Wafer cleaning and drying device

Abstract

The utility model belongs to the technical field of wafer production, and discloses a wafer cleaning and drying device, which comprises a box body, a separator, a wafer cleaning unit and an environment control unit. A wafer to be cleaned and dried is placed in the operation chamber, and the wafer cleaning unit can spray cleaning liquid to the wafer and perform rotary spin-drying on the wafer. And the air supply assembly can supply the filtered air into the operation chamber, so that the cleanliness of the operation chamber is ensured. Meanwhile, when the wafer is cleaned and spin-dried in a rotating mode, the cover body is in a working state to block liquid drops separated from the surface of the wafer in the circumferential direction, the liquid drops are made to drop into the settling cavity, splashing of the liquid drops is avoided, and the cleanliness of the upper end face of the partition piece is ensured. Through the arrangement of the separator, the supplied air which does not directly pass through the cover body flows back to the separator and does not directly flow into the settling chamber, so that the blown pollutants are prevented from being attached to the wafer again after the part of the supplied air blows the pollutants on the bottom plate of the settling chamber, and the cleanliness of the surface of the wafer can be ensured to meet the requirement.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a wafer cleaning and drying device. Background Art

[0002] 3D IC (three-dimensional stacked chip) is a kind of high-end chip and is currently a popular development direction. It has higher requirements for wafer processing, one is thinness, which requires the wafer thickness to be processed to less than 20μm; the other is ultra-cleanliness, with a particle size requirement of 0.16μm or 0.2μm <50 particles.

[0003] Traditionally, wafers are dried by spin drying, using the centrifugal force of the rotation to remove the cleaning liquid on the surface of the wafer. However, in actual applications, water stains will still remain on the surface of the wafer, and the wafer cannot be completely dried. At the same time, any particles in the environment may still be re-adsorbed onto the surface of the wafer, resulting in failure to meet cleanliness requirements. Utility Model Content

[0004] The utility model aims to provide a wafer cleaning and drying device, which can not only clean the wafer surface, but also dry the wafer, thus simplifying the production process; at the same time, it can also ensure the cleanliness of the wafer surface and improve the output rate of qualified wafers.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] Provided is a wafer cleaning and drying device, comprising:

[0007] A box body, wherein an inner cavity is arranged in the box body;

[0008] A partition, circumferentially sealed in the box, the partition is provided with a communication hole, and the box is provided with an exhaust pipeline connected with the inner cavity;

[0009] A wafer cleaning unit is disposed in the inner cavity and is capable of spraying a cleaning liquid on the wafer in the inner cavity and rotating and drying the wafer;

[0010] The environmental control unit includes an air supply component and a cover body. The air supply component is arranged on one side of the box body and can supply air into the inner cavity. The cover body is arranged at the connecting hole. The cover body has openings at both ends. The cover body has a working state of covering the outside of the wafer.

[0011] As an optional solution for the wafer cleaning and drying device, an exhaust mechanism is provided at the exhaust pipeline, and an input end of the exhaust mechanism is connected to the exhaust pipeline to discharge the air in the inner cavity.

[0012] As an optional solution for the wafer cleaning and drying device, the bottom wall of the box body is provided with a drainage channel, and the drainage channel is configured to be connected to an external water pipe so as to be able to discharge the cleaning liquid in the box body.

[0013] As an optional solution of the wafer cleaning and drying device, the wafer cleaning unit includes:

[0014] A fixing structure, disposed in the inner cavity, capable of clamping and fixing the wafer and driving the wafer to rotate;

[0015] A first cleaning structure, disposed in the inner cavity, for cleaning the first surface of the wafer;

[0016] The second cleaning structure is arranged in the inner cavity and is used for cleaning the second surface of the wafer.

[0017] As an optional solution of the wafer cleaning and drying device, the first cleaning structure includes:

[0018] A fixed bracket, fixedly mounted on the inner wall of the box;

[0019] The rotating nozzle is rotatably disposed on the fixed bracket, and the rotating nozzle can spray cleaning liquid onto the first surface of the wafer.

[0020] As an optional solution of the wafer cleaning and drying device, the first cleaning structure includes:

[0021] A rotating bracket is rotatably arranged on the bottom wall of the box body, and has a working state of being located above the wafer and a avoiding state of avoiding above the wafer;

[0022] The fixed nozzle is fixedly arranged on a side of the rotating bracket facing the wafer.

