Circuit board assembly, battery assembly and electronic equipment

Abstract

The embodiment of the utility model discloses a circuit board assembly, a battery assembly and electronic equipment. The circuit board assembly comprises a hard circuit board, a flexible circuit board, a first electronic element and a second electronic element. The hard circuit board has a first mounting surface on one side in the thickness direction. One side of the flexible circuit board in the thickness direction is provided with a second mounting surface, the orientation of the second mounting surface is opposite to that of the first mounting surface, and the flexible circuit board and the hard circuit board are partially overlapped and are connected at the overlapping part. The first electronic component is arranged on the first mounting surface. The second electronic component is arranged on the second mounting surface. The height dimension of the second electronic component is larger than that of the first electronic component. According to the embodiment of the invention, the thickness of the circuit board assembly can be reduced.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a circuit board assembly, a battery assembly and an electronic device. Background Art

[0002] When electronic devices need to be designed to be thin and light, the thickness of the circuit board components inside them needs to be reduced.

[0003] At present, a circuit board assembly includes a circuit board and a plurality of electronic components arranged on one surface of the circuit board. The heights of the electronic components vary greatly. For example, the height of the capacitor is relatively large, while the height of the resistor is relatively small. When the two are welded on the circuit board, the capacitor will be much higher than the resistor. The maximum thickness of the circuit board assembly is the sum of the thickness of the circuit board and the height of the electronic component with the largest height. This structural layout is not conducive to controlling the overall thickness of the circuit board assembly. Utility Model Content

[0004] Embodiments of the present application provide a circuit board assembly, a battery assembly, and an electronic device, which can reduce the thickness of the circuit board assembly at electronic components corresponding to larger heights.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] On the one hand, a circuit board assembly is provided, including: a rigid circuit board, a flexible circuit board, a first electronic component and a second electronic component. The rigid circuit board is used to connect to a battery cell, and the rigid circuit board has a first mounting surface on one side in the thickness direction, and the thickness dimension of the rigid circuit board is T1mm. The flexible circuit board has a second mounting surface on one side in the thickness direction, and the orientation of the second mounting surface is opposite to that of the first mounting surface. The flexible circuit board and the rigid circuit board are partially overlapped and connected at the overlap, and the thickness dimension of the flexible circuit board is T2mm. The first electronic component is arranged on the first mounting surface and is located outside the overlapping area of ​​the flexible circuit board and the rigid circuit board. In the normal direction of the first mounting surface, the height dimension of the first electronic component is H1mm. The second electronic component is arranged on the second mounting surface and is located outside the overlapping area of ​​the flexible circuit board and the rigid circuit board. In the normal direction of the second mounting surface, the height dimension of the second electronic component is H2mm. Wherein, it satisfies: H1 <H2,T2<T1。

[0007] In addition to or instead of one or more features disclosed above, the circuit board assembly includes a plastic package, which is disposed on the second mounting surface and located outside the overlapping area of ​​the flexible circuit board and the rigid circuit board, and the plastic package covers at least a portion of the second electronic component.

[0008] In addition to or as an alternative to one or more of the features disclosed above, the plastic package completely covers the second electronic component, and in the normal direction of the second mounting surface, the height dimension of the plastic package is H3 mm, satisfying: H3≤T1.

[0009] In addition to or in lieu of one or more of the features disclosed above, or as an alternative, the following is satisfied: T2 <H2。

[0010] In addition to one or more of the features disclosed above, or as an alternative, the circuit board assembly further includes a first welding material layer, a second welding material layer, and a third welding material layer. In the normal direction of the first mounting surface, the first welding material layer is connected between the rigid circuit board and the first electronic component, and the height dimension of the first welding material layer is L1mm. In the normal direction of the first mounting surface, the second welding material layer is connected between the rigid circuit board and the flexible circuit board, and the height dimension of the second welding material layer is L2mm. In the normal direction of the second mounting surface, the second welding material layer is connected between the flexible circuit board and the second electronic component, and the height dimension of the third welding material layer is L3mm. Wherein, it satisfies: T2+L2≤H1+L1, H2+L3≤T1+L2.

