Sensor control device
By designing a sensor control device that utilizes the principle of mechanical switching, the problems of power consumption and leakage current of semiconductor devices in standby state of medical devices are solved, and the service life of the power supply and the cost reduction are achieved.
Patent Information
- Application Number
- CN202421594083.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-07-05
AI Technical Summary
The power supply of existing medical devices may be consumed in standby state, resulting in insufficient power supply during use, and leakage current of semiconductor devices in the off state, shortening shelf life.
Design a sensor control device to control the power supply through the mechanical switching principle using the trigger part and the switch module, reduce leakage current and improve the service life of the power supply.
Reduce leakage current through mechanical conduction, extend the service life of the power supply, and reduce costs, avoiding the problem of shortening shelf life caused by leakage current of semiconductor devices.
Smart Images

Figure CN222804293U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of biomedicine industry, and in particular to a sensor control device. Background Art
[0002] Monitoring the glucose concentration or other analyte levels (such as blood ketone concentration or lactate concentration, etc.) of some users is essential for their health. For example, for diabetic patients, if their glucose concentration is not monitored, some complications may occur due to failure to control it in time. For example, continuous glucose monitoring (CGM) systems have been widely used in the field of glucose control. Users can use CGM systems to continuously monitor glucose, control glucose and reduce the occurrence of complications.
[0003] The above-mentioned medical devices for monitoring analyte levels need to be equipped with a power supply to maintain their daily work. During the period from the completion of the medical device to the first use by the user, it is usually in a waiting state for transportation. The power supply may be consumed during the standby process, so that the power supply cannot provide enough power when the user uses the medical device. At present, there are some solutions that use magnetic field switches or NFC (Near Field Communication) activation devices to control the power supply of the power supply. Such solutions are generally based on semiconductor devices to realize the switching function.
[0004] However, since semiconductors still have a certain amount of leakage current when they are turned off, the continuous leakage current can easily shorten the shelf life of medical devices. In addition, semiconductors are easily affected by temperature and may produce large leakage currents in some cases, thus affecting the life or reliability of medical devices. Summary of the invention
[0005] The utility model is proposed in view of the above situation, and its purpose is to provide a sensor control device capable of prolonging the service life of a power supply.
[0006] To this end, the utility model provides a sensor control device, comprising: a sensor component, an electronic component and a connection component; the sensor component comprises a distal part for measuring a signal related to an analyte level and a proximal part connected to the distal part and having a first contact, the distal part being connected to the electronic component through the proximal part; the electronic component comprises an electronic device, a device housing for accommodating the electronic device, and a receiving part formed in the device housing and for accommodating the connection component, the electronic device comprises a second contact, a power module and a switch module connected to the power module; the connection component comprises a connector and a trigger part, the connector comprises a conductive part for connecting the first contact and the second contact and a sealing part at least partially surrounding the conductive part, at least a part of the trigger part protruding from a surface of the sealing part away from the sensor component side, when the conductive part and the second contact are in contact, the trigger part contacts and presses the switch module to put the switch module in a closed state. In this case, the switch module realizes the switch function based on the mechanical switch principle of contact and compression, and controls the state of the switch module by cleverly connecting the sensor component and the electronic component through the trigger part, thereby reducing the leakage current through mechanical conduction, thereby increasing the service life of the power supply. In addition, compared with using semiconductor devices to control the conduction of the power supply, it is not dependent on the device that cooperates with the semiconductor device, which helps to reduce costs.
[0007] In addition, in the sensor control device of the utility model, optionally, the switch module includes a third contact, a fourth contact and a conductive member; when the switch module is in an open state, the third contact is connected to the conductive member, and the fourth contact is not in contact with the conductive member, and when the trigger part squeezes the conductive member, the conductive member contacts the fourth contact. In this case, the switch module can be in a closed state by making the conductive member contact the fourth contact, which helps to simplify the conduction of the switch module.
[0008] In addition, in the sensor control device of the utility model, optionally, the switch module includes a third contact, a fourth contact and a conductive member; when the switch module is in an off state, the third contact is not in contact with the conductive member, and the fourth contact is not in contact with the conductive member; when the trigger part squeezes the conductive member, the conductive member is in contact with the third contact and the conductive member is in contact with the fourth contact. In this case, both contacts are not in contact with the conductive member, which helps to reduce the possibility of mis-activating the switch module when the control device is not in use.
[0009] In addition, in the sensor control device of the present invention, optionally, the third contact and / or the fourth contact not in contact with the conductive member are isolated from the conductive member by an insulating medium, and the insulating medium is in a gaseous or solid state, thereby facilitating isolation of the contact and the conductive member.
[0010] In addition, in the sensor control device involved in the utility model, optionally, the switch module further includes a first insulating member, which is disposed between the conductive member and the fourth contact and supports the conductive member, and when the trigger portion squeezes the conductive member, the conductive member moves along the space formed by the first insulating member and the third contact and toward the fourth contact to make the conductive member contact the fourth contact. In this case, the conductive member is isolated from the fourth contact by the first insulating member, which can reduce the risk of mis-conducting the switch module due to the possible undesired deformation of the conductive member.
[0011] In addition, in the sensor control device of the present invention, optionally, at least a portion of the trigger portion is a tapered geometric body. In this case, the conductive member can be squeezed with a relatively concentrated pressure, so that the corresponding portion of the conductive member is preferentially moved toward the fourth contact so that the portion contacts the fourth contact.
[0012] In addition, in the sensor control device of the utility model, optionally, the insulating medium between the fourth contact and the conductive member is in a gaseous state, and when the trigger unit squeezes the conductive member, the conductive member moves toward the fourth contact so that the conductive member contacts the fourth contact. In this case, the conductive member can be easily contacted with the fourth contact by the gaseous insulating medium, and the implementation process is simpler than setting an insulating medium in other forms.
[0013] In addition, in the sensor control device involved in the present invention, optionally, the electronic device also includes a processing module, the switch module is arranged between the power module and the processing module, and when the switch module is in the closed state, the processing module is connected to the power module; or the electronic device also includes a processing module and a power controller, the processing module includes a processing controller, the power module is respectively connected to the power controller and the processing module, the switch module is arranged between the power module and the power controller, and when the switch module is in the closed state, the power controller is connected to the power module to change the input of the processing controller, and when the input of the processing controller changes, the processing module Start working, when the processing module starts working, the processing controller locks the power state of the power module; or the electronic device also includes a processing module and a power controller connected to the power module, the processing module includes a processing controller, the processing module is connected to the power module through the power controller, the switch module is arranged between the power module and the power controller, when the switch module is in the closed state, the power controller turns on the power module to change the input of the power controller, when the input of the power controller changes, the power module starts to supply power to the processing module through the power controller, when the processing module is powered on, the processing controller locks the power controller. In this case, the switch module is arranged between the power module and the processing module, which can simplify the control of the power module. In addition, the power module is connected to the power controller and the processing module respectively, and the power controller is used to change the input of the processing controller, so that the processing module starts working, which helps to control the power module from being affected by the power controller when in use. In addition, the switch module is arranged between the power module and the power controller, and the power controller is used as an intermediate device to control the power module to supply power to the processing module, which helps to avoid wrong shutdown when in use by locking the power controller and the circuit design is relatively simple.
