Connecting piece and circuit assembly

Abstract

The utility model provides a connecting piece and a circuit assembly. The connector is applied to the circuit board. The connecting piece comprises a base, a pin and an interconnection part, the pin and the interconnection part are both connected to the peripheral side face of the base in a bent mode, the extension direction of the pin is opposite to the extension direction of the interconnection part, the base is used for being welded to the circuit board or abutting against the circuit board, the pin is used for being arranged and welded to the circuit board in a penetrating mode or used as a welding pin, and the interconnection part is used for being connected with the electric appliance element or the circuit board. The connecting piece provided by the utility model not only can independently adopt a reflow soldering process, but also can independently adopt a wave soldering process, so that the use requirements of multiple scenes are met, the current-carrying capacity of the circuit assembly is improved, and the high-strength current requirement of the circuit assembly is met.

Description

Technical Field

[0001] The present application belongs to the technical field of circuit components, and in particular relates to connectors and circuit components. Background Art

[0002] Connectors are usually soldered to circuit boards and connected to electrical components so that the electrical components are electrically connected to the circuit boards. In the related art, the process of soldering connectors to circuit boards often uses a reflow soldering process or a wave soldering process. However, the connectors in the related art can only meet one process, resulting in the connectors on a circuit board using only one process, resulting in a low current carrying capacity of the circuit components, which cannot meet the high current requirements of the circuit components. Utility Model Content

[0003] In view of this, the first aspect of the present application provides a connector for use with a circuit board, the connector comprising a base, a pin, and an interconnection portion, the pin and the interconnection portion being both bent and connected to the peripheral side surface of the base, and an extension direction of the pin is opposite to an extension direction of the interconnection portion, the base being used to be welded to the circuit board or to support the circuit board, the pin being used to penetrate and be welded to the circuit board or to serve as a welding foot, and the interconnection portion being used to connect electrical components or the circuit board.

[0004] The connector provided in the first aspect of the present application is composed of a base, a pin, and an interconnection. In the reflow soldering process, the base is used to be soldered to the surface of the circuit board, and the pin is inserted and soldered to the circuit board. In the wave soldering process, the base is used to support the circuit board and is not soldered to the circuit board, and the pin is used as a soldering foot. In addition, the reflow soldering process can also be used to solder both the base and the pin to the circuit board. The interconnection is used to plug with the electrical component so that the electrical component is electrically connected to the circuit board through the connector; or, the interconnection is used to directly electrically connect to the circuit board.

[0005] Furthermore, the mutual cooperation between the base and the pins can not only improve the welding strength between the connector and the circuit board, but also improve the current carrying capacity of the circuit assembly.

[0006] Therefore, the connector provided in the present application can adopt either the reflow soldering process alone or the wave soldering process alone, thereby meeting the usage requirements of multiple scenarios, improving the current-carrying capacity of the circuit component, and meeting the high-intensity current requirements of the circuit component.

[0007] Among them, the interconnection part includes a sub-buffer part and a sub-connection part, the sub-buffer part is arranged between the base and the sub-connection part, the sub-buffer part is bent, the extension direction of the sub-connection part is perpendicular to the extension direction of the base, and the sub-connection part is used to connect the electrical components.

[0008] Wherein, along the arrangement direction from the base to the connecting member, the width of the sub-connecting portion gradually decreases.

[0009] Wherein, the interconnection portion further includes a sub-bending portion provided between the sub-buffering portion and the sub-connecting portion, and the sub-bending portion protrudes along the extending direction of the base.

[0010] Wherein, a notch is provided on the side surface of the sub-bend portion.

[0011] Among them, the interconnection part also includes a first sub-vertical part arranged between the sub-buffer part and the sub-bending part, and a second sub-vertical part arranged between the sub-bending part and the sub-connecting part, and the extension direction of the first sub-vertical part and the second sub-vertical part are both perpendicular to the extension direction of the base.

