Package structure

Abstract

The utility model relates to a packaging structure. The package structure includes: a substrate; the functional chip is located above the substrate, the functional chip is internally provided with a heat dissipation channel, a heat dissipation fluid inlet and a heat dissipation fluid outlet, the heat dissipation fluid inlet and the heat dissipation fluid outlet are both located in the surface of the functional chip, and the heat dissipation fluid inlet and the heat dissipation fluid outlet are both communicated with the heat dissipation channel; the heat sink structure is located on the surface, away from the substrate, of the functional chip, the heat dissipation channel is filled with heat dissipation fluid, and the heat dissipation fluid can enter the heat dissipation channel from the heat dissipation fluid inlet and flow out of the heat dissipation channel through the heat dissipation fluid outlet. According to the utility model, the heat dissipation performance of the functional chip is improved, the accumulation of heat in the packaging structure is reduced, the improvement of the performance of the packaging structure is realized, and the service life of the packaging structure is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, and in particular to a packaging structure. Background Art

[0002] With the continuous evolution of advanced packaging technology, wafer-level packaging has been used more and more widely. Wafer-level packaging can achieve higher-density integration (including higher density and more functions) in a limited space, making it possible to realize a complete system in a single package. For example, the packaging process has developed from traditional 2D (two-dimensional) packaging technology to 2.5D packaging technology and 3D packaging technology. With the development of packaging technology, the packaging structure has become increasingly complex. As the integration of the packaging structure continues to increase and the frequency continues to increase, the heat dissipation of the packaging structure has become increasingly prominent. The accumulation of heat inside the packaging structure will cause the temperature of electronic structures such as functional chips and functional devices in the packaging structure to be too high, thereby affecting the performance of electronic structures such as the functional chips and functional devices, and easily leading to a shortened service life of the packaging structure.

[0003] Therefore, how to enhance the heat dissipation performance of the packaging structure, thereby reducing the accumulation of heat inside the packaging structure, so as to improve the performance of the packaging structure and extend the service life of the packaging structure, is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The utility model provides a packaging structure, which is used for enhancing the heat dissipation performance of the packaging structure, thereby reducing the accumulation of heat inside the packaging structure, so as to improve the performance of the packaging structure and prolong the service life of the packaging structure.

[0005] According to some embodiments, the utility model provides a packaging structure, including:

[0006] substrate;

[0007] A functional chip is located above the substrate, wherein the functional chip has a heat dissipation channel and a heat dissipation fluid inlet and a heat dissipation fluid outlet both located on the surface of the functional chip, and the heat dissipation fluid inlet and the heat dissipation fluid outlet are both connected to the heat dissipation channel;

[0008] The heat dissipation channel is filled with a heat dissipation fluid, and the heat dissipation fluid can enter the heat dissipation channel from the heat dissipation fluid inlet and flow out of the heat dissipation channel through the heat dissipation fluid outlet;

[0009] The heat sink structure is located on the surface of the functional chip facing away from the substrate.

[0010] In some embodiments, the functional chip includes a chip body and a passivation layer located on a surface of the chip body facing away from the substrate;

[0011] The heat dissipation channel is located in the chip body, and the heat dissipation fluid inlet and the heat dissipation fluid outlet both penetrate the passivation layer and are connected to the heat dissipation channel in the chip body.

[0012] In some embodiments, the heat dissipation channel is an arc-shaped channel.

[0013] In some embodiments, the arc-shaped channel includes a plurality of arc-shaped grooves, the plurality of arc-shaped grooves are arranged in a direction parallel to the top surface of the substrate, and adjacent arc-shaped grooves are meshed and connected.

[0014] In some embodiments, the arc-shaped channel includes a plurality of the arc-shaped grooves arranged along a first direction and a second direction, the first direction and the second direction are both parallel to the top surface of the substrate, and the first direction intersects with the second direction;

[0015] The arcuate grooves adjacent to each other along the first direction are meshed and connected, and the arcuate grooves adjacent to each other along the second direction are meshed and connected.

[0016] In some embodiments, the heat dissipation fluid inlet and the heat dissipation fluid outlet are distributed at opposite ends of the heat dissipation channel along the third direction.