[0014] In addition, in the sensor control device of the utility model, optionally, the switch module is arranged in a space formed by the plurality of second contacts, and the trigger part is arranged in a space formed by the plurality of conductive parts. Thus, it is convenient to make the trigger part contact and press the switch module when the sensor component and the electronic component are connected.
[0015] In addition, in the sensor control device of the present invention, optionally, the trigger part is made of insulating material, thereby reducing the risk of mis-activating other devices during the process of squeezing the switch module.
[0016] In addition, in the sensor control device of the utility model, optionally, the connection assembly further comprises a support portion for supporting the connector, the trigger portion passes through the sealing portion and is fixed to the support portion, and the hardness of the support portion is greater than the hardness of the sealing portion. In this case, the support portion can increase the pressure of the trigger portion squeezing the switch module, thereby facilitating the deformation of the switch module.
[0017] According to the utility model, a sensor control device capable of prolonging the service life of a power supply is provided. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The present invention will now be explained in further detail by way of example only with reference to the accompanying drawings.
[0019] Figure 1 It is a schematic diagram showing the monitoring environment of glucose concentration involved in the example of the present utility model.
[0020] Figure 2 Detailed description of the invention is given in detail below.
[0021] Figure 3 It is a schematic diagram showing the assembly of the electronic components and the connection components involved in the example of the utility model.
[0022] Figure 4 It is a schematic diagram showing the structure of the sensor assembly involved in the example of the utility model.
[0023] Figure 5A It is a schematic diagram showing the structure of the electronic components involved in the example of the utility model.
[0024] Figure 5B It is a schematic diagram showing the assembly of the electronic components involved in the example of the utility model.
[0025] Fig. 6A It shows that along Figure 5A FIG. 2 is a cross-sectional schematic diagram of a first embodiment of a switch module of AA′ shown in FIG.
[0026] Figure 6B It shows that along Figure 5A FIG. 2 is a schematic cross-sectional view of a second embodiment of a switch module AA′ shown in FIG.
[0027] Figure 7 Schematic diagram showing the connection components involved in the example of the present utility model.
[0028] Figure 8 Schematic diagram showing a connector according to an example of the present invention.
[0029] Fig. 9AThis is a schematic diagram showing a first embodiment of the shape of a trigger portion according to an example of the present invention.
[0030] Fig. 9B It is a schematic diagram which shows the 2nd Embodiment of the shape of the trigger part which concerns on Example of this invention.
[0031] Fig. 10A 1 is a schematic diagram showing a first embodiment of controlling a target circuit by a switch module according to an example of the present invention.
[0032] Fig. 10B This is a schematic diagram showing a second embodiment of controlling a target circuit by a switch module according to an example of the present invention.
[0033] Fig. 10C This is a schematic diagram showing a third embodiment of controlling a target circuit by a switch module according to an example of the present invention. DETAILED DESCRIPTION
[0034] Hereinafter, with reference to the accompanying drawings, the preferred embodiments of the present utility model are described in detail. In the following description, the same symbols are given to the same components, and repeated descriptions are omitted. In addition, the accompanying drawings are only schematic diagrams, and the ratio of the dimensions of the components to each other or the shapes of the components, etc. may be different from the actual ones. It should be noted that the terms "including" and "having" in the present utility model and any variations thereof, such as the process, method, system, product or device of a series of steps or units included or possessed are not necessarily limited to those steps or units clearly listed, but may include or have other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0035] First, the relevant terms involved in the present utility model are introduced.
[0036] "Mechanical switch" can refer to a device that makes a circuit close or open through physical mechanical means. The on-off mode of a mechanical switch is to make the corresponding components contact or separate through external force (for example, through the extrusion of the trigger part involved in the utility model). In addition, closing a circuit through a mechanical switch can be called mechanical conduction.
[0037] A sensor control device involved in the example of the present utility model can be used to collect signals related to analyte levels (hereinafter referred to as analyte signals), and can improve the service life of the power supply through the switch module and the trigger unit. The sensor control device is hereinafter referred to as the control device. The control device involved in the example of the present utility model can also be called a medical device or an analyte monitoring device, etc.
[0038] In some examples, when the analyte is glucose, the sensor component may be a glucose sensor, and the analyte level may be a glucose concentration. However, it may not be limited to the glucose concentration. For example, by changing the sensor component, other body fluid components other than the glucose concentration may also be obtained. The body fluid components here may be, for example, one or more of glucose, acetylcholine, amylase, bilirubin, cholesterol, chorionic gonadotropin, creatine kinase, creatine, creatinine, DNA, fructosamine, glutamine, growth hormone, hormone, ketone body, lactate, oxygen, peroxide, prostate specific antigen, prothrombin, RNA, thyroid stimulating hormone, or troponin.
[0039] For the convenience of description, some examples are described below using glucose as the analyte, and accordingly, the analyte level is the glucose concentration. It should be noted that this does not limit the present invention, and unless there is a contradiction, the relevant description is also applicable to other analyte levels.
[0040] Examples of the present utility model will be described in detail below with reference to the accompanying drawings. Figure 1 It is a schematic diagram showing the monitoring environment of glucose concentration involved in the example of the present utility model.
[0041] refer to Figure 1 , the monitoring environment may include a control device 100 and a receiving device 900. The control device 100 may be configured to obtain the analyte information of the host. The receiving device 900 may be configured to receive the analyte information and process and / or display the analyte information. In some examples, the control device 100 may be coupled to the receiving device 900. In some examples, the control device 100 may be directly or indirectly communicatively coupled to the receiving device 900. The control device 100 may be communicatively coupled to the receiving device 900 via one or more communication links. For example, the communication link may include at least one of a proprietary wireless protocol, a wired communication link (e.g., serial communication), and a wireless communication link (e.g., Bluetooth). In other examples, the control device 100 may also operate as an independent device and have a receiving device 900 integrated within itself.
[0042] Figure 2 1 is an exemplary block diagram showing a control device 100 according to an example of the present invention. Figure 3 It is a schematic diagram showing the assembly of the electronic component 120 and the connection component 130 involved in the example of the present utility model.
[0043] refer to Figure 2In some examples, the control device 100 may include a sensor component 110, an electronic component 120, and a connection component 130. The sensor component 110 may be used to measure an analyte signal, the electronic component 120 may be used to receive the analyte signal, and the connection component 130 may be used to connect the sensor component 110 and the electronic component 120.
[0044] In some examples, at least a portion of the sensor assembly 110 may be implanted under the skin of the host, the electronic assembly 120 may be adhered to the body surface of the host, and at least a portion of the sensor assembly 110 may be electrically connected to the electronic assembly 120 via the connection assembly 130. In some examples, the sensor assembly 110 may be detachably assembled to the electronic assembly 120 via the connection assembly 130. In this case, the connection assembly 130 and the electronic assembly 120 may be packaged separately before the connection assembly 130 is assembled to the electronic assembly 120, so as to facilitate sterilization of the sensor assembly 110 and the electronic assembly 120 in different ways.
