Circuit board assembly, battery assembly and electronic equipment

Abstract

The embodiment of the utility model discloses a circuit board assembly, a battery assembly and electronic equipment. The circuit board assembly comprises a rigid-flex circuit board, a second flexible circuit board, a first electronic element and a second electronic element. The rigid-flex circuit board comprises a rigid circuit board and a first flexible circuit board, the first flexible circuit board is connected to the side wall surface, and the rigid circuit board is used for being connected with the single battery. And the second flexible circuit board and the first flexible circuit board are partially superposed and are connected at the superposed part. The first electronic component is arranged on the hard circuit board. The second electronic component is arranged on the second flexible circuit board and located in an area outside the area where the first flexible circuit board and the second flexible circuit board are overlapped. According to the embodiment of the invention, the thickness of the circuit board assembly can be reduced.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a circuit board assembly, a battery assembly and an electronic device. Background Art

[0002] When electronic devices need to be designed to be thin and light, the thickness of the circuit board components inside them needs to be reduced.

[0003] At present, the circuit board assembly includes a rigid circuit board and a plurality of electronic components arranged on one side of the rigid circuit board. The heights of the electronic components vary greatly. For example, the height of the capacitor is greater than the height of the resistor. When the two are welded on the rigid circuit board, the capacitor will be much higher than the resistor. The maximum thickness of the circuit board assembly is the sum of the thickness of the rigid circuit board and the height of the electronic component with the largest height. Utility Model Content

[0004] Embodiments of the present application provide a circuit board assembly, a battery assembly, and an electronic device, which can reduce the thickness of the circuit board assembly.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] On the one hand, a circuit board assembly is provided, which includes a hard-soft circuit board, a second flexible circuit board, a first electronic component and a second electronic component. The hard-soft circuit board includes a hard circuit board and a first flexible circuit board, the two surfaces of the hard circuit board in the thickness direction are respectively a first mounting surface and a first back surface, the hard circuit board also includes a side wall surface connected between the first mounting surface and the first back surface, the first flexible circuit board is connected to the side wall surface, and the hard circuit board is used to connect with a battery cell. The thickness dimension of the hard circuit board is T1mm, and the thickness dimension of the first flexible circuit board is T2mm. The second flexible circuit board overlaps at least part of the first flexible circuit board and is connected at the overlap, and the thickness dimension of the second flexible circuit board is T3mm. The first electronic component is arranged on the first mounting surface, and the height dimension of the first electronic component in the thickness direction of the hard circuit board is H1mm. The second electronic component is arranged on the second flexible circuit board and is located outside the overlapped area of ​​the first flexible circuit board and the second flexible circuit board. The height dimension of the second electronic component in the thickness direction of the second flexible circuit board is H2mm. Among them, it satisfies: T1+H1 <T1+H2,T2+T3<T1+H2,T3+H2<T1+H2。

[0007] In addition to or as an alternative to one or more features disclosed above, one surface of the second flexible circuit board in its thickness direction is a second mounting surface, and the second electronic component is arranged on the second mounting surface; the first mounting surface and the second mounting surface have the same orientation.

[0008] In addition to or as an alternative to one or more features disclosed above, one surface of the first flexible circuit board in its thickness direction is a third mounting surface, and the second flexible circuit board is connected to the third mounting surface; the first mounting surface and the third mounting surface are oriented in opposite directions.

[0009] In addition to or as an alternative to one or more features disclosed above, in the thickness direction of the rigid circuit board, the connection between the first flexible circuit board and the side wall surface is spaced apart from the first mounting surface and the first back surface, respectively.

[0010] In addition to one or more of the features disclosed above, or as an alternative, the circuit board assembly has a predetermined direction, a surface of the rigid circuit board in the predetermined direction is a side wall surface; an end of the first flexible circuit board facing away from the rigid circuit board in the predetermined direction is a predetermined end; the second flexible circuit board includes a first sub-section and a second sub-section, the first sub-section is overlapped and connected to the predetermined end, in the predetermined direction, the second sub-section is located on the side of the first flexible circuit board facing away from the rigid circuit board, and the second electronic component is arranged in the second sub-section.