[0017] In some embodiments, the arc-shaped channel includes a plurality of branch channels arranged along a first direction, each of the branch channels includes a plurality of arc-shaped grooves arranged along a second direction and interlocked and connected, and the arc-shaped grooves at the ends of adjacent branch channels are interlocked and connected.

[0018] In some embodiments, the heat dissipation fluid inlet and the heat dissipation fluid outlet are respectively connected to ends of the two branch channels;

[0019] The heat dissipation fluid inlet and the heat dissipation fluid outlet are located at the same end of the arc-shaped channel along the second direction; or, the heat dissipation fluid inlet and the heat dissipation fluid outlet are located at opposite ends of the arc-shaped channel along the second direction.

[0020] In some embodiments, the width of the heat dissipation fluid inlet and the width of the heat dissipation fluid outlet are both greater than or equal to 5 micrometers.

[0021] In some embodiments, the number of the functional chips is multiple, and the multiple functional chips are arranged along a first direction, and the first direction is parallel to the top surface of the substrate;

[0022] There are multiple heat sink structures, the multiple heat sink structures are arranged along the first direction, and the multiple heat sink structures are located one by one on the surfaces of the multiple functional chips away from the substrate.

[0023] In some embodiments, the number of the functional chips is multiple, and the multiple functional chips are arranged along a first direction, and the first direction is parallel to the top surface of the substrate;

[0024] The heat dissipation channels in the plurality of functional chips are interconnected, and the heat dissipation fluid inlet and the heat dissipation fluid outlet are distributed on two different functional chips;

[0025] The heat sink structure is continuously distributed on the surfaces of the plurality of functional chips away from the substrate.

[0026] The packaging structure provided by the utility model is provided with a heat dissipation channel and a heat dissipation fluid inlet and a heat dissipation fluid outlet both connected to the heat dissipation channel in the functional chip above the substrate, and a heat sink structure is provided on the surface of the functional chip away from the substrate, so that the heat dissipation fluid can enter the heat dissipation channel from the heat dissipation fluid inlet and flow out of the heat dissipation channel through the heat dissipation fluid outlet, that is, the heat dissipation channel is used as a microchannel for the flow of the heat dissipation fluid, thereby improving the heat dissipation performance of the functional chip through the flow of the heat dissipation fluid, reducing the accumulation of heat inside the packaging structure, achieving an improvement in the performance of the packaging structure, and helping to extend the service life of the packaging structure. Moreover, the utility model is to set the heat dissipation channel inside the functional chip without adding an additional heat dissipation structure, avoiding the occupation of the internal space of the packaging structure, thereby helping to improve the integration of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Attached Figure 1 It is a cross-sectional schematic diagram of a first packaging structure in a specific implementation mode of the utility model;

[0028] Attached Figure 2 It is a partial top view schematic diagram of the first functional chip in a specific implementation mode of the utility model;

[0029] Attached Figure 3 It is a partial top view schematic diagram of the second functional chip in a specific implementation mode of the utility model;

[0030] Attached Figure 4 It is a cross-sectional schematic diagram of a second packaging structure in a specific implementation manner of the utility model;

[0031] Attached Figure 5 It is a cross-sectional schematic diagram of a third packaging structure in a specific implementation manner of the utility model;

[0032] Attached Figure 6 It is a cross-sectional schematic diagram of a fourth packaging structure in a specific implementation manner of the utility model;

[0033] Attached Figure 7It is a cross-sectional schematic diagram of a functional chip in a specific implementation mode of the utility model;

[0034] Attached Figure 8 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after a passivation layer is formed on a functional chip;

[0035] Attached Fig. 9 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after an opening is formed on the passivation layer;

[0036] Attached Fig.10 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after a heat dissipation channel is formed in a functional chip;

[0037] Attached Fig.11 It is a cross-sectional schematic diagram of the fifth packaging structure in the specific implementation manner of the utility model. DETAILED DESCRIPTION

[0038] The specific implementation of the packaging structure provided by the utility model is described in detail below with reference to the accompanying drawings.