[0045] In addition, the connection component 130 can be mounted inside or outside the electronic component 120. In some examples, the connection component 130 can be mounted on a receiving portion 122 (described later) of the electronic component 120, and the receiving portion 122 can be located inside or outside the electronic component 120. For example, the receiving portion 122 can be located on the outer surface or inner surface of a device housing 123 (described later) of the electronic component 120.
[0046] In some examples, the receiving portion 122 located outside the electronic component 120 can facilitate the removal of the sensor component 110 from the outside of the electronic component 120, which is applicable to an integrated electronic component 120. Figure 3 The example in which the receiving portion 122 is a cavity outside the electronic component 120 is shown, and it should be noted that it does not limit the present invention. In some examples, the receiving portion 122 located inside the electronic component 120 can facilitate the removal of the sensor component 110 when the electronic component 120 is opened, which is suitable for a split electronic component 120.
[0047] Figure 4 Schematic diagram showing the structure of the sensor assembly 110 involved in the example of the present utility model.
[0048] refer to Figure 4 In some examples, the sensor assembly 110 may include a distal portion 111 and a proximal portion 112. The distal portion 111 may be used to measure an analyte signal, and the proximal portion 112 may be used to receive an analyte signal. The proximal portion 112 may be connected to the distal portion 111.
[0049] In some examples, distal portion 111 can be connected to electronic assembly 120 via proximal portion 112. In some examples, distal portion 111 can be placed under the skin of a host.
[0050] In some examples, the distal portion 111 may include a plurality of electrodes. In some examples, the plurality of electrodes may include a working electrode and a counter electrode. In some examples, for a glucose sensor, a sensing layer including a glucose enzyme may be provided on the working electrode, and the distal portion 111 placed subcutaneously may undergo an oxidation-reduction reaction with glucose in the body fluid through the glucose enzyme on the working electrode, and form a loop with the counter electrode to generate a current signal (i.e., one of the analyte signals). In some examples, the current signal may be processed to obtain glucose concentration information.
[0051] In some examples, the plurality of electrodes of the distal portion 111 may further include a reference electrode. In some examples, the reference electrode may form a known and fixed potential difference with the body fluid. In this case, the potential difference between the working electrode and the body fluid is measured by the potential difference formed by the reference electrode and the working electrode, thereby being able to more accurately obtain the voltage generated by the working electrode.
[0052] refer to Figure 4 In some examples, the proximal portion 112 may have a first contact 1121, and the first contact 1121 may be used to connect to the electronic component 120. In some examples, the proximal portion 112 may be connected to the electronic component 120 through the connecting component 130. In some examples, the first contact 1121 may be in the shape of a disk.
[0053] In some examples, the sensor assembly 110 may be made of a flexible material, thereby being able to better adapt to various environments (eg, deployment environments).
[0054] In some examples, a portion of the sensor assembly 110 may be accommodated in the puncture member, so that the sensor assembly 110 can be guided to be implanted under the skin of the host through the puncture member. In some examples, the puncture member may be installed in the connection assembly 130.
[0055] Figure 5A Schematic diagram showing the structure of the electronic component 120 involved in the example of the present utility model. Figure 5B 1 is a schematic diagram showing the assembly of the electronic component 120 involved in the example of the present utility model.
[0056] As described above, in some examples, the electronics assembly 120 can receive the analyte signal measured by the sensor assembly 110. As an example, Figure 5A 1 is a schematic diagram showing the electronic component 120 with the mounting space of the connection component 130 being located outside.
[0057] refer to Figure 5B In some examples, the electronic assembly 120 may include an electronic device 121. The electronic device 121 may be configured to receive, process and / or transmit the analyte signal. In some examples, the electronic device 121 may be a PCB (Printed Circuit Board).
[0058] refer to Figure 5A and 5B In some examples, the electronic device 121 may include a second contact 1211. The second contact 1211 may be used to connect with the first contact 1121 of the sensor assembly 110. In some examples, the number of the second contacts 1211 and the number of the first contacts 1121 may be the same.
[0059] Continue to refer Figure 5B In some examples, the electronic device 121 may include a power module 1212. The power module 1212 may provide electrical energy.
[0060] In some examples, the electronic device 121 may include a processing module 1213. The processing module 1213 may be configured to receive an analyte signal. In some examples, the processing module 1213 may also be configured to further process the analyte signal. In some examples, the processing module 1213 may also be configured to transmit the received analyte signal to the receiving device 900.
[0061] In some examples, the processing module 1213 may include a processing controller 12131 (described later). In some examples, the processing controller 12131 may control the power module 1212. In some examples, the processing controller 12131 may cooperate with the power controller 1215 (described later) to control the power module 1212.
[0062] Continue to refer Figure 5A and 5B In some examples, the electronic device 121 may include a switch module 1214. The switch module 1214 may be connected to the power module 1212. Thus, the switch module 1214 can control the power module 1212. In some examples, the switch module 1214 may control the power module 1212 to supply power to the processing module 1213. Specifically, the switch module 1214 may enable the power module 1212 to provide power to the processing module 1213 or stop the power module 1212 from providing power to the processing module 1213.
[0063] In some examples, the switch module 1214 may have an open state and a closed state. In some examples, the state of the switch module 1214 may be controlled by the trigger unit 132 (described later). In some examples, the initial state of the switch module 1214 may be an open state. In some examples, under the action of the trigger unit 132, the switch module 1214 may be switched from the initial open state to the closed state. In some examples, when the switch module 1214 is in the closed state, the sensor assembly 110 and the electronic assembly 120 may be electrically connected.
[0064] In some examples, the switch module 1214 may be a mechanical switch. That is, the switch module 1214 may implement a switch function based on a physical mechanical form. In this case, mechanical conduction can reduce leakage current, thereby increasing the service life of the power supply. In addition, compared to using semiconductor devices to control power conduction, it is not dependent on devices that cooperate with semiconductor devices (such as magnets), which helps to reduce costs.
[0065] Fig. 6A It shows that along Figure 5A FIG. 2 is a cross-sectional view of the switch module 1214 of the first embodiment shown in FIG. Figure 6B It shows that along Figure 5A FIG. 2 is a cross-sectional view of the switch module 1214 of the second embodiment shown in FIG.
[0066] refer to Fig. 6A In some examples, the switch module 1214 may include a third contact 12141, a fourth contact 12142, and a conductive member 12143. The third contact 12141 and the fourth contact 12142 may physically disconnect the circuit between the device requiring electric energy and the power module 1212. For example, the third contact 12141 and the fourth contact 12142 may physically disconnect a portion of the circuit between the processing module 1213 and the power module 1212. The conductive member 12143 may close the physically disconnected circuit by physically contacting the third contact 12141 and the fourth contact 12142. In some examples, if the conductive member 12143 conducts the third contact 12141 and the fourth contact 12142, the power module 1212 may start to provide electric energy to the processing module 1213. The third contact 12141 and the fourth contact 12142 of the switch module 1214 are collectively referred to as switch contacts hereinafter.