[0012] Wherein, the connecting member includes two interconnecting parts, the two interconnecting parts are respectively arranged on two opposite sides of the base, and the extending directions of the two interconnecting parts are the same.

[0013] Among them, the peripheral side surface of the base includes a first side surface and a second side surface arranged opposite to each other, the connecting member also includes a protrusion arranged on the first side surface, the interconnection part is arranged on the second side surface, the protrusion is extended in the direction from the second side surface to the first side surface, and the protrusion is used to support the circuit board.

[0014] The base includes two end surfaces arranged opposite to each other and the peripheral side surface bent to connect the two end surfaces. The base is provided with heat dissipation holes, and the heat dissipation holes penetrate the two end surfaces.

[0015] The second aspect of the present application provides a circuit assembly, which includes a circuit board, an electrical component, and a connector as provided in the first aspect of the present application, wherein the base and the pins of the connector are both connected to the circuit board, and the interconnection portion of the connector is connected to the electrical component or the circuit board.

[0016] The circuit assembly provided in the second aspect of the present application, by adopting the connector provided in the first aspect of the present application, can adopt either the reflow soldering process alone or the wave soldering process alone, thereby meeting the use requirements of multiple scenarios, improving the current-carrying capacity of the circuit assembly, and meeting the high-intensity current requirements of the circuit assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0018] Figure 1 A three-dimensional structural diagram of a connector provided in one embodiment of the present application.

[0019] Figure 2 for Figure 1 A three-dimensional structural diagram of the middle connector from another perspective.

[0020] Figure 3 for Figure 1 Side view of the middle connector.

[0021] Figure 4 for Figure 1 Side view of the middle connector from another perspective.

[0022] Figure 5 for Figure 1 Top view of the connecting piece.

[0023] Figure 6 A three-dimensional structural diagram of a connector provided in another embodiment of the present application.

[0024] Figure 7 for Figure 6 A three-dimensional structural diagram of the middle connector from another perspective.

[0025] Figure 8 A three-dimensional structural diagram of a connector provided in yet another embodiment of the present application.

[0026] Fig. 9 for Figure 8 A three-dimensional structural diagram of the middle connector from another perspective.

[0027] Explanation of reference numerals: connector 1, base 11, peripheral side surface 111, first side surface 1111, second side surface 1112, end surface 112, heat dissipation hole 113, pin 12, interconnection portion 13, sub-buffer portion 131, sub-connecting portion 132, sub-bending portion 133, notch 1331, first sub-vertical portion 134, second sub-vertical portion 135, protrusion 14. DETAILED DESCRIPTION

[0028] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0029] Unless otherwise specified or there is a contradiction, the terms and phrases used in this application have the following meanings:

[0030] In this application, "first", "second", etc. are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0031] In this application, "one or several" refers to any one, any two or more of the listed items. Among them, "several" refers to any two or more of the listed items.

[0032] In the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0034] Please refer to Figure 1-Figure 5 , Figure 1 A three-dimensional structural diagram of a connector provided in one embodiment of the present application. Figure 2 for Figure 1 A three-dimensional structural diagram of the middle connector from another perspective. Figure 3 for Figure 1 Side view of the middle connector. Figure 4 for Figure 1 Side view of the middle connector from another perspective. Figure 5 for Figure 1 Top view of the connecting piece.

[0035] This embodiment provides a connector 1, which is applied to a circuit board. The connector 1 includes a base 11, a pin 12, and an interconnection portion 13. The pin 12 and the interconnection portion 13 are both bent and connected to the peripheral side surface 111 of the base 11, and the extension direction of the pin 12 (such as Figure 1 The extending direction of the interconnection portion 13 (as shown in the middle direction D1) is Figure 1 In contrast to the direction D2, the base 11 is used to be soldered to the circuit board or to support the circuit board, the pin 12 is used to penetrate and solder to the circuit board or to serve as a soldering foot, and the interconnection portion 13 is used to connect electrical components or the circuit board.