[0039] This specific implementation provides a packaging structure, Figure 1 Schematic diagram of the cross section of the first packaging structure in the specific implementation mode of the utility model. Figure 1 As shown, the packaging structure includes:

[0040] substrate 10;

[0041] A functional chip is located above the substrate 10, wherein the functional chip has a heat dissipation channel 15 and a heat dissipation fluid inlet 17 and a heat dissipation fluid outlet 18 both located on the surface of the functional chip, and the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 are both connected to the heat dissipation channel 15;

[0042] The heat dissipation channel is filled with heat dissipation fluid, and the heat dissipation fluid can enter the heat dissipation channel 15 from the heat dissipation fluid inlet 17 and flow out of the heat dissipation channel 15 through the heat dissipation fluid outlet 18;

[0043] The heat sink structure is located on the surface of the functional chip facing away from the substrate 10 .

[0044] Specifically, the substrate 10 includes a top surface and a bottom surface that are relatively distributed, the functional chip is mounted or flipped on the top surface of the substrate 10 along a third direction D3, and the heat sink structure is located on the side of the functional chip away from the substrate 10 along the third direction D3, wherein the third direction D3 intersects vertically with the top surface of the substrate 10. In one example, the functional chip is electrically connected to the substrate 10 through a first conductive bump 13, and a first bottom filler layer 12 is also filled between the functional chip and the substrate 10. The substrate 10 has a circuit layer inside, and a lead-out solder ball 11 is provided on the bottom surface of the substrate 10, and the lead-out solder ball 11 is electrically connected to the circuit layer inside the substrate 10. The functional chip has the heat dissipation channel 15 and the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 both connected to the heat dissipation channel 15. By setting a groove structure in the heat dissipation channel 15, the functional chip can maintain a certain rigidity in the overall structure, so that when the functional chip is mounted on the substrate, it can resist the tensile deformation and torsional deformation caused by the mounting process on the functional chip, and can also improve the supporting performance of the functional chip when the heat sink structure is installed on the functional chip, thereby improving the performance of the packaging structure and improving the reliability and stability of the packaging structure. The heat dissipation fluid can enter the heat dissipation channel 15 through the heat dissipation fluid inlet 17 and flow in the heat dissipation channel 15 to absorb the heat generated during the operation of the functional chip, and the heat dissipation fluid can flow out of the heat dissipation channel 15 through the heat dissipation fluid outlet 18, so as to transfer the heat generated during the operation of the functional chip to the outside of the packaging structure.

[0045] In this specific embodiment, the heat inside the packaging structure is absorbed by the flow of the heat dissipation fluid in the heat dissipation channel 15, thereby improving the heat dissipation performance of the packaging structure, reducing the accumulation of heat inside the packaging structure, achieving an improvement in the performance of the packaging structure, and helping to extend the service life of the packaging structure. Moreover, the utility model sets the heat dissipation channel inside the functional chip without adding an additional heat dissipation structure, avoiding the occupation of the internal space of the packaging structure, thereby helping to improve the integration of the packaging structure.

[0046] This specific implementation is described by taking the example of directly mounting the functional chip on the substrate 10. Figure 4 is a cross-sectional schematic diagram of a second packaging structure in a specific embodiment of the utility model. In other specific embodiments, such as Figure 4As shown, the packaging structure also includes an adapter board 40 located between the functional chip and the substrate 10, the functional chip is electrically connected to the adapter board 40 through a first conductive bump 13, and a second bottom filling layer 43 is filled between the functional chip and the adapter board 40; the adapter board is electrically connected to the substrate 10 through a second conductive bump 42, and a third bottom filling layer 41 is also filled between the adapter board 40 and the substrate 10.

[0047] In some embodiments, the functional chip includes a chip body 14 and a passivation layer 16 located on a surface of the chip body 14 facing away from the substrate 10;

[0048] The heat dissipation channel 15 is located in the chip body 14 , and the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 both penetrate the passivation layer 16 and are connected to the heat dissipation channel 15 in the chip body 14 .