[0067] In some examples, when the switch module 1214 is in the off state, at least one of the switch contacts of the switch module 1214 may not contact the conductive member 12143. In some examples, the third contact 12141 and / or the fourth contact 12142 that are not in contact with the conductive member 12143 may be isolated from the conductive member 12143 by an insulating medium. That is, the contacts that do not need to contact the conductive member 12143 may be isolated from the conductive member 12143 by the insulating medium.
[0068] In some examples, the insulating medium may be in a gaseous or solid state, thereby facilitating the isolation of the contact and the conductive member 12143. For example, the gaseous insulating medium may be air.
[0069] In some examples, the switch module 1214 can be squeezed by the trigger portion 132 to put the switch module 1214 in a closed state. In some examples, the switch module 1214 can be disposed near the second contact 1211. Thus, it is helpful to squeeze the switch module 1214 to put the switch module 1214 in a closed state when the conductive portion 1311 and the second contact 1211 are in contact. In some examples, the switch module 1214 can be disposed near the second contact 1211 and related to the position of the trigger portion 132.
[0070] In some examples, the switch module 1214 can be disposed in a space formed by the plurality of second contacts 1211. Thus, it is convenient to contact the trigger portion 132 disposed in the space formed by the plurality of conductive portions 1311. In addition, when the trigger portion 132 is disposed in the space formed by the plurality of conductive portions 1311, it is also convenient to make the trigger portion 132 contact and squeeze the switch module 1214 when the sensor component 110 and the electronic component 120 are connected. In some examples, the switch module 1214 can also be disposed around the space formed by the plurality of second contacts 1211.
[0071] In some examples, when the switch module 1214 is in the open state, the third contact 12141 may be connected to the conductive member 12143, and the fourth contact 12142 may not be in contact with the conductive member 12143. In this case, the switch module 1214 can be in a closed state by making the conductive member 12143 contact the fourth contact 12142, which helps to simplify the conduction of the switch module 1214. In some examples, when the trigger part 132 squeezes the conductive member 12143, the conductive member 12143 may contact the fourth contact 12142. Thus, the switch module 1214 can be in a closed state.
[0072] refer to Fig. 6AIn some examples, when the switch module 1214 is in the disconnected state, the third contact 12141 may be connected to the conductive member 12143, the fourth contact 12142 may not be in contact with the conductive member 12143, and the insulating medium therebetween may be in a gaseous state, and when the triggering portion 132 squeezes the conductive member 12143, the conductive member 12143 may move toward the fourth contact 12142 to make the conductive member 12143 contact the fourth contact 12142. In this case, the conductive member 12143 can be easily contacted with the fourth contact 12142 by the gaseous insulating medium, and the implementation process is simpler than setting an insulating medium in other forms.
[0073] For example, refer to Fig. 6A , the trigger portion 132 can press the conductive member 12143 downward along the extrusion direction D and contact the fourth contact 12142, wherein the insulating area A can be filled with air.
[0074] refer to Figure 6B In some examples, when the switch module 1214 is in the disconnected state, the third contact 12141 may be connected to the conductive member 12143, the fourth contact 12142 may not be in contact with the conductive member 12143, and the insulating medium therebetween may be in a solid state.
[0075] Specifically, the switch module 1214 may include a first insulating member 12144, which may be disposed between the conductive member 12143 and the fourth contact 12142 and support the conductive member 12143. When the triggering portion 132 presses the conductive member 12143, the conductive member 12143 may move along the space formed by the first insulating member 12144 and the third contact 12141 and toward the fourth contact 12142 so that the conductive member 12143 contacts the fourth contact 12142. That is, the pressing of the triggering portion 132 may cause the conductive member 12143 to deform downward along the space supported by the first insulating member 12144 and contact the fourth contact 12142. In this case, the conductive member 12143 is isolated from the fourth contact 12142 by the first insulating member 12144, so that the risk of mis-conducting the switch module 1214 may be reduced due to the unexpected deformation of the conductive member 12143.
[0076] For example, refer to Figure 6B The trigger portion 132 can squeeze the conductive member 12143 downward along the extrusion direction D, so that the conductive member 12143 is deformed, and after breaking away from the support of the first insulating member 12144, it moves toward the fourth contact 12142 along the side of the first insulating member 12144 close to the third contact 12141, and then contacts the fourth contact 12142.
[0077] In some examples, the hardness of the first insulating member 12144 may be lower than the hardness of the triggering portion 132. In this case, the first insulating member 12144 is easy to deform, so that the conductive member 12143 can move along the first insulating member 12144. For example, the material of the first insulating member 12144 may be a foam material or a plastic with low hardness. In some examples, the first insulating member 12144 may also be formed by dispensing and curing.
[0078] In some examples, when the switch module 1214 is in the open state, the conductive member 12143 may not contact the third contact 12141 and the fourth contact 12142. Specifically, the third contact 12141 may not contact the conductive member 12143, and the fourth contact 12142 may not contact the conductive member 12143. In this case, both contacts are not in contact with the conductive member 12143, which helps to reduce the possibility of mis-activating the switch module 1214 when the control device 100 is not in use. In some examples, when the trigger portion 132 squeezes the conductive member 12143, the conductive member 12143 may contact the third contact 12141 and the conductive member 12143 may contact the fourth contact 12142. Thus, the switch module 1214 can be in a closed state.
[0079] In some examples, two insulating members may be provided so that the conductive member 12143 does not contact the third contact 12141 and the fourth contact 12142. Specifically, the switch module 1214 may include a second insulating member and a third insulating member, the second insulating member may be provided between the conductive member 12143 and the third contact 12141, the third insulating member may be provided between the conductive member 12143 and the fourth contact 12142, the second insulating member and the third insulating member may support the conductive member 12143, and when the triggering portion 132 presses the conductive member 12143, the conductive member 12143 may move along the space formed by the second insulating member and the third insulating member and toward the third contact 12141 and the fourth contact 12142 to make the conductive member 12143 contact the third contact 12141 and the fourth contact 12142.
[0080] In some examples, the spatial relationship between the switch contact and the conductive member 12143 may be arranged along the direction in which the connecting component 130 is installed into the electronic component 120. Thus, the assembly process of the control device 100 can be fully utilized to realize the state switching of the switch module 1214.
[0081] In some examples, the switch contacts may be made of a flexible conductive material, such as conductive silicone.
[0082] In some examples, the conductive member 12143 may have elasticity or plasticity, so that it is easy to deform after being compressed to connect the corresponding contacts. For example, the conductive member 12143 may be a thin metal sheet or a spring.
[0083] As described above, a portion of the switch contacts may be connected to the conductive member 12143. In some examples, the switch contacts may be connected to the conductive member 12143 by welding. In some examples, the switch contacts may be integrated with the conductive member 12143.