[0036] The connector 1 provided in this embodiment can be applied to a printed circuit board (PCB) and form a circuit assembly with the printed circuit board. The circuit assembly can be applied to a power module. The power module includes a housing and a circuit assembly, and the circuit assembly is mounted in the housing. The power module can be applied to a charging device, such as a charging pile.

[0037] The connector 1 provided in this embodiment can also be called a copper busbar. The connector 1 has a conductive function. The material of the connector 1 is a conductive material, such as ordinary copper, oxygen-free copper, hard copper, silver-clad copper, etc. The connector 1 is used to fix the electrical component on the circuit board and realize the electrical connection between the electrical component and the circuit board. For example, the electrical component can be a transformer, or a high-low voltage electrical appliance, or a switch contact, or a wire for power distribution installation, etc.

[0038] The connector 1 provided in this embodiment is composed of a base 11, a pin 12, and an interconnection portion 13. The base 11 is plate-shaped, the pin 12 is bent compared to the base 11, and the interconnection portion 13 is bent compared to the base 11, and the bending direction of the pin 12 is opposite to the bending direction of the base 11. The number of the pin 12 and the interconnection portion 13 is at least one.

[0039] For example, the connector 1 has four pins 12. For another example, the connector 1 has one interconnection portion 13. For another example, the connector 1 has two interconnections 13. Optionally, one interconnection portion 13 is provided between two pins 12. Optionally, along the arrangement direction from the base 11 to the pins 12, the width of the pins 12 gradually decreases.

[0040] Specifically, in the reflow soldering process, the base 11 is used to be soldered to the surface of the circuit board, and the pins 12 are inserted and soldered to the circuit board. For example, the base 11 and the circuit board are soldered to the surface of the circuit board through solder paste, which improves the bonding strength between the connector 1 and the circuit board, and at the same time improves the current carrying capacity of the connector 1, saving costs. The pins 12 are soldered to the openings of the circuit board.

[0041] Optionally, the thickness of the pin 12 is 1 mm-1.5 mm. For example, the thickness of the pin 12 may be 1 mm, or 1.1 mm, or 1.2 mm, or 1.3 mm, or 1.4 mm, or 1.5 mm, etc. By limiting the thickness of the pin 12 to 1 mm-1.5 mm, the filling rate of the solder paste during soldering in the reflow process can be increased, and the bonding strength between the connector 1 and the circuit board can be increased.

[0042] In the wave soldering process, the base 11 is used to support the circuit board and is not soldered to the circuit board, and the pins 12 are used as solder pins. In addition, the reflow soldering process can also be used to solder the base 11 and the pins 12 to the circuit board. The interconnection part 13 is used to plug with the electrical component so that the electrical component is electrically connected to the circuit board through the connector 1; or, the interconnection part 13 is used to directly electrically connect to the circuit board.

[0043] Furthermore, the mutual cooperation between the base 11 and the pins 12 can not only improve the welding strength between the connector 1 and the circuit board, but also improve the current carrying capacity of the circuit assembly.

[0044] Therefore, the connector 1 provided in this embodiment can adopt either the reflow soldering process or the wave soldering process alone, thereby meeting the usage requirements of multiple scenarios, improving the current carrying capacity of the circuit component, and meeting the high-intensity current requirements of the circuit component.

[0045] Please refer to Figure 1-Figure 5 In one embodiment, the interconnection portion 13 includes a sub-buffer portion 131 and a sub-connection portion 132, the sub-buffer portion 131 is arranged between the base 11 and the sub-connection portion 132, the sub-buffer portion 131 is bent, the extension direction of the sub-connection portion 132 is perpendicular to the extension direction of the base 11, and the sub-connection portion 132 is used to connect the electrical components.

[0046] One end of the sub-buffer portion 131 is connected to the base 11, and the other end is connected to the sub-connection portion 132. The sub-buffer portion 131 is bent, which can also be understood as the shape of the sub-buffer portion 131 is arc-shaped, or the sub-buffer portion 131 is configured as a round chamfer.