[0011] In addition to or as an alternative to one or more of the features disclosed above, L1 = L2 = L3.

[0012] In addition to or as an alternative to one or more of the features disclosed above, the rigid circuit board has a first solder pad and the flexible circuit board has a second solder pad. The circuit board assembly also includes a second solder material layer. At the overlapping portion of the flexible circuit board and the rigid circuit board, the first solder pad and the second solder pad are arranged opposite to each other, and the second solder material layer is connected between the first solder pad and the second solder pad.

[0013] In addition to or as an alternative to one or more of the features disclosed above, the first electronic component is a MOSFET, and the second electronic component is a control chip.

[0014] In addition to or as an alternative to one or more features disclosed above, the first electronic component is electrically connected to the rigid circuit board, the flexible circuit board is electrically connected to the rigid circuit board, and the second electronic component is electrically connected to the flexible circuit board.

[0015] In addition to or as an alternative to one or more features disclosed above, the rigid circuit board extends in a predetermined direction, and the flexible circuit board is connected to an extending end of the rigid circuit board in the predetermined direction and extends in the predetermined direction.

[0016] On the other hand, the present application also provides a battery assembly, the battery assembly includes a circuit board assembly and a battery cell. The circuit board assembly is any of the above circuit board assemblies. The battery cell is connected to the hard circuit board in the circuit board assembly and is electrically conductive.

[0017] In addition to or as an alternative to one or more of the features disclosed above, the battery assembly has an intersecting first direction and a second direction. The battery cell includes a main body and two pole ears with different polarities, the pole ears are connected to the main body and are located on one side of the main body in the first direction, the pole ears are connected to the hard circuit board and are electrically conductive, and the two pole ears with different polarities are arranged at intervals in the second direction. The hard circuit board is arranged on one side of the main body in the first direction and extends along the second direction. The flexible circuit board is arranged on one side of the main body in the first direction, connected to the extended end of the hard circuit board in the second direction, and extends along the second direction.

[0018] On the other hand, the present application also provides an electronic device, which includes any of the above-mentioned battery assemblies.

[0019] One of the above technical solutions has the following advantages or beneficial effects:

[0020] The embodiment of the present application adjusts the distribution positions of the components of the circuit board assembly, combines electronic components with small height with hard circuit boards, and combines electronic components with large height with flexible circuit boards, thereby forming a high-low complementary combination structure. Since the thickness of the flexible circuit board is less than that of the hard circuit board, compared with the prior art, the thickness of the circuit board assembly at the corresponding electronic components with large height can be reduced.

[0021] Furthermore, when the thickness of the flexible circuit board is smaller than the height of the electronic component with a large height, the maximum thickness of the circuit board assembly is also smaller than the maximum thickness of the circuit board assembly in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0023] Figure 1 is a cross-sectional view of an embodiment of the electronic device of the present application;

[0024] Figure 2 It is a schematic diagram of the three-dimensional structure of a battery assembly in the related art;

[0025] Figure 3 yes Figure 2 A 3D exploded view of the battery assembly;

[0026] Figure 4 It is a schematic diagram of the three-dimensional structure of an embodiment of a battery assembly of the present application;

[0027] Figure 5 is a schematic diagram of the three-dimensional structure of another embodiment of the battery assembly of the present application;

[0028] Figure 6 is a schematic diagram of the three-dimensional structure of another embodiment of the battery assembly of the present application;

[0029] Figure 7 It is a schematic cross-sectional structure diagram of an embodiment of a circuit board assembly of the present application;

[0030] Figure 8 is a schematic cross-sectional structure diagram of another embodiment of the circuit board assembly of the present application;

[0031] Fig. 9 It is a schematic diagram of a rigid circuit board and a flexible circuit board in an unassembled state in one embodiment of a circuit board assembly of the present application.