[0049] Specifically, the chip body 14 includes a front side and a back side that are relatively distributed along the third direction D3, the front side of the chip body 14 faces the substrate 10, and the passivation layer 16 covers the back side of the chip body 14 to protect the back side of the chip body 14. In one example, the material of the passivation layer 16 can be a nitride material (e.g., silicon nitride) or an oxide material (e.g., silicon dioxide). The heat dissipation channel 15 is located in the chip body 14, and the heat dissipation channel 15 extends in a direction parallel to the top surface of the substrate 10, and the heat dissipation channel 15 does not penetrate the chip body 14 along the third direction D3, so as to improve the reliability of the packaging structure while avoiding the leakage of the heat dissipation fluid between the functional chip and the substrate, and simplifying the manufacturing process of the packaging structure. The heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 both penetrate the passivation layer 16 along the third direction D3 and communicate with the heat dissipation channel 15 in the chip body 14.

[0050] In one example, the heat sink structure includes a heat sink body 19, a heat sink input end 21 and a heat sink output end 20 located on the heat sink body 19, the heat sink input end has a heat sink inlet 211, the heat sink output end has a heat sink outlet 201, the heat sink inlet 211 is connected to the heat dissipation fluid inlet 17, and the heat sink outlet 201 is connected to the heat dissipation fluid outlet 18. The material of the heat sink body 19 can be a heat conductive material such as metal. The heat sink body 19 can be bonded to the surface of the passivation layer 16 away from the chip body 14 by adhesive.

[0051] In one example, the passivation layer 16 further includes a plurality of openings penetrating the passivation layer 16 and located between the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 , and the openings are used to etch the chip body 14 to form the heat dissipation channel 15 .

[0052] Attached Fig.11 is a cross-sectional schematic diagram of the fifth packaging structure in the specific implementation mode of the utility model. In another example, Fig.11 As shown, the passivation layer 16 is only provided with the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18, that is, there is no other opening in the passivation layer 16 between the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18, and the heat dissipation channel is formed by transversely etching the chip body 14 along the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18. With the above structure, on the one hand, the heat dissipation fluid in the heat dissipation channel 15 can be blocked from overflowing through the passivation layer 16; on the other hand, it is also helpful to simplify the formation process of the heat dissipation channel.

[0053] In some embodiments, the heat dissipation channel 15 is an arc-shaped channel.

[0054] Specifically, the heat dissipation channel 15 is an arc-shaped channel, which means that at least the side wall of the heat dissipation channel is arc-shaped. In one example, the contour line of the arc-shaped channel is a semicircular arc or a superior arc (i.e., an arc larger than a semicircle), wherein the contour line of the arc-shaped channel is formed by connecting all the side lines of the arc-shaped channel in sequence. In another example, the contour line of the arc-shaped channel is formed by connecting multiple arcs with the same or different curvatures end to end. By setting the channel as an arc-shaped channel, on the one hand, the formation process of the heat dissipation channel 15 can be simplified; on the other hand, the arc-shaped structure can better resist the tensile deformation and torsional deformation of the functional chip caused by the mounting process (for example, mounting the functional chip on the substrate 10 or installing the heat sink structure on the functional chip), thereby further improving the performance of the packaging structure.

[0055] In other embodiments, the cross-section of the heat dissipation channel 15 may also be a polygon such as a triangle or a rectangle to meet the requirements of different processes.

[0056] Attached Figure 2 is a partial top view schematic diagram of the first functional chip in the specific implementation mode of the utility model, Figure 3 FIG. 1 is a partial top view of the second functional chip in the specific implementation mode of the utility model. Figure 2 or Figure 3 As shown, the arc-shaped channel includes a plurality of arc-shaped grooves 151 , and the plurality of arc-shaped grooves 151 are arranged in a direction parallel to the top surface of the substrate 10 , and adjacent arc-shaped grooves 151 are engaged and connected.

[0057] In some embodiments, Figure 2 As shown, the arc-shaped channel includes a plurality of arc-shaped grooves 151 arranged along a first direction D1 and a second direction D2, the first direction D1 and the second direction D2 are both parallel to the top surface of the substrate 10, and the first direction D1 intersects with the second direction D2;

[0058] The arc-shaped grooves 151 adjacent to each other along the first direction D1 are meshed and connected, and the arc-shaped grooves 151 adjacent to each other along the second direction D2 are meshed and connected.

[0059] In some embodiments, the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 are distributed at opposite ends of the heat dissipation channel 15 along the third direction D3.