[0047] Therefore, in this embodiment, the sub-buffer portion 131 connected between the base 11 and the sub-connecting portion 132 is bent so that the sub-buffer portion 131 can play a buffering role during the mating process between the connector 1 and the electrical component, buffering the vertical downward insertion force of the electrical component, avoiding the cracking of the solder paste caused by the concentrated force on the connector 1, thereby improving the connection reliability of the connector 1.

[0048] Please refer to Figure 1-Figure 5 In one embodiment, along the arrangement direction from the base 11 to the connecting member 1, the width of the sub-connecting portion 132 gradually decreases.

[0049] The width of the sub-connection part 132 is gradually reduced, which can also be understood as chamfers being provided around the sub-connection part 132. Therefore, in this embodiment, the width of the sub-connection part 132 is limited to form a chamfer, and in the process of the connector 1 and the electrical component being matched, the chamfer plays a guiding role, which is conducive to the connection between the sub-connection part 132 and the electrical component, and is conducive to the plugging of the sub-connection part 132 into the electrical component.

[0050] Please refer to Figure 1-Figure 5 In one embodiment, the interconnection portion 13 further includes a sub-bending portion 133 disposed between the sub-buffering portion 131 and the sub-connecting portion 132 , and the sub-bending portion 133 protrudes along the extension direction of the base 11 .

[0051] One end of the sub-bend portion 133 is connected to the sub-buffer portion 131, and the other end is connected to the sub-connection portion 132. The sub-bend portion 133 is provided with a protrusion, and the number of the protrusions is not limited in this embodiment. For example, the shape of the sub-bend portion 133 is C-shaped, S-shaped, or wavy.

[0052] In the related art, the main function of the connector 1 is to carry current. At the same time, the connector 1 also needs to meet the actual use requirements such as vibration and micro-corrosion. At present, for many welded connectors 1, the stress after welding is relatively large. Therefore, this embodiment sets a sub-bend portion 133 to form a flexible structure of the connector 1, which can absorb assembly stress. At this time, the thickness and width of the connector 1 can be increased, thereby improving the current carrying capacity of the connector 1. In addition, after the connector 1 is plugged into the electrical component, it can float slightly left and right and up and down, while ensuring the connection reliability between the connector 1 and the electrical component. The use of this structure can meet the micro-corrosion problems that may be caused by vibration, impact, etc. in the subsequent actual use process, thereby improving the reliability of circuit components.

[0053] Please refer to Figure 6-Figure 7 , Figure 6 A three-dimensional structural diagram of a connector provided in another embodiment of the present application. Figure 7 for Figure 6 A three-dimensional structural diagram of the middle connector from another perspective. In one embodiment, a notch 1331 is provided on the side of the sub-bend portion 133 .

[0054] The width of the sub-bend portion 133 where the notch 1331 is provided is smaller than the width of the sub-buffer portion 131. For example, one sub-bend portion 133 is provided with two notches 1331. Therefore, in this embodiment, by providing the notch 1331 in the sub-bend portion 133, the stress absorption capability of the sub-bend portion 133 is further improved, the flexibility of the connector 1 is further increased, the mutual friction between the connector 1 and the electrical components during use is reduced, the fretting corrosion caused by the friction is reduced, and the reliability of the circuit assembly is further improved.

[0055] Please refer to Figure 1-Figure 5In one embodiment, the interconnection portion 13 also includes a first sub-vertical portion 134 disposed between the sub-buffer portion 131 and the sub-bending portion 133, and a second sub-vertical portion 135 disposed between the sub-bending portion 133 and the sub-connecting portion 132, and the extension directions of the first sub-vertical portion 134 and the second sub-vertical portion 135 are both perpendicular to the extension direction of the base 11.