[0032] Explanation of the reference numerals: 10 - battery cell; 110 - main body; 120 - ear; 20 - connector; 30 - hard circuit board; 310 - first mounting surface; 40 - first electronic component; 50 - second electronic component; 60 - flexible circuit board; 610 - second mounting surface; 70 - plastic package; 810 - first welding material layer; 820 - second welding material layer; 830 - third welding material layer; 90 - overlapping area; 1 - screen assembly; 2 - housing; 3 - accommodating space; 4 - battery assembly; 5 - circuit board assembly; X - first direction; Y - second direction; Z - third direction. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and beneficial effects of this application more clear, the following further describes this application in detail in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining this application, not for limiting this application.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0035] In the embodiment of the present application, the electronic device is, for example, a mobile phone, a tablet computer, an audio player, a camera, etc. The following description takes a mobile phone as an example.

[0036] With the continuous advancement of technology and consumers' demand for larger displays and greater portability, folding screen technology has emerged. In a folding screen mobile phone, the two display screens are foldable. There are two battery assemblies in a folding screen mobile phone. The display screen and the battery assembly are set correspondingly, and each battery assembly supplies power to the corresponding display screen. Compared with tablet phones, in folding screen phones, the thickness of the battery assembly needs to be further reduced.

[0037] See also Figure 1 . Figure 1 It is a cross-sectional view of an embodiment of the electronic device of the present application.

[0038] The electronic device includes a screen assembly 1, a battery assembly 4 and a shell 2. An accommodating space 3 is formed between the screen assembly 1 and the shell 2. The battery assembly 4 is accommodated in the accommodating space 3 and is located between the screen assembly 1 and the shell 2 in the third direction Z. The battery assembly 4 is electrically connected to the screen assembly 1 to supply power to the screen assembly 1. The screen assembly 1 includes a display screen, which is electrically connected to the battery assembly 4. The thickness dimension of the battery assembly 4 in the third direction Z is Tmm. In the embodiment of the present application, the thickness of the battery assembly 4 is the maximum thickness of the battery assembly 4.

[0039] See also Figure 2 and Figure 3 . Figure 2 and Figure 3 They are respectively a schematic diagram of the three-dimensional structure and a three-dimensional exploded diagram of the battery assembly 4 in the related art (the disclosed art). For the convenience of description, the following definition is made: the battery assembly 4 has a first direction X, a second direction Y and a third direction Z, any two of which intersect. Specifically, any two of the first direction X, the second direction Y and the third direction Z are perpendicular.

[0040] In the related art, the battery assembly 4 includes a battery cell 10 and a circuit board assembly 5 .

[0041] The battery cell 10 includes a main body 110 and two tabs 120 with different polarities. The tab 120 is connected to the main body 110 and is located on one side of the main body 110 in the first direction X. The two tabs 120 with different polarities are arranged at intervals in the second direction Y. Optionally, the battery cell 10 is a soft pack battery, and the thickness direction of the battery cell 10 is the third direction Z.

[0042] The circuit board assembly 5 is located at one side of the main body 110 in the first direction X.

[0043] The circuit board assembly 5 includes a rigid circuit board 30, a first electronic component 40, and a second electronic component 50. The first electronic component 40 and the second electronic component 50 are respectively arranged on the rigid circuit board 30 and are located on the same side of the rigid circuit board 30. The height of the first electronic component 40 is less than the height of the second electronic component 50. The number of electronic components in the circuit board assembly 5 is not limited to two.

[0044] The tab 120 is connected and electrically connected to the rigid circuit board 30. Specifically, the tab 120 is connected and electrically connected to the rigid circuit board 30 through the connector 20. The connector 20 is, for example, a nickel sheet. The connector 20 may also be omitted, and the tab 120 is directly connected and electrically connected to the rigid circuit board 30.

[0045] When the battery assembly 4 is assembled between the screen assembly 1 and the shell 2 , the thickness direction of the battery cell 10 is the spacing direction between the screen assembly 1 and the shell 2 , and the thickness direction of the circuit board assembly 5 is the spacing direction between the screen assembly 1 and the shell 2 .