[0011] In addition to or as an alternative to one or more features disclosed above, the circuit board assembly includes a plastic package, which is arranged on the second flexible circuit board and is located outside the overlapping area of ​​the first flexible circuit board and the second flexible circuit board, and the plastic package covers at least a portion of the second electronic component.

[0012] In addition to one or more of the above-disclosed features, or as an alternative, the plastic encapsulation completely covers the second electronic component, and in the thickness direction of the second flexible circuit board, the height dimension of the plastic encapsulation is H3mm, satisfying: T3+H3 <T1+H2。

[0013] In addition to one or more of the features disclosed above, or as an alternative, the first flexible circuit board has a first solder pad, and the second flexible circuit board has a second solder pad; the circuit board assembly also includes a welding material layer; at the overlapping position of the first flexible circuit board and the second flexible circuit board, the first solder pad and the second solder pad are arranged opposite to each other, and the welding material layer is connected between the first solder pad and the second solder pad.

[0014] In addition to or as an alternative to one or more of the features disclosed above, the first electronic component is a MOSFET, and the second electronic component is a control chip.

[0015] In addition to or as an alternative to one or more features disclosed above, the first electronic component is electrically connected to the rigid circuit board, the first flexible circuit board is electrically connected to the second flexible circuit board, and the second electronic component is electrically connected to the second flexible circuit board.

[0016] On the other hand, the present application also provides a battery assembly, the battery assembly includes a circuit board assembly and a battery cell. The circuit board assembly is any of the above circuit board assemblies. The battery cell is connected to the hard circuit board in the circuit board assembly and is electrically conductive.

[0017] On the other hand, the present application also provides an electronic device, which includes the above-mentioned battery assembly.

[0018] One of the above technical solutions has the following advantages or beneficial effects:

[0019] Compared with the prior art, the embodiment of the present application adds a first flexible circuit board and a second flexible circuit board, and sets the first electronic component with a lower height on the rigid circuit board, and sets the second electronic component with a higher height on the second flexible circuit board. In the embodiment of the present application, since the first flexible circuit board and the second flexible circuit board are flexible, the position of the second electronic component can be adaptively adjusted to be staggered with the rigid circuit board, which is conducive to reducing the overall thickness of the circuit board assembly. Specifically, in the prior art, the thickness of the circuit board assembly is the sum of the thickness of the rigid circuit board and the height of the second electronic component. In the embodiment of the present application, at the corresponding first electronic component, the thickness of the circuit board assembly is the sum of the thickness of the rigid circuit board and the height of the first electronic component, and is less than the thickness of the circuit board assembly in the prior art. In the embodiment of the present application, at the corresponding second flexible circuit board and the first flexible circuit board overlap, the thickness of the circuit board assembly is the sum of the thickness of the second flexible circuit board and the thickness of the first flexible circuit board part, and is less than the thickness of the circuit board assembly in the prior art. In the embodiment of the present application, at the corresponding second electronic component, the thickness of the circuit board assembly is the sum of the height of the second flexible circuit board and the second electronic component, and is less than the thickness of the circuit board assembly in the prior art. Therefore, the embodiment of the present application reduces the thickness of the circuit board assembly compared to the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0021] Figure 1 is a schematic diagram of a circuit board assembly in the prior art;

[0022] Figure 2 is a schematic diagram of a circuit board assembly in one embodiment of the present application;

[0023] Figure 3 yes Figure 2 A schematic diagram of another state of the circuit board assembly shown;

[0024] Figure 4 is a schematic diagram of a circuit board assembly in another embodiment of the present application;

[0025] Figure 5 is a schematic diagram of a circuit board assembly in yet another embodiment of the present application;

[0026] Figure 6 is a schematic diagram of a circuit board assembly in yet another embodiment of the present application;

[0027] Figure 7 This is a schematic diagram of an embodiment of the present application in which the first flexible circuit board and the second flexible circuit board are not assembled;

[0028] Figure 8 is a schematic diagram of the three-dimensional structure of a battery assembly in one embodiment of the present application;

[0029] Fig. 9 yes Figure 8 3D exploded schematic diagram of the battery assembly shown

[0030] Fig.10 It is a schematic diagram of an electronic device in one embodiment of the present application.