[0084] Return to reference Figure 5B In some examples, the electronic device 121 may include a power controller 1215 . The power controller 1215 may cooperate with the switch module 1214 to control the power module 1212 .
[0085] In some examples, the electronic device 121 may further include a sampling module. The sampling module may be configured to sample electrode signals of the sensor assembly 110. In some examples, the electronic device 121 may further include a wireless communication module. The wireless communication module may be configured to communicate with an external device (e.g., the receiving device 900) to achieve wireless data transmission.
[0086] Continue to refer Figure 5B In some examples, the electronic component 120 may include a receiving portion 122, and the receiving portion 122 may be used to accommodate the connection component 130. In some examples, the receiving portion 122 may be a concave cavity outside the electronic component 120 (see Figure 5A In some examples, the receiving portion 122 may be a receiving cavity inside the electronic component 120. In some examples, the receiving portion 122 may be formed in a device housing 123 (described later). That is, the device housing 123 may form a space that can receive the connection component 130.
[0087] In some examples, the receiving portion 122 may be a concave cavity formed outside the device housing 123. In some examples, the concave cavity may be formed by being recessed in the device housing 123 in the thickness direction of the device housing 123 (see Figure 5A ). In some examples, a locking structure that cooperates with the support portion 133 of the connection component 130 may be provided on the edge of the cavity. In some examples, the second contact 1211 of the electronic device 121 may be located in the cavity.
[0088] In some examples, the receiving portion 122 may be a receiving cavity disposed inside the device housing 123. In some examples, the receiving cavity may be disposed on a lower surface inside the device housing 123. In some examples, the device housing 123 may include a base and an upper cover combined to the base, and the receiving portion 122 may be formed on an inner surface of the base. In some examples, for the receiving cavity disposed in the device housing 123, the connecting component 130 is accommodated in the receiving portion 122 and the upper cover is combined with the base (that is, the electronic component 120 is closed) to electrically connect the sensor component 110 to the electronic component 120. That is, when the connecting component 130 is accommodated in the receiving portion 122 and the upper cover is combined with the base, the sensor component 110 may be electrically connected to the electronic component 120. In some examples, the second contact 1211 of the electronic device 121 may be located on a surface of the electronic device 121 opposite to the receiving cavity.
[0089] Continue to refer Figure 5B In some examples, the electronic assembly 120 may include a device housing 123 . The device housing 123 may be used to accommodate the electronic device 121 . That is, the electronic device 121 may be disposed inside the device housing 123 .
[0090] Return to reference Figure 5A In some examples, the electronic component 120 may include a first engagement hole 124 extending from the upper surface to the lower surface, and when the sensor component 110 is assembled to the electronic component 120, the axis of the sensor component 110 may pass through the first engagement hole 124. In this case, the puncture member is inserted into the subcutaneous tissue through the first engagement hole 124, which helps to place the sensor component 110 under the skin. In some examples, when the receiving portion 122 is a receiving cavity provided in the device housing 123, the first engagement hole 124 may not be necessary.
[0091] In some examples, the side of the electronic component 120 that contacts the skin may be provided with adhesive backing, thereby facilitating the electronic component 120 to adhere to the host's skin surface.
[0092] Figure 7 Schematic diagram showing a connection assembly 130 according to an example of the present invention. Figure 8 1 is a schematic diagram showing a connector 131 according to an example of the present invention.
[0093] As described above, in some examples, the connection component 130 can be used to provide an electrical connection between the sensor component 110 and the electronic component 120. Figure 7 In some examples, the connection assembly 130 may include a connector 131, which may be used to provide an electrical connection between the sensor assembly 110 and the electronic assembly 120. In some examples, the connector 131 may also provide a waterproof seal.
[0094] refer to Figure 8 In some examples, the connector 131 may include a conductive portion 1311 and a sealing portion 1312, wherein the conductive portion 1311 may realize electrical connection between the sensor component 110 and the electronic component 120, and the sealing portion 1312 may realize waterproof sealing of a portion of the conductive portion 1311 that does not require electrical connection. In some examples, the sealing portion 1312 may also realize electrical insulation of a portion of the conductive portion 1311 that does not require electrical connection.
[0095] In some examples, the conductive portion 1311 can be used to connect the first contact 1121 and the second contact 1211. In some examples, the conductive portion 1311 can have an end 1311a protruding from the surface of the sealing portion 1312. In some examples, the two ends 1311a of the conductive portion 1311 can contact with a corresponding number of first contacts 1121 and a corresponding number of second contacts 1211, respectively.
[0096] In some examples, for the conductive part 1311 made of elastic material, the end 1311a of the conductive part 1311 can be higher than the sealing ring 13121a (described later) of the sealing part 1312. In this case, when the sealing part 1312 is in a compressed state, the conductive part 1311 is compressed and deformed, which can improve the tightness of the end 1311a of the conductive part 1311 and the electronic component, thereby improving the reliability of the electrical connection.
[0097] In some examples, the number of the conductive parts 1311 may be multiple. For example, the number of the conductive parts 1311 may be 2, 3, or 4. Figure 8 In the illustrated embodiment, the number of the conductive portions 1311 is 3. However, the example of the present embodiment is not limited thereto, and the number of the conductive portions 1311 may be the same as the number of the first contacts 1121 of the sensor assembly 110. That is, the plurality of conductive portions 1311 may correspond to the plurality of first contacts 1121. In some examples, the conductive portion 1311 may be columnar.
[0098] As described above, the connector 131 may include a sealing portion 1312. Figure 8 In some examples, the sealing portion 1312 may at least partially surround the conductive portion 1311. In some examples, the sealing portion 1312 may surround a portion of the conductive portion 1311 that does not need to be electrically connected to provide a waterproof seal and / or electrical insulation.
[0099] In some examples, the sealing portion 1312 may include a first seat 13121, and the first seat 13121 may at least partially surround the conductive portion 1311 to expose the end 1311a of the conductive portion 1311. In some examples, the periphery of the first seat 13121 may have a sealing ring 13121a that is higher than the exposed surface of the conductive portion 1311. That is, the outer ring of the first seat 13121 has a raised fence. In some examples, two sealing rings 13121a may be respectively provided at both ends of the first seat 13121. Thereby, waterproof sealing can be provided for the corresponding electronic components at both ends.
[0100] In some examples, when the sensor assembly 110 is electrically connected to the electronic assembly 120, the first seat 13121 with the sealing ring 13121a can provide a waterproof seal for the second contact 1211. In some examples, the first seat 13121 with the sealing ring 13121a can also provide a waterproof seal for the first contact 1121.
[0101] Continue to refer Figure 8 In some examples, the sealing portion 1312 may further include a second seat body 13122. In some examples, the first seat body 13121 and the second seat body 13122 may provide a housing space for the proximal portion 112 of the sensor assembly 110. In some examples, the proximal portion 112 of the sensor assembly 110 may be located between the first seat body 13121 and the second seat body 13122.
[0102] In some examples, the first seat body 13121 having the sealing ring 13121a and the second seat body 13122 can cooperate to provide a waterproof seal for the first contact 1121.