[0046] In the related art, the maximum thickness of the circuit board assembly 5 is the sum of the thickness of the rigid circuit board 30 and the height of the second electronic component 50 .

[0047] The embodiment of the present application improves the structure of the circuit board assembly 5 in the related art to reduce the thickness of the circuit board assembly 5, thereby facilitating the thinning of the electronic device.

[0048] See also Figure 4 . Figure 4 It is a schematic diagram of the three-dimensional structure of an embodiment of a battery assembly 4 of the present application. Figure 4 , Figure 5 as well as Figure 6 The second electronic component 50 is located on the invisible side of the flexible circuit board 60 , and the second electronic component 50 is indicated by a dotted line.

[0049] In the embodiment of the present application, the battery assembly 4 includes a battery cell 10 and a circuit board assembly 5 .

[0050] The battery cell 10 includes a main body 110 and two tabs 120 with different polarities. The tab 120 is connected to the main body 110 and is located at one side of the main body 110 in the first direction X. The two tabs 120 with different polarities are arranged in the second direction Y at intervals.

[0051] The circuit board assembly 5 is located at one side of the main body 110 in the first direction X. The circuit board assembly 5 includes a hard circuit board 30 , a flexible circuit board 60 , a first electronic component 40 and a second electronic component 50 .

[0052] The first electronic component 40 is connected to and electrically connected with the rigid circuit board 30. The flexible circuit board 60 is connected to and electrically connected with the rigid circuit board 30. The second electronic component 50 is connected to and electrically connected with the flexible circuit board 60.

[0053] In some embodiments, the first electronic component 40 is a MOSFET, and the second electronic component 50 is a control chip. In other embodiments, the first electronic component 40 may also be a resistor, a capacitor, or other electronic components. In other embodiments, the second electronic component 50 may also be a resistor, a capacitor, or other electronic components.

[0054] The tab 120 is connected and electrically connected to the rigid circuit board 30. Specifically, the tab 120 can be connected to the rigid circuit board 30 through the connector 20, or can be directly connected to the rigid circuit board 30.

[0055] In some embodiments, the rigid circuit board 30 is disposed on one side of the main body 110 in the first direction X and extends along the second direction Y. The flexible circuit board 60 is disposed on one side of the main body 110 in the first direction X, connected to an extended end of the rigid circuit board 30 in the second direction Y, and extends along the second direction Y.

[0056] See also Figure 5 and Figure 6 . Figure 5 and Figure 6 It is a schematic diagram of the three-dimensional structure of two other embodiments of the battery assembly 4 of the present application.

[0057] In other embodiments, the flexible circuit board 60 may also be in other shapes, such as Figure 5 In other embodiments, the flexible circuit board 60 may also be disposed on other parts of the rigid circuit board 30, such as Figure 6 shown.

[0058] See also Figure 7 . Figure 7 It is a schematic cross-sectional structure diagram of an embodiment of a circuit board assembly 5 of the present application. Figure 7 In FIG. 1 , an overlapping area 90 of the flexible circuit board 60 and the rigid circuit board 30 is shown by a double-dashed line.

[0059] The rigid circuit board 30 has a first mounting surface 310 on one side in the thickness direction. The thickness dimension of the rigid circuit board 30 is T1 mm. The flexible circuit board 60 has a second mounting surface 610 on one side in the thickness direction. The orientation of the second mounting surface 610 is opposite to that of the first mounting surface 310. The flexible circuit board 60 is partially overlapped with the rigid circuit board 30 and connected at the overlapping portion. The thickness dimension of the flexible circuit board 60 is T2 mm. The first electronic component 40 is disposed on the first mounting surface 310 and is located in an area outside the overlapping region of the flexible circuit board 60 and the rigid circuit board 30. In the normal direction (D1 direction) of the first mounting surface 310, the height dimension of the first electronic component 40 is H1 mm. The second electronic component 50 is disposed on the second mounting surface 610 and is located in an area outside the overlapping region of the flexible circuit board 60 and the rigid circuit board 30. In the normal direction (D2 direction) of the second mounting surface 610, the height dimension of the second electronic component 50 is H2 mm. Wherein, it satisfies: H1 < H2, T2 < T1. Further, it also satisfies: T2 < H2.