[0031] Explanation of the reference numerals: 20 first electronic component; 30 second electronic component; 10 hard circuit board; 101 first mounting surface; 102 first back surface; 103 side wall; 40 first flexible circuit board; 401 third mounting surface; 402 third back surface; 403 first solder pad; 50 second flexible circuit board; 510 first sub-unit; 520 second sub-unit; 501 second mounting surface; 502 second back surface; 503 second solder pad; 60 plastic package; 710 first welding material layer; 720 second welding material layer; 730 third welding material layer; 80 hard-soft circuit board; 1 circuit board assembly; 2 battery cell; 3 connecting piece; 4 main body; 5 ear; 6 battery assembly; 7 electronic device; 8 screen assembly; 9 housing; X first direction; Y second direction; Z third direction. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and beneficial effects of this application more clear, the following further describes this application in detail in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining this application, not for limiting this application.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0034] See also Figure 1 . Figure 1 It is a schematic diagram of a circuit board assembly 1 in the prior art.

[0035] In the prior art, the circuit board assembly 1 includes a rigid circuit board 10 and a plurality of electronic components disposed on the same side surface of the rigid circuit board 10. The heights of the electronic components are different. The electronic component with a lower height is named as the first electronic component 20, and the electronic component with a higher height is named as the second electronic component 30. The embodiments of the present application are also named as such below.

[0036] In the prior art, the thickness of the circuit board assembly 1 is the sum of the thickness of the rigid circuit board 10 and the height of the second electronic component 30 .

[0037] The circuit board assembly 1 is used in electronic devices. As the market demands for lighter and thinner electronic devices, it is necessary to reduce the thickness of the circuit board assembly 1. The electronic device is, for example, a folding screen mobile phone. The circuit board assembly 1 is electrically connected to the battery cell 2 and is sandwiched between the display screen and the housing.

[0038] The embodiment of the present application improves the structure of the circuit board assembly 1 in the prior art to reduce the thickness of the circuit board assembly 1, thereby facilitating the thinning of the electronic device.

[0039] See also Figure 2 . Figure 2 1 is a schematic diagram of a circuit board assembly 1 in an embodiment of the present application. In the figure, only a portion of the rigid circuit board 10 and the second flexible circuit board 50 are shown.

[0040] The circuit board assembly 1 includes a rigid-flexible circuit board 80 , a second flexible circuit board 50 , a first electronic component 20 and a second electronic component 30 .

[0041] The rigid-flexible circuit board 80 includes a rigid circuit board 10 and a first flexible circuit board 40. The two surfaces of the rigid circuit board 10 in the thickness direction are respectively a first mounting surface 101 and a first back surface 102. The rigid circuit board 10 also includes a side wall surface 103 connected between the first mounting surface 101 and the first back surface 102. The first flexible circuit board 40 is connected to the side wall surface 103. The two surfaces of the first flexible circuit board 40 in the thickness direction are respectively a third mounting surface 401 and a third back surface 402.

[0042] Specifically, the rigid circuit board 10 and the first flexible circuit board 40 are connected as a whole through processes such as lamination according to relevant process requirements. The rigid-soft combined circuit board 80 may optionally be a prior art. The rigid circuit board 10 is composed of a rigid substrate and a metal layer. The rigid substrate has good insulation properties and mechanical strength, and the material of the rigid substrate is, for example, glass fiber reinforced epoxy resin. The metal layer is, for example, a copper layer, which is used for electronic signal transmission and connecting electronic components. The first flexible circuit board 40 is composed of a flexible substrate and a metal layer. The flexible substrate can be a thin film polymer material, such as polyimide (PI) or polyester film. The metal layer is typically a copper layer in the form of a thin film. Due to the characteristics of the flexible substrate, the first flexible circuit board 40 can maintain the stability and reliability of the electronic connection under bending and twisting. In addition, the thickness of the first flexible circuit board 40 is usually much smaller than the thickness of the rigid circuit board 10.