[0023] As an optional solution of the wafer cleaning and drying device, the second cleaning structure includes:

[0024] A flow guide, the output end of which extends into the inner cavity;

[0025] A spray plate is arranged at the output end of the guide member, and the spray plate can spray the cleaning liquid or drying gas transported by the guide member to the second surface of the wafer.

[0026] As an optional solution for the wafer cleaning and drying device, a first guide channel is provided on the guide member, a second guide channel connected to the first guide channel is provided on the spray plate, and a plurality of nozzles are arranged at circumferential intervals on the spray plate, and the plurality of nozzles are all arranged at an angle and are all connected to the second guide channel.

[0027] As an optional solution of the wafer cleaning and drying device, a connecting valve is provided at the input end of the flow guide member, and the connecting valve is configured to be connected to a pipeline for conveying cleaning liquid or conveying drying gas.

[0028] As an optional solution for the wafer cleaning and drying device, the cover body is movably arranged at the connecting hole, can be raised to the working state relative to the partition, and can be moved relative to the partition to a retracted state stored at the bottom side of the partition.

[0029] Beneficial effects of the utility model:

[0030] The utility model provides a wafer cleaning and drying device, comprising a box, a partition, a wafer cleaning unit and an environmental control unit. The wafer to be cleaned and dried is placed on the wafer cleaning unit in the inner cavity, and the wafer cleaning unit can spray cleaning liquid on the wafer and rotate and dry the wafer. The air supply component can send air into the inner cavity of the box to ensure the cleanliness of the air in the inner cavity. When the wafer is rotated for cleaning and drying, the cover body is always in a working state of covering the outer side of the wafer to block the droplets detached from the surface of the wafer along the circumferential direction, so that the droplets fall to the bottom of the inner cavity, so that the droplets and pollutants on the surface of the wafer flow directly to the bottom side space of the partition, avoid the backflow of the washed droplets and pollutants in the upper side space of the partition, and ensure the cleanliness of the upper end face of the partition. At the same time, part of the air supplied to the inner cavity by the air supply component directly passes through the cover body and flows to the bottom side of the inner cavity of the box, and is finally discharged through the exhaust duct; the air supplied to the bottom side of the inner cavity of the box can perform secondary drying treatment on the wafer to achieve complete drying of the wafer.

[0031] The partition is set so that the other part of the air supply that does not directly pass through the cover body will flow to the partition instead of directly flowing to the bottom side of the inner cavity, thereby preventing the pollutants on the bottom plate of the inner cavity from being blown up by this part of the air supply and then re-attaching the blown-up pollutants to the wafer.

[0032] Compared with not setting up a partition, after setting up the partition, the inlet area of ​​air flowing from the upper side of the partition to the lower side of the partition is reduced, so that the wind pressure in the space at the bottom side of the partition can be further increased, which is more conducive to the sinking of polluted particles.

[0033] The device can not only complete the cleaning and drying of wafers in one box, simplifying the process, but also ensure the cleanliness of the wafer surface and improve the output rate of qualified wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is an overall schematic diagram of a wafer cleaning and drying device provided in a specific embodiment of the utility model;

[0035] Figure 2It is a cross-sectional view of a wafer cleaning and drying device provided in a specific embodiment of the utility model;

[0036] Figure 3 It is a partial structural schematic diagram of a wafer cleaning and drying device provided in a specific embodiment of the utility model;

[0037] Figure 4 It is a cross-sectional view of a second cleaning structure provided in an embodiment of the present utility model;

[0038] Figure 5 It is a cross-sectional view of a wafer cleaning and drying device provided in an embodiment of the utility model when no partition is provided.