[0056] The sub-buffer portion 131, the first sub-vertical portion 134, the sub-bend portion 133, the second sub-vertical portion 135, and the sub-connection portion 132 are sequentially connected along the arrangement direction from the base 11 to the sub-connection portion 132. The first sub-vertical portion 134 and the second sub-vertical portion 135 are both perpendicular to the base 11. Therefore, in this embodiment, by providing the first sub-vertical portion 134 and the second sub-vertical portion 135, the flexibility of the connector 1 is further increased, the reliability of the connector 1 is improved, and the reliability of the circuit assembly is further improved.

[0057] Please refer to Figure 8-Figure 9 , Figure 8 A three-dimensional structural diagram of a connector provided in yet another embodiment of the present application. Fig. 9 for Figure 8 In one embodiment, the connector 1 includes two interconnecting portions 13, which are respectively disposed on opposite sides of the base 11, and the two interconnecting portions 13 extend in the same direction.

[0058] In this embodiment, by providing two interconnecting parts 13 on the base 11, the current carrying capacity of the connector 1 can be further improved, and the position tolerance of the connector 1 can also be improved, which is beneficial to improving the assembly accuracy and further improving the reliability of the circuit assembly.

[0059] Optionally, in one embodiment, the connecting member 1 includes two interconnecting portions 13, and the two interconnecting portions 13 are respectively arranged on opposite sides of the base 11, and the extension directions of the two interconnecting portions 13 are the same. The interconnecting portion 13 also includes a sub-bending portion 133 arranged between the sub-buffer portion 131 and the sub-connecting portion 132, and the sub-bending portion 133 protrudes along the extension direction of the base 11, and a notch 1331 is provided on the side of the sub-bending portion 133.

[0060] Please refer to Figure 1-Figure 5 In one embodiment, the peripheral side surface 111 of the base 11 includes a first side surface 1111 and a second side surface 1112 that are disposed opposite to each other, the connector 1 also includes a protruding portion 14 disposed on the first side surface 1111, the interconnecting portion 13 is disposed on the second side surface 1112, and the protruding portion 14 extends along the direction from the second side surface 1112 to the first side surface 1111 (such as Figure 5The protrusion 14 is extended in the middle direction D3, and is used to support the circuit board.

[0061] The protrusion 14 and the interconnection portion 13 are arranged on opposite sides of the base 11, and the protrusion 14 protrudes compared to the base 11. Optionally, the width of the protrusion 14 is smaller than the width of the base 11, and the length of the protrusion 14 is smaller than the length of the base 11. In this embodiment, the protrusion 14 is used to abut against the circuit board to increase the contact area between the connector 1 and the circuit board, thereby improving the connection reliability between the connector 1 and the circuit board, and can also improve the verticality of the connector 1 when welding with the circuit board, reducing the difficulty of operation.

[0062] Please refer to Figure 1-Figure 5 In one embodiment, the base 11 includes two end surfaces 112 disposed opposite to each other, and the peripheral side surface 111 bent to connect the two end surfaces 112 . The base 11 is provided with a heat dissipation hole 113 , and the heat dissipation hole 113 passes through the two end surfaces 112 .

[0063] The heat dissipation hole 113 passes through the two end surfaces 112 , and the heat dissipation hole 113 is arranged adjacent to the pins 12 , and one pin 12 corresponds to one heat dissipation hole 113 . Optionally, the number of the heat dissipation hole 113 is at least one. For example, the base 11 has four heat dissipation holes 113 and four pins 12 .

[0064] In the related art, the pins 12 of the connector 1 have a large amount of heat dissipation, resulting in poor solder quality and easy formation of solder internal voids. Therefore, in this embodiment, by providing heat dissipation holes 113 on the base 11, the heat of the connector 1 can be evenly dissipated through the heat dissipation holes 113 during the wave soldering process, so as to avoid solder voids caused by excessive heat dissipation of the connector 1, thereby improving the soldering quality and the reliability of the circuit assembly.