[0103] In some examples, the sealing portion 1312 may further include a seat body connecting portion 13123 , and the seat body connecting portion 13123 may be used to connect the first seat body 13121 and the second seat body 13122 .
[0104] In some examples, the sealing portion 1312 may further include an extension portion, which may extend outward along the side wall of the sealing portion 1312 near the proximal portion 112 of the sensor assembly 110. In some examples, the extension portion has a through hole, which may be used to cooperate with a protrusion of a fixing component to fix the connection component 130. In addition, the fixing component may be such that the connector 131 is disposed on the support portion 133 (described later).
[0105] In some examples, the conductive portion 1311 may be made of a first material, and the sealing portion 1312 may be made of a second material, where the first material is different from the second material.
[0106] In some examples, the first material may include a conductive substance. In some examples, the first material may include silica gel and a conductive substance. In some examples, the first material may be made by adding a conductive substance to silica gel.
[0107] In some examples, the second material may be a non-conductive material. In some examples, the second material may be a non-conductive elastic material. That is, the sealing portion 1312 may be made of a non-conductive elastic material. In this case, the sealing portion 1312 made of an elastic material has the property of being deformed under pressure, which can improve the tightness of the fit with the relevant contact surface of the electronic component, thereby improving the sealing effect. In some examples, the second material may be a non-conductive silicone.
[0108] Return to reference Figure 7 In some examples, the connection component 130 may include a trigger portion 132. The trigger portion 132 may be used to control the state of the switch module 1214. In some examples, the trigger portion 132 may contact and squeeze the switch module 1214 to put the switch module 1214 in a closed state when the conductive portion 1311 and the second contact 1211 are in contact. In this case, the switch module 1214 is a mechanical switch based on a physical mechanical form, and the switch module 1214 is in a closed state by using the conductive portion 1311 and the second contact 1211 to contact, which helps to achieve mechanical conduction while maintaining the existing structure of the control device 100.
[0109] As described above, in some examples, the trigger portion 132 may press the conductive member 12143 to move the conductive member 12143 toward the fourth contact 12142, thereby causing the conductive member 12143 to contact the fourth contact 12142. In some examples, the trigger portion 132 may press the conductive member 12143 to move the conductive member 12143 along the space formed by the first insulating member 12144 and the third contact 12141 toward the fourth contact 12142, thereby causing the conductive member 12143 to contact the fourth contact 12142. In some examples, the trigger portion 132 may press the conductive member 12143, thereby causing the conductive member 12143 to contact the third contact 12141 and the conductive member 12143 to contact the fourth contact 12142.
[0110] In some examples, the trigger portion 132 may be disposed on the connector 131. In some examples, the trigger portion 132 may be disposed on the sealing portion 1312. In this case, it is possible to facilitate the control of the switch module 1214 during the process of the connection component 130 connecting the sensor component 110 and the electronic component 120, and further help to achieve mechanical conduction while maintaining the existing structure of the control device 100 (for example, maintaining the product complexity and size basically unchanged). In some examples, at least a portion of the trigger portion 132 may protrude from the surface of the sealing portion 1312 away from the sensor component 110 (refer to Figure 7 In this case, on the one hand, the sealed space formed by the sealing portion 1312 can be used to provide a waterproof seal, and on the other hand, it is convenient to put the switch module 1214 in a closed state when the sensor component 110 and the electronic component 120 are assembled.
[0111] In some examples, the trigger portion 132 may be disposed on a surface of the sealing portion 1312 that is away from the sensor assembly 110. In some examples, the trigger portion 132 may penetrate the sealing portion 1312 and protrude from a surface of the sealing portion 1312 that is away from the sensor assembly 110.
[0112] In some examples, the trigger portion 132 may be disposed on the connector 131 and fixed to the support portion 133 (described later). In some examples, the trigger portion 132 may penetrate the sealing portion 1312 and be fixed to the support portion 133. Specifically, the trigger portion 132 may penetrate the sealing portion 1312, wherein one end of the trigger portion 132 may protrude from the surface of the sealing portion 1312 away from the sensor assembly 110, and the other end may be fixed to the support portion 133. In this case, the hardness of the support portion 133 is generally large, and the pressure of the trigger portion 132 pressing the switch module 1214 can be increased through the support portion 133, thereby facilitating the deformation of the switch module 1214.
[0113] In some examples, when the trigger portion 132 penetrates the sealing portion 1312, the sensor assembly 110 can avoid the trigger portion 132. For example, the proximal portion 112 can avoid the axis of the trigger portion 132 or the proximal portion 112 can have an avoidance space so that the axis of the trigger portion 132 passes through the avoidance space. In some examples, the avoidance space can be an avoidance hole.
[0114] Continue to refer Figure 7 In some examples, the trigger part 132 may be located in the space formed by the plurality of conductive parts 1311. Thus, the structure of the connection component 130 can be made compact. In some examples, the trigger part 132 may also be located outside the space formed by the plurality of conductive parts 1311. For example, the trigger part 132 may be located around the space formed by the plurality of conductive parts 1311.
[0115] In some examples, the trigger portion 132 may be made of an insulating material, thereby reducing the risk of mis-activating other devices during the process of squeezing the switch module 1214 .
[0116] In some examples, the hardness of the trigger portion 132 may be greater than the hardness of the conductive member 12143 of the switch module 1214. This helps to form sufficient deformation when the conductive member 12143 is squeezed.
[0117] Fig. 9A 1 is a schematic diagram showing a first embodiment of the shape of the trigger unit 132 according to the example of the present invention. Fig. 9B 1 is a schematic diagram showing a second embodiment of the shape of the trigger portion 132 according to the example of the present invention. In order to better describe the shape of the trigger portion 132, Fig. 9A and Fig. 9B A part of the structure of the connector 131 is also included.
[0118] In addition, the shape of the trigger portion 132 can be any shape that can squeeze the switch module 1214 to move at least a portion of the switch module 1214 toward a desired direction, thereby placing the switch module 1214 in a closed state.
[0119] In some examples, at least a portion of the trigger portion 132 may include a square geometric shape (see Fig. 9A ) and tapered geometry (reference Fig. 9B In some examples, at least a portion of the trigger portion 132 may be one end of the trigger portion 132.
[0120] For example, the square geometry may be a cube or a cuboid. In addition, the tapered geometry may have a feature of a wider bottom gradually transitioning to a narrower top. That is, the tapered geometry may have a tapered feature from wide to narrow. For example, the tapered geometry may be a conical structure or a wedge-shaped structure.
[0121] In some examples, the shape of at least a portion of the triggering portion 132 may be set according to the structure of the switch module 1214. To this end, the present invention further provides some examples.
[0122] As described above, in some examples, the trigger portion 132 can squeeze the conductive member 12143 so that the conductive member 12143 can move toward the fourth contact 12142, thereby making the conductive member 12143 contact the fourth contact 12142. Preferably, at least a portion of the trigger portion 132 can be a square geometric body. In this case, the conductive member 12143 can be squeezed with a relatively uniform pressure, so that the conductive member 12143 can move toward the fourth contact 12142 as a whole, thereby increasing the possibility of contacting the fourth contact 12142.