[0039] In the figure:

[0040] 100. Wafer;

[0041] 1. Box; 10. Passage; 11. Partition; 12. Working chamber; 13. Settling chamber; 14. Exhaust duct; 15. Support;

[0042] 2. Fixed structure; 21. Support seat; 22. Clamping structure; 221. Support plate; 222. Clamping assembly; 2221. First limiting column; 2222. Second limiting column;

[0043] 3. Wafer cleaning unit;

[0044] 31. First cleaning structure; 311. Fixed bracket; 312. Rotating nozzle; 313. Rotating bracket; 3131. Fixed rod; 3132. Rotating swing arm; 314. Fixed nozzle;

[0045] 32, second cleaning structure; 321, flow guide; 3211, first flow guide channel; 3212, connecting valve; 322, spray plate; 3221, second flow guide channel; 3222, spray port;

[0046] 4. Environmental control unit; 41. Air supply assembly; 42. Cover body. DETAILED DESCRIPTION

[0047] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0048] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0050] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0051] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0052] like Figures 1 to 4As shown, this embodiment provides a wafer cleaning and drying device, including a housing 1, a partition 11, a wafer cleaning unit 3 and an environmental control unit 4. The housing 1 is provided with an inner cavity, the partition 11 is circumferentially sealed in the housing 1, and the partition 11 is provided with a connecting hole to separate the inner cavity into an operating chamber 12 and a sedimentation chamber 13 that are interconnected. The housing 1 is provided with an exhaust duct 14 that is connected to the sedimentation chamber 13 to achieve air circulation in the operating chamber 12 and the sedimentation chamber 13, and at the same time, the air with pollutants is discharged in time. The wafer cleaning unit 3 is arranged in the housing 1, and can spray the cleaning liquid on the wafer 100 located in the operating chamber 12, and spin and dry the wafer 100. The environment control unit 4 includes an air supply component 41 and a cover 42. The air supply component 41 is arranged on one side of the housing 1 and can supply air to the working chamber 12. The cover 42 is arranged at the connecting hole, and the gap between the cover 42 and the connecting hole is very small. In this embodiment, the distance between the cover 42 and the connecting hole is about 3 mm. The cover 42 has openings at both ends. The air supplied by the air supply component 41 to the working chamber 12 flows into the settling chamber 13 through the openings at both ends of the cover 42, and then is discharged through the exhaust duct 14 connected to the settling chamber 13. The cover 42 has a working state in which the cover is arranged outside the wafer 100.

[0053] When the wafer 100 is ready to be cleaned and dried, the cover 42 is adjusted to the working state to block the droplets detached from the surface of the wafer 100 along the circumferential direction, so that the droplets fall into the sedimentation chamber 13, so that the droplets and pollutants on the surface of the wafer 100 flow directly to the sedimentation chamber 13, avoiding the backflow of the washed droplets and pollutants in the working chamber 12, and ensuring the cleanliness of the upper end surface of the partition 11. At the same time, the air supply component 41 supplies air to the working chamber 12, and the air flow direction of the air supply is as follows: Figure 2 As shown by the middle arrow, a part of the air supply directly passes through the cover body 42 and flows through the working chamber 12 to the settling chamber 13, and is finally discharged through the exhaust pipe 14; the air supply flowing through the settling chamber 13 can perform secondary drying treatment on the wafer 100, thereby achieving complete drying of the wafer 100. The arrangement of the partition 11 allows another part of the air supply that does not directly pass through the cover body 42 to flow onto the partition 11, rather than directly flowing into the settling chamber 13, so as to prevent the part of the air supply from blowing up the pollutants on the bottom plate of the settling chamber 13, and the blown-up pollutants from reattaching to the wafer 100.

[0054] Reference Figure 5If the partition 11 is not provided in the box body 1, there is no partition between the working chamber 12 and the settling chamber 13 of the inner cavity. A part of the air supplied by the air supply component 41 flows toward the wafer 100 through the cover body 42, and this part of the air supply dries the wafer 100; the other part of the air supply will flow directly from the working chamber 12 to the settling chamber 13, and blow up the pollutants settled in the settling chamber 13. The blown-up pollutants may re-attach to the wafer 100, affecting the cleanliness of the wafer 100. In addition, compared with not providing the partition 11, after providing the partition 11, the inlet area of ​​the settling chamber 13 is reduced, so that the wind pressure in the settling chamber 13 can be further increased, which is more conducive to the sinking of polluted particles.

[0055] At the same time, in this embodiment, two production processes (cleaning and drying) of the wafer 100 are integrated into one process, which greatly saves time and makes the equipment more efficient in producing the wafer 100 .