[0043] The basic structure of the second flexible circuit board 50 is the same as that of the first flexible circuit board 40, which will not be described again. The second flexible circuit board 50 overlaps at least a portion of the first flexible circuit board 40 and is connected at the overlapped portion. Figure 2 In the illustrated embodiment, the second flexible circuit board 50 overlaps a portion of the first flexible circuit board 40. In other embodiments, the second flexible circuit board 50 may also overlap the entire first flexible circuit board 40. Overlapping: The thickness direction of the first flexible circuit board 40 is consistent with the thickness direction of the second flexible circuit board 50, and they are arranged oppositely. The two surfaces of the second flexible circuit board 50 in the thickness direction are the second mounting surface 501 and the second back surface 502, respectively. The second flexible circuit board 50 is connected to the third mounting surface 401, that is, the second mounting surface 501 is arranged oppositely and connected to a part of the third mounting surface 401. Further, the second flexible circuit board 50 and the first flexible circuit board 40 are electrically conductive at the connection.

[0044] In some embodiments, the first electronic component 20 is a MOSFET, and the second electronic component 30 is a control chip. In other embodiments, the first electronic component 20 may also be a resistor, a capacitor, or other electronic components. In other embodiments, the second electronic component 30 may also be a resistor, a capacitor, or other electronic components.

[0045] The first electronic component 20 is disposed on the first mounting surface 101 . Furthermore, the first electronic component 20 is electrically connected to the rigid circuit board 10 .

[0046] The second electronic component 30 is disposed on the second mounting surface 501 of the second flexible circuit board 50 and is located outside the overlapped area of ​​the first flexible circuit board 40 and the second flexible circuit board 50. Furthermore, the second electronic component 30 is electrically connected to the second flexible circuit board 50.

[0047] When the circuit board assembly 1 is applied to a battery assembly, the hard circuit board 10 is used to connect with the battery cell 2 .

[0048] Please refer to the next step Figure 3 . Figure 3 yes Figure 2 A schematic diagram showing another state of the circuit board assembly 1 is shown.

[0049] In the embodiment of the present application, since the first flexible circuit board 40 and the second flexible circuit board 50 are flexible, the position of the second electronic component 30 can be adaptively adjusted to be staggered with the rigid circuit board 10, thereby facilitating reducing the overall thickness of the circuit board assembly 1. Figure 3 Only the bending deformation of the second flexible circuit board 50 is shown, and the first flexible circuit board 40 can also be bent and deformed (see Figure 5 ).

[0050] Specifically, the thickness of the rigid circuit board 10 is T1 mm. The thickness of the first flexible circuit board 40 is T2 mm. The thickness of the second flexible circuit board 50 is T3 mm. In the thickness direction of the rigid circuit board 10, the height of the first electronic component 20 is H1 mm. In the thickness direction of the second flexible circuit board 50, the height of the second electronic component 30 is H2 mm. Among them, T1+H1 <T1+H2,T2+T3<T1+H2,T3+H2<T1+H2。

[0051] In the prior art, the thickness of the circuit board assembly 1 is the sum of the thickness of the rigid circuit board 10 and the height of the second electronic component 30, that is, T1+H2. In the embodiment of the present application, at the corresponding first electronic component 20, the thickness of the circuit board assembly 1 is the sum of the thickness of the rigid circuit board 10 and the height of the first electronic component 20, that is, T1+H1, and is less than the thickness of the circuit board assembly 1 in the prior art. In the embodiment of the present application, at the corresponding second flexible circuit board 50 and the first flexible circuit board 40 overlap, the thickness of the circuit board assembly 1 is the sum of the thickness of the second flexible circuit board 50 and the thickness of the first flexible circuit board 40, that is, T2+T3, and is less than the thickness of the circuit board assembly 1 in the prior art. In the embodiment of the present application, at the corresponding second electronic component 30, the thickness of the circuit board assembly 1 is the sum of the height of the second flexible circuit board 50 and the second electronic component 30, that is, T3+H2, and is less than the thickness of the circuit board assembly 1 in the prior art. As a result, the embodiment of the present application reduces the thickness of the circuit board assembly 1 compared with the prior art.