[0065] Optionally, when the pin 12 is inserted through and soldered to the circuit board, the height of the pin 12 protruding from the circuit board is 0-0.5 mm. For example, when the pin 12 is inserted through and soldered to the circuit board, the height of the pin 12 protruding from the circuit board can be 0.1 mm, or 0.2 mm, or 0.3 mm, or 0.4 mm, or 0.5 mm, etc. In this embodiment, the undesirable effect of low tin penetration rate can be reduced by setting the protruding height of the pin 12, thereby improving the welding quality.

[0066] The present application also provides a circuit assembly, which includes a circuit board, an electrical component, and a connector as provided above in the present application, wherein the base and the pins of the connector are both connected to the circuit board, and the interconnecting portion of the connector is connected to the electrical component or the circuit board.

[0067] The circuit assembly provided in this embodiment can adopt either the reflow soldering process or the wave soldering process by adopting the connector provided above in this application, thereby meeting the usage requirements of multiple scenarios, improving the current carrying capacity of the circuit assembly, and meeting the high-intensity current requirements of the circuit assembly.

[0068] The above is a detailed introduction to the contents provided in the implementation mode of the present application. This article explains and illustrates the principles and implementation modes of the present application. The above explanation is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation mode and application scope. In summary, the contents of this specification should not be understood as limiting the present application.

Claims

1. A connector, characterized in that: Applied to a circuit board, the connector includes a base, a pin, and an interconnection portion, the pin and the interconnection portion are both bent and connected to the peripheral side surface of the base, and the extension direction of the pin is opposite to the extension direction of the interconnection portion, the base is used to be welded to the circuit board or to support the circuit board, the pin is used to penetrate and weld to the circuit board or serve as a welding foot, and the interconnection portion is used to connect electrical components or the circuit board.

2. The connector according to claim 1, characterized in that The interconnection part includes a sub-buffer part and a sub-connection part, the sub-buffer part is arranged between the base and the sub-connection part, the sub-buffer part is bent, the extension direction of the sub-connection part is perpendicular to the extension direction of the base, and the sub-connection part is used to connect the electrical components.

3. The connector according to claim 2, characterized in that Along the arrangement direction from the base to the connecting member, the width of the sub-connecting portion gradually decreases.

4. The connector according to claim 2, characterized in that: The interconnection portion further includes a sub-bending portion disposed between the sub-buffering portion and the sub-connecting portion, and the sub-bending portion protrudes along an extending direction of the base.

5. The connector according to claim 4, characterized in that A notch is provided on the side surface of the sub-bend portion.

6. The connector according to claim 4, characterized in that: The interconnection portion further includes a first sub-vertical portion disposed between the sub-buffer portion and the sub-bending portion, and a second sub-vertical portion disposed between the sub-bending portion and the sub-connecting portion, wherein the extension directions of the first sub-vertical portion and the second sub-vertical portion are both perpendicular to the extension direction of the base.

7. The connector according to claim 1, characterized in that: The connecting member includes two interconnecting parts, which are respectively arranged on two opposite sides of the base, and the two interconnecting parts extend in the same direction.

8. The connector according to claim 1, characterized in that The peripheral side surface of the base includes a first side surface and a second side surface arranged opposite to each other, the connecting member also includes a protrusion arranged on the first side surface, the interconnection portion is arranged on the second side surface, the protrusion extends from the second side surface to the first side surface, and the protrusion is used to support the circuit board.

9. The connector according to claim 1, characterized in that: The base includes two end surfaces arranged opposite to each other and the peripheral side surface bent to connect the two end surfaces. The base is provided with a heat dissipation hole, and the heat dissipation hole passes through the two end surfaces.

10. A circuit assembly, characterized in that: The circuit assembly includes a circuit board, an electrical component, and a connector as described in any one of claims 1 to 9, wherein the base of the connector and the pins are both connected to the circuit board, and the interconnection portion of the connector is connected to the electrical component or the circuit board.

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