[0056] Specifically, Figure 1 As shown, the side wall of the box 1 is provided with a passage 10 for the wafer 100 to enter and exit the box 1. A baffle is rotatably provided at the passage 10, and the baffle has a closed state in which it blocks the passage 10, and an open state in which it does not block the passage 10. When the wafer 100 needs to enter and exit the working chamber 12, the baffle is adjusted to the open state; when the wafer 100 is cleaned and dried in the working chamber 12, the baffle is adjusted to the closed state to ensure the sealing of the working chamber 12, and at the same time, it is conducive to ensuring the cleanliness of the working chamber 12.

[0057] Specifically, in this embodiment, the baffle is made of a transparent material, which can facilitate operators to observe the situation in the working chamber 12.

[0058] Optionally, the cover 42 is movably disposed at the communicating hole, can be raised to a working state relative to the partition 11, and can be moved relative to the partition 11 to be stored in a retracted state at the bottom side of the partition 11, that is, the cover 42 can be retracted into the settling chamber 13. When the wafer 100 needs to be taken, the cover 42 can be adjusted to the retracted state to facilitate the taking of the wafer 100.

[0059] Optionally, a driving mechanism is provided between the cover body 42 and the partition 11 , the fixed end of the driving mechanism is fixed on the partition 11 , and the output end is connected to the cover body 42 , so that the cover body 42 can be lifted and lowered in the vertical direction under the drive of the driving mechanism.

[0060] Exemplarily, the driving mechanism may be a pneumatic driving mechanism, a hydraulic driving mechanism or an electric driving mechanism. In this embodiment, the hydraulic driving mechanism is preferred, which has the advantages of small motion inertia and fast response speed.

[0061] Specifically, in this embodiment, two exhaust ducts 14 are provided; in other embodiments, the number of exhaust ducts 14 can be set as needed.

[0062] Optionally, a plurality of support members 15 are provided between the bottom wall of the box body 1 and the partition 11 to provide support for the partition 11. Exemplarily, in this embodiment, the support members 15 are support columns, and a total of four support columns are provided, and the four support columns are arranged at intervals along the circumference of the partition 11; or, in other embodiments, the support members 15 may also be support plates 221, as long as they can provide support for the partition 11.

[0063] Optionally, the wafer cleaning unit 3 includes a fixing structure 2, a first cleaning structure 31 and a second cleaning structure 32. Figure 2 As shown, the fixing structure 2 is disposed in the inner cavity, and can clamp and fix the wafer 100 and drive the wafer 100 to rotate; Figure 3 and Figure 4 The first cleaning structure 31 is arranged in the inner cavity for cleaning the first surface of the wafer 100; the second cleaning structure 32 is arranged in the inner cavity for cleaning the second surface of the wafer 100. The first cleaning structure 31 and the second cleaning structure 32 are integrated to clean the two surfaces of the wafer 100 at the same time. While cleaning the two surfaces of the wafer 100, the wafer 100 can be dried simultaneously. The structural combination optimizes the process and saves space.

[0064] Specifically, in this embodiment, the first surface is the upper surface of the wafer 100 , and the second surface is the lower surface of the wafer 100 .

[0065] Specifically, Figure 2 As shown, the fixing structure 2 includes a supporting seat 21 and a clamping structure 22. The supporting seat 21 is protruded from the bottom wall of the box body 1. The clamping structure 22 is rotatably arranged on the supporting seat 21. The clamping structure 22 can clamp and fix the wafer 100 and drive the wafer 100 to rotate synchronously with the clamping structure 22 to dry the wafer 100.

[0066] Optionally, continue to refer to Figure 2 The clamping structure 22 includes a support plate 221 and a plurality of clamping components 222. The support plate 221 is rotatably disposed on the support seat 21, and the plurality of clamping components 222 are fixedly disposed on the support plate 221 along the circumference of the support plate 221. Figure 4Each clamping assembly 222 includes a first limiting column 2221 and a plurality of second limiting columns 2222, and the plurality of second limiting columns 2222 are fixedly arranged on a side of the first limiting column 2221 away from the support seat 21. The wafer 100 is placed on the first limiting column 2221 and abuts against the plurality of second limiting columns 2222. The above arrangement can limit the position of the wafer 100; at the same time, the materials are easily available and the manufacturing cost is low.

[0067] Specifically, a rotating motor is provided between the supporting seat 21 and the supporting plate 221, for driving the rotation of the supporting plate 221. The rotating motor is a device already disclosed in the prior art, and will not be described in detail herein.

[0068] For example, in this embodiment, there are three clamping assemblies 222 , each of which includes a first limiting column 2221 and three second limiting columns 2222 .