[0060] In an application scenario, T1 = 0.7 mm, T2 = 0.1 mm, H1 = 0.1 mm, H2 = 0.4 mm. In Figure 2 and Figure 3 the related art shown, the maximum thickness T of the circuit board assembly 5 =

[0061] T1 + H2 = 0.7 mm + 0.4 mm = 1.1 mm. In Figure 7 the embodiment shown, at the position corresponding to the first electronic component 40, T = T1 + H1 = 0.7 mm + 0.1 mm = 0.8 mm; at the position corresponding to the second electronic component 50, T =

[0062] T2 + H2 = 0.1 mm + 0.4 mm = 0.5 mm; at the position corresponding to the overlapping region 90, T = T1 +

[0063] T2 = 0.7 mm + 0.1 mm = 0.8 mm. In Figure 7 the embodiment shown, the maximum thickness of the circuit board assembly 5 is 0.8 mm.

[0064] In the embodiment of the present application, by adjusting the distribution positions of the components of the circuit board assembly, the electronic components with small height are combined with the rigid circuit board 30, and the electronic components with large height are combined with the flexible circuit board 60, so as to form a combined structure with high-low complementarity. Compared with Figure 2 and Figure 3 the related art shown, the embodiment of the present application can reduce the maximum thickness of the circuit board assembly 5.

[0065] The rigid circuit board 30 (also known as a printed circuit board, Printed Circuit Board, or PCB) and the flexible circuit board 60 (Flexible Printed Circuit Board, FPC) are two common electronic device components that differ in materials, construction, and application. The rigid circuit board 30 is composed of a rigid substrate and a metal layer. The rigid substrate has good insulation properties and mechanical strength, and the material of the rigid substrate is, for example, glass fiber reinforced epoxy resin. The metal layer is, for example, a copper layer, which is used for electronic signal transmission and connecting electronic components. The flexible circuit board 60 is composed of a flexible substrate and a metal layer. The flexible substrate can be a film-like polymer material, such as polyimide (PI) or polyester film. The metal layer is typically a copper layer in the form of a film. Due to the characteristics of the flexible substrate, the flexible circuit board 60 can maintain the stability and reliability of the electronic connection under bending and twisting. In addition, the thickness of the flexible circuit board 60 is usually much smaller than that of the rigid circuit board 30.

[0066] The flexible circuit board 60 has the characteristic of flexibility, so that the embodiment of the present application also has the following beneficial effects.

[0067] If the hard circuit board 30 and the flexible circuit board 60 are connected by soldering, stress may be generated at the connection. If both the hard circuit board 30 and the flexible circuit board 60 are rigid circuit boards, under the action of stress, the flatness of the assembly formed by the hard circuit board 30 and the flexible circuit board 60 is difficult to control, resulting in the thickness of the circuit board assembly 5 being magnified due to assembly error. In the embodiment of the present application, since the flexible circuit board 60 has the characteristics of flexibility, the stress at the connection can be eliminated.

[0068] Please also read Figure 1 Since the flexible circuit board 60 is flexible, the second electronic component 50 and the flexible circuit board 60 can adaptively adjust their positions in the third direction Z to avoid interference with the screen assembly 1 or the housing 2 , thereby improving the compatibility of the circuit board assembly 5 .

[0069] See also Figure 8 A schematic cross-sectional view of another embodiment of a circuit board assembly 5 of the present application.

[0070] Since the flexible circuit board 60 is flexible, the stress resistance of the second electronic component 50 may be reduced. In order to improve the stress resistance of the second electronic component 50, the circuit board assembly 5 further includes a plastic package 70.

[0071] The plastic package 70 is disposed on the second mounting surface 610 and is located outside the overlapping area of ​​the flexible circuit board 60 and the rigid circuit board 30. The plastic package 70 covers at least a portion of the second electronic component 50. Furthermore, the plastic package 70 completely covers the second electronic component 50.