[0052] like Figure 2 As shown, in some embodiments, in the thickness direction of the rigid circuit board 10, the connection between the first flexible circuit board 40 and the side wall surface 103 is spaced from the first mounting surface 101 and the first back surface 102. Further, in the thickness direction of the rigid circuit board 10, the connection between the first flexible circuit board 40 and the side wall surface 103 is located in the middle area of ​​the rigid circuit board 10.

[0053] See also Figure 4 . Figure 4 It is a schematic diagram of a circuit board assembly 1 in another embodiment of the present application.

[0054] In some other embodiments, in the thickness direction of the rigid circuit board 10 , the connection between the first flexible circuit board 40 and the side wall surface 103 is flush with the first mounting surface 101 on the side close to the first mounting surface 101 .

[0055] Figure 5 It is a schematic diagram of a circuit board assembly 1 in yet another embodiment of the present application.

[0056] In some other embodiments, in the thickness direction of the rigid circuit board 10 , the connection between the first flexible circuit board 40 and the side wall surface 103 is flush with the first back surface 102 on the side close to the first back surface 102 .

[0057] See also Figure 2In some embodiments, the first mounting surface 101 and the second mounting surface 501 are oriented in the same direction. The first mounting surface 101 is oriented in the direction D1, and the second mounting surface 501 is oriented in the direction D2. The combination of the rigid circuit board 10, the first flexible circuit board 40, and the second flexible circuit board 50 is named as a circuit board assembly. In the circuit board assembly 1, the first electronic component 20 and the second electronic component 30 are respectively arranged on the same side of the circuit board assembly.

[0058] Correspondingly, in this embodiment, the first mounting surface 101 and the third mounting surface 401 are oriented in opposite directions.

[0059] See also Figure 5 In some other embodiments, the first mounting surface 101 and the second mounting surface 501 are oriented in opposite directions. In the circuit board assembly 1, the first electronic component 20 and the second electronic component 30 are respectively disposed on two sides of the circuit board assembly.

[0060] Correspondingly, in this embodiment, the first mounting surface 101 and the third mounting surface 401 are oriented in the same direction.

[0061] See also Figure 2 In some embodiments, the circuit board assembly 1 has a predetermined direction D3, and a surface of the rigid circuit board 10 in the predetermined direction D3 is a side wall surface 103. The end of the first flexible circuit board 40 that is away from the rigid circuit board 10 in the predetermined direction D3 is a predetermined end. The second flexible circuit board 50 includes a first sub-section 510 and a second sub-section 520. The first sub-section 510 is overlapped and connected to the predetermined end. In the predetermined direction D3, the second sub-section 520 is located on the side of the first flexible circuit board 40 that is away from the rigid circuit board 10, and the second electronic component 30 is disposed in the second sub-section 520.

[0062] The above embodiments respectively list several optional ways of the relative position relationship between the rigid circuit board 10 , the first flexible circuit board 40 and the second flexible circuit board 50 . The above embodiments can be combined with each other.

[0063] For example, see Figure 2 In some embodiments, in the thickness direction of the rigid circuit board 10, the connection between the first flexible circuit board 40 and the side wall surface 103 is spaced from the first mounting surface 101 and the first back surface 102. The first mounting surface 101 and the second mounting surface 501 are oriented in the same direction. The first mounting surface 101 and the third mounting surface 401 are oriented in opposite directions.