[0069] Furthermore, if Figure 3 As shown, the first cleaning structure 31 includes a fixed bracket 311 and a plurality of rotating nozzles 312. The fixed bracket 311 is fixedly mounted on the inner wall of the housing 1, and the plurality of rotating nozzles 312 are rotatably mounted on the fixed bracket 311. By adjusting the angle of the rotating nozzle 312 toward the first surface of the wafer 100, the rotating nozzle 312 is adjusted to a suitable position to ensure that the most suitable liquid drop point can be adjusted, thereby ensuring that the first surface of the wafer 100 can be fully cleaned. Specifically, the fixed bracket 311 is fixedly mounted on the upper wall of the housing 1, and the fixed bracket 311 is composed of a plurality of connecting rods; the plurality of rotating nozzles 312 are all mounted on the fixed bracket 311, and each nozzle is filled with a cleaning liquid, which can be pure water or other chemical liquids with a cleaning function, as long as the purpose of cleaning the wafer 100 can be achieved.

[0070] Illustratively, in this embodiment, three rotating nozzles 312 are disposed on the fixed bracket 311 ; in other embodiments, the number of the rotating nozzles 312 can be set as required.

[0071] Further, continue to refer to Figure 3The first cleaning structure 31 also includes a rotating bracket 313 and a fixed nozzle 314. The rotating bracket 313 is rotatably arranged on the bottom wall of the box body 1. The rotating bracket 313 has a working state located above the wafer 100 and a evasive state evading above the wafer 100. The fixed nozzle 314 is fixedly arranged on the side of the rotating bracket 313 facing the wafer 100. When the cleaning of the wafer 100 begins, the rotating bracket 313 is first adjusted to the evasive state evading above the wafer 100, and the first surface of the wafer 100 is preliminarily cleaned by the plurality of rotating nozzles 312. After the preliminarily cleaning is completed, the rotating bracket 313 is adjusted to the working state located above the wafer 100, and the first surface of the wafer 100 is deeply cleaned by the fixed nozzle 314 to improve the cleaning degree of the first surface of the wafer 100.

[0072] Further, refer to Figure 3 The rotating bracket 313 includes a fixed rod 3131 and a rotating swing arm 3132. The fixed rod 3131 is fixed to the bottom wall of the box body 1. The rotating swing arm 3132 is rotatably arranged on the fixed rod 3131. The fixed rod 3131 and the rotating swing arm 3132 are both provided with flow channels. The fixed nozzle 314 is fixed to the side of the rotating swing arm 3132 facing the wafer 100 and is connected to the flow channel in the rotating swing arm 3132. The rotating swing arm 3132 rotates to drive the fixed nozzle 314 to move, thereby performing a comprehensive deep cleaning on the first surface of the wafer 100.

[0073] Optionally, the fixed nozzle 314 is a two-fluid nozzle, so as to be able to spray two fluids toward the first surface of the wafer 100 , and the sprayed two fluids have a higher cleaning ability.

[0074] Exemplarily, in this embodiment, the two fluids are mixed by a high-pressure gaseous fluid (usually nitrogen) and a liquid fluid (usually deionized water), and then sprayed out through a two-fluid nozzle, so that droplets formed by the high-pressure gas and the liquid fluid are sprayed out at a speed exceeding the speed of sound propagation in air (340 m / s).

[0075] Optionally, refer to Figure 4 The second cleaning structure 32 includes a flow guide 321 and a spray plate 322. Figure 2The output end of the flow guide 321 passes through the support seat 21 and extends into the working chamber 12. The flow guide 321 is provided with a first flow guide channel 3211. The spray plate 322 is fixedly arranged at one end of the flow guide 321 extending into the working chamber 12. The spray plate 322 is provided with a second flow guide channel 3221 connected with the first flow guide channel 3211. The spray plate 322 is provided with a plurality of nozzles 3222 spaced apart along the circumferential direction. The plurality of nozzles 3222 are all arranged obliquely and are all connected with the second flow guide channel 3221. By arranging the nozzles 3222 obliquely, it can be ensured that the cleaning liquid or drying gas sprayed from the nozzles 3222 can cover a larger range of the second surface of the wafer 100, thereby ensuring comprehensive cleaning and comprehensive drying of the second surface of the wafer 100.