[0072] The plastic package 70 can improve the stress resistance of the second electronic component 50 .

[0073] The plastic encapsulation 70 is coated on the second electronic component 50 by plastic encapsulation technology. Plastic encapsulation is a common electronic packaging technology used to protect electronic components, integrated circuits and circuit boards, while improving their reliability and durability. The second electronic component 50 is encapsulated in the plastic encapsulation 70 to prevent it from being mechanically damaged. The plastic encapsulation material is usually a polymer material with good insulation performance, heat resistance and mechanical strength, such as epoxy resin (EP) or polyimide (PI).

[0074] In the case where the plastic package 70 completely covers the second electronic component 50 , in order to ensure that the embodiment of the present application can reduce the thickness of the circuit board assembly 5 , the following limitations are further made.

[0075] In the normal direction of the second mounting surface 610 , the height dimension of the plastic package 70 is H3 mm, satisfying: H3≤T1.

[0076] See also Figure 8 In some embodiments, the various parts of the circuit board assembly 5 are connected and electrically connected by soldering.

[0077] The first electronic component 40 is connected to the rigid circuit board 30 by soldering and is electrically connected to the rigid circuit board 30. Specifically, in the normal direction of the first mounting surface 310, the first welding material layer 810 is connected between the rigid circuit board 30 and the first electronic component 40.

[0078] The flexible circuit board 60 is connected to the rigid circuit board 30 by soldering and is electrically connected to the rigid circuit board 30. Specifically, in the normal direction of the first mounting surface 310, the second welding material layer 820 is connected between the rigid circuit board 30 and the flexible circuit board 60.

[0079] Please also read Fig. 9 A schematic diagram of a hard circuit board 30 and a flexible circuit board 60 in an unassembled state in an embodiment of a circuit board assembly 5 of the present application.

[0080] The rigid circuit board 30 has a first solder pad 320, and the flexible circuit board 60 has a second solder pad 620. The first solder pad 320 is a part of the metal layer in the rigid circuit board 30, and the exposed portion of the first solder pad 320 forms a part of the first mounting surface 310. The second solder pad 620 is a part of the metal layer in the flexible circuit board 60, and the exposed portion of the second solder pad 620 forms a part of the second mounting surface 610.

[0081] At the overlapped portion of the flexible circuit board 60 and the rigid circuit board 30, the first pads 320 and the second pads 620 are arranged opposite to each other, and the second welding material layer 820 is connected between the first pads 320 and the second pads 620. Specifically, the number of the first pads 320 and the second pads 620 is equal and corresponds to each other. The second welding material layer 820 is connected between the corresponding first pads 320 and the second pads 620.

[0082] The second electronic component 50 is connected to the flexible circuit board 60 by soldering and is electrically connected to the flexible circuit board 60. Specifically, in the normal direction of the second mounting surface 610, the second welding material layer 820 is connected between the flexible circuit board 60 and the second electronic component 50.

[0083] When the connection method of soldering is adopted, the thickness of the circuit board assembly 5 will be affected. In order to ensure that the embodiment of the present application can reduce the thickness of the circuit board assembly 5, the following limitations are also made.

[0084] Specifically, the height dimension of the first welding material layer 810 is L1 mm. The height dimension of the second welding material layer 820 is L2 mm. The height dimension of the third welding material layer 830 is L3 mm. Among them, it satisfies: T2+L2≤H1+L1, H2+L3≤T1+L2. Further, L1=L2=L3. In other embodiments, L1, L2 and L3 may also be unequal.

[0085] In one application scenario, T1 = 0.7 mm, T2 = 0.1 mm, H1 = 0.1 mm, H2 = 0.4 mm,

[0086] L1=L2=L3=0.05mm. Figure 2 and Figure 3 In the related art shown, T =

[0087] T1+H2+L3=0.7mm+0.4mm+0.05mm=1.15mm. Figure 8 In the embodiment shown, T=

[0088] T1+H1+L1=0.7mm+0.1mm+0.05mm=0.85mm.