[0064] See also Figure 2Since the second flexible circuit board 50 is flexible, the stress resistance of the second electronic component 30 may be reduced. In order to improve the stress resistance of the second electronic component 30 , in some embodiments, the circuit board assembly 1 further includes a plastic package 60 .

[0065] The plastic seal 60 is disposed on the second mounting surface 501 and is located outside the overlapped area of ​​the second flexible circuit board 50 and the first flexible circuit board 40. The plastic seal 60 covers at least a portion of the second electronic component 30. Further, the plastic seal 60 completely covers the second electronic component 30. Specifically, the plastic seal 60 is disposed in the second sub-portion 520.

[0066] The plastic package 60 can improve the stress resistance of the second electronic component 30 .

[0067] The plastic encapsulation 60 is coated on the second electronic component 30 by plastic encapsulation technology. Plastic encapsulation is a common electronic packaging technology used to protect electronic components, integrated circuits and circuit boards, while improving their reliability and durability. The second electronic component 30 is encapsulated in the plastic encapsulation 60 to prevent it from being mechanically damaged. The plastic encapsulation material is usually a polymer material with good insulation performance, heat resistance and mechanical strength, such as epoxy resin (EP) or polyimide (PI).

[0068] When the plastic package 60 completely covers the second electronic component 30 , the thickness of the circuit board assembly 1 increases at the location corresponding to the second electronic component 30 . To ensure that the embodiment of the present application can reduce the thickness of the circuit board assembly 1 relative to the prior art, the following limitations are also made.

[0069] In the thickness direction of the second flexible circuit board 50, the height dimension of the plastic package 60 is H3mm, satisfying: T3+H3 <T1+H2。

[0070] See also Figure 6 . Figure 6 It is a schematic diagram of a circuit board assembly 1 in yet another embodiment of the present application.

[0071] In some embodiments, various parts of the circuit board assembly 1 are connected and electrically connected by soldering.

[0072] The first electronic component 20 is connected to the rigid circuit board 10 by soldering and is electrically connected to the rigid circuit board 10. Specifically, in the thickness direction of the rigid circuit board 10, the first welding material layer 710 is connected between the rigid circuit board 10 and the first electronic component 20.

[0073] The second flexible circuit board 50 is connected to the first flexible circuit board 40 by soldering and is electrically conductive with the first flexible circuit board 40. Specifically, in the thickness direction of the second flexible circuit board 50, the second solder material layer 720 is connected between the second flexible circuit board 50 and the first flexible circuit board 40.

[0074] Please refer to Figure 7 together. Schematic diagram of the unassembled state of the first flexible circuit board 40 and the second flexible circuit board 50 in an embodiment of the circuit board assembly 17 of the present application.

[0075] The first flexible circuit board 40 has a first pad 403, and the second flexible circuit board 50 has a second pad 503. The first pad 403 is a part of the metal layer in the first flexible circuit board 40. At the same time, the exposed part of the first pad 403 forms a part of the third mounting surface 401. The second pad 503 is a part of the metal layer in the second flexible circuit board 50. At the same time, the exposed part of the second pad 503 forms a part of the second mounting surface 501.

[0076] At the overlapping portion of the first flexible circuit board 40 and the second flexible circuit board 50, the first pad 403 and the second pad 503 are disposed opposite to each other, and the second solder material layer 720 is connected between the first pad 403 and the second pad 503. Specifically, the number of the first pads 403 is equal to that of the second pads 503 and they are in one-to-one correspondence. The second solder material layer 720 is connected between the corresponding first pad 403 and second pad 503.

[0077] The second electronic component 30 is connected to the second flexible circuit board 50 by soldering and is electrically conductive with the second flexible circuit board 50. Specifically, in the thickness direction of the second flexible circuit board 50, the third solder material layer 730 is connected between the second flexible circuit board 50 and the second electronic component 30.

[0078] When the soldering connection method is adopted, it will affect the thickness of the circuit board assembly 1. To ensure that the thickness of the circuit board assembly 1 can be reduced in the embodiments of the present application, the following limitations are further made.