[0060] exist Figure 2 In the viewing angle shown, the arc-shaped channel is not visible, so the relative position relationship between the plurality of arc-shaped grooves 151 in the arc-shaped channel is indicated by dotted lines. Figure 2 The solid arrow in represents the flow direction of the heat dissipation fluid in the arc-shaped channel. Figure 1 and Figure 2As shown, the arc-shaped channel includes a plurality of arc-shaped grooves 151 arranged along the first direction D1 and the second direction D2, and the arc-shaped grooves 151 adjacent to each other along the first direction D1 are interlocked and connected, and the arc-shaped grooves 151 adjacent to each other along the second direction D2 are interlocked and connected, so as to form the arc-shaped channel including a plurality of arc-shaped grooves 151 interlocked and connected with each other. By forming a plurality of arc-shaped grooves 151 interlocked and connected with each other to form the arc-shaped channel, the forming process of the arc-shaped channel can be simplified, and the position and size of the arc-shaped channel can be flexibly controlled. The arc-shaped grooves 151 adjacent to each other along the first direction D1 are interlocked and connected, and the arc-shaped grooves 151 adjacent to each other along the second direction D2 are interlocked and connected, which can increase the width of the arc-shaped channel along the first direction D1 and the length along the second direction D2, thereby increasing the size of the arc-shaped channel, so as to further improve the resistance of the functional chip to deformation such as stretching and torsion, thereby further improving the reliability and stability of the packaging structure. In one example, the size of the top 152 of the arc groove 151 (e.g., the width of the top 152 of the arc groove 151 along the first direction D1 and the width along the second direction D2) is smaller than the size of the bottom of the arc groove 151 (e.g., the width of the bottom of the arc groove 151 along the first direction D1 and the width along the second direction D2), so as to further simplify the formation process of the heat dissipation channel. The multiple mentioned in this specific embodiment refers to more than two. The heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 are distributed at opposite ends of the heat dissipation channel 15 along the third direction D3, for example, the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 are distributed at opposite ends of the heat dissipation channel 15 along the second direction D2 along the third direction D3, so as to facilitate the heat dissipation fluid to flow more smoothly in the heat dissipation channel 15.

[0061] In some embodiments, Figure 3 As shown, the arcuate channel includes a plurality of branch channels arranged along the first direction D1, each of the branch channels includes a plurality of arcuate grooves 151 arranged along the second direction D2 and interlocked and connected, and the arcuate grooves 151 at the ends of adjacent branch channels are interlocked and connected.

[0062] In order to facilitate smoother flow of the heat dissipation fluid in the heat dissipation channel 15, in some embodiments, the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 are respectively connected to the ends of the two branch channels;

[0063] The heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 are located at the same end of the arc-shaped channel along the second direction D2; or, the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 are located at opposite ends of the arc-shaped channel along the second direction D2.

[0064] exist Figure 3 In the viewing angle shown, the arc-shaped channel is not visible, so the relative position relationship between the plurality of arc-shaped grooves 151 in the arc-shaped channel is indicated by dotted lines. Figure 3 The solid arrow in represents the flow direction of the heat dissipation fluid in the arc-shaped channel. Figure 1 and Figure 3 As shown, the arc-shaped channel includes a plurality of branch channels ( Figure 3 Two branch channels are shown in the figure), each of the branch channels includes a plurality of arc grooves 151 arranged along the second direction D2 and interlocked with each other, and the arc grooves 151 at the ends of adjacent branch channels are interlocked with each other, thereby reducing the excessive area occupied by the arc channels in the functional chip, improving the resistance of the functional chip to deformation such as stretching and torsion, and reducing the process difficulty of forming the arc channels.

[0065] In some embodiments, the width of the heat dissipation fluid inlet 17 and the width of the heat dissipation fluid outlet 18 are both greater than or equal to 5 micrometers.

[0066] For example, the width of the heat dissipation fluid inlet 17 along the first direction D1 and the width of the heat dissipation fluid outlet 18 along the first direction D1 are both greater than or equal to 5 microns, so that the heat dissipation fluid can flow smoothly from the heat dissipation fluid inlet 17 into the heat dissipation channel 15, and the heat dissipation fluid can flow smoothly from the heat dissipation fluid outlet 18 out of the heat dissipation channel 15, and it helps to simplify the subsequent process of forming the arc channel.