[0089] In summary, the embodiments of the present application can reduce the thickness of the circuit board assembly, thereby facilitating the thinning of the electronic device.

[0090] The introduction provided in the above steps is only used to help understand the method, structure and core idea of ​​the present application. For ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A circuit board assembly, characterized in that: include: A hard circuit board, used for connecting with a battery cell, wherein the hard circuit board has a first mounting surface on one side in a thickness direction, and the thickness dimension of the hard circuit board is T1 mm; A flexible circuit board having a second mounting surface on one side in the thickness direction, the second mounting surface being oriented opposite to the first mounting surface, the flexible circuit board partially overlapping with the rigid circuit board and connected at the overlapping portion, and the thickness dimension of the flexible circuit board being T2 mm; A first electronic component is disposed on the first mounting surface and is located outside the overlapping area of ​​the flexible circuit board and the rigid circuit board. In the normal direction of the first mounting surface, the height dimension of the first electronic component is H1 mm; A second electronic component is disposed on the second mounting surface and is located outside the overlapping area of ​​the flexible circuit board and the rigid circuit board. In the normal direction of the second mounting surface, the height dimension of the second electronic component is H2 mm; Among them, meet: H1 <H 2， T2 <T1。 2. The circuit board assembly according to claim 1, wherein: include: The plastic sealing member is arranged on the second mounting surface and is located outside the overlapping area of ​​the flexible circuit board and the rigid circuit board, and the plastic sealing member covers at least a part of the second electronic component.

3. The circuit board assembly as claimed in claim 2, characterized in that: The plastic package completely covers the second electronic component. In the normal direction of the second mounting surface, the height dimension of the plastic package is H3 mm, satisfying: H3≤T1.

4. The circuit board assembly according to claim 1, wherein: Satisfaction: T2 <H2。 5. The circuit board assembly according to claim 1, wherein: Also includes: A first welding material layer, connected between the rigid circuit board and the first electronic component in the normal direction of the first mounting surface, wherein the height dimension of the first welding material layer is L1 mm; a second welding material layer, connected between the rigid circuit board and the flexible circuit board in the normal direction of the first mounting surface, the height dimension of the second welding material layer being L2 mm; a third welding material layer, connected between the flexible circuit board and the second electronic component in the normal direction of the second mounting surface, and the height dimension of the third welding material layer is L3 mm; Among them, it satisfies: T2+L2≤H1+L1, H2+L3≤T1+L2.

6. The circuit board assembly according to claim 1, wherein: The rigid circuit board has a first solder pad, and the flexible circuit board has a second solder pad; The circuit board assembly also includes a second welding material layer; At the overlapping portion of the flexible circuit board and the rigid circuit board, the first solder pad and the second solder pad are arranged opposite to each other, and the second solder material layer is connected between the first solder pad and the second solder pad.

7. The circuit board assembly according to claim 1, wherein: The first electronic component is a MOSFET, and the second electronic component is a control chip.

8. The circuit board assembly according to claim 1, wherein: The rigid circuit board extends along a predetermined direction, and the flexible circuit board is connected to an extending end of the rigid circuit board in the predetermined direction and extends along the predetermined direction.

9. A battery assembly, characterized in that: include: The circuit board assembly according to any one of claims 1 to 8; The battery cell is connected to the hard circuit board and is electrically conductive.

10. The battery assembly according to claim 9, characterized in that: The battery assembly has a first direction and a second direction that intersect each other; The battery cell comprises a main body and two tabs with different polarities, wherein the tab is connected to the main body and is located on one side of the main body in the first direction, the tab is connected to the hard circuit board and is electrically connected, and the two tabs with different polarities are spaced apart in the second direction; The rigid circuit board is disposed on one side of the main body in the first direction and extends along the second direction; The flexible circuit board is arranged on one side of the main body in the first direction, connected to an extending end of the rigid circuit board in the second direction, and extends along the second direction.

11. An electronic device, characterized in that: A battery assembly comprising the battery assembly according to claim 9 or 10.

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