[0079] Specifically, the height dimension of the first solder material layer 710 is L1 mm. The height dimension of the second solder material layer 720 is L2 mm. The height dimension of the third solder material layer 730 is L3 mm. Among them, it satisfies: T1 + H1 + L1 < T1 + H2 + L1, T2 + T3 + L2 < T1 + H2 + L1, T3 + H2 + L3 < T1 + H2 + L1. Further, L1 = L2 = L3. In other embodiments, L1, L2, and L3 may not be equal.

[0080] In one application scenario, T1 = 0.7 mm, T2 = 0.1 mm, T3 = 0.1 mm, H1 = 0.1 mm, H2 = 0.4 mm, L1 = L2 = L3 = 0.05 mm. In the prior art, the thickness of the circuit board assembly 1 is T = T1 + H2 + L3 = 0.7 mm + 0.4 mm + 0.05 mm = 1.15 mm. Figure 6 In the illustrated embodiment, at the position corresponding to the first electronic component 20, the thickness of the circuit board assembly 1 is T=T1+H1+L1=0.7mm+0.1mm+0.05mm=0.85mm; at the position corresponding to the overlap of the second flexible circuit board 50 and the first flexible circuit board 40, the thickness of the circuit board assembly 1 is T=T2+T3+L2=0.1mm+0.1mm+0.05mm=0.25mm; at the position corresponding to the second electronic component 30, the thickness of the circuit board assembly 1 is T=T3+H2+L3=0.1mm+0.4mm+0.05mm=0.55mm.

[0081] See also Figure 8 and Fig. 9 . Figure 8 It is a schematic diagram of the three-dimensional structure of the battery assembly 6 in one embodiment of the present application. Fig. 9 yes Figure 8 A three-dimensional exploded schematic diagram of the battery assembly 6 is shown.

[0082] For the convenience of description, the following definition is made: the battery assembly 6 has a first direction X, a second direction Y, and a third direction Z, any two of which intersect. Specifically, any two of the first direction X, the second direction Y, and the third direction Z are perpendicular.

[0083] The battery assembly 6 includes a battery cell 2 , a connector 3 and a circuit board assembly 1 .

[0084] Optionally, the battery cell 2 is a soft-pack battery, and the thickness direction of the battery cell 2 is the third direction Z.

[0085] The battery cell 2 includes a main body 4 and two tabs 5 with different polarities. The tab 5 is connected to the main body 4 and is located on one side of the main body 4 in the first direction X. The two tabs 5 with different polarities are arranged in the second direction Y at intervals.

[0086] The circuit board assembly 1 is located at one side of the main body 4 in the first direction X. The circuit board assembly 1 is the circuit board assembly 1 of any of the above embodiments.

[0087] The tab 5 is connected to the rigid circuit board 10 and is electrically connected. Specifically, the tab 5 is connected to the rigid circuit board 10 and is electrically connected through the connector 3. The connector 3 is, for example, a nickel sheet. The connector 3 may also be omitted, and the tab 5 is directly connected to the rigid circuit board 10 and is electrically connected.

[0088] The embodiment of the present application further provides an electronic device 7. The electronic device 7 includes the circuit board assembly 1 of any of the above embodiments. The electronic device 7 is, for example, a mobile phone, a tablet computer, an audio player, or a camera.

[0089] In one embodiment, the electronic device 7 is a mobile phone. Specifically, the electronic device 7 includes a screen assembly 8, a shell 9, a battery cell 2, and a circuit board assembly 1. An accommodation space is formed between the screen assembly 8 and the shell 9. The battery cell 2 and the circuit board assembly 1 are accommodated in the accommodation space. The battery cell 2, the circuit board assembly 1, and the screen assembly 8 are electrically connected to each other, and the battery cell 2 supplies power to the screen assembly 8. The screen assembly 8 includes a display screen, and the display screen is electrically connected to the battery cell 2. The thickness direction of the circuit board assembly 1, the thickness direction of the battery cell 2, and the spacing direction of the screen assembly 8 and the shell 9 are consistent.

