] Working principle:

[0037] When in use, the thermal paste 1 is in direct contact with the heat source, and uses its high thermal conductivity to quickly transfer the heat to the thermal conductive layer 2. The thermal conductive layer 2 is made of a material with a high thermal conductivity coefficient to ensure that the heat is evenly distributed within the layer and further transferred to the heat spreader 3. The interior of the heat spreader 3 is composed of an upper shell plate and a lower shell plate with high thermal conductivity, and a liquid wick is filled in the middle. When the heat transferred by the thermal conductive layer 2 reaches the heat spreader 3, the heat is absorbed by the working liquid in the liquid wick, and the working liquid is heated and evaporated in the heat source area to form steam. The steam quickly diffuses inside the heat spreader 3 to a colder area. In the colder area, the steam condenses into liquid and releases heat to the surrounding environment or continues to be absorbed by the liquid wick to complete a thermal cycle. The heat sink 5 is composed of multiple metal sheets and has a large surface area, and dissipates heat to the surrounding environment through air convection. In the environment, the heat spreader 3 evenly conducts heat to the heat sink 5, and the heat sink 5 uses its surface area advantage to effectively dissipate heat to the surrounding air. By gently pushing the mounting frame 702 and using its built-in first slider 703 to slide smoothly in the first slide groove 701, precise adjustment along the horizontal X-axis direction is achieved. Subsequently, the mounting block 705 is adjusted, and the positioning along the horizontal Y-axis direction is completed with the help of the flexible movement of the second slider 706 in the second slide groove 704. Once the mounting block 705 reaches the ideal position, the bolt 803 is rotated to make it firmly threaded into the corresponding hole of the electronic device. During this process, the spring 804 is automatically compressed to provide the necessary preload for the connection, absorb external shocks and vibrations, protect the heat dissipation module from damage, and ensure its long-term stable operation.

[0038] In summary: the design of the adjustment mechanism 7 allows the user to flexibly adjust the fixed structure position according to equipment of different specifications and layouts. The horizontal X-axis adjustment of the mounting frame 702 in the first slide groove 701 and the horizontal Y-axis adjustment of the mounting block 705 in the second slide groove 704 enable the flexibility of the heat dissipation module on the mounting hole 6. The fixing mechanism 8 achieves a firm fixation of the entire heat dissipation module through the fastening cooperation of the bolt 803 and the nut 802 and the buffering effect of the spring 804, which not only ensures the stability of the heat dissipation module during use, but also can provide a certain buffering protection when subjected to external impact or vibration, thereby reducing the risk of damage to the internal structure of the heat dissipation module.

Claims

1. A VC heat dissipation module, characterized in that: The invention comprises a thermal conductive paste (1), a thermal conductive layer (2) being arranged on one side of the thermal conductive paste (1), a heat spreader (3) being arranged on one side of the thermal conductive layer (2), a fixing plate (4) being arranged on one side of the heat spreader (3), a heat sink (5) being arranged on one side of the fixing plate (4), and mounting holes (6) being arranged at four corners of the fixing plate (4), and further comprises: An adjusting mechanism (7), wherein the adjusting mechanism (7) is arranged inside the mounting hole (6), and a fixing mechanism (8) is arranged inside the adjusting mechanism (7).

2. A VC heat dissipation module according to claim 1, characterized in that: The adjustment mechanism (7) comprises a first sliding groove (701) formed on the inner walls of both sides of the mounting hole (6), a mounting frame (702) is slidably mounted inside the mounting hole (6), and first sliding blocks (703) are fixedly mounted on both sides of the mounting frame (702).

3. A VC heat dissipation module according to claim 2, characterized in that: The first sliding block (703) is slidably installed inside the first sliding groove (701); the installation frame (702) is a hollow structure, and the inner walls on both sides thereof are provided with second sliding grooves (704).

4. A VC heat dissipation module according to claim 3, characterized in that: A mounting block (705) is slidably mounted inside the mounting frame (702), and second sliding blocks (706) are fixedly mounted on both sides of the mounting block (705), and the second sliding blocks (706) are slidably mounted inside the second sliding groove (704).

5. The VC heat dissipation module according to claim 1, characterized in that: The fixing mechanism (8) comprises a through hole (801) formed on the surface of the mounting block (705), a nut (802) being fixedly mounted at one end of the through hole (801), a bolt (803) being inserted into the interior of the through hole (801), and a spring (804) being sleeved on the outer side of the bolt (803).

6. A VC heat dissipation module according to claim 5, characterized in that: The end of the bolt (803) is threadedly connected to the inner side of the nut (802), and the spring (804) is located between the rear end of the bolt (803) and the mounting block (705).

7. The VC heat dissipation module according to claim 1, characterized in that: The heat soaking plate (3) consists of an upper shell plate and a lower shell plate, and a liquid absorption core is arranged inside the heat soaking plate.

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