[0067] Attached Figure 5 is a cross-sectional schematic diagram of a third packaging structure in a specific implementation mode of the utility model. Figure 5 As shown, there are multiple function chips 50, and the multiple function chips 50 are arranged along a first direction D1, and the first direction D1 is parallel to the top surface of the substrate 10;

[0068] There are multiple heat sink structures 51, which are arranged along the first direction D1, and are located one by one on the surfaces of the multiple functional chips 50 away from the substrate 10. The above structure can not only further enhance the heat dissipation performance of the packaging structure as a whole, but also facilitate flexible adjustment of the heat dissipation performance of each functional chip.

[0069] Attached Figure 6 is a cross-sectional schematic diagram of a fourth packaging structure in a specific implementation mode of the utility model. In other embodiments, such as Figure 6As shown, there are multiple function chips 50, and the multiple function chips 50 are arranged along a first direction D1, and the first direction D1 is parallel to the top surface of the substrate 10;

[0070] The heat dissipation channels 15 in the plurality of function chips 50 are interconnected, and the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 are distributed on two different function chips 50;

[0071] The heat sink structure 51 is continuously distributed on the surfaces of the functional chips 50 away from the substrate 10. The above structure can not only further enhance the heat dissipation performance of the packaging structure as a whole, but also help simplify the installation steps of the heat sink structure and reduce the manufacturing cost of the packaging structure.

[0072] In one example, the packaging structure further includes a plastic encapsulation layer for encapsulating the plurality of function chips 50, wherein the plastic encapsulation layer has a connection channel, and the connection channel is connected to the heat dissipation channel 15 in two adjacent function chips 50. For example, the connection channel is located between two adjacent function chips 50 along the first direction D1, and one end of the connection channel is connected to the heat dissipation channel 15 in one function chip 50, and the other end of the connection channel is connected to the heat dissipation channel 15 in another function chip 50.

[0073] The packaging structure in this specific embodiment can be formed by the following steps: First, a first conductive bump 13 is formed on the front surface of the chip body 14, such as Figure 7 Next, a first protective layer 80 covering the first conductive bump and a second protective layer 81 covering the first protective layer 80 are formed on the front surface of the chip body 14, and after thinning the chip body 14 to a preset thickness, the passivation layer 16 is deposited on the back surface of the thinned chip body 14. Figure 8 Afterwards, the passivation layer is etched by an etching process to form an opening 90 penetrating the passivation layer 16, as shown in FIG. Fig. 9 In one example, the width of the opening 90 (e.g., the width of the opening 90 along the first direction D1) is greater than or equal to 5 microns, so as to facilitate the subsequent formation of an arc groove. Then, the chip body 14 is etched downward along the opening 90 to form the heat dissipation channel 15 having an arc channel structure and the heat dissipation fluid inlet 17 and the heat dissipation fluid outlet 18 connected to the heat dissipation channel 15, as shown in FIG. Fig.10In the process of etching the chip body 14 downward along the opening 90, the etching parameters, such as etching angle, etching agent type, etching time, etching agent dosage, etc., can be adjusted to make the etching rate of the chip body 14 along the first direction D1 and the second direction D2 greater than the etching rate of the chip body 14 along the third direction D3, so that the arc grooves 151 adjacent to each other along the first direction D1 are interlocked and connected, and the arc grooves 151 adjacent to each other along the second direction D2 are interlocked and connected, and the multiple interlocked arc grooves 151 together constitute the arc channel, see Figure 1 and Figure 2 Then, the first protective layer 80 and the second protective layer 81 are removed, and the functional chip is mounted on the substrate 10, and the heat sink structure is installed on the side of the functional chip away from the substrate 10, so as to obtain Figure 1 The structure shown.

[0074] The packaging structure provided in this specific embodiment is provided with a heat dissipation channel and a heat dissipation fluid inlet and a heat dissipation fluid outlet both connected to the heat dissipation channel in the functional chip above the substrate, and a heat sink structure is provided on the surface of the functional chip away from the substrate, so that the heat dissipation fluid can enter the heat dissipation channel from the heat dissipation fluid inlet and flow out of the heat dissipation channel through the heat dissipation fluid outlet, that is, the heat dissipation channel is used as a microchannel for the flow of the heat dissipation fluid, thereby improving the heat dissipation performance of the functional chip through the flow of the heat dissipation fluid, reducing the accumulation of heat inside the packaging structure, achieving an improvement in the performance of the packaging structure, and helping to extend the service life of the packaging structure. Moreover, in this specific embodiment, the heat dissipation channel is provided inside the functional chip without adding an additional heat dissipation structure, thereby avoiding the occupation of the internal space of the packaging structure, thereby helping to improve the integration of the packaging structure.