[0123] In some examples, the trigger portion 132 can squeeze the conductive member 12143 so that the conductive member 12143 moves along the space formed by the first insulating member 12144 and the third contact 12141 and toward the fourth contact 12142, thereby making the conductive member 12143 contact the fourth contact 12142. Preferably, at least a portion of the trigger portion 132 can be a tapered geometry. In this case, the conductive member 12143 can be squeezed with a relatively concentrated pressure, so that the corresponding portion of the conductive member 12143 is preferentially moved toward the fourth contact 12142 so that the portion is in contact with the fourth contact 12142.
[0124] In some examples, the trigger portion 132 can squeeze the conductive member 12143 so that the conductive member 12143 contacts the third contact 12141 and the conductive member 12143 contacts the fourth contact 12142. Preferably, at least a portion of the trigger portion 132 can be a square geometric body. In this case, the conductive member 12143 can be squeezed with a relatively uniform pressure, so that the conductive member 12143 moves toward the third contact 12141 and the fourth contact 12142 as a whole, thereby increasing the possibility of contacting the third contact 12141 and the fourth contact 12142.
[0125] As described above, the triggering part 132 can control the state of the switch module 1214. Specifically, when the sensor component 110 and the electronic component 120 are not assembled (for example, when the control device 100 is on a shelf), the switch module 1214 located in the electronic component 120 can be in an open state (for example, the conductive member 12143 is not in full contact with the switch contact); when the sensor component 110 is assembled with the electronic component 120 through the connecting component 130, the triggering part 132 located in the connecting component 130 can start to contact and squeeze the switch module 1214 as the connecting component 130 is assembled to the electronic component 120, and the switch module 1214 is squeezed and deformed and is in a closed state (for example, the conductive member 12143 is deformed and in full contact with the switch contact).
[0126] Return to reference Figure 7 In some examples, the connection component 130 may further include a support portion 133, and the support portion 133 may be used to support the connector 131. Specifically, the connector 131 may be accommodated in the electronic component 120 through the support portion 133. For example, the connector 131 may be accommodated in the receiving portion 122 of the electronic component 120 through the support portion 133. In some examples, the support portion 133 may at least partially surround the bottom of the connector 131.
[0127] In some examples, the support portion 133 may have a second engagement hole 1331, and the axis of the sensor assembly 110 may pass through the second engagement hole 1331. In some examples, when the connection component 130 is embedded in the electronic component 120, the first engagement hole 124 of the electronic component 120 and the second engagement hole 1331 of the support portion 133 may be communicated with each other. That is, when the connection component 130 is embedded in the electronic component 120, the axis of the distal portion 111 of the sensor assembly 110 may pass through the first engagement hole 124 of the electronic component 120 and the second engagement hole 1331 of the support portion 133.
[0128] In some examples, the support portion 133 may further include a structure capable of being fastened to the electronic component 120. Figure 7 In some examples, the support portion 133 may further include a snap-fit portion 1332 disposed around the support portion 133. In addition, the receiving portion 122 of the electronic component 120 may also be formed into a shape matching the support portion 133 to be suitable for receiving the support portion 133.
[0129] In some examples, the hardness of the support portion 133 may be greater than the hardness of the connector 131. In this case, the support portion 133 can protect the connector 131 when the connector 131 achieves some effects of a low-hardness material (eg, waterproof sealing).
[0130] In some examples, the hardness of the support portion 133 may be greater than the hardness of the sealing portion 1312 of the connector 131. In this case, when the trigger portion 132 is fixed to the support portion 133, the support portion 133 can increase the pressure of the trigger portion 132 pressing the switch module 1214, thereby facilitating the switch module 1214 to deform.
[0131] As described above, the switch module 1214 has an open state and a closed state. The switch module 1214 can control the circuit between the power module 1212 and the processing module 1213 (hereinafter referred to as the target circuit). For this reason, the utility model also provides some examples of controlling the target circuit through the switch module 1214. It should be noted that this does not limit the utility model, and the method of controlling the target circuit can be selected as needed.
[0132] Fig. 10A 1 is a schematic diagram showing a first embodiment of controlling a target circuit by a switch module 1214 according to an example of the present invention. Fig. 10B 1 is a schematic diagram showing a second embodiment of controlling a target circuit by a switch module 1214 according to an example of the present invention. Fig. 10C 1 is a schematic diagram showing a third embodiment of the present invention in which the target circuit is controlled by the switch module 1214. It should be noted that: Fig. 10A , Fig. 10B and Fig. 10C It is a schematic diagram showing a part of the connection related to the switch module 1214, and the omitted part can be set as needed.
[0133] refer to Fig. 10A In some examples, the switch module 1214 can be disposed between the processing module 1213 and the power module 1212. Thus, the control of the power module 1212 can be simplified. When the switch module 1214 is in a closed state, the processing module 1213 can connect to the power module 1212. That is, after the conductive member 12143 of the switch module 1214 is squeezed, the power module 1212 can be directly connected. In some examples, when the switch module 1214 is in an open state, the processing module 1213 can disconnect from the power module 1212.
[0134] refer to Fig. 10B and 10C In some examples, the power module 1212 and the power controller 1215 can be connected to control the target circuit through the switch module 1214.
[0135] As described above, in some examples, the processing module 1213 may include a processing controller 12131. In some examples, the processing controller 12131 may start working after detecting a change in the input of the power controller 1215. In some examples, the processing controller 12131 may also lock the power state of the power module 1212 or lock the power controller 1215. In this case, whether the processing module 1213 is powered on can be made independent of the power controller 1215 (i.e., it has no direct relationship with the state of the switch module 1214), thereby avoiding erroneous shutdown during use.
[0136] In some examples, the power controller 1215 can cause a change in the input of the processing controller 12131 of the processing module 1213. Thus, after the power controller 1215 is turned on, the processing controller 12131 can identify the state change of the power controller 1215.
[0137] refer to Fig. 10BIn some examples, the power module 1212 may be connected to the power controller 1215 and the processing module 1213 respectively, and the switch module 1214 may be provided between the power module 1212 and the power controller 1215. When the switch module 1214 is in a closed state, the power controller 1215 turns on the power module 1212 to change the input of the processing controller 12131, and when the input of the processing controller 12131 changes, the processing module 1213 starts to work. In this case, the power module 1212 is connected to the power controller 1215 and the processing module 1213 respectively, and the power controller 1215 is used to change the input of the processing controller 12131, thereby starting the processing module 1213, which helps control the control without being affected by the power controller 1215 when in use.
[0138] In some examples, the processing module 1213 starting to work may refer to the processing module 1213 being activated. For example, when the switch module 1214 is in an open state, the processing module 1213 may be in a shutdown or dormant state. When the switch module 1214 is in a closed state, the processing module 1213 may be activated through the power controller 1215 and the processing controller 12131. In some examples, when the processing module 1213 starts to work, the electronic component 120 may be electrically connected to the sensor component 110.