[0076] Specifically, when cleaning the second surface of the wafer 100, the cleaning liquid is injected into the first guide channel 3211, passes through the second guide channel 3221, and then sprayed to the second surface of the wafer 100 through the plurality of nozzles 3222 to clean the second surface of the wafer 100. When the wafer 100 is cleaned and needs to be dried, the drying gas is injected into the first guide channel 3211, passes through the second guide channel 3221, and then sprayed to the second surface of the wafer 100 through the plurality of nozzles 3222 to dry the second surface of the wafer 100.

[0077] For example, the drying gas is nitrogen commonly used in the art. Nitrogen is an inert gas at room temperature and pressure, and has the advantages of being tasteless, odorless and highly stable.

[0078] Further, continue to refer to Figure 4 A connecting valve 3212 is provided at one end of the flow guide 321 away from the working chamber 12. The connecting valve 3212 is configured to be connected to a pipeline for conveying cleaning liquid or conveying dry gas, which is easy to operate and is conducive to improving working efficiency.

[0079] Specifically, in this embodiment, the connecting valve 3212 is a three-way valve, a first end of the three-way valve is connected to the first guide channel 3211 of the guide member 321, and a second end and a third end are respectively connected to the cleaning liquid pipeline and the drying gas pipeline.

[0080] Optionally, a drainage channel is provided on the bottom wall of the box body 1, and the drainage channel is configured to be connected to an external water pipe so as to discharge the cleaning liquid in the box body 1, avoid a large amount of cleaning liquid accumulating in the box body 1, and ensure the cleanliness of the box body 1.

[0081] After the wafer 100 to be cleaned is fixed in the working chamber 12 by the clamping structure 22, the cover body 42 is adjusted to the working state where the cover is set on the outside of the wafer 100, and the clamping structure 22 is driven to rotate, and the wafer 100 is driven to rotate at the same time. After the rotation speed is stabilized, the first cleaning structure 31 sprays the cleaning liquid to the first surface of the wafer 100 to clean the first surface of the wafer 100; while cleaning the first surface, or after the first surface is cleaned, the second cleaning structure 32 sprays the cleaning liquid to the second surface of the wafer 100 to clean the second surface of the wafer 100. During the entire process of cleaning the wafer 100, the cover body 42 is always in a working state to ensure that the waste liquid after cleaning the wafer 100 falls into the sedimentation chamber 13, and prevents the waste liquid from falling to the upper end surface of the partition 11 under the action of centrifugal force, which is convenient for the collection of waste liquid. At the same time, the cleanliness of the upper end surface of the partition 11 can be guaranteed. After the first surface and the second surface of the wafer 100 are cleaned, the wafer 100 continues to rotate, and the centrifugal force is used to spin off the droplets on the first surface of the wafer 100. At the same time, the second cleaning structure 32 sprays the drying gas to the second surface of the wafer 100 to dry the second surface of the wafer 100, thereby ensuring the dryness and drying efficiency of the wafer 100. The above arrangement can complete the cleaning and drying of the wafer 100 in one chamber, simplify the process, and reduce the processing cost.

[0082] For example, refer to Figure 1 In this embodiment, the air supply component 41 is arranged on the upper side of the box body 1; in other embodiments, the air supply component 41 can also be arranged on any side of the box body 1, for example, on the left side or the right side of the box body 1, as long as it can supply air to the inner cavity, and no specific limitation is made here.

[0083] Optionally, the air supply assembly 41 includes an air supply mechanism and a filter element. The filter element is arranged between the output end of the air supply mechanism and the working chamber 12 to filter the air supplied from the air supply mechanism to the working chamber 12 to ensure the cleanliness of the air supplied into the working chamber 12.

[0084] Specifically, the air supply mechanism is a commonly used air supply fan in the art, which is an existing device that has been disclosed in the prior art. Its specific structure and principle refer to the prior art and will not be repeated here. In addition, the filter element is also a coarse-effect, medium-effect or high-effect filter element commonly used in the prior art in the art, and the specific filtering level can be selected as needed according to the working environment.