[0075] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A packaging structure, characterized in that: include: substrate; A functional chip is located above the substrate, wherein the functional chip has a heat dissipation channel and a heat dissipation fluid inlet and a heat dissipation fluid outlet both located on the surface of the functional chip, and the heat dissipation fluid inlet and the heat dissipation fluid outlet are both connected to the heat dissipation channel; The heat dissipation channel is filled with a heat dissipation fluid, and the heat dissipation fluid can enter the heat dissipation channel from the heat dissipation fluid inlet and flow out of the heat dissipation channel through the heat dissipation fluid outlet; The heat sink structure is located on the surface of the functional chip facing away from the substrate.

2. The packaging structure according to claim 1, characterized in that: The functional chip comprises a chip body and a passivation layer located on a surface of the chip body facing away from the substrate; The heat dissipation channel is located in the chip body, and the heat dissipation fluid inlet and the heat dissipation fluid outlet both penetrate the passivation layer and are connected to the heat dissipation channel in the chip body.

3. The packaging structure according to claim 1, characterized in that: The heat dissipation channel is an arc-shaped channel.

4. The packaging structure according to claim 3, characterized in that: The arc-shaped channel includes a plurality of arc-shaped grooves, the plurality of arc-shaped grooves are arranged in a direction parallel to the top surface of the substrate, and adjacent arc-shaped grooves are engaged and communicated.

5. The packaging structure according to claim 4, characterized in that: The arc-shaped channel includes a plurality of arc-shaped grooves arranged along a first direction and a second direction, the first direction and the second direction are both parallel to the top surface of the substrate, and the first direction intersects with the second direction; The arcuate grooves adjacent to each other along the first direction are meshed and connected, and the arcuate grooves adjacent to each other along the second direction are meshed and connected.

6. The packaging structure according to claim 5, characterized in that: The heat dissipation fluid inlet and the heat dissipation fluid outlet are distributed at two opposite ends of the heat dissipation channel along the second direction.

7. The packaging structure according to claim 4, characterized in that: The arc-shaped channel includes a plurality of branch channels arranged along a first direction, each of the branch channels includes a plurality of arc-shaped grooves arranged along a second direction and interlocked with each other, the arc-shaped grooves at the ends of adjacent branch channels are interlocked with each other, the first direction and the second direction are both parallel to the top surface of the substrate, and the first direction intersects with the second direction.

8. The packaging structure according to claim 7, characterized in that: The heat dissipation fluid inlet and the heat dissipation fluid outlet are respectively connected to the ends of the two branch channels; The heat dissipation fluid inlet and the heat dissipation fluid outlet are located at the same end of the arc-shaped channel along the second direction; or, the heat dissipation fluid inlet and the heat dissipation fluid outlet are located at opposite ends of the arc-shaped channel along the second direction.

9. The packaging structure according to claim 1, characterized in that: The width of the heat dissipation fluid inlet and the width of the heat dissipation fluid outlet are both greater than or equal to 5 micrometers.

10. The packaging structure according to claim 1, characterized in that: There are multiple function chips, and the multiple function chips are arranged along a first direction, and the first direction is parallel to the top surface of the substrate; There are multiple heat sink structures, the multiple heat sink structures are arranged along the first direction, and the multiple heat sink structures are located one by one on the surfaces of the multiple functional chips away from the substrate.

11. The packaging structure according to claim 1, characterized in that: There are multiple function chips, and the multiple function chips are arranged along a first direction, and the first direction is parallel to the top surface of the substrate; The heat dissipation channels in the plurality of functional chips are interconnected, and the heat dissipation fluid inlet and the heat dissipation fluid outlet are distributed on two different functional chips; The heat sink structure is continuously distributed on the surfaces of the plurality of functional chips away from the substrate.

Images