[0090] In summary, the embodiment of the present application can reduce the thickness of the circuit board assembly 1.

[0091] The introduction provided in the above steps is only used to help understand the method, structure and core idea of ​​the present application. For ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A circuit board assembly, characterized in that: include: A hard-soft circuit board, the hard-soft circuit board comprising a hard circuit board and a first flexible circuit board, the two surfaces of the hard circuit board in the thickness direction thereof are respectively a first mounting surface and a first back surface, the hard circuit board further comprises a side wall surface connected between the first mounting surface and the first back surface, the first flexible circuit board is connected to the side wall surface, the hard circuit board is used to be connected to a battery cell, the thickness dimension of the hard circuit board is T1mm, and the thickness dimension of the first flexible circuit board is T2mm; a second flexible circuit board, overlapping at least part of the first flexible circuit board and connected at the overlapping part, wherein the thickness of the second flexible circuit board is T3 mm; A first electronic component is arranged on the first mounting surface, and the height dimension of the first electronic component in the thickness direction of the rigid circuit board is H1 mm; A second electronic component is disposed on the second flexible circuit board and is located outside the overlapped area of ​​the first flexible circuit board and the second flexible circuit board, and a height dimension of the second electronic component in a thickness direction of the second flexible circuit board is H2 mm; Among them, meet: T1+H1 <T1+H2,T2+T3<T1+H2,T3+H2<T1+H2。 2. The circuit board assembly according to claim 1, wherein: One surface of the second flexible circuit board in the thickness direction is a second mounting surface, and the second electronic component is arranged on the second mounting surface; The first mounting surface and the second mounting surface are oriented in the same direction.

3. The circuit board assembly according to claim 1, wherein: One surface of the first flexible circuit board in the thickness direction is a third mounting surface, and the second flexible circuit board is connected to the third mounting surface; The first mounting surface and the third mounting surface are oriented in opposite directions.

4. The circuit board assembly according to claim 1, wherein: In the thickness direction of the rigid circuit board, the connection between the first flexible circuit board and the side wall surface is spaced apart from the first mounting surface and the first back surface, respectively.

5. The circuit board assembly according to claim 1, wherein: The circuit board assembly has a predetermined direction, and a surface of the rigid circuit board in the predetermined direction is the side wall surface; An end of the first flexible circuit board away from the rigid circuit board in the predetermined direction is a predetermined end; The second flexible circuit board includes a first sub-section and a second sub-section, the first sub-section is overlapped and connected to the predetermined end, the second sub-section is located on the side of the first flexible circuit board away from the rigid circuit board in the predetermined direction, and the second electronic component is arranged in the second sub-section.

6. The circuit board assembly according to claim 1, wherein: include: The plastic sealing member is arranged on the second flexible circuit board and is located outside the overlapping area of ​​the first flexible circuit board and the second flexible circuit board, and the plastic sealing member covers at least a part of the second electronic component.

7. The circuit board assembly according to claim 6, wherein: The plastic package completely covers the second electronic component. In the thickness direction of the second flexible circuit board, the height dimension of the plastic package is H3mm, satisfying: T3+H3 <T1+H2。 8. The circuit board assembly according to claim 1, wherein: The first flexible circuit board has a first solder pad, and the second flexible circuit board has a second solder pad; The circuit board assembly also includes a welding material layer; At the overlapped portion of the first flexible circuit board and the second flexible circuit board, the first pad and the second pad are arranged opposite to each other, and the welding material layer is connected between the first pad and the second pad.

9. The circuit board assembly according to claim 1, wherein: The first electronic component is a MOSFET, and the second electronic component is a control chip.

10. A battery assembly, characterized in that: include: The circuit board assembly according to any one of claims 1 to 9; The battery cell is connected to the hard circuit board and is electrically conductive.

11. An electronic device, characterized in that: A battery assembly comprising the battery assembly of claim 10.

Images