[0085] Optionally, an exhaust mechanism (not shown) is provided at the exhaust duct 14, and the input end of the exhaust mechanism is connected to the exhaust duct 14, which can discharge the air in the settling chamber 13, ensuring that the air containing pollutants in the settling chamber 13 can be discharged in time to prevent a large amount of polluted air from accumulating. Each exhaust duct 14 is provided with an exhaust mechanism to ensure the timeliness of exhaust. The greater the wind speed of the exhaust mechanism, the faster the air containing pollutants in the settling chamber 13 can be discharged.

[0086] Exemplarily, the exhaust mechanism is an exhaust fan commonly used in the art, which is an existing device that has been disclosed in the prior art. Its specific structure and principle refer to the prior art and will not be repeated here.

[0087] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer cleaning and drying device, characterized in that: include: A box body (1), wherein an inner cavity is provided in the box body (1); A partition (11) is circumferentially sealed and arranged in the box body (1); a communicating hole is arranged on the partition (11); and an exhaust pipe (14) communicating with the inner cavity is arranged on the box body (1); A wafer cleaning unit (3) is disposed in the inner cavity and is capable of spraying a cleaning liquid on the wafer (100) in the inner cavity and rotating and drying the wafer (100); An environmental control unit (4) comprises an air supply component (41) and a cover body (42), wherein the air supply component (41) is arranged on one side of the housing (1) and is capable of supplying air into the inner cavity, the cover body (42) is arranged at the connecting hole, and both ends of the cover body (42) have openings. The cover body (42) has a working state in which the cover is arranged on the outside of the wafer (100).

2. The wafer cleaning and drying device according to claim 1, characterized in that: An exhaust mechanism is provided at the exhaust pipeline (14); an input end of the exhaust mechanism is connected to the exhaust pipeline (14) and is capable of exhausting the air in the inner cavity.

3. The wafer cleaning and drying device according to claim 1, characterized in that: The bottom wall of the box body (1) is provided with a drainage channel, and the drainage channel is configured to be connected to an external water pipe so as to be able to discharge the cleaning liquid in the box body (1).

4. The wafer cleaning and drying device according to claim 1, characterized in that: The wafer cleaning unit (3) comprises: A fixing structure (2) is arranged in the inner cavity, capable of clamping and fixing the wafer (100) and driving the wafer (100) to rotate; A first cleaning structure (31), disposed in the inner cavity, for cleaning a first surface of the wafer (100); A second cleaning structure (32) is disposed in the inner cavity and is used to clean the second surface of the wafer (100).

5. The wafer cleaning and drying device according to claim 4, characterized in that: The first cleaning structure (31) comprises: A fixed bracket (311) fixedly mounted on the inner wall of the box body (1); The rotating nozzle (312) is rotatably disposed on the fixed support (311), and the rotating nozzle (312) is capable of spraying cleaning liquid onto the first surface of the wafer (100).

6. The wafer cleaning and drying device according to claim 4, characterized in that: The first cleaning structure (31) comprises: A rotating bracket (313) is rotatably arranged on the bottom wall of the box body (1), and has a working state of being located above the wafer (100) and a avoiding state of avoiding above the wafer (100); The fixed nozzle (314) is fixedly arranged on a side of the rotating bracket (313) facing the wafer (100).

7. The wafer cleaning and drying device according to claim 4, characterized in that: The second cleaning structure (32) comprises: A flow guide (321), the output end of which extends into the inner cavity; A spray plate (322) is arranged at the output end of the flow guide (321), and the spray plate (322) is capable of spraying the cleaning liquid or drying gas transported by the flow guide (321) onto the second surface of the wafer (100).

8. The wafer cleaning and drying device according to claim 7, characterized in that: The guide member (321) is provided with a first guide channel (3211), the spray plate (322) is provided with a second guide channel (3221) connected with the first guide channel (3211), and the spray plate (322) is provided with a plurality of nozzles (3222) spaced apart along the circumferential direction, and the plurality of nozzles (3222) are all arranged at an inclination and are all connected with the second guide channel (3221).

9. The wafer cleaning and drying device according to claim 7, characterized in that: The input end of the flow guide (321) is provided with a connecting valve (3212), and the connecting valve (3212) is configured to be connected to a pipeline for conveying cleaning liquid or conveying drying gas.

10. The wafer cleaning and drying device according to any one of claims 1 to 9, characterized in that: The cover body (42) is movably arranged at the communicating hole, and can be raised relative to the partition (11) to the working state, and can be moved relative to the partition (11) to a retracted state stored at the bottom side of the partition (11).

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