[0139] In some examples, when the power controller 1215 turns on the power module 1212 , the pin level of the processing controller 12131 may be pulled high, thereby causing the input of the processing controller 12131 to change.
[0140] In some examples, when the processing module 1213 starts to work, the processing controller 12131 can lock the power state of the power module 1212. That is, after the processing module 1213 starts to work, the processing controller 12131 can lock the power state to avoid accidental shutdown.
[0141] In some examples, the processing module 1213 can be connected to the power module 1212 through the power controller 1215. Fig. 10CIn some examples, the power controller 1215 may be connected to the power module 1212, the processing module 1213 may be connected to the power module 1212 through the power controller 1215, and the switch module 1214 may be provided between the power module 1212 and the power controller 1215. When the switch module 1214 is in a closed state, the power controller 1215 turns on the power module 1212 to change the input of the power controller 1215. When the input of the power controller 1215 changes, the power module 1212 may start to supply power to the processing module 1213 through the power controller 1215. In this case, the switch module 1214 is provided between the power module 1212 and the power controller 1215, and the power controller 1215 is used as an intermediate device to control the power module 1212 to supply power to the processing module 1213, which helps to avoid accidental shutdown during use by locking the power controller 1215, and the circuit design is relatively simple.
[0142] In some examples, when the power controller 1215 is connected to the power module 1212 , the pin level of the power controller 1215 may be pulled high, thereby changing the input of the power controller 1215 .
[0143] In some examples, when the processing module 1213 is powered on, the processing controller 12131 can lock the power controller 1215. That is, the processing controller 12131 can lock the power controller 1215 to avoid accidental shutdown. In this case, the power controller 1215 can be made independent of the state of the switch module 1214, thereby avoiding accidental shutdown during use.
[0144] In some examples, the processing controller 12131 can detect the state of the power controller 1215 and lock the power controller 1215 when a change in an input of the power controller 1215 is detected.
[0145] The control device 100 involved in the example of the utility model is provided with a trigger part 132 in the connection component 130, and a switch module 1214 is provided in the electronic component 120. When the sensor component 110 and the electronic component 120 are connected, the trigger part 132 contacts and squeezes the switch module 1214 to put the switch module 1214 in a closed state. In this case, the switch module 1214 implements the switch function based on the mechanical switch principle of contact and squeezing, and the state of the switch module 1214 is controlled by the trigger part 132 by cleverly utilizing the process of connecting the sensor component 110 and the electronic component 120, thereby reducing the leakage current through mechanical conduction, and further increasing the service life of the power supply. In addition, compared with using semiconductor devices to control the conduction of the power supply, it is not dependent on the device that cooperates with the semiconductor device, which helps to reduce costs.
[0146] Although the utility model is specifically described above in conjunction with the accompanying drawings and examples, it is to be understood that the above description does not limit the utility model in any form. Those skilled in the art can modify and change the utility model as needed without departing from the essential spirit and scope of the utility model, and these modifications and changes all fall within the scope of the utility model.
Claims
1. A sensor control device, characterized in that: include: A sensor component, an electronic component and a connection component; the sensor component includes a distal portion for measuring a signal related to an analyte level and a proximal portion connected to the distal portion and having a first contact, the distal portion being connected to the electronic component via the proximal portion; the electronic component includes an electronic device, a device housing for accommodating the electronic device, and a receiving portion formed in the device housing and for accommodating the connection component, the electronic device includes a second contact, a power module and a switch module connected to the power module; the connection component includes a connector and a trigger portion, the connector includes a conductive portion for connecting the first contact and the second contact and a sealing portion at least partially surrounding the conductive portion, at least a portion of the trigger portion protruding from a surface of the sealing portion away from the sensor component side, and when the conductive portion and the second contact are in contact, the trigger portion contacts and squeezes the switch module to put the switch module in a closed state.
2. The sensor control device according to claim 1, characterized in that: The switch module includes a third contact, a fourth contact and a conductive member; when the switch module is in an off state, the third contact is connected to the conductive member, and the fourth contact is not in contact with the conductive member; when the trigger portion squeezes the conductive member, the conductive member is in contact with the fourth contact.
3. The sensor control device according to claim 1, characterized in that: The switch module includes a third contact, a fourth contact and a conductive member; when the switch module is in an off state, the third contact is not in contact with the conductive member, and the fourth contact is not in contact with the conductive member; when the trigger portion squeezes the conductive member, the conductive member is in contact with the third contact and the conductive member is in contact with the fourth contact.
4. The sensor control device according to claim 2 or 3, characterized in that: The third contact and / or the fourth contact not in contact with the conductive member are isolated from the conductive member by an insulating medium, and the insulating medium is in a gaseous or solid state.
5. The sensor control device according to claim 2, characterized in that: The switch module also includes a first insulating member, which is arranged between the conductive member and the fourth contact and supports the conductive member. When the trigger portion squeezes the conductive member, the conductive member moves along the space formed by the first insulating member and the third contact and toward the fourth contact to make the conductive member contact the fourth contact.
6. The sensor control device according to claim 5, characterized in that: At least a portion of the trigger portion is a tapered geometry.
7. The sensor control device according to claim 2, characterized in that: The insulating medium between the fourth contact and the conductive member is in a gaseous state. When the trigger portion presses the conductive member, the conductive member moves toward the fourth contact so that the conductive member contacts the fourth contact.
8. The sensor control device according to claim 1, characterized in that: The electronic device further comprises a processing module, the switch module is arranged between the power module and the processing module, and when the switch module is in the closed state, the processing module switches on the power module; or The electronic device further comprises a processing module and a power controller, the processing module comprises a processing controller, the power module is connected to the power controller and the processing module respectively, the switch module is arranged between the power module and the power controller, when the switch module is in the closed state, the power controller switches on the power module to change the input of the processing controller, when the input of the processing controller changes, the processing module starts to work, when the processing module starts to work, the processing controller locks the power state of the power module; or The electronic device also includes a processing module and a power controller connected to the power module, the processing module includes a processing controller, the processing module is connected to the power module through the power controller, the switch module is arranged between the power module and the power controller, when the switch module is in the closed state, the power controller turns on the power module to change the input of the power controller, when the input of the power controller changes, the power module starts to supply power to the processing module through the power controller, and when the processing module is powered on, the processing controller locks the power controller.
9. The sensor control device according to claim 1, characterized in that: The switch module is disposed in a space formed by a plurality of the second contacts, and the trigger portion is disposed in a space formed by a plurality of the conductive portions.
10. The sensor control device according to any one of claims 1 to 3 and 5 to 9, characterized in that: The trigger part is made of insulating material.
11. The sensor control device according to any one of claims 1 to 3 and 5 to 9, characterized in that: The connection assembly further includes a supporting portion for supporting the connector, the trigger portion penetrates the sealing portion and is fixed to the supporting portion, and the hardness of the supporting portion is greater than the hardness of the sealing portion.
Citation Information
Cited By
Sensor control apparatus
WO